KR20150031147A - Composite functional sheet - Google Patents

Composite functional sheet Download PDF

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Publication number
KR20150031147A
KR20150031147A KR20130135876A KR20130135876A KR20150031147A KR 20150031147 A KR20150031147 A KR 20150031147A KR 20130135876 A KR20130135876 A KR 20130135876A KR 20130135876 A KR20130135876 A KR 20130135876A KR 20150031147 A KR20150031147 A KR 20150031147A
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KR
South Korea
Prior art keywords
sheet
functional sheet
heat
pressure
adhered
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KR20130135876A
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Korean (ko)
Inventor
이승진
김선기
정병선
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조인셋 주식회사
김선기
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Publication of KR20150031147A publication Critical patent/KR20150031147A/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Abstract

The present invention relates to a composite functional sheet of a single body which is bonded on a printed circuit board by improving functions while thinning a thickness by a hardening process with heat and pressure in which constant temperature and pressure are provided and satisfies a soldering temperature in soldering. The composite functional sheet comprises: a B-stage available functional sheet of a thermosetting heat resistant epoxy resin in which 70 wt% or more of thermal conductive ceramic powders or soft magnetic powders for preventing electromagnetic wave absorption or static electricity are mixed; and a B-stage available adhesive sheet of the thermosetting heat resistance epoxy resin which is bonded by being laminated on at least one side of the functional sheet. The functional sheet and the adhesive sheet are solid phase conditions and forms a single body by being completely bonded to each other by being thermally hardened while being thinned in a thickness of 30% or more by predetermined temperature and pressure from the outside. The other side of the functional sheet is smooth. The adhesive sheet of the single body is thermally bonded to an object by thermal hardening. The single body satisfies the temperature conditions of soldering. The functional sheet improves functions by thinning the thickness.

Description

{COMPOSITE FUNCTIONAL SHEET}

The present invention relates to a multifunctional sheet, and more particularly to a multifunctional sheet which is thinned by a curing process in which a constant temperature and pressure are provided to improve functionality and adhere to an object.

In the case of a thermally conductive sheet or an electromagnetic wave absorber sheet which has no self-adhesive force in the past, a self-sticking double-sided adhesive tape (PSA) made of a thermoplastic polymer resin which is pressed and adhered to one surface of a heat- To thereby adhere the thermally conductive sheet or the electromagnetic wave absorber sheet to the circuit board (PCB).

When the thermally conductive sheet or the electromagnetic wave absorber sheet made of a thermoplastic polymer resin is adhered to a circuit board by using a double-sided adhesive tape having a self-adhesive force that is adhered by pressure, it is difficult to reliably adhere to the circuit board and adhere to the circuit board. There is a disadvantage that it is difficult to have a reliable adhesive force because the adhesive tape is melted by the high temperature provided when the circuit board is soldered. For example, when the printed circuit board is reflow soldered, the double-sided pressure-sensitive adhesive tape adhered thereto is deformed or peeled off by heat.

In addition, when the thermally conductive sheet or the electromagnetic wave absorber sheet is not reliably adhered to the circuit board, there is a disadvantage that the electrostatic capacity and the inductance value are changed and the electrical performance is not uniform and the performance is deteriorated.

Further, since the double-sided pressure-sensitive adhesive tape has self-adhesive force at room temperature, it is difficult to handle and there is a disadvantage that the workability of the manufacturing process is inconvenient.

In another conventional technique, a thermally conductive sheet or an electromagnetic wave absorber sheet having no self-adhesive force may be applied to a liquid thermosetting adhesive agent and cured to adhere to an object. In this case, however, it is difficult to continuously and uniformly supply the pressure.

Another conventional technique can bond a thermally conductive sheet or an electromagnetic wave absorber sheet having a self-adhesive force to an object. In this case, the electromagnetic wave absorbing powder or the thermally conductive powder contained in the polymer resin deteriorates the adhesive strength and is difficult to reliably adhere to and adhere, and the adhesive strength is lowered due to the heat provided at the time of soldering.

In addition, there is a disadvantage that the electromagnetic wave absorbing performance and the heat conduction performance are deteriorated when the above-described thermally conductive sheet or the electromagnetic wave absorber sheet is not pressed sufficiently by high temperature and high pressure.

In addition, in order to improve the heat conduction performance and the electromagnetic wave absorbing performance of the heat-conductive sheet or the electromagnetic wave absorber sheet described above, a large amount of magnetic powder or thermally conductive powder must be put in. In this case, the surface is not smooth, .

Accordingly, an object of the present invention is to provide a multi-functional sheet having heat resistance that can be reliably adhered to an object such as a circuit board by high temperature and high pressure.

Another object of the present invention is to provide a composite function sheet in which electric or thermal performance is uniformized and improved by high temperature and high pressure.

Another object of the present invention is to provide a multifunctional functional sheet in which the phenomenon that the surface is smooth and the powder is released when the friction occurs is reduced.

Another object of the present invention is to provide a multi-functional sheet having heat resistance capable of accommodating the soldering temperature at the time of soldering.

Another object of the present invention is to provide a multi-functional sheet which is not melted by heat under soldering conditions.

Another object of the present invention is to provide a composite functional sheet which is easy to handle at room temperature and is easy to work.

The above object is achieved by a thermosetting heat-resistant epoxy resin B-stage capable functional sheet having a soft magnetic powder or a thermally conductive ceramic powder for electromagnetic wave absorption and prevention of static electricity mixed by 70% or more by weight; And a B-stage capable adhesive sheet of thermosetting heat-resistant epoxy resin laminated on at least one surface of the functional sheet and adhered thereto, wherein the functional sheet and the adhesive sheet are in a solid state, and the functional sheet and the adhesive The sheet is cured by heat and pressure with a thickness of 30% or more thinned from the outside by predetermined temperature and pressure, and is completely bonded to each other to form a monolithic body. The monolith satisfies the temperature condition of soldering, Characterized in that the adhesive sheet of the single body is adhered to the opposing object by the curing and the other surface of the functional sheet is smooth and the functional sheet is thinned to improve the functionality Sheet.

Preferably, the functional sheet and the adhesive sheet are adhered to each other by printing or casting a liquid heat-resistant epoxy resin corresponding to the functional sheet and the adhesive sheet on a counter sheet, followed by drying in a temperature lower than the preset temperature .

Preferably, the temperature of the drying step is about 100 占 폚, and the predetermined temperature may be about 200 占 폚.

Preferably, a heat-resistant polymer film or a metal foil satisfying the soldering temperature condition may be interposed between the functional sheet and the adhesive sheet or the other surface of the functional sheet.

Preferably, the soldering is reflow soldering with a solder cream.

Preferably, the preset temperature and pressure may be applied by iso-compression of an autoclave or a hot press.

Preferably, the object may be any of a flexible, semi-flexible and rigid printed circuit board, flat cable, or electronic component that serves to transmit or process electrical signals.

Preferably, the thickness of the multi-functional sheet may be 0.03 mm to 0.2 mm.

Preferably, the soft magnetic metal powder has a flake shape, and the ceramic powder may be spherical.

The above object is achieved by a thermosetting heat-resistant epoxy resin functional sheet having a soft magnetic powder or a thermally conductive ceramic powder for electromagnetic wave absorption and prevention of static electricity mixed in a ratio of 70% or more by weight; And a B-stage capable adhesive sheet of a thermosetting heat-resistant epoxy resin laminated on at least one surface of the functional sheet and adhered to the adhesive sheet, wherein the adhesive sheet is thinned by the preset temperature and pressure from the outside, And the other side of the functional sheet is smoothed and the adhesive sheet of the monolith is adhered to the opposed object by the curing by the preset temperature and pressure The present invention relates to a composite functional sheet.

The above object is also achieved by a thermosetting resin composition comprising a pair of thermosetting heat resistant epoxy resin B-stageable adhesive sheets; And a B-stage capable functional sheet of a heat-curable heat resistant epoxy resin interposed between and adhered to the adhesive sheet and having a soft magnetic powder or a thermally conductive ceramic powder for electromagnetic wave absorption or prevention of static electricity mixed by 70% or more by weight Wherein the functional sheet and the adhesive sheet are cured by heat and pressure while being thinned by 30% or more from a predetermined temperature and pressure from the outside, are completely bonded to each other to form a single body, the single body satisfies the temperature condition of soldering, Characterized in that the exposed surface of at least one of the adhesive sheets of the single body is thermally adhered to the opposed object by the curing by the preset temperature and pressure and the functional sheet is thinned As shown in Fig.

Preferably, the heat-resistant polymer film or the metal foil may be laminated and adhered to the exposed surface of the adhesive sheet not adhered to the object.

The above object is achieved by a heat-curable heat-resistant epoxy resin B-stage capable adhesive sheet; A heat-resistant polymer film or metal foil interposed between and adhered to the adhesive sheets; And a heat-curable heat-resistant epoxy resin having a soft magnetic powder or a thermally conductive ceramic powder for preventing electromagnetism or static electricity from being laminated and adhered on any one of the above-mentioned adhesive sheet and a B- Wherein the functional sheet and the adhesive sheet are cured by heat and pressure while being thinned by 30% or more from a predetermined temperature and pressure from the outside, and are completely bonded together to form a unitary body, and the unitary body satisfies the temperature condition of soldering The surface of the functional sheet is smoothed and the exposed surface of the heat-resistant polymer film or the adhesive sheet on which the metal foil is not laminated by the predetermined temperature and pressure is adhered to the opposed object by the curing , The functional sheet has a thinner thickness, Is improved by using the multi-functional sheet.

According to the above-described structure, the B-stageable adhesive sheet of a heat-curable heat-resistant epoxy resin having adhesiveness by heat and pressure and the B-stage capable adhesive sheet of electromagnetic wave absorbency, heat- Sheets can be stacked and used to adhere to and adhere to an object such as a printed circuit board reliably by high temperature and high pressure, and to have reliable thermal and electrical performance.

In addition, due to the high temperature and high pressure, the B-stage capable adhesive sheet and the B-stage capable functional sheet are thinned, resulting in uniform and improved thermal and electrical performance.

In addition, there is an advantage that the surface is smoothed by high temperature and high pressure, and the powder is dropped less when rubbed.

Further, since a heat-curable polymer having heat resistance is used, the soldering temperature can be satisfied at the time of soldering and is not melted by heat.

Further, since there is no self-adhesive force at room temperature, there is an advantage that it is easy to handle and the operation is convenient.

1 is a perspective view showing a multi-function sheet according to an embodiment of the present invention.
Fig. 2 shows complete bonding of the composite sheet to the FPCB.
3 is a perspective view showing a multi-functional sheet according to another embodiment of the present invention.
4 (a) and 4 (b) are perspective views showing a multi-function sheet according to another embodiment of the present invention, respectively.
5 (a), 5 (b) and 5 (c) are perspective views showing a composite function sheet according to another embodiment of the present invention, respectively.

Hereinafter, a composite function sheet according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a multi-function sheet 100 according to an embodiment of the present invention.

The multifunction functional sheet 100 is composed of a B-stage capable adhesive sheet 110 and a B-stage capable functional sheet 120 laminated on and adhered thereto.

Here, the B-stageable type means that the diluent contained in the diluent is evaporated at a temperature and a time when the cross-linking due to the reaction between the epoxy resin and the curing agent does not start and is not sticky due to little self- It is sticky at a certain temperature and pressure (high temperature and high pressure) and can have adhesive property.

The thickness of the multi-function sheet 100 may be 0.03 mm to 0.2 mm. For example, the thickness of the B-stage capable functional sheet 120 may be thicker than the thickness of the B-stage capable adhesive sheet 110 The function of the functional sheet can be maximized.

The B-stageable adhesive sheet 110 and the B-stageable functional sheet 120 are made of a heat-curable heat-resistant epoxy resin and are fully cured at high temperature and high pressure to form a unitary body and are each subjected to soldering, such as reflow soldering Temperature condition is satisfied.

Therefore, the B-stage capable adhesive sheet 110 and the B-stage capable functional sheet 120 are cured by heat and pressure while being thinned by a constant temperature and pressure from the outside, The B-stage capable adhesive sheet 110 is a flexible, semi-flexible, and rigid material that acts to transmit and process opposing objects, such as electrical signals, by curing by heat and pressure. Can be reliably adhered to any one of a printed circuit board, a flat cable, or an electronic component to improve thermal and electrical performance, and can have uniform or improved electrical or thermal properties, especially by being pressed and thinned.

As a result, since the thickness of the functional sheet 120 is reduced by heat and pressure, the functional powder contained in the functional sheet 120, for example, the electromagnetic wave absorbing powder such as soft magnetic metal powder or the density of the thermally conductive powder such as alumina Has an effect of increasing electromagnetic wave absorption, preventing static electricity, or improving thermal conductivity because it is increased in proportion to the reduced thickness.

For example, preferably, when the multifunctional sheet 100 having a thickness of 0.1 mm is an electromagnetic wave absorber, the permeability is at least 80%, and the thermal conductivity is at least 1 W / mK.

As described above, the B-stageable adhesive sheet 110 and the B-stageable functional sheet 120 are heat-resistant epoxy resins, preferably heat-resistant epoxy resins.

The B-stage-capable adhesive sheet 110 and the B-stage-capable functional sheet 120 may be formed by printing or casting a liquid heat-resistant epoxy resin on a counter sheet, followed by drying to form a laminate structure. At this time, the B-stage-capable adhesive sheet 110 and the B-stageable functional sheet 120 are laminated together by a temperature provided in the drying process.

In the process of manufacturing the B-stage capable adhesive sheet 110 and the B-stage capable functional sheet 120, the drying temperature is lower than the temperature applied for forming the monolith as described above. For example, The temperature may be around 100 占 폚 and the temperature applied to form the monolith may be around 200 占 폚. However, the above application temperature is not limited to this in consideration of the kind of the heat-resistant epoxy resin, the kind of the additive such as the curing agent and diluent, the content thereof and the working time.

The B-stage-capable functional sheet 110 is mixed with a soft magnetic metal powder in a flake shape to have electromagnetic wave absorbency or prevent static electricity, and spherical thermally conductive ceramic powder can be mixed to have thermal conductivity .

On the other hand, in a variant, the B-stage capable functional sheet 120 is made of a heat-cured, fully cured polymer resin previously sufficiently pressed by high temperature and high pressure, and the B- And can be adhered.

In this case, the B-stage capable functional sheet 120 is thinner than the B-stage capable adhesive sheet 110 because it is fully cured sufficiently beforehand by high temperature and high pressure.

According to the configuration of the modification, the B-stage-capable adhesive sheet 110 is fully cured with adhesive force at a high temperature and a high pressure to be provided thereafter, and adhered to the FPCB, the printed circuit board or the structure.

Hereinafter, a method of manufacturing and using the multi-functional sheet 100 having the above structure will be described in detail with reference to FIGS. 1 and 2. FIG.

Fig. 2 shows complete bonding of the composite sheet to the FPCB.

(Fe alloy or Ni alloy) or a thermally conductive ceramic powder (hereinafter referred to as " heat-curable ") on a thermosetting B-stageable adhesive sheet 110 produced by casting a liquid heat resistant epoxy resin to a thin thickness, Boron, and alumina) is mixed with 70% or more of the total weight of the thermosetting epoxy resin, and the thermosetting B-stageable functional sheet 120 is laminated by heat or drying.

Here, the liquid thermosetting epoxy resin is prepared by casting in the state where a liquid diluent such as methyl ethyl ketone (MEK) or alcohol is mixed at a rate of about 40%, and is dried in such a degree that the diluent can evaporate, The diluent contained in the liquid thermosetting epoxy resin is dried to become a B-stage capable functional sheet 120 having little mechanical sticking force and mechanical strength.

At this time, since the previously prepared thermosetting B-stageable adhesive sheet 110 is fully cured at about 200 캜, it can be kept in a B-stage capable state without being cured in the drying process at around 100 캜.

On the other hand, in the opposite manufacturing process, a liquid thermosetting epoxy resin adhesive is printed or cast on a previously prepared heat-curable B-stage capable functional sheet 120 and dried by heat to form a thermosetting B- The adhesive sheet 110 is laminated and adhered.

As described above, the B-stage-capable adhesive sheet 110 and the B-stageable functional sheet 120 are adhered to the FPCB 10 at a constant heat and pressure through an autoclave or a hot press, Lt; / RTI >

In this example, the FPCB 10 is exemplified as an object, but it is not limited to this, and it may be an electronic component, a case, a frame, or a display device mounted on the electronic device.

2, the multifunctional functional sheet 100 is positioned so that the B-stage capable adhesive sheet 110 is opposed to the surface of the FPCB 10 on which the circuit pattern 20 is formed, A temperature of about 150 캜 and a pressure of 22 kg / cm 2 or more are applied for about 2 hours and 40 minutes to adhere onto the FPCB 10.

As a result, the B-stage capable adhesive sheet 110 and the B-stage capable functional sheet 120 are completely cured to each other by the applied high temperature heat and high pressure to form a monolithic thermosetting B- The possible adhesive sheet 110 is reliably adhered and adhered onto the FPCB 10.

At this time, since the multifunctional functional sheet 100 is very thin, it is adhered to the FPCB 10 along the surface curvature of the FPCB 10 formed by the circuit pattern 20, and the circuit pattern of the FPCB 10 20 can be engraved in the composite functional sheet 100. [ As described above, since the multi-function sheet 100 is closely contacted to cover the circuit pattern 20 of the FPCB 10, adhesion reliability is improved. As a result, when the functional sheet 120 is an electromagnetic wave absorbing property, The effect of heat conduction and heat dissipation of the FPCB 10 due to the effect of adding the thermally conductive material to the FPCB 10 when the functional sheet 120 is thermally conductive can be effectively protected .

In other words, the electrical or thermal performance is uniformed and improved at the same time by the close contact of the multifunction functional sheet 100. For example, when the FPCB 10 on which the circuit pattern 20 is formed is used as an antenna, the value of the capacitance or the inductance must be constant in order to provide a reliable antenna performance. As described above, If attached, this condition can be met.

In order to prevent the B-stage capable functional sheet 120 from being buried when the multifunctional functional sheet 100 is pressed by an autoclave or a hot press, a protective film is formed on the B-stage capable functional sheet 120 You can press it. In this case, the surface roughness of the B-stage-capable functional sheet 120 is lowered by the protective film, and a smooth surface can be obtained.

In addition, the epoxy resin contained in the functional sheet 120 is pushed out to cover the powder by the high temperature and the high pressure on the surface of the functional sheet 120 exposed to the outside, and as a result, the surface of the multi- The powder contained in the woofer functional sheet 120 does not fall off due to external friction.

According to such a principle, there is an advantage that the insulation resistance of the surface of the functional sheet 120 becomes large in the case of the functional sheet 120 including the soft magnetic powder.

The thermally curable B-stage capable functional sheet 120 of the multifunction functional sheet 100 is located on the opposite side of the FPCB 10 or on the side where the conductive pattern is located and performs an electrical or thermal function.

Here, the temperature and pressure provided in the autoclave or the hot press is higher than the temperature and pressure provided in the drying process when the B-stage capable adhesive sheet 110 and the B-stage capable functional sheet 120 are adhered to each other high.

The B-stage capable adhesive sheet 110 and the B-stage capable functional sheet 110 are different from each other depending on the working method and the kind of the polymer resin material. The time required for complete curing of the resin 120 is sufficient. For example, when a high temperature and a high pressure are provided by a roll-to-roll process, the provided temperature and pressure become large and the working time becomes short.

In the process described above, the B-stageable adhesive sheet 110 and the B-stageable functional sheet 120 are completely cured and adhered to each other due to the applied high temperature and high pressure, Uniformity and improved electrical or thermal performance.

Preferably, the thickness of the functional sheet 120 may be thinned by more than 30% by heat and pressure to improve electrical or thermal performance.

In other words, the liquid thermosetting epoxy resin or the liquid silicone rubber is cast in a state in which a liquid diluent such as MEK or alcohol is mixed in an amount of about 40%, and the diluent is dried to form the B-stageable adhesive sheet 110 and the B When the stage-capable functional sheet 120 is manufactured, a space is formed at a portion where the diluent evaporates, and electrical and thermal performances are deteriorated. As described above, in the full curing process in which high temperature and high pressure are applied, So that the electrical or thermal performance is improved.

In addition, the soldering performed at about 200 캜, particularly the reflow soldering condition, can be satisfied, and the thickness can be thinned by 30% or more based on the initial thickness during the above-described pressing process.

3 is a perspective view showing a multi-function sheet 200 according to another embodiment of the present invention.

According to this embodiment, the multifunction functional sheet 200 is composed of a pair of B-stage capable adhesive sheets 210 and 212 and a B-stage capable functional sheet 220 sandwiched therebetween.

4 (a) and 4 (b) are perspective views showing a multi-function sheet 300 according to another embodiment of the present invention.

4A, the multifunctional functional sheet 300 includes a heat-resistant polymer film 330 interposed between the B-stageable adhesive sheet 310 and the B-stageable functional sheet 320 . Here, the heat resistant polymer film 330 satisfies the temperature conditions of soldering, particularly reflow soldering.

According to this structure, the mechanical strength is improved by the interposed polymer film 330.

Instead of the heat resistant polymer film 330, a metal foil may be used. In this case, in addition to the increase in mechanical strength, the thermal conductivity is improved and the effect of electromagnetic shielding is added.

Preferably, the thickness of the heat-resistant polymer film 330 or the metal foil may be 0.008 mm to 0.05 mm.

4 (b), the multi-function sheet 300 includes a B-stage capable adhesive sheet 310, a B-stage capable functional sheet 320 laminated on and adhered to the B-stage capable functional sheet 320, And a heat-resistant polymer film 330 such as polyimide adhered on the top.

With this configuration, the electrical insulation is reliably ensured and the mechanical strength is improved by the polymer film 330 laminated on the top surface.

If electrical insulation is not a problem, a metal foil can be used in place of the polymer film 330, as in Fig. 4 (a).

5 (a), 5 (b) and 5 (c) are perspective views showing a composite function sheet according to another embodiment of the present invention, respectively.

5A, a heat-resistant polymer film 330 or a metal foil is interposed between the B-stage capable adhesive sheet 310 and the B-stage capable functional sheet 320, and the B- The B-stage-capable adhesive sheet 312 is laminated on the functional sheet 320 and adhered.

The mechanical strength is increased by the heat resistant polymer film 330 or the metal foil which satisfies the temperature condition of the reflow soldering, and in particular, the thermal conductivity is improved by the metal foil and the electromagnetic wave is shielded.

5B, a B-stage capable functional sheet 320 is interposed between a pair of B-stage capable adhesive sheets 310 and 312, and a B- The heat-resistant polymer film 330 or the metal foil is adhered to the upper surface of the heat-

The mechanical strength is increased by the heat resistant polymer film 330 that satisfies the temperature condition of the reflow soldering and electrical insulation can be maintained at the upper surface exposed to the outside. When the metal foil is laminated, in addition to the mechanical strength, the thermal conductivity is improved and the electromagnetic wave is shielded.

5C, a heat-resistant polymer film 330 or a metal foil is interposed between a pair of B-stage capable adhesive sheets 310 and 312, and a B-stage capable adhesive sheet 312 Stage functional sheet 320 is laminated and adhered to the upper surface of the B-stage capable functional sheet 320.

The mechanical strength is increased by the heat resistant polymer film 330 that satisfies the temperature condition of the reflow soldering, and when the metal foil is laminated, the thermal conductivity is improved in addition to the mechanical strength, and the electromagnetic wave is shielded.

According to the above embodiments, the B-stage capable adhesive sheet and the B-stage capable functional sheet laminated and adhered to the B-stage capable adhesive sheet are stacked or laminated on the functional sheet made of the heat- The use of the B-stage-capable adhesive sheet has the advantage that the adhesive layer is completely cured by the high temperature and high pressure provided thereafter, the thickness is thinned, the adhesive strength is improved, and the electrical or thermal performance is uniformly improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Accordingly, the scope of the present invention should not be construed as being limited to the embodiments described above, but should be construed in accordance with the following claims.

100, 200, 300: Multifunctional sheet
110, 210, 310, 312: B-stage capable adhesive sheet
120, 220, 320: B-stage capable adhesive sheet
230, 330: heat-resistant polymer film

Claims (14)

A B-stage capable functional sheet of thermosetting heat-resistant epoxy resin mixed with 70% or more by weight of soft magnetic powder or thermally conductive ceramic powder for electromagnetic wave absorption and prevention of static electricity; And
Stage capable adhesive sheet of a thermosetting heat-resistant epoxy resin laminated on at least one surface of the functional sheet and adhered thereto,
Wherein the functional sheet and the adhesive sheet are in a solid state,
The functional sheet and the adhesive sheet are cured by heat and pressure while being thinned by 30% or more from a predetermined temperature and pressure from the outside, and are completely bonded to each other to form a unitary body. The unitary body satisfies the temperature condition of soldering,
The adhesive sheet of the monolith is adhered to the opposed object by the curing by the predetermined temperature and pressure, the other surface of the functional sheet is smoothed,
And the functional sheet is improved in thickness by the thinning of the functional sheet. The method according to claim 1,
The functional sheet and the adhesive sheet are adhered to each other by printing or casting a liquid heat-resistant epoxy resin corresponding to the functional sheet and the adhesive sheet on a counter sheet, Wherein the sheet is a multi-function sheet. The method of claim 2,
Wherein the temperature of the drying step is about 100 占 폚 and the predetermined temperature is about 200 占 폚. The method according to claim 1,
Characterized in that a heat-resistant polymer film or a metal foil satisfying the soldering temperature condition is interposed between the functional sheet and the adhesive sheet or the other surface of the functional sheet. The method according to claim 1 or 4,
Wherein the soldering is reflow soldering by a solder cream. The method according to claim 1,
Characterized in that the preset temperature and pressure are applied by iso-compression of an autoclave or a hot press. The method according to claim 1,
Characterized in that the object is any one of a flexible, semi-flexible and rigid printed circuit board, a flat cable, and an electronic component, which serves to transmit or process an electrical signal. . The method according to claim 1,
Wherein the thickness of the multi-function sheet is 0.03 mm to 0.2 mm. The method according to claim 1,
Wherein the soft magnetic metal powder has a flake shape and the ceramic powder has a spherical shape. A functional sheet of thermosetting heat-resistant epoxy resin mixed with 70% or more by weight of soft magnetic powder or thermally conductive ceramic powder for electromagnetic wave absorption and prevention of static electricity; And
Stage capable adhesive sheet of a thermosetting heat-resistant epoxy resin laminated on at least one surface of the functional sheet and adhered thereto,
Wherein the adhesive sheet is cured by heat and pressure as the thickness of the adhesive sheet is reduced by the predetermined temperature and pressure from the outside and is completely bonded to the functional sheet to form a unitary body and the other side of the functional sheet is smooth,
And the adhesive sheet of the monolith is adhered to the opposed object by the curing by the preset temperature and pressure. A pair of thermosetting heat resistant epoxy resin B-stage capable adhesive sheet; And
Stage functional sheet of a thermosetting heat-resistant epoxy resin having a soft magnetic powder or a thermally conductive ceramic powder interposed between and adhered between the adhesive sheets to prevent electromagnetic wave absorption and static electricity from being mixed in a ratio of 70% ,
Wherein the functional sheet and the adhesive sheet are cured by heat and pressure while being thinned by 30% or more from a predetermined temperature and pressure from the outside, are completely bonded to each other to form a unitary body, the unitary body satisfies the temperature condition of soldering,
The exposed surface of at least one of the adhesive sheets of the single body is thermally adhered to the opposed object by the curing by the predetermined temperature and pressure,
And the functional sheet is improved in thickness by the thinning of the functional sheet. The method of claim 11,
Wherein a heat-resistant polymer film or a metal foil is laminated and adhered to the exposed surface of the adhesive sheet not adhered to the object. A pair of thermosetting heat resistant epoxy resin B-stage capable adhesive sheet;
A heat-resistant polymer film or metal foil interposed between and adhered to the adhesive sheets; And
A B-stage capable functional sheet of a thermosetting heat resistant epoxy resin having a soft magnetic powder or a thermally conductive ceramic powder for electromagnetic wave absorption and prevention of static electricity, which is laminated and adhered on any one of the above adhesive sheets, Respectively,
Wherein the functional sheet and the adhesive sheet are cured by heat and pressure while being thinned by 30% or more from a preset temperature and pressure from the outside, and are completely bonded to each other to form a unitary body. The unitary body satisfies the temperature condition of soldering, The surface of the sheet is smoothed,
The exposed surface of the heat resistant polymer film or the adhesive sheet on which the metal foil is not laminated by the predetermined temperature and pressure is adhered to the opposed object by the curing,
And the functional sheet is improved in thickness by the thinning of the functional sheet. A composite function sheet of claim 1; And
A circuit board or a cable on which a circuit pattern is formed,
Wherein the composite function sheet is adhered to the circuit board or the cable by being adhered to the adhesive sheet of the composite function sheet by the high temperature and high pressure so that the unevenness due to the circuit pattern is formed on the adhesive sheet of the composite function sheet.
KR20130135876A 2013-09-13 2013-11-08 Composite functional sheet KR20150031147A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112235965A (en) * 2019-07-15 2021-01-15 卓英社有限公司 Heat-conducting elastic protection component for Harper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112235965A (en) * 2019-07-15 2021-01-15 卓英社有限公司 Heat-conducting elastic protection component for Harper

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