KR20150010010A

KR20150010010A - Optical semiconductor illuminating apparatus

Info

Publication number: KR20150010010A
Application number: KR20130083576A
Authority: KR
Inventors: 국지은; 김경례; 최재영; 김지완
Original assignee: 주식회사 포스코엘이디
Priority date: 2013-07-16
Filing date: 2013-07-16
Publication date: 2015-01-28

Abstract

The present invention relates to an optical semiconductor illuminating apparatus. The optical semiconductor illuminating apparatus includes a light emitting module including at least one semiconductor optical device; a first optical member which is extended from the edge of the light emitting module and is made of a semi-transparent and transparent material; and a second optical member which receives the first optical member and the light emitting module and has an open surface. The second member is transparent to improve illuminance and minimize the formation of a dark part.

Description

[0001] OPTICAL SEMICONDUCTOR ILLUMINATION APPARATUS [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus that can increase illuminance while minimizing the formation of arm portions.

Optical semiconductors using light sources such as LEDs (light emitting diodes), organic light emitting diodes (LEDs), laser diodes, organic light emitting diodes, etc. have lower power consumption than those of incandescent lamps and fluorescent lamps, have a long service life and excellent durability, It is one of the parts popularly used for illumination.

A luminaire using a semiconductor optical device such as an LED or the like as a light source has a structure having only one directional light distribution. The light distribution is controlled by using a lens, a reflector, a diffusion cover, and the like.

However, in a luminaire using a semiconductor optical device such as an LED or the like as a light source, there arises a problem that the backside of the illumination, for example, the inside of the reflector becomes dark due to the directivity of the light emitted from the LED itself.

In addition, in the case of a lighting device such as a light bulb type product, too much light is irradiated to the rear surface, which causes a problem that the illuminance is relatively lowered.

Patent Application No. 10-2008-0000192 Patent Application No. 10-2010-0123041

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide an optical semiconductor lighting apparatus which can increase the illuminance while minimizing the formation of arm portions.

According to an aspect of the present invention, there is provided a light emitting module including: a light emitting module including at least one semiconductor optical device; A first optical member extending from an edge of the light emitting module and made of a translucent or transparent material; And a second optical member which receives the light emitting module and the first optical member and whose one surface is open, and the second optical member is transparent.

Here, the optical semiconductor lighting device may further include a diffusion cover coupled to one surface of the first optical member.

At this time, the diffusion cover may be a transparent or semitransparent material, specifically, a transparent or translucent resin, and a fluorescent material mixed with the resin.

The first optical member may further include a transparent or translucent diffusion cover which is formed integrally with the first optical member so as to face the light emitting module.

It is a matter of course that a light pattern may be formed on the inner surface of the second optical member such that an obstacle and a valley are repeated from the edge of the light emitting module toward the one surface.

In addition, the 'semiconductor optical device' described in the claims and the detailed description means such as a light emitting diode chip or the like which includes or uses an optical semiconductor.

The 'semiconductor optical device' may include a package level including various kinds of optical semiconductor devices including the above-described light emitting diode chip.

According to the present invention having the above-described configuration, the following effects can be achieved.

First, since the first optical member built in the second optical member made of a transparent material can irradiate light to the rear surface of the second optical member, the occurrence of the dark portion can be minimized, Can be improved.

In particular, when the present invention is applied to an illumination device such as a down light, it is possible to realize an effect of making the lighting target space appear to be brighter.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional schematic view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention;
2 is a cross-sectional schematic view showing the overall structure of an optical semiconductor lighting device according to another embodiment of the present invention.
3 to 7 are sectional schematic views showing the structure of a diffusion cover, which is a main part of an optical semiconductor lighting apparatus according to various embodiments of the present invention.
8 is a schematic cross-sectional view showing the overall structure of an optical semiconductor lighting device according to another embodiment of the present invention.
9 is a cross-sectional schematic view showing the overall structure of an optical semiconductor lighting device according to another embodiment of the present invention.
FIG. 10 is a graph showing that the optical semiconductor illuminating apparatus according to an embodiment of the present invention and conventional lighting apparatuses are illuminated through the illuminance comparison

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a schematic cross-sectional view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view illustrating the overall structure of an optical semiconductor lighting apparatus according to another embodiment of the present invention. 7 is a schematic cross-sectional view showing the structure of a diffusion cover, which is a major part of an optical semiconductor lighting apparatus according to various embodiments of the present invention.

It can be understood that the present invention includes the first optical member 100, the second optical member 300, and the light emitting module 400 as shown.

The second optical member 300 is made of a transparent material whose one surface is opened, and forms a space in which the light emitting module 400 and the first optical member 100, which will be described later, are embedded.

The light emitting module 400 includes at least one semiconductor optical device 401 incorporated in the second optical member 300, and the semiconductor optical device 401 serves as a light source.

The first optical member 100 is a translucent or transparent material that is embedded in the second optical member 300 and extends from the edge of the light emitting module 400 toward the one surface. It can be said that it is a member for changing the direction.

It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention.

The first optical member 100 is a member for changing the direction of light emitted from the light emitting module 400 as described above and has a shape gradually increasing toward one surface side of the opened second optical member 300.

That is, since the first optical member 100 is made of a transparent or semi-transparent material, the light having a strong directivity emitted from the light emitting module 400 will be transmitted or reflected by colliding with an unspecified point of the first optical member 100 The transmitted light is transmitted through the second optical member 300 to be irradiated to the back surface of the second optical member 300, and the reflected light is irradiated to the front surface of the second optical member 300.

Here, the inclination angle? Formed by the first optical member 100 with the light emitting module 400 can be set within a range of 90 degrees to 180 degrees so as to realize the objective downstream light, and the inclination angle? More preferably within a range of 90 degrees to 150 degrees.

2, the present invention is coupled to one surface of the first optical member 100 to change the direction of light emitted from the light emitting module 400 together with the first optical member 100, And a diffusion cover 500 for allowing light to be irradiated to the light emitting device 500.

Of course, the main purpose of the diffusion cover 500 is to widen the area irradiated with light due to its terminological characteristics. However, it is also necessary to add a light pattern, paint or the like to the diffusion cover 500 itself to narrow the irradiation area of light Of course it is possible.

The second optical member 300 accommodates the light emitting module 400 as described above and includes a diffusion cover 500 corresponding to the light emitting module 400 in view of the light engine concept To serve as the 'engine body' of the light engine.

The main body of the engine will be understood as a structural concept that extends to the combination of the light emitting module defined in the consortium of LED lighting engine standard, "Zhaga consortium", and the electrically connected power unit.

As described above, the diffusion cover 500 widens an area irradiated with light from the light emitting module 400, and is preferably made of a transparent or translucent material as compared with the transparent second optical member 300.

That is, since the diffusion cover 500 is made of a transparent or semi-transparent material, the light emitted from the light emitting module 400 having high linearity will be transmitted or reflected by colliding with an unspecified point of the diffusion cover 500, The light is irradiated toward the front side of the second optical member 300 and the reflected light is transmitted through the first optical member 100 that is transparent or translucent to the side or back side of the second optical member 300, The arm portion is minimized.

The diffusion cover 500 may include a transparent or translucent resin 510 and a fluorescent material 520 to be mixed with the resin 510 as shown in FIG. 3 or may include a resin 510 The fluorescent material 530 may be formed on one side of the resin 510 or the fluorescent material 530 may be formed on both sides of the resin 510 as shown in FIG.

6, the diffusion cover 500 may be formed by applying an insulating protective organic coating agent to form a conformal coating layer 540 on one side of the resin 510 as shown in FIG. 6, 510 may be coated with an insulating protective organic coating agent to form the conformal coating layer 540 on both sides.

It is needless to say that the present invention may be applied to an embodiment having a first optical member 100 'formed integrally on the inclined outer surface of the diffusion cover as shown in FIGS.

The first optical member 100 'is formed in a truncated cone shape having a trapezoidal cross section as shown in the figure, and the first optical member 100' is an outer surface inclined toward the one side of the light emitting module 400 ' And a diffusion cover 120 of transparent or semitransparent material which is formed integrally with the first optical member 100 'so as to face the light emitting module 400' is provided at an end edge of the outer surface 110 to be.

Here, the height h of the first optical member 100 'extending from the light emitting module 400' is the distance from the center of the light emitting module 400 'to the imaginary part connecting the two side edges of the light emitting module 400' (W) of the straight line length (w).

That is, the ratio of the height h to the length w can be freely set within the range of 1: 2, such as 1: 1 to 9, as shown in FIG.

At this time, the inclination angle? Formed by the inclined outer surface 110 with the light emitting module 400 'can be set in a range of 45 degrees to 90 degrees, and the inclination angle? Is set so that the desired post- It can be freely set within a range of 60 to 90 degrees.

The second optical member 300 'functions in the same manner as the second optical member 300 of the embodiment shown in FIGS. 1 and 2. The second optical member 300' is formed in a hemispherical shape from the edge of the light emitting module 400 ' do.

The inner surface of the second optical member 300 'has a mountain 310 and a valley 320 facing the one side from the edge of the light emitting module 400' to induce light scattering and light diffusion and prevent glare, It is preferable to form a light pattern 300p having various shapes such as a repeated pattern.

In order to comparatively analyze the degree of formation of the afterglow light by using the transparent second optical member 300, 300 'of the optical semiconductor lighting apparatus according to the present invention and the transparent or translucent diffusion covers 500, 120, The light distribution of a conventional lighting apparatus having a housing and a transparent or translucent diffusion cover was measured and compared with each other as shown in the graph of Fig.

For reference, the circles in the dotted line in FIG. 10 are conventional lighting apparatuses, and the closed curve indicated by the solid line portion is the optical semiconductor lighting apparatus according to the present invention.

Accordingly, as compared with the conventional lighting apparatus in which the after-shake light is not formed at all, the present invention shows a region in which the annular light is formed at the lower center of the graph as shown in the graph of FIG.

As described above, it is understood that the present invention is based on a technical idea to provide an optical semiconductor lighting device that can increase the illuminance while minimizing the formation of dark portions.

It will be apparent to those skilled in the art that many other modifications and applications are possible within the scope of the basic technical idea of the present invention.

100 ... first reflector 200 ... second reflector
300 ... housing 400 ... light emitting module
500 ... spread cover

Claims

A light emitting module including at least one semiconductor optical device;
A first optical member extending from an edge of the light emitting module and made of a translucent or transparent material; And
And a second optical member which receives the light emitting module and the first optical member and whose one surface is open,
And the second optical member is transparent.

The method according to claim 1,
In the optical semiconductor lighting device,
And a diffusion cover coupled to one surface of the first optical member.

The method of claim 2,
Wherein the diffusion cover is made of transparent or semitransparent material.

The method of claim 2,
The diffusion cover
Transparent or translucent resin,
And a fluorescent material to be mixed with the resin.

The method of claim 2,
The diffusion cover
Transparent or translucent resin,
And a fluorescent material formed on both sides or one side of the resin.

The method according to claim 1,
At the end of the first optical member,
Further comprising a transparent or translucent diffusion cover formed to face the light emitting module and formed integrally with the first optical member.

The method according to claim 1,
And a light pattern is formed on the inner surface of the second optical member so that the peak and the valley are repeated from the edge of the light emitting module toward the one surface.