KR20150019265A - Apparatus for inspecting semiconductor package - Google Patents
Apparatus for inspecting semiconductor package Download PDFInfo
- Publication number
- KR20150019265A KR20150019265A KR20130095902A KR20130095902A KR20150019265A KR 20150019265 A KR20150019265 A KR 20150019265A KR 20130095902 A KR20130095902 A KR 20130095902A KR 20130095902 A KR20130095902 A KR 20130095902A KR 20150019265 A KR20150019265 A KR 20150019265A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- accommodating
- accommodating portion
- inspection apparatus
- connection terminal
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
1. An inspection apparatus for a semiconductor package for performing a reliability test of a semiconductor package, the inspection apparatus comprising: a housing accommodating the semiconductor package so that a connection terminal of the semiconductor package faces upward; part; A connecting portion fixedly provided above the accommodating portion so as to be electrically connected to a connection terminal of the semiconductor package accommodated in the accommodating portion by lifting the accommodating portion; A receiving arrangement for aligning the receiving position of the semiconductor package such that the semiconductor package is received at the correct position of the receiving portion; And a positioning portion for aligning the positions of the accommodating portion and the connecting portion when the accommodating portion is lifted and lowered so that the connecting portion and the connecting portion of the semiconductor package accurately connect with each other.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an inspection apparatus for a semiconductor package, and more particularly to an inspection apparatus for a semiconductor package for performing a reliability test of the semiconductor package.
Generally, semiconductor packages perform reliability tests such as electrical conditions, thermal stress, and the like. At this time, a test such as a reliability test for the semiconductor package mainly uses a test device such as a test handler.
An example of a test device such as the test handler is disclosed in Korean Patent No. 1149759 (hereinafter referred to as a "cited invention"). In the reliability test of the semiconductor package using the inspection apparatus disclosed in the above citing invention, the semiconductor package is arranged so as to have a state in which the semiconductor package is set at a right angle or a connection terminal of the semiconductor package faces downward. And a connection terminal of the semiconductor package accommodated in the insert of the test tray is disposed to face the socket of the test board, and then the semiconductor package is pressed to the socket by using a pawder, Of the socket. At this time, if the connection terminal of the semiconductor package and the socket of the test board are not correctly aligned, the reliability of the reliability test is lowered, so that the connection terminal of the semiconductor package and the socket of the test board must be accurately aligned.
Here, the alignment using the inspection apparatus disclosed in the cited invention uses a structure in which a connection terminal of a semiconductor package is seated on an alignment member of a mesh structure disposed in an insert, and is inserted into a socket of a test board using a guide Structure.
However, the alignment of the connection terminals of the semiconductor package and the socket of the test board using the conventional inspection apparatus is not easy due to the workability of the alignment member and the guide as the connection terminals of the semiconductor package have fine pitches, There is a problem in that the alignment is not accurately performed. In addition, since the semiconductor package may be positioned at right angles or downward, the position of the semiconductor package may be incorrect due to its own weight, so that the alignment may be disturbed.
It is an object of the present invention to provide an inspection apparatus for a semiconductor package capable of more accurately connecting a connection terminal of a semiconductor package and a member connected to a connection terminal of the semiconductor package through precise alignment as the semiconductor package is treated more stably.
According to an aspect of the present invention, there is provided an apparatus for inspecting a semiconductor package for performing a reliability test of a semiconductor package, the apparatus comprising: 1. A semiconductor device comprising: an accommodating portion accommodating a semiconductor package and capable of lifting and lowering in a state of accommodating the semiconductor package; A connecting portion fixedly provided above the accommodating portion so as to be electrically connected to a connection terminal of the semiconductor package accommodated in the accommodating portion by lifting the accommodating portion; A receiving arrangement for aligning the receiving position of the semiconductor package such that the semiconductor package is received at the correct position of the receiving portion; And a positioning portion for aligning the positions of the accommodating portion and the connecting portion when the accommodating portion is lifted and lowered so that the connecting portion and the connecting portion of the semiconductor package accurately connect with each other.
The apparatus for inspecting a semiconductor package according to an embodiment of the present invention may further include a heating unit provided on a bottom surface of the accommodating unit to heat the semiconductor package accommodated in the accommodating unit.
As described above, according to the present invention, the inspection apparatus includes the accommodating portion capable of accommodating the semiconductor package so that the connection terminal of the semiconductor package faces upward, and the connecting portion fixedly provided above the accommodating portion, The connection terminal of the package can be electrically connected to the connection portion.
Therefore, when the receiving position of the semiconductor package accommodated in the accommodating portion and the disposing position of the accommodating portion and the disposing position of the connecting portion are accurately adjusted, the alignment of the connecting terminal and the connecting portion of the semiconductor package can be more accurately achieved. Particularly, since the connection terminals of the semiconductor package are accommodated in the accommodating portion so as to face upward, it is possible to prevent a situation in which alignment is disturbed due to its own weight.
Therefore, in the reliability test of the semiconductor package using the inspection apparatus of the present invention, since the semiconductor package and the connection portion can be more accurately aligned, the reliability of the data according to the reliability test can be expected to be improved.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram showing an inspection apparatus for a semiconductor package according to an embodiment of the present invention; FIG.
While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.
Example
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram showing an inspection apparatus for a semiconductor package according to an embodiment of the present invention; FIG.
Referring to FIG. 1, the
The
The
Thus, in the present invention, since the
In the
In the inspection of the electrical state of the
Therefore, in the inspection of the electrical state of the
In the inspection of the electrical state of the
In the present invention, the receiving position of the
In the
As described above, the
Therefore, the
Therefore, in the reliability test of the semiconductor package using the inspection apparatus of the present invention, since the semiconductor package and the connection portion can be more accurately aligned, the reliability of the data according to the reliability test is improved. As a result, It can be expected that the product competitiveness will be secured.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.
11: accommodating portion 13: connecting portion
15: Heating section 17:
19: connecting member 21:
23: insertion part 25: positioning part
51: semiconductor package 53: connection terminal
100: Inspection device
Claims (2)
An accommodating portion accommodating the semiconductor package such that a connection terminal of the semiconductor package faces upward, and capable of ascending and descending while accommodating the semiconductor package;
A connecting portion fixedly provided above the accommodating portion so as to be electrically connected to a connection terminal of the semiconductor package accommodated in the accommodating portion by lifting the accommodating portion;
A receiving arrangement for aligning the receiving position of the semiconductor package such that the semiconductor package is received at the correct position of the receiving portion; And
And a positioning unit for aligning the positions of the accommodating unit and the connection unit when the accommodating unit is lifted and lowered so that the connection terminals of the semiconductor package and the connection unit accurately connect to each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130095902A KR102041183B1 (en) | 2013-08-13 | 2013-08-13 | Apparatus and Method for inspecting semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130095902A KR102041183B1 (en) | 2013-08-13 | 2013-08-13 | Apparatus and Method for inspecting semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150019265A true KR20150019265A (en) | 2015-02-25 |
KR102041183B1 KR102041183B1 (en) | 2019-11-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020130095902A KR102041183B1 (en) | 2013-08-13 | 2013-08-13 | Apparatus and Method for inspecting semiconductor package |
Country Status (1)
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KR (1) | KR102041183B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180001918A (en) * | 2016-06-28 | 2018-01-05 | 세메스 주식회사 | Method of inspecting insert assembly and test socket for inspecting semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005172492A (en) * | 2003-12-09 | 2005-06-30 | Nec Electronics Corp | Test system and test method for semiconductor package |
KR20110093456A (en) * | 2010-02-12 | 2011-08-18 | 삼성전자주식회사 | Insert containing apparatus of semiconductor package |
KR20130076722A (en) * | 2011-12-28 | 2013-07-08 | 가부시키가이샤 아드반테스트 | Electronic component testing apparatus |
-
2013
- 2013-08-13 KR KR1020130095902A patent/KR102041183B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005172492A (en) * | 2003-12-09 | 2005-06-30 | Nec Electronics Corp | Test system and test method for semiconductor package |
KR20110093456A (en) * | 2010-02-12 | 2011-08-18 | 삼성전자주식회사 | Insert containing apparatus of semiconductor package |
KR20130076722A (en) * | 2011-12-28 | 2013-07-08 | 가부시키가이샤 아드반테스트 | Electronic component testing apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180001918A (en) * | 2016-06-28 | 2018-01-05 | 세메스 주식회사 | Method of inspecting insert assembly and test socket for inspecting semiconductor device |
Also Published As
Publication number | Publication date |
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KR102041183B1 (en) | 2019-11-06 |
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