KR20150075418A - Chip substrate comprising an lens insert - Google Patents

Chip substrate comprising an lens insert Download PDF

Info

Publication number
KR20150075418A
KR20150075418A KR1020130141256A KR20130141256A KR20150075418A KR 20150075418 A KR20150075418 A KR 20150075418A KR 1020130141256 A KR1020130141256 A KR 1020130141256A KR 20130141256 A KR20130141256 A KR 20130141256A KR 20150075418 A KR20150075418 A KR 20150075418A
Authority
KR
South Korea
Prior art keywords
lens
sides
chip
insertion portion
lens insertion
Prior art date
Application number
KR1020130141256A
Other languages
Korean (ko)
Inventor
안범모
남기명
전영철
Original Assignee
(주)포인트엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)포인트엔지니어링 filed Critical (주)포인트엔지니어링
Priority to KR1020130141256A priority Critical patent/KR20150075418A/en
Priority to US14/546,201 priority patent/US9374890B2/en
Priority to CN201410663975.2A priority patent/CN104659194B/en
Publication of KR20150075418A publication Critical patent/KR20150075418A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Abstract

The present invention relates to a chip substrate and a manufacturing method thereof. More particularly, the present invention relates to a chip substrate comprising a lens insertion part. A chip substrate comprising a lens insertion part according to the present invention comprises a conduction layer which is stacked in a direction to form the chip substrate, an insulating layer which is alternately stacked with the conduction layer and electrically separates the conduction layer; and a groove which has a preset depth in a region which includes the insulating layer on the upper surface of the chip substrate. It includes a lens insertion part which has a predetermined number of sides on the upper surface and forms an arc in a region where the sides meet. According to the present invention, a space for inserting a lens can be formed with a shape including a straight line. Also, a lens to be inserted can be manufactured with a shape including a straight line. Thereby, a process of manufacturing a lens inserted into the chip substrate can be simplified.

Description

 [0001] The present invention relates to a chip plate comprising a lens insertion portion,

 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip original plate and a manufacturing method thereof, and more particularly to a chip original plate having a lens insertion portion.

 Conventionally, the upper surface of the chip original plate is formed by mechanical processing or chemical etching as a space for mounting a chip on a chip original plate. That is, a method of fabricating an upper part of an unprocessed rectangular plate-like metal disc by etching a mounting space has been disclosed in Korean Patent Registration No. 10-0986211.

 Furthermore, when an optical device chip such as UV or LED is mounted on such a chip substrate, a space of a top-down bottom shape is formed to enhance the light reflection performance. After forming the space, the lens is molded to mount the chip and seal the mounting space, thereby increasing the light efficiency.

At this time, when the lens is molded, the space formed for mounting is formed in a circular shape when viewed from the top surface of the chip original plate, and the shape of the lens is formed circular so as to correspond to the shape.

However, in order to precisely process the lens into a circular shape, there is a difficulty in the manufacturing process as compared with processing a lens formed of a straight line of a square or triangle.

 SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip disc structure in which a space for inserting a lens is formed in a shape including a straight line.

More specifically, the space in which the chip is mounted and the space in which the lens is inserted are separated so that the space into which the lens is inserted is formed into a shape including a straight line, and a space in which the chip is mounted is further formed inside the space It is aimed to propose a chip disc structure.

According to an aspect of the present invention, there is provided a chip board comprising a lens insertion portion, An insulating layer laminated alternately with the conductive layer to electrically isolate the conductive layer; And a lens inserting portion formed on the upper surface of the chip disc to have a predetermined depth with respect to an area including the insulating layer and having a predetermined number of sides on the upper surface and forming an arc in a region where the sides and sides meet, do.

And the arc of the lens insertion portion is formed protruding out of a region formed by the extension of the side and the side.

It is preferable that the chip original plate further includes a cavity made of a groove reaching a predetermined depth with respect to a region including the insulating layer in an inner region of the lens insertion portion.

Preferably, the cavity is formed in a shape of an upper light-tight shape in which the cross-sectional area becomes narrower as the depth of the groove becomes deeper.

The lens insertion unit may further include a call protruding outwardly from the upper surface of the chip disc.

It is preferable that the lens insertion unit has four sides and forms an arc in four areas where the sides and sides meet.

And an electrode display unit for displaying an electrode with respect to at least one conductive layer of the conductive layer separated by the insulating layer on the upper surface of the chip original plate.

Preferably, the lens insertion portion further includes a groove reaching a predetermined depth on a surface contacting the lens when the lens is inserted.

 According to the present invention, since the space for inserting the lens can be formed in a shape including a straight line, and the inserted lens can also be formed in a shape including a straight line, the manufacturing process of the lens inserted into the chip original plate can be further simplified.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view of a chip original plate having a lens insert according to an embodiment of the present invention; FIG.
2 is a cross-sectional view of a chip original plate having a lens insertion portion according to an embodiment of the present invention.
3 is a perspective view of a chip original plate having a lens insertion portion according to an embodiment of the present invention.
4 is a top view of a chip original plate having a lens insertion unit according to an embodiment of the present invention.
5 is a top view of a chip original plate having a plurality of lens insertion portions according to an embodiment of the present invention.
6 is a cross-sectional view of a chip original plate having a lens insertion portion according to an embodiment of the present invention.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art will be able to devise various apparatuses which, although not explicitly described or shown herein, embody the principles of the invention and are included in the concept and scope of the invention. It is also to be understood that all conditional terms and examples recited in this specification are, in principle, expressly intended for the purpose of enabling the inventive concept to be understood, and are not intended to be limiting as to such specifically recited embodiments and conditions .

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: .

In the following description, a detailed description of known technologies related to the present invention will be omitted when it is determined that the gist of the present invention may be unnecessarily blurred. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In this embodiment, a conductive layer including a plurality of electrically conductive materials having a predetermined thickness is laminated alternately with an insulating layer made of an insulating material interposed therebetween in order to manufacture a chip base plate.

By heating and pressing in a laminated state, a conductive material mass (mass) in which a plurality of insulating layers are arranged with an interval is produced. Next, the thus-produced conductive material block is vertically cut so as to include the insulating layer, thereby completing the fabrication of the chip base plate in which the plurality of the vertical insulating layers are arranged in parallel at intervals. That is, in this embodiment, the one direction is the vertical direction, and the conductive material mass is vertically cut along the stacking direction to manufacture the chip original plate.

A chip insert having a lens insert portion and a cavity are formed on a chip original plate manufactured by cutting according to the above-described method to manufacture a chip original plate having a lens insert portion according to the present embodiment.

In this embodiment, the chip original plate has a shape similar to that of FIG. 5, and a plurality of lens insertion portions and cavities may be formed on the upper surface of the chip original plate. However, for the sake of more detailed explanation, a chip original plate including one lens insertion portion or a cavity will be described as an example. That is, the chip original plate according to Figs. 1 to 3 can be manufactured by cutting a chip original plate according to Fig. 5 as a unit chip original plate into a unit of the lens insertion unit.

Hereinafter, with reference to FIG. 1, a chip original plate having a lens insertion portion according to the present embodiment will be described.

 FIG. 1 is a top view of a chip original plate 100 having a lens insertion unit 140 according to an embodiment of the present invention. 1, a chip substrate 100 having a lens insertion unit 140 according to an embodiment of the present invention includes a conductive layer 110, an insulating layer 120, a lens insertion unit 140, and a cavity 130 . That is, when viewed from above the chip disc 100 according to the present embodiment, the lens insertion portion 140 is formed inward relative to the quadrangular chip disc 100, and the cavity 130 is formed inside the lens insertion portion 140 do. At this time, the lens insertion portion 140 and the cavity 130 are formed to include the insulating layer 120.

In this embodiment, the conductive layer 110 is laminated in one direction to form the chip disc 100, and functions as an electrode for applying an electrode to a chip mounted by a later process. Here, the one direction is formed along the stacking direction of the conductive layers 110 alternately stacked with the insulating layer 120 in the stacking step as described above, and is formed by stacking in the horizontal direction according to FIG.

The insulating layer 120 is stacked alternately with the conductive layer 110 to electrically separate the conductive layer 110. That is, the chip substrate which is insulated with the insulating layer 120 interposed therebetween can serve as (+) electrode terminal and (-) electrode terminal, respectively.

In the present embodiment, the insulating layer 120 exists between two conductive layers 110. However, two insulating layers 120 are formed between the three conductive layers 110, 100, and it is also possible that more insulating layers 120 are formed depending on the use thereof.

The lens insertion portion 140 is formed of a groove reaching a predetermined depth with respect to an area including the insulating layer 120 on the upper surface of the chip disc 100. The lens insertion portion 140 has a predetermined number of sides on the lens upper surface, In the region where the sides meet, an arc is formed.

That is, according to FIG. 1, a region including the insulating layer 120 is formed on the upper surface of the chip disc 100 formed by stacking the conductive layer 110, the insulating layer 120, and the conductive layer 110 in this order in the horizontal direction, As shown in Fig. Specifically, in this embodiment, the shape of the lens insertion portion 140 has four sides, and arcs are formed at four corners where the sides meet. That is, grooves having sides parallel to the sides of the chip original plate 100 according to FIG. 1 are formed.

At this time, in this embodiment, it is preferable that the corners are rounded. In the case of using a cutting machine that performs rotational motion such as a milling machine to form grooves in the chip original plate 100 to form the lens insertion portion 140 in the manufacturing process, it is difficult to form grooves having right-angled corners , It is possible to form grooves through linear motion at the time of designing and to move to the position of the next to be formed by the cutter through arcs according to a predetermined curvature in forming the next side, .

In addition, as shown in FIG. 1, in this embodiment, it is preferable that the arc is formed protruding outside the region formed by the extension line of sides and sides. The shape of the lens inserting portion 140 is for securing the inserted space of the lens and fixing the inserted lens. In this embodiment, in order to solve the difficulty in the manufacturing process of the conventional circular lens, It is preferable that the arc is formed on the outer side of the corner of the lens that forms the right angle.

In other words, if a call is formed in the extension line of sides and sides, the edge of the lens to be inserted should be formed so as to correspond to the curvature of the arc. However, if the arc is formed outside the edge formed by sides and sides as in the present embodiment, It is possible to easily accommodate the lens and to fix the lens through each side. Furthermore, after the insertion of the lens, the gap between the arc and the lens can be sealed by post-treatment to complete the insertion of the lens.

In the present embodiment, the lens insertion portion 140 having four sides has been described in order to accommodate the rectangular lens. However, the number of sides of the lens insertion portion 140 may vary depending on the application and the shape of the lens. But it can be formed in some of the corners where sides and sides meet.

The chip disc 100 according to the present embodiment may further include a cavity 130 formed in a region including the insulating layer 120 inside the lens insertion portion 140 formed according to the above description.

Referring to FIG. 2, the lens insertion portion 140 is formed inwardly by forming a groove at a predetermined depth of the chip disc 100, and the lens insertion portion 140 is formed in a region deeper than the depth of the lens insertion portion 140 The cavity 130 is formed.

In the present embodiment, it is preferable that the width is narrower toward the lower side, and it is formed in the shape of a lower light bulb. Since the cavity 130 is formed in an upper light-tight shape to enhance the light reflection performance of the chip to be mounted, an outer wall inclined diagonally from the cross section according to FIG. 2 is formed.

1 and 2, a single cavity 130 is formed in one lens insertion portion 140. However, it is also possible to form a plurality of cavities 130 according to the use of the chip original plate 100 It is also possible to form four cavities 130 and two insulating layers 120 according to the structure shown in FIG.

Further, the chip disc 100 having the lens insertion unit 140 according to the present embodiment may further include an electrode display unit.

Referring to FIG. 1, as described above, in the present embodiment, the chip disc 100 has the insulating layer 120 formed between the two conductive layers 110, and thus the conductive layer 110 separated from the insulating layer 120 110 may be applied to each of the other electrodes. Therefore, the marking 150 is applied only to the surface of one conductive layer 110, and the conductive layer 110 of the marked portion is previously promised that the (+) pole is applied, The electrode can be judged.

4, the lens insertion portion 140 of the chip disc 100 having the lens insertion portion 140 according to the present embodiment includes a plurality of protrusions 140 formed on the top surface of the chip disc 100, (142). In other words, when a jig or a robot is used instead of the adsorption method in moving and joining the quadrangular lens by forming the arc 142 protruding from two sides opposite to each other in FIG. 1, It is possible to provide a jig groove to help smoothly progress the joining process or to precisely join the joining process.

Referring to FIG. 6, the lens insertion portion 140 according to the present embodiment may further include a groove 144 reaching a predetermined depth on a surface contacting with the lens when inserting the lens. That is, in this embodiment, the bonding agent is injected into the space formed by the predetermined groove 144 on the contact surface along the periphery of the lens insertion portion 140, and the lens is bonded. Therefore, since the bonding agent used in the lens bonding may overflow to the inside and outside of the bonding region, a separate groove 144 may be provided on the bonding surface with the lens for quantitative use of the bonding agent.

As described above, the chip original plate according to the above embodiment has been described with reference to the unit chip original plate 100 as shown in FIG. 3 in which a single lens insertion portion is formed for convenience of explanation. However, in this embodiment, A plurality of lens insertion portions may be formed as shown in FIG. 3, and each unit chip plate as shown in FIG. 3 can be manufactured by cutting along a cutting guide line 160 shown on the upper surface of the chip original plate.

The above-mentioned chip original plate is designed to solve the difficulty in the manufacturing process due to the fact that the shape of the lens must be formed in a circular shape according to the conventional circular chip mounting space. In this embodiment, before forming the circular cavity in which the chip is mounted, And the lens is formed in a shape having a straight line like a quadrangle, thereby making it easier to perform the process.

Further, it is possible to easily form the arc at the portion where the side of the lens inserting portion and the side where the side where the lens inserting portion intersects, to move the side of the cutter more easily in drawing the groove of the lens inserting portion, .

It will be apparent to those skilled in the art that various modifications, substitutions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. will be.

Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

Claims (8)

A conductive layer laminated in one direction to constitute a chip original plate;
An insulating layer laminated alternately with the conductive layer to electrically isolate the conductive layer; And
And a lens inserting portion formed on the upper surface of the chip original plate so as to reach a predetermined depth with respect to an area including the insulating layer and having a predetermined number of sides on the upper surface and forming an arc in a region where the sides and sides meet, And a lens insertion portion which is characterized by comprising: The method according to claim 1,
Wherein the arc of the lens insertion portion is protruded to the outside of a region formed by the extension of the sides and sides. The method according to claim 1,
The above-
Further comprising a cavity having a groove reaching a predetermined depth with respect to a region including the insulating layer in an inner region of the lens insertion portion. The method of claim 3,
Wherein the cavity is formed in a shape of an upper light bulb having a smaller cross-sectional area as the depth of the groove becomes deeper. The method according to claim 1,
Wherein the lens insertion portion further comprises a hole formed on an upper surface of the chip original plate so as to protrude to the outside of the side. The method according to claim 1,
Wherein the lens insertion portion has four sides and forms an arc in four regions where the sides and sides meet. The method according to claim 1,
The above-
Further comprising an electrode display unit for displaying an electrode on at least one of the conductive layers separated by the insulating layer on the upper surface of the chip original plate. The method according to claim 1,
Wherein the lens insertion portion further includes a groove reaching a predetermined depth on a surface contacting with the lens when the lens is inserted.
KR1020130141256A 2013-11-20 2013-11-20 Chip substrate comprising an lens insert KR20150075418A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020130141256A KR20150075418A (en) 2013-11-20 2013-11-20 Chip substrate comprising an lens insert
US14/546,201 US9374890B2 (en) 2013-11-20 2014-11-18 Chip substrate having a lens insert
CN201410663975.2A CN104659194B (en) 2013-11-20 2014-11-19 Chip base with lens insert

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130141256A KR20150075418A (en) 2013-11-20 2013-11-20 Chip substrate comprising an lens insert

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020150137344A Division KR20150118065A (en) 2015-09-30 2015-09-30 Chip substrate comprising an lens insert

Publications (1)

Publication Number Publication Date
KR20150075418A true KR20150075418A (en) 2015-07-06

Family

ID=53173046

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130141256A KR20150075418A (en) 2013-11-20 2013-11-20 Chip substrate comprising an lens insert

Country Status (3)

Country Link
US (1) US9374890B2 (en)
KR (1) KR20150075418A (en)
CN (1) CN104659194B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190119951A (en) 2018-04-13 2019-10-23 (주)포인트엔지니어링 Optical device package

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102212340B1 (en) 2015-01-02 2021-02-05 (주)포인트엔지니어링 Chip substrate comprising junction groove in lens insert
CN106340502A (en) * 2015-07-09 2017-01-18 普因特工程有限公司 Chip substrate with concave part and chip package same
CN106340578A (en) * 2015-07-09 2017-01-18 普因特工程有限公司 Chip substrate with plating layer and chip package using same
US10043787B2 (en) * 2017-01-10 2018-08-07 International Business Machines Corporation Optoelectronic chip embedded organic substrate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5615052A (en) * 1993-04-16 1997-03-25 Bruce W. McCaul Laser diode/lens assembly
WO2005038935A1 (en) * 2003-10-15 2005-04-28 Nichia Corporation Light-emitting device
US7425083B2 (en) * 2005-05-02 2008-09-16 Samsung Electro-Mechanics Co., Ltd. Light emitting device package
KR100867516B1 (en) 2005-05-02 2008-11-07 삼성전기주식회사 Light emitting device package
US7906794B2 (en) * 2006-07-05 2011-03-15 Koninklijke Philips Electronics N.V. Light emitting device package with frame and optically transmissive element
US7661842B2 (en) * 2007-07-25 2010-02-16 I-Chiun Precision Industry Co., Ltd. Structure of a supporting assembly for surface mount device LED and manufacturing method thereof
KR100986211B1 (en) 2008-01-04 2010-10-07 주식회사 이츠웰 Metal substrate, method of making the substrate, and smd type led package using the substrate
US8207553B2 (en) * 2008-03-25 2012-06-26 Bridge Semiconductor Corporation Semiconductor chip assembly with base heat spreader and cavity in base
US8390083B2 (en) 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
US20110062454A1 (en) * 2009-09-11 2011-03-17 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Light emitting device having remotely located light scattering material
US8796798B2 (en) * 2010-01-27 2014-08-05 Ricoh Company, Ltd. Imaging module, fabricating method therefor, and imaging device
US8575645B2 (en) * 2011-11-22 2013-11-05 GEM Weltronics TWN Corporation Thin multi-layer LED array engine
KR20140094752A (en) * 2013-01-22 2014-07-31 삼성전자주식회사 An electronic device package and a packaging substrate for the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190119951A (en) 2018-04-13 2019-10-23 (주)포인트엔지니어링 Optical device package
US11201272B2 (en) 2018-04-13 2021-12-14 Point Engineering Co., Ltd. Optical device package

Also Published As

Publication number Publication date
CN104659194B (en) 2018-11-09
US9374890B2 (en) 2016-06-21
CN104659194A (en) 2015-05-27
US20150138656A1 (en) 2015-05-21

Similar Documents

Publication Publication Date Title
KR20150075418A (en) Chip substrate comprising an lens insert
JP2005079536A (en) Method of manufacturing solid-state imaging apparatus
KR20130087249A (en) Semiconductor apparatus and image sensor package using the same
KR101668353B1 (en) Chip substrate and chip package module
US10014455B2 (en) Chip substrate comprising cavity with curved surfaces
KR101900933B1 (en) Chip substrate comprising an lens insert
JP3838573B2 (en) Solid-state imaging device
KR101900935B1 (en) Chip substrate comprising an lens insert
KR20150118065A (en) Chip substrate comprising an lens insert
KR102212340B1 (en) Chip substrate comprising junction groove in lens insert
KR20180072411A (en) Method for manufacturing semiconductor package
KR101516371B1 (en) Chip substrate comprising a bonding groove and a sealing member for the chip substrate
US20160380167A1 (en) Pre-cut substrate and unit chip substrate comprising hemispherical cavity
JP2006332686A (en) Solid-state imaging device
KR20150130153A (en) Chip substrate and substrate unit comprising a hemispherical cavity
KR101777683B1 (en) Chip substrate and substrate unit comprising a hemispherical cavity
KR101856481B1 (en) Substrate for light emitting device and manufacturing method thereof and light emitting device
JP7022509B2 (en) Light emitting device, mounting board, light emitting body
KR20150137150A (en) Chip substrate comprising a groove portion and chip package using the chip substrate
KR101902365B1 (en) Light emitting device and manufacturing method thereof
JP2011210990A (en) Semiconductor device, and method of manufacturing semiconductor device
TW201633516A (en) Semiconductor device and method for manufacturing same
KR20120096424A (en) Circuit arrangement
KR20180049941A (en) Light emitting device and manufacturing method thereof
JP2004055948A (en) Rotary electrical part

Legal Events

Date Code Title Description
A201 Request for examination
AMND Amendment
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
A107 Divisional application of patent
J201 Request for trial against refusal decision
J301 Trial decision

Free format text: TRIAL NUMBER: 2015101005773; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20150930

Effective date: 20170320