KR20150019265A - Apparatus for inspecting semiconductor package - Google Patents

Apparatus for inspecting semiconductor package Download PDF

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Publication number
KR20150019265A
KR20150019265A KR20130095902A KR20130095902A KR20150019265A KR 20150019265 A KR20150019265 A KR 20150019265A KR 20130095902 A KR20130095902 A KR 20130095902A KR 20130095902 A KR20130095902 A KR 20130095902A KR 20150019265 A KR20150019265 A KR 20150019265A
Authority
KR
South Korea
Prior art keywords
semiconductor package
accommodating
accommodating portion
inspection apparatus
connection terminal
Prior art date
Application number
KR20130095902A
Other languages
Korean (ko)
Other versions
KR102041183B1 (en
Inventor
이진환
Original Assignee
세메스 주식회사
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Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020130095902A priority Critical patent/KR102041183B1/en
Publication of KR20150019265A publication Critical patent/KR20150019265A/en
Application granted granted Critical
Publication of KR102041183B1 publication Critical patent/KR102041183B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

1. An inspection apparatus for a semiconductor package for performing a reliability test of a semiconductor package, the inspection apparatus comprising: a housing accommodating the semiconductor package so that a connection terminal of the semiconductor package faces upward; part; A connecting portion fixedly provided above the accommodating portion so as to be electrically connected to a connection terminal of the semiconductor package accommodated in the accommodating portion by lifting the accommodating portion; A receiving arrangement for aligning the receiving position of the semiconductor package such that the semiconductor package is received at the correct position of the receiving portion; And a positioning portion for aligning the positions of the accommodating portion and the connecting portion when the accommodating portion is lifted and lowered so that the connecting portion and the connecting portion of the semiconductor package accurately connect with each other.

Description

[0001] Apparatus for inspecting semiconductor package [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an inspection apparatus for a semiconductor package, and more particularly to an inspection apparatus for a semiconductor package for performing a reliability test of the semiconductor package.

Generally, semiconductor packages perform reliability tests such as electrical conditions, thermal stress, and the like. At this time, a test such as a reliability test for the semiconductor package mainly uses a test device such as a test handler.

An example of a test device such as the test handler is disclosed in Korean Patent No. 1149759 (hereinafter referred to as a "cited invention"). In the reliability test of the semiconductor package using the inspection apparatus disclosed in the above citing invention, the semiconductor package is arranged so as to have a state in which the semiconductor package is set at a right angle or a connection terminal of the semiconductor package faces downward. And a connection terminal of the semiconductor package accommodated in the insert of the test tray is disposed to face the socket of the test board, and then the semiconductor package is pressed to the socket by using a pawder, Of the socket. At this time, if the connection terminal of the semiconductor package and the socket of the test board are not correctly aligned, the reliability of the reliability test is lowered, so that the connection terminal of the semiconductor package and the socket of the test board must be accurately aligned.

Here, the alignment using the inspection apparatus disclosed in the cited invention uses a structure in which a connection terminal of a semiconductor package is seated on an alignment member of a mesh structure disposed in an insert, and is inserted into a socket of a test board using a guide Structure.

However, the alignment of the connection terminals of the semiconductor package and the socket of the test board using the conventional inspection apparatus is not easy due to the workability of the alignment member and the guide as the connection terminals of the semiconductor package have fine pitches, There is a problem in that the alignment is not accurately performed. In addition, since the semiconductor package may be positioned at right angles or downward, the position of the semiconductor package may be incorrect due to its own weight, so that the alignment may be disturbed.

It is an object of the present invention to provide an inspection apparatus for a semiconductor package capable of more accurately connecting a connection terminal of a semiconductor package and a member connected to a connection terminal of the semiconductor package through precise alignment as the semiconductor package is treated more stably.

According to an aspect of the present invention, there is provided an apparatus for inspecting a semiconductor package for performing a reliability test of a semiconductor package, the apparatus comprising: 1. A semiconductor device comprising: an accommodating portion accommodating a semiconductor package and capable of lifting and lowering in a state of accommodating the semiconductor package; A connecting portion fixedly provided above the accommodating portion so as to be electrically connected to a connection terminal of the semiconductor package accommodated in the accommodating portion by lifting the accommodating portion; A receiving arrangement for aligning the receiving position of the semiconductor package such that the semiconductor package is received at the correct position of the receiving portion; And a positioning portion for aligning the positions of the accommodating portion and the connecting portion when the accommodating portion is lifted and lowered so that the connecting portion and the connecting portion of the semiconductor package accurately connect with each other.

The apparatus for inspecting a semiconductor package according to an embodiment of the present invention may further include a heating unit provided on a bottom surface of the accommodating unit to heat the semiconductor package accommodated in the accommodating unit.

As described above, according to the present invention, the inspection apparatus includes the accommodating portion capable of accommodating the semiconductor package so that the connection terminal of the semiconductor package faces upward, and the connecting portion fixedly provided above the accommodating portion, The connection terminal of the package can be electrically connected to the connection portion.

Therefore, when the receiving position of the semiconductor package accommodated in the accommodating portion and the disposing position of the accommodating portion and the disposing position of the connecting portion are accurately adjusted, the alignment of the connecting terminal and the connecting portion of the semiconductor package can be more accurately achieved. Particularly, since the connection terminals of the semiconductor package are accommodated in the accommodating portion so as to face upward, it is possible to prevent a situation in which alignment is disturbed due to its own weight.

Therefore, in the reliability test of the semiconductor package using the inspection apparatus of the present invention, since the semiconductor package and the connection portion can be more accurately aligned, the reliability of the data according to the reliability test can be expected to be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram showing an inspection apparatus for a semiconductor package according to an embodiment of the present invention; FIG.

While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Example

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram showing an inspection apparatus for a semiconductor package according to an embodiment of the present invention; FIG.

Referring to FIG. 1, the testing apparatus 100 of the present invention includes a receiving portion 11, a connecting portion 13, and the like for performing a reliability test such as an electrical state, thermal stress, etc. of the semiconductor package 51 can do.

The accommodating portion 11 accommodates the semiconductor package 51 so that the connection terminal 53 of the semiconductor package 51 faces upward. That is, the bottom of the receiving portion 11 is provided so as to face the ground, and the semiconductor package 51 is received on the upper surface of the receiving portion 11. The receiving portion 11 may be provided so as to be movable up and down. Thus, although not shown, the receiving portion 11 may be connected to a member capable of raising and lowering the receiving portion 11. Here, as an example of the member capable of raising and lowering the accommodating portion 11, there is an air cylinder.

The semiconductor package 51 is received in the receiving part 11 so that the semiconductor package 51 is received at the correct position of the receiving part 11 when the semiconductor package 51 is received in the receiving part 11. [ And a receiving arrangement part 17 for aligning the receiving position of the receiving part. The accommodating and aligning unit 17 may be configured to guide the edge of the semiconductor package 51 when the semiconductor package 51 is accommodated in the accommodating unit 11, (Not shown).

Thus, in the present invention, since the accommodating portion 11 and the accommodating alignment portion 17 are provided, the connection terminal 53 of the semiconductor package 51 is received so as to face upward, and the semiconductor package 51 And can be accommodated in the receiving portion 11 in an accurately aligned state.

In the inspection apparatus 100 of the present invention, the connection portion 14 is electrically connected to the connection terminal 53 of the semiconductor package 51 accommodated in the accommodating portion 11 by lifting the accommodating portion 11 As shown in FIG. Accordingly, the connection portion 13 may be provided to be fixed above the accommodation portion 11. [ The connecting portion 13 may include a member 19 that can be electrically connected to the connection terminal 53 of the semiconductor package 51 by lifting and lowering the accommodating portion 11. [ That is, the connection portion 13 may include a member 19 such as a terminal that can be electrically connected to the connection terminal 53 of the semiconductor package 51.

In the inspection of the electrical state of the semiconductor package 51 using the inspection apparatus 100 of the present invention, the semiconductor package 51 is accommodated in the accommodating portion 11, The connection portion 13 of the semiconductor package 51 is connected to the connecting portion 13 so that the connection portion 13 of the semiconductor package 51 is connected to the connecting portion 13, As shown in Fig.

Therefore, in the inspection of the electrical state of the semiconductor package 51 using the inspection apparatus 100 of the present invention, it is possible to prevent a situation where the semiconductor package 51 is misaligned due to the load, The connection terminal 53 of the package 51 and the connection portion 13 can be connected more accurately.

In the inspection of the electrical state of the semiconductor package 51 using the inspection apparatus 100 of the present invention, in addition to the alignment position of the semiconductor package 51, the accommodating portion 11, It is also necessary to align the positions between the first and second contact portions 13. The inspection apparatus 100 of the present invention may include a positioning unit 25 for aligning the positions of the accommodating unit 11 and the connection unit 13 when the accommodating unit 11 moves up and down. The positioning unit 25 may include a protrusion 21 and an insertion unit 23. In the present invention, the protrusion 21 is provided in the connection unit 13, 23 can be provided in the accommodating portion 11. [ The insertion portion 23 provided in the accommodating portion 11 is inserted into the protruding portion 21 provided in the connection portion 13 when the accommodating portion 11 ascends and descends toward the connection portion 13, Alignment can be achieved. The positioning portion 25 may have a structure in which the projecting portion 21 is provided in the receiving portion 11 and the insertion portion 23 is provided in the connecting portion 13. [

In the present invention, the receiving position of the semiconductor package 51 is aligned using the receiving aligning portion 17, and the receiving portion 11 and the connecting portion 13 of the semiconductor package 51 are also aligned with each other, the connection terminal 53 of the semiconductor package 51 and the connection portion 13 can be more accurately connected.

In the inspection apparatus 100 of the present invention, the heating unit 15 may be provided on the bottom surface of the accommodating unit 11. As described above, the inspection apparatus 100 of the present invention can heat the semiconductor package 51 accommodated in the accommodating portion 11 by providing the heating portion 15. [ The heating of the semiconductor package 51 accommodated in the accommodating portion 11 by using the heating portion 15 is also for examining the thermal stress of the semiconductor package 51 as well.

As described above, the inspection apparatus 100 according to the present invention has a structure in which the connection terminals 53 of the semiconductor package 51 can be received so as to face upward, Not only the connection terminal 53 of the semiconductor package 51 and the connection portion 13 can be connected more accurately but also the use of a member such as a conventional test tray, Structure.

Therefore, the inspection apparatus 100 of the present invention accurately detects the placement position of the accommodating section 11 and the placement position of the connection section 13 together with the accommodating position of the semiconductor package 51 accommodated in the accommodating section 11 The connection terminal 53 of the semiconductor package 51 can be more accurately aligned with the connection portion 13 and the connection terminal 53 of the semiconductor package 51 can be aligned It is possible to prevent a situation in which alignment is disturbed due to its own weight.

Therefore, in the reliability test of the semiconductor package using the inspection apparatus of the present invention, since the semiconductor package and the connection portion can be more accurately aligned, the reliability of the data according to the reliability test is improved. As a result, It can be expected that the product competitiveness will be secured.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

11: accommodating portion 13: connecting portion
15: Heating section 17:
19: connecting member 21:
23: insertion part 25: positioning part
51: semiconductor package 53: connection terminal
100: Inspection device

Claims (2)

1. An inspection apparatus for a semiconductor package for performing a reliability test of a semiconductor package,
An accommodating portion accommodating the semiconductor package such that a connection terminal of the semiconductor package faces upward, and capable of ascending and descending while accommodating the semiconductor package;
A connecting portion fixedly provided above the accommodating portion so as to be electrically connected to a connection terminal of the semiconductor package accommodated in the accommodating portion by lifting the accommodating portion;
A receiving arrangement for aligning the receiving position of the semiconductor package such that the semiconductor package is received at the correct position of the receiving portion; And
And a positioning unit for aligning the positions of the accommodating unit and the connection unit when the accommodating unit is lifted and lowered so that the connection terminals of the semiconductor package and the connection unit accurately connect to each other. The inspection apparatus of a semiconductor package according to claim 1, further comprising a heating section provided on a bottom surface of the accommodating section to heat the semiconductor package accommodated in the accommodating section.
KR1020130095902A 2013-08-13 2013-08-13 Apparatus and Method for inspecting semiconductor package KR102041183B1 (en)

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Application Number Priority Date Filing Date Title
KR1020130095902A KR102041183B1 (en) 2013-08-13 2013-08-13 Apparatus and Method for inspecting semiconductor package

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Application Number Priority Date Filing Date Title
KR1020130095902A KR102041183B1 (en) 2013-08-13 2013-08-13 Apparatus and Method for inspecting semiconductor package

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KR20150019265A true KR20150019265A (en) 2015-02-25
KR102041183B1 KR102041183B1 (en) 2019-11-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180001918A (en) * 2016-06-28 2018-01-05 세메스 주식회사 Method of inspecting insert assembly and test socket for inspecting semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005172492A (en) * 2003-12-09 2005-06-30 Nec Electronics Corp Test system and test method for semiconductor package
KR20110093456A (en) * 2010-02-12 2011-08-18 삼성전자주식회사 Insert containing apparatus of semiconductor package
KR20130076722A (en) * 2011-12-28 2013-07-08 가부시키가이샤 아드반테스트 Electronic component testing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005172492A (en) * 2003-12-09 2005-06-30 Nec Electronics Corp Test system and test method for semiconductor package
KR20110093456A (en) * 2010-02-12 2011-08-18 삼성전자주식회사 Insert containing apparatus of semiconductor package
KR20130076722A (en) * 2011-12-28 2013-07-08 가부시키가이샤 아드반테스트 Electronic component testing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180001918A (en) * 2016-06-28 2018-01-05 세메스 주식회사 Method of inspecting insert assembly and test socket for inspecting semiconductor device

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