KR20150026555A - Apparatus and method for bonding touch panel and flexible printed circuit board - Google Patents

Apparatus and method for bonding touch panel and flexible printed circuit board Download PDF

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Publication number
KR20150026555A
KR20150026555A KR20130105558A KR20130105558A KR20150026555A KR 20150026555 A KR20150026555 A KR 20150026555A KR 20130105558 A KR20130105558 A KR 20130105558A KR 20130105558 A KR20130105558 A KR 20130105558A KR 20150026555 A KR20150026555 A KR 20150026555A
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KR
South Korea
Prior art keywords
touch panel
circuit board
printed circuit
jig
substrate
Prior art date
Application number
KR20130105558A
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Korean (ko)
Inventor
공태경
김기보
Original Assignee
한국터치스크린(주)
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Priority to KR20130105558A priority Critical patent/KR20150026555A/en
Publication of KR20150026555A publication Critical patent/KR20150026555A/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

The present invention can secure stable bonding between a touch panel and a printed circuit board through a mechanical structure designed to apply a constant pressure for bonding a printed circuit board and a touch panel, and simultaneously apply a mechanical bonding and a heat treatment, The present invention relates to a bonding apparatus for a touch panel, and more particularly, to a bonding apparatus for a touch panel that can simplify a bonding process of a circuit board, and a method of bonding a touch panel using the bonding apparatus. The upper and lower pressing plates are respectively in close contact with the upper and lower portions of the touch panel, and the upper and lower pressing plates are respectively provided on the upper and lower jigs, respectively. A groove-shaped printed circuit board guide portion is provided, and the upper jig and lower One of its fastening when the touch panel is a printed circuit is pressed by the upper platen and the lower platen, exposed to the outside of the touch panel substrate is characterized in that located in the space defined by the guide sections the printed circuit board.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a bonding apparatus for a touch panel,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for a touch panel and a bonding method of the touch panel using the same. More particularly, the present invention relates to a bonding apparatus for bonding a touch panel and a printed circuit board The present invention relates to a bonding apparatus for a touch panel and a method for bonding a touch panel using the bonding apparatus, which can simplify a bonding process between a touch panel and a printed circuit board by simultaneously applying mechanical bonding and heat treatment.

BACKGROUND ART A touch panel is a device mounted on a surface of a display device to convert a physical contact of a user's finger or a touch pen into an electrical signal and outputs the electrical signal. The touch panel includes a liquid crystal display, a plasma display panel, and EL (electro-luminescence) devices.

Such a touch panel can be roughly divided into a capacitive type, a resistive type, an ultrasonic type, and an infrared type according to the operation principle. Among them, the structure of the resistive type touch panel is as follows (refer to Korean Patent No. 10-903052 See note). FIG. 1 is a perspective view of a general resistive touch panel, and FIG. 2 is an exploded perspective view of a general resistive touch panel.

1 and 2, a conventional resistive touch panel is composed of a combination of an upper substrate 110 and a lower substrate 120, and the upper substrate 110 and the lower substrate 120 are formed on the lower substrate 120, A plurality of dot spacers 130 are formed at regular intervals to maintain the spacing between the light emitting diodes 120. The upper substrate 110 and the lower substrate 120 are coupled to each other through an adhesive 140. The upper substrate 110 and the lower substrate 120 are respectively connected to an insulating substrate 111 and an ITO Indium Tin Oxide (ITO) 112 (122).

Under such a structure, when an external physical force is applied to the upper substrate 110 and the ITO of the upper substrate 110 is brought into contact with the ITO of the lower substrate 120, the X-axis and Y-axis potentials And recognizes the touch position. In order to recognize the X-axis and Y-axis potentials, the touch panel is provided with an upper electrode 113 and a lower electrode 123 on the upper substrate 110 and the lower substrate 120, respectively. The upper electrode 113 and the lower electrode 123 are connected to the flexible printed circuit board 150 and the printed circuit board 150 is connected to the upper electrode 113 and the lower electrode 123, So that the touch position can be grasped.

In the conventional resistive touch panel, the flexible printed circuit board 150 is electrically connected to one or both of the upper electrode 113 and the lower electrode 123 (FIGS. 3 and 4 Reference). A conductive adhesive is provided on one end of the flexible printed circuit board 150, and the flexible printed circuit board is connected to or connected to the upper electrode 113 or the lower electrode 123 via a conductive adhesive.

The connection of the flexible printed circuit board 150 to the upper electrode 113 and the lower electrode 123 is performed by sequentially performing the heat treatment process and the bonding process. That is, in a state where the flexible printed circuit board is provided between the upper substrate 110 and the lower substrate 120, the flexible printed circuit board 150 is electrically connected to the upper electrode 113, Bonding of the upper substrate 110, the lower substrate 120, and the flexible printed circuit board 150 is completed by applying a bonding process.

The bonding process is usually performed by a bonding machine having a heat head (see FIGS. 3 and 4). In order to ensure stable bonding, the temperature, pressure, and time set in the bonding apparatus Should be optimized. If one of the conditions of temperature, pressure, and time is set incorrectly, the connection failure occurs. In addition, there are problems in that various types of joining defects are generated due to a device error of the bonding apparatus.

Korean Patent No. 10-903052

SUMMARY OF THE INVENTION It is an object of the present invention to provide a touch panel and a printed circuit board which can secure stable bonding between a touch panel and a printed circuit board through a mechanical structure designed to apply a predetermined pressure to a printed circuit board and a touch panel, The present invention provides a bonding apparatus for a touch panel and a method of bonding a touch panel using the same, which can simplify a bonding process between a touch panel and a printed circuit board by simultaneously applying mechanical bonding and heat treatment.

According to another aspect of the present invention, there is provided an apparatus for bonding a touch panel, the apparatus comprising: an upper jig and a lower jig for selectively engaging and disengaging the upper jig and the lower jig, The upper and lower pressing plates are selectively in close contact with the upper and lower portions of the touch panel. The upper and lower jigs are respectively provided with grooved printed circuit board guide portions. The upper jig and the lower pressing plate One end of the panel is pressed by the upper pressing plate and the lower pressing plate, and the printed circuit board exposed to the outside of the touch panel is located in the space formed by the printed circuit board guiding portion.

The touch panel includes an upper substrate and a lower substrate, one end of the printed circuit board is connected to one or both of the upper substrate and the lower substrate, and one end of the printed circuit board is connected to both the upper substrate and the lower substrate The upper pressurizing plate presses the upper substrate and the lower pressing plate presses the lower surface of the lower substrate. When one end of the printed circuit board is connected to one substrate, the upper pressurizing plate pressurizes the printed circuit board, As shown in FIG.

A fastening hole is provided at a corresponding position of the upper jig and the lower sheet, and a fastening screw is coupled to the fastening hole to fasten the upper jig and the lower sheet. In addition, there is a step between the lower pressure plate and the printed circuit board guide part of the lower paper, and the step between the lower pressure plate and the printed circuit board guide part is smaller than the thickness of the lower board of the touch panel. When the upper jig and the lower sheet are fastened to each other, the distance between the upper and lower pressing plates is smaller than the thickness of the pressing object provided between the upper and lower pressing plates.

The method of bonding a touch panel according to the present invention includes the steps of preparing an assembled touch panel, placing one end of the assembled touch panel on a lower pressing plate of the lower sheet, and the printed circuit board exposed to the outside of the touch panel, A step of fastening the upper jig and the lower jig by connecting the fastening screw to the fastening holes of the upper jig and the lower jig in a state where the upper jig is provided on the lower jig, And thermally treating the touch panel to electrically connect the conductive adhesive to the electrodes of the touch panel by applying heat to the conductive adhesive provided on both sides or one side of the printed circuit board.

The bonding apparatus of the touch panel and the bonding method of the touch panel using the same according to the present invention have the following effects.

It is possible to realize a junction between the touch panel and the printed circuit board through a simple mechanical structure, and the applied pressure can be selectively controlled. At the same time, the bonding process and the heat treatment process can be simultaneously performed, thereby simplifying the process.

1 is a perspective view of a general resistive touch panel;
2 is an exploded perspective view of a general resistive touch panel;
3 and 4 are reference views for explaining a bonding process using a conventional bonding apparatus.
5 is a perspective view of a bonding apparatus for a touch panel according to an embodiment of the present invention.
6A and 6B are reference views showing a touch panel coupled to a bonding apparatus according to an embodiment of the present invention.
7 is a flowchart illustrating a bonding method of a touch panel according to an embodiment of the present invention.

The touch panel is composed of a combination of an upper substrate and a lower substrate, and an upper electrode and a lower electrode are provided on the upper substrate and the lower substrate, respectively. Electrical signals of the upper electrode and the lower electrode are transmitted to a printed circuit board do. The printed circuit board of the touch panel may be electrically connected to one or both of the upper electrode and the lower electrode. The joining of the touch panel and the printed circuit board can be performed by pressing the upper substrate and the lower substrate while the printed circuit board is mounted between the upper substrate and the lower substrate of the touch panel. Thereby bonding the touch panel to the printed circuit board. The present invention can be applied to a touch panel having an upper electrode of an upper substrate and a lower electrode of a lower substrate and an upper electrode and a lower electrode electrically connected to a printed circuit board, Type touch panel.

Hereinafter, a bonding apparatus for a touch panel and a method for bonding a touch panel using the same according to an embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 5, a bonding apparatus for a touch panel according to an embodiment of the present invention includes an upper jig 510 and a lower jig 520. The upper jig 510 and the lower jig 520 form a pair of the upper jig 510 and the lower jig 520 by pressurizing and bonding the touch panel and the printed circuit board 151.

The touch panel and the printed circuit board 151 are pressed by the engagement of the upper jig 510 and the lower jig 520. For this purpose, a touch panel is mounted on the upper jig 510 and the lower jig 520, Is provided. That is, the upper jig 510 is provided with an upper pressing plate 511, and the lower jig 520 is provided with a lower pressing plate 521. The printed circuit board 151 may be electrically connected to one or both of the upper substrate 110 (the upper electrode 113) and the lower substrate 120 (the lower electrode 123) When the printed circuit board 151 is connected to two substrates, the upper pressure plate 511 presses the upper substrate 110 and the lower pressure plate 521 presses the lower surface of the lower substrate 120 (see FIG. 6B) . In the case where the printed circuit board 151 is connected to one substrate, one end of the printed circuit board 151 is mounted on the lower electrode 123 of the lower substrate 120, The lower pressing plate 521 presses the lower surface of the lower substrate 120 (see FIG. 6A).

When the upper jig 510 and the lower jig 520 are fastened, the distance between the upper and lower pressing plates 511 and 521 corresponds to the thickness of the pressing object. When both the upper substrate 110 and the lower substrate 120 are pressed, that is, when the printed circuit board 151 is connected to both the upper substrate 110 and the lower substrate 120, the upper and lower pressure plates 511, 521 correspond to the total thickness of the upper substrate 110 and the lower substrate 120. When one of the upper substrate 110 and the lower substrate 120 and the printed circuit board 151 are pressed, The distance between the lower substrate 511 and the lower pressure plate 521 corresponds to the thickness of the upper substrate 110 or the lower substrate 120. The distance between the upper pressing plate 511 and the lower pressing plate 521 is preferably designed to be slightly smaller than the thickness of the pressing object for bonding the touch panel to the printed circuit board 151 by pressurization. As the distance between the upper and lower pressing plates 511 and 521 becomes smaller, the pressure applied to the touch panel and the printed circuit board 151 in the bonded state increases. By using this principle, The distance between the pressure plate 511 and the lower pressure plate 521 can be selectively adjusted. In addition, the widths of the upper and lower pressing plates 511 and 521 can be selectively adjusted according to the length of the printed circuit board 151 bonded to the touch panel.

The upper jig 510 and the lower jig 520 are provided with fastening holes 501 for fastening the upper and lower jigs 510 and 520, 502 are combined. The upper jig 510 and the lower jig 520 can be fastened by the engagement of the fastening screw 502 with the fastening hole 501. By fastening the upper jig 510 and the lower jig 520 The pressing and bonding of the touch panel and the printed circuit board 151 becomes possible.

In order to prevent the printed circuit board 151 from being damaged during the fastening of the upper jig 510 and the lower jig 520 to the upper jig 510 and the lower jig 520, The upper jig 510 and the lower jig 520 are provided with the printed circuit board guide portions 512 and 522 at positions where the printed circuit board 151 is provided when the upper jig 510 and the lower jig 520 are fastened. And the damage of the printed circuit board 151 can be prevented even when the upper jig 510 and the lower jig 520 are fastened together. The printed circuit board guiding portion 522 of the lower jig 520 is provided adjacent to the lower pressing plate 521. The lower pressing plate 521 and the printed circuit board guiding portion 522 have a step, The step L between the lower pressing plate 521 and the printed circuit board guide portion 522 should be smaller than the thickness t of the lower substrate 120 in order to prevent the circuit board 151 from being damaged.

Next, a bonding method of the touch panel using the bonding apparatus having the above-described structure will be described.

Referring to FIG. 7, the assembled touch panel is prepared (S701). The assembled touch panel refers to a touch panel in which the upper substrate 110 and the lower substrate 120 are coupled to each other. One end of the printed circuit board 151 is preliminarily connected to the inside of the touch panel, Is exposed to the outside of the touch panel. A conductive adhesive 151 is previously provided on one end of the printed circuit board 151 provided inside the touch panel and the printed circuit board 151 is electrically connected to the upper electrode 113 and the lower substrate 120 of the upper substrate 110 The conductive adhesive 151 is provided on both sides of the printed circuit board 151 and the printed circuit board 151 is connected to only one of the two electrodes. The conductive adhesive 151 is provided only on one surface of the printed circuit board 151 that is in contact with the electrodes.

Next, the assembled touch panel is mounted on the lower jig 520 of the bonding apparatus (S702). The printed circuit board 151 exposed to the outside of the touch panel is mounted on the printed circuit board guide portion 522 of the lower jig 520, . Since the step L between the lower pressing plate 521 of the lower jig 520 and the printed circuit board guide part 522 is smaller than the thickness t of the lower substrate 120 as described above, (151) is provided on the printed circuit board guide portion (522).

Then, the upper jig 510 and the lower jig 520 are fastened (S703). Specifically, the upper jig 510 is provided on the lower jig 520 and the fastening screw 502 is coupled to the fastening hole 501 of the upper jig 510 and the lower jig 520, 510) and the lower jig (520). The upper pressing plate 511 of the upper jig 510 presses the upper substrate 110 of the touch panel (when the printed circuit board 151 is connected to both the upper substrate 110 and the lower substrate 120) The upper jig 510 and the lower jig 520 are brought into close contact with the printed circuit board 151 (when the printed circuit board 151 is connected only to the lower substrate 120) provided on the lower substrate 120 of the panel, The printed circuit board 151 and the touch panel are pressed and joined together.

With the upper jig 510 and the lower jig 520 engaged, a heat treatment process is performed (S704). In the heat treatment process, the printed circuit board 151 is bonded to the touch panel by the engagement of the upper jig 510 and the lower jig 520. In the process of doubling the bonding between the printed circuit board 151 and the touch panel, The conductive adhesive 151 provided on both sides or one side of the printed circuit board 151 is heated to apply an adhesive state 151 between the conductive adhesive 151 and the electrode (the upper electrode 113 and / or the lower electrode 123) . Conventionally, the bonding process is performed after applying the heat treatment process to the assembled touch panel. However, in the present invention, the heat treatment process and the bonding process can be simultaneously performed, thereby simplifying the process. The heat treatment may be performed at a temperature of 100 to 160 ° C for 10 to 60 minutes.

501: fastening hole 502: fastening screw
510: upper jig 511: upper pressure plate
512: printed circuit board guide part 520: lower jig
521: lower pressing plate 522: printed circuit board guide part

Claims (7)

And an upper jig and a lower jig which are selectively engaged and disengaged,
The upper and lower pressing plates are respectively in close contact with the upper and lower portions of the touch panel,
Wherein the upper jig and the lower jig are provided with grooved printed circuit board guide portions,
One end of the touch panel is pressed by the upper pressing plate and the lower pressing plate when the upper jig and the lower sheet are fastened to each other and the printed circuit board exposed to the outside of the touch panel is located in the space formed by the printed circuit board guide And a bonding apparatus for bonding the touch panel.
The touch panel according to claim 1, wherein the touch panel includes an upper substrate and a lower substrate, and one end of the printed circuit board is connected to one or both of the upper substrate and the lower substrate,
When one end of the printed circuit board is connected to both the upper substrate and the lower substrate, the upper pressing plate presses the upper substrate, the lower pressing plate presses the lower surface of the lower substrate,
Wherein when the one end of the printed circuit board is connected to one substrate, the upper pressing plate presses the printed circuit board and the lower pressing plate presses the lower surface of the lower substrate.
The apparatus of claim 1, wherein a fastening hole is provided at a corresponding position of the upper jig and the lower sheet, and an upper jig and a lower sheet are fastened to each other through a fastening screw being coupled to the fastening hole.
The touch panel according to claim 1, wherein a step is present between the lower pressing plate of the lower sheet and the printed circuit board guide part, and the step between the lower pressing plate and the printed circuit board guide part is smaller than the thickness of the lower substrate of the touch panel. The bonding device of the panel.
The bonding apparatus of claim 1, wherein a distance between the upper and lower pressing plates is smaller than a thickness of a pressing object provided between the upper and lower pressing plates when the upper jig and the lower plate are fastened.
A method of bonding a touch panel using the bonding apparatus of the touch panel of claim 1,
Preparing an assembled touch panel;
Mounting one end of the assembled touch panel on a lower pressure plate of the lower paper sheet and placing the printed circuit board exposed to the outside of the touch panel on a printed circuit board guide portion of the lower paper sheet;
Connecting an upper jig and a lower jig by connecting a fastening screw to the fastening holes of the upper jig and the lower jig in a state where the upper jig is provided on the lower jig; And
And thermally treating the touch panel in a state where the upper jig and the lower sheet are engaged to electrically connect the conductive adhesive and the electrode of the touch panel by applying heat to the conductive adhesive provided on both sides or one side of the printed circuit board Wherein the touch panel is formed of a metal.
The touch panel according to claim 6, wherein the assembled touch panel includes an upper substrate and a lower substrate, and one end of the printed circuit board is connected to one or both of the upper substrate and the lower substrate. Way.
KR20130105558A 2013-09-03 2013-09-03 Apparatus and method for bonding touch panel and flexible printed circuit board KR20150026555A (en)

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KR20130105558A KR20150026555A (en) 2013-09-03 2013-09-03 Apparatus and method for bonding touch panel and flexible printed circuit board

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170001255A (en) 2015-06-26 2017-01-04 한국터치스크린(주) Resistive type touch panel and manufacturing method thereof
US10266607B2 (en) * 2015-02-25 2019-04-23 Mogam Institute For Biomedical Research Antibody binding to TFPI and composition comprising the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10266607B2 (en) * 2015-02-25 2019-04-23 Mogam Institute For Biomedical Research Antibody binding to TFPI and composition comprising the same
EP4279128A2 (en) 2015-02-25 2023-11-22 Mogam Institute for Biomedical Research Novel antibody binding to tfpi and composition comprising the same
KR20170001255A (en) 2015-06-26 2017-01-04 한국터치스크린(주) Resistive type touch panel and manufacturing method thereof

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