KR20150069913A - Specimens for measuring the bonding strength of thin film and methods for measuring the bonding strength of thin film using the same - Google Patents

Specimens for measuring the bonding strength of thin film and methods for measuring the bonding strength of thin film using the same Download PDF

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Publication number
KR20150069913A
KR20150069913A KR1020130156633A KR20130156633A KR20150069913A KR 20150069913 A KR20150069913 A KR 20150069913A KR 1020130156633 A KR1020130156633 A KR 1020130156633A KR 20130156633 A KR20130156633 A KR 20130156633A KR 20150069913 A KR20150069913 A KR 20150069913A
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KR
South Korea
Prior art keywords
thin film
flexible substrate
adhesive strength
measuring
rigid plate
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Application number
KR1020130156633A
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Korean (ko)
Inventor
지금영
이재상
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삼성전기주식회사
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Priority to KR1020130156633A priority Critical patent/KR20150069913A/en
Publication of KR20150069913A publication Critical patent/KR20150069913A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/36—Embedding or analogous mounting of samples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/0091—Peeling or tearing

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

A specimen for measuring adhesion strength of a thin film is disclosed. According to one aspect of the present invention, the specimen for measuring adhesion strength of a thin film comprises: a flexible printed circuit board; a thin film attached to one surface of the flexible printed circuit board at a first adhesion strength; a rigid plate supporting the thin film; and an adhesive layer interposed between the thin film and the rigid plate and having a second adhesion strength.

Description

TECHNICAL FIELD The present invention relates to a test piece for measuring the adhesive strength of a thin film and a method for measuring the adhesive strength of the thin film using the test piece.

The present invention relates to a specimen for measuring the adhesive strength of a thin film and a method for measuring the adhesive strength of the thin film using the same.

The bonding strength between the substrate and the thin film is one of the most important characteristics when the thin film is adhered to the substrate, for example, between the different materials. Particularly, when the bonding strength between the substrate and the thin film is low, the product performance and reliability can be lowered. Therefore, it is important to secure an adhesive strength of a certain value or more.

Various methods for measuring the bonding strength between the substrate and the thin film have been studied, and various measuring methods can be applied according to the characteristics of the specimen. The most commonly used measurement methods include a 90 degree peel test measurement method. In the 90 degree fill test measurement method, one end of a flexible thin plate having a constant width is held, a load applied is measured while being detached at a constant speed from the substrate, and the measured load is divided by the width of the flexible thin plate to calculate the adhesive strength. The fill test measurement method is relatively simple, applicable to various specimens, and has the advantage of excellent reproducibility of measurement results. In addition, it is possible to directly confirm the success of the experiment or the reliability of the measurement result from the peel curve formed during the measurement.

The background art of the present invention is disclosed in Korean Patent Laid-Open Publication No. 10-2005-0055128 (2005. 06. 13, a method of measuring the adhesive strength of a capacitor embedded in a printed circuit board).

It is an object of the present invention to provide a test piece for measuring the adhesive strength of a thin film used for measuring an adhesive strength between a flexible substrate and a thin film and a method for measuring the adhesive strength of the thin film using the test piece.

According to an aspect of the present invention, there is provided a flexible substrate comprising: a flexible substrate; A thin film adhered to one surface of the flexible substrate with a first adhesive strength; A rigid plate supporting the thin film; And a bonding layer interposed between the thin film and the rigid plate and having a second bonding strength.

According to another aspect of the present invention, there is provided a method of manufacturing a flexible substrate, comprising the steps of: providing a flexible substrate on one side of which a thin film is attached at a first bonding strength; Fabricating a specimen for bonding strength measurement of a thin film by stacking the flexible substrate on the rigid plate such that the thin film faces the rigid plate and interposing an adhesive layer having a second bonding strength between the thin film and the rigid plate; Fixing the specimen to a jig; Holding one end of the flexible substrate using a gripper and separating the flexible substrate from the thin film toward the other end of the flexible substrate; And calculating the first adhesive strength by measuring a load applied to the gripper while the flexible substrate is separated from the thin film.

The specimen may be fixed to the jig through the rigid plate.

The load applied to the gripper may act in a direction perpendicular to the contact surface between the flexible substrate and the thin film.

The first adhesive strength can be calculated by dividing the load applied to the gripper by the width of the thin film while the flexible substrate is separated from the thin film.

The second adhesive strength may exceed the first adhesive strength.

The rigid plate may be made of metal.

According to the embodiments of the present invention, the bonding strength between the thin film and the flexible substrate can be measured by pulling out the flexible substrate with the thin film fixed on the rigid plate. As a result, compared with the case where the thin film is pulled off with the substrate held in a fixed state, it is difficult to measure the thin film due to the thinness of the thin film, thereby preventing the problem that the measurement is impossible or the thin film is broken during pulling the thin film .

1 is a view showing a test piece for measuring the adhesive strength of a thin film according to an embodiment of the present invention.
2 is a view showing a method of measuring the adhesive strength of a thin film according to another embodiment of the present invention.
3 is a view showing an example of a peel test apparatus.
FIG. 4 is a view showing a peel curve. FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present invention, the term "comprises" or "having ", etc. is intended to specify that there is a feature, number, step, operation, element, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of a test piece for measuring the adhesive strength of a thin film and a test method for measuring a test piece of a thin film using the same according to the present invention will be described in detail with reference to the accompanying drawings. In the following description, The same reference numerals denote the same elements, and a duplicate description thereof will be omitted.

1 is a view showing a test piece for measuring the adhesive strength of a thin film according to an embodiment of the present invention.

Referring to FIG. 1, a test piece 10 for measuring the adhesive strength of a thin film according to an embodiment of the present invention includes a flexible substrate 100, a thin film 110, an adhesive layer 120, and a rigid plate 130.

The flexible substrate 100 can be bent by a load.

A thin film 110 is attached to one surface of the flexible substrate 100 with a first bonding strength. That is, the flexible substrate 100 and the thin film 110 can be separated from each other only by applying a load equal to or greater than the first adhesive strength. The test piece 10 for measuring the adhesive strength of a thin film according to an embodiment of the present invention is a specimen for measuring the first adhesive strength.

The adhesive layer 120 is interposed between the thin film 110 and the rigid plate 130.

The adhesive layer 120 has a second adhesive strength. That is, the thin film 110 and the rigid plate 130 are attached to each other through the adhesive layer 120 with a second adhesive strength, and the thin film 110 and the rigid plate 130 need to be subjected to a load greater than the second adhesive strength, . ≪ / RTI > Here, the second adhesive strength may exceed the first adhesive strength. As a result, when the flexible substrate 100 is pulled at a predetermined load in order to measure the first adhesive strength in the method of measuring the adhesive strength of a thin film to be described later, the thin film 110 and the rigid plate 130 are separated from each other . The first adhesive strength can be measured if the flexible substrate 100 and the thin film 110 are separated from each other and if the thin film 110 and the rigid plate 130 are separated from each other, This is because the adhesive strength may result in measurement.

The rigid plate 130 may be made of a material that is not easily deformed or broken by a load, for example, a metal.

The rigid plate 130 supports the flexible substrate 100 and the thin film 110.

Specifically, the thin film 110 is disposed to face one surface of the rigid plate 130, and the adhesive layer 120 is interposed between the rigid plate 130 and the thin film 110, The substrate 100 and the thin film 110 can be supported. That is, the test piece 10 for measuring the adhesive strength of a thin film according to an embodiment of the present invention may be formed by sequentially stacking the flexible substrate 100, the thin film 110, the adhesive layer 120, and the rigid plate 130 have.

2 is a view showing a method of measuring the adhesive strength of a thin film according to another embodiment of the present invention.

Referring to FIG. 2, the method for measuring the adhesive strength of a thin film according to another embodiment of the present invention includes the steps of providing a flexible substrate (S100), fabricating a sample for measuring the adhesive strength of a thin film (S110) (S130) of holding one end of the flexible substrate and separating the flexible substrate from the thin film, and calculating a first adhesive strength (S140).

First, a flexible substrate with a thin film adhered on one side with a first adhesive strength is provided (S100).

The flexible substrate 100 can be bent by an external force.

A thin film 110 is attached to one surface of the flexible substrate 100 with a first bonding strength. That is, the flexible substrate 100 and the thin film 110 can be separated from each other only by applying a load equal to or greater than the first adhesive strength.

Next, a specimen for measuring the bonding strength of the thin film for measuring the first bonding strength between the flexible substrate and the thin film is prepared (S110).

The test piece 10 for measuring the adhesion strength of the thin film is obtained by laminating the flexible substrate 100 on the rigid plate 130 such that the thin film 110 is opposed to the rigid plate 130 and separating the flexible substrate 100 between the thin film 110 and the rigid plate 130 The adhesive layer 120 having a second adhesive strength.

The second bond strength may exceed the first bond strength.

The test piece 10 for measuring the adhesive strength of a thin film may be formed by stacking a flexible substrate 100, a thin film 110, an adhesive layer 120 and a rigid plate 130 in this order.

Next, the specimen is fixed to the jig of the fill test apparatus (S120).

3 is a view showing an example of a peel test apparatus.

Referring to FIG. 3, the fill test apparatus 20 includes a jig 200, a gripper 210, and a load cell 220.

The test piece 10 may be fixed to the jig 200 by a clamping device or the like.

The jig 200 can move at a constant speed in the horizontal direction with the test piece 10 fixed.

The gripper 210 may hold one end of the flexible substrate 100 of the test piece 10 fixed to the jig 200 and apply an upward load.

The load cell 220 can measure a load applied to the gripper 210.

The specimen 10 can be fixed to the jig 200 through the rigid plate 130. Specifically, the specimen 10 can be fixed to the jig 200 such that the rigid plate 130 contacts the jig 200 and the flexible substrate 100 is positioned at the uppermost position.

Next, one end of the flexible substrate is held and separated from the thin film (S130).

One end of the flexible substrate 100 is held by the gripper 210 of the peel test apparatus 20 and the flexible substrate 100 is separated from the thin film 110 from one end of the flexible substrate 100 toward the other end.

An upward load is applied to the gripper 210 holding one end of the flexible substrate 100 and the jig 200 to which the test piece 10 is fixed moves in the horizontal direction. Specifically, the jig 200 can move at a constant speed such that the peeling position of the flexible substrate 100 and the thin film 110 is disposed directly below the gripper 210. As a result, the upward load applied to the gripper 210 can act in a direction perpendicular to the contact surface between the flexible substrate 100 and the thin film 110. [

Next, the first adhesive strength is calculated by measuring a load applied to the gripper while the flexible substrate is separated from the thin film (S140).

FIG. 4 is a view showing a peel curve. FIG.

Referring to FIG. 4, it can be seen that the load applied to the gripper 210 is increased and maintained at a constant value. It can be seen that peeling occurs between the flexible substrate 100 and the thin film 110 when the load applied to the pyramid 210 is kept constant. 4 showing the result of measurement of the applied load of the gripper 210 in accordance with the horizontal movement displacement of the jig 200, the application of the gripper 210 in which peeling occurs between the flexible substrate 100 and the thin film 110 The load can be detected. The applied load of the gripper 210 can be measured by the load cell 220.

The first adhesive strength can be calculated by dividing the applied load of the gripper 210 by the width of the thin film 110. [ To this end, the thin film 110 may be formed on the flexible substrate 100 with a constant width.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims and their equivalents. And such changes are, of course, within the scope of the claims.

10: The Psalms
20: Peel Test Device
100: flexible substrate
110: Thin film
120: adhesive layer
130: Rigid plate
200: jig
210: gripper
220: Load cell

Claims (9)

A flexible substrate;
A thin film adhered to one surface of the flexible substrate with a first adhesive strength;
A rigid plate supporting the thin film; And
And a bonding layer interposed between the thin film and the rigid plate and having a second bonding strength.
The method according to claim 1,
And the second adhesive strength exceeds the first adhesive strength.
The method according to claim 1,
Wherein the rigid plate is made of a metal.
Providing a flexible substrate on one side of which a thin film is attached at a first bonding strength;
Fabricating a specimen for bonding strength measurement of a thin film by stacking the flexible substrate on the rigid plate such that the thin film faces the rigid plate and interposing an adhesive layer having a second bonding strength between the thin film and the rigid plate;
Fixing the specimen to a jig;
Holding one end of the flexible substrate using a gripper and separating the flexible substrate from the thin film toward the other end of the flexible substrate; And
And calculating the first adhesive strength by measuring a load applied to the gripper while the flexible substrate is separated from the thin film.
5. The method of claim 4,
Wherein the specimen is fixed to the jig through the rigid plate.
5. The method of claim 4,
Wherein the load applied to the gripper acts in a direction perpendicular to a contact surface between the flexible substrate and the thin film.
The method according to claim 6,
Wherein the first adhesive strength is calculated by dividing the load applied to the gripper by the width of the thin film while the flexible substrate is separated from the thin film.
5. The method of claim 4,
And the second adhesive strength exceeds the first adhesive strength.
5. The method of claim 4,
Wherein the rigid plate is made of a metal.
KR1020130156633A 2013-12-16 2013-12-16 Specimens for measuring the bonding strength of thin film and methods for measuring the bonding strength of thin film using the same KR20150069913A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107631981A (en) * 2017-09-21 2018-01-26 深圳市星源材质科技股份有限公司 Coat method of testing and its application of barrier film peel strength
WO2021017267A1 (en) * 2019-07-29 2021-02-04 武汉华星光电技术有限公司 Fixing jig

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107631981A (en) * 2017-09-21 2018-01-26 深圳市星源材质科技股份有限公司 Coat method of testing and its application of barrier film peel strength
WO2021017267A1 (en) * 2019-07-29 2021-02-04 武汉华星光电技术有限公司 Fixing jig
US11378500B2 (en) 2019-07-29 2022-07-05 Wuhan China Star Optoelectronics Technology Co., Ltd. Fixing jig

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