KR20140120283A - Composition for laser direct structuring process - Google Patents
Composition for laser direct structuring process Download PDFInfo
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- KR20140120283A KR20140120283A KR1020140066515A KR20140066515A KR20140120283A KR 20140120283 A KR20140120283 A KR 20140120283A KR 1020140066515 A KR1020140066515 A KR 1020140066515A KR 20140066515 A KR20140066515 A KR 20140066515A KR 20140120283 A KR20140120283 A KR 20140120283A
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- KR
- South Korea
- Prior art keywords
- resin
- laser
- weight
- resin composition
- parts
- Prior art date
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- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 239000010451 perlite Substances 0.000 description 1
- 235000019362 perlite Nutrition 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000005120 petroleum cracking Methods 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001008 quinone-imine dye Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- HTNRBNPBWAFIKA-UHFFFAOYSA-M rhodamine 700 perchlorate Chemical compound [O-]Cl(=O)(=O)=O.C1CCN2CCCC3=C2C1=C1OC2=C(CCC4)C5=[N+]4CCCC5=CC2=C(C(F)(F)F)C1=C3 HTNRBNPBWAFIKA-UHFFFAOYSA-M 0.000 description 1
- TUIHPLOAPJDCGN-UHFFFAOYSA-M rhodamine 800 Chemical compound [Cl-].C1CCN2CCCC3=C2C1=C1OC2=C(CCC4)C5=[N+]4CCCC5=CC2=C(C#N)C1=C3 TUIHPLOAPJDCGN-UHFFFAOYSA-M 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- KBAFDSIZQYCDPK-UHFFFAOYSA-M sodium;octadecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCCCCCCCS([O-])(=O)=O KBAFDSIZQYCDPK-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 229910052566 spinel group Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000003831 tetrazolyl group Chemical group 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000001017 thiazole dye Substances 0.000 description 1
- 125000004001 thioalkyl group Chemical group 0.000 description 1
- 125000005000 thioaryl group Chemical group 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- IYQYZZHQSZMZIG-UHFFFAOYSA-N tricyclo[5.2.1.0(2.6)]deca-3,8-diene, 4.9-dimethyl Chemical compound C1C2C3C=C(C)CC3C1C=C2C IYQYZZHQSZMZIG-UHFFFAOYSA-N 0.000 description 1
- MZHULIWXRDLGRR-UHFFFAOYSA-N tridecyl 3-(3-oxo-3-tridecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCC MZHULIWXRDLGRR-UHFFFAOYSA-N 0.000 description 1
- 150000004684 trihydrates Chemical class 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- YJLVKRVGSARISS-UHFFFAOYSA-N tris(2,6-dimethylphenyl) phosphite Chemical compound CC1=CC=CC(C)=C1OP(OC=1C(=CC=CC=1C)C)OC1=C(C)C=CC=C1C YJLVKRVGSARISS-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000001018 xanthene dye Substances 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- WGEATSXPYVGFCC-UHFFFAOYSA-N zinc ferrite Chemical compound O=[Zn].O=[Fe]O[Fe]=O WGEATSXPYVGFCC-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Abstract
Description
본 발명은 수지 표면에 대한 금속층 도금에 관한 것이며, 더욱 상세하게는 레이저 직접 구조화 공정(laser direct structuring process)용 조성물에 관한 것이다.The present invention relates to metal layer plating on a resin surface, and more particularly to a composition for a laser direct structuring process.
수지 성형체 표면의 적어도 일부에 금속층을 도금하기 위하여, 레이저 직접 구조화 공정이 사용될 수 있다. 레이저 직접 구조화 공정은, 도금 단계 이전에 수행되는 공정으로서, 수지 성형체 표면의 도금 대상 영역에 레이저를 조사함으로써, 수지 성형체 표면의 도금 대상 영역을 개질하여 도금에 적합한 성질을 갖도록 하는 공정을 의미한다. 이를 위하여, 수지 성형체는, 레이저에 의하여 금속 핵을 형성할 수 있는 "레이저 직접 구조화용 핵 생성제(이하 간단히 '핵 생성제'라 함)"를 함유하여야 한다. 수지 성형체에 함유된 핵 생성제는, 레이저를 받으면, 분해되면서 금속 핵을 생성한다. 또한, 레이저가 조사된 도금 대상 영역은 표면 거칠기를 갖게 된다. 이러한 금속 핵 및 표면 거칠기의 존재로 인하여, 레이저로 개질된 도금 대상 영역은 도금에 적합하게 된다. In order to plate a metal layer on at least a part of the surface of the resin molded article, a laser direct structuring process may be used. The laser direct structuring step is a step performed before the plating step, and means a step of modifying a region to be plated on the surface of the resin molded article by irradiating a laser beam onto a region to be plated on the surface of the resin molded body to have properties suitable for plating. To this end, the resin molded article should contain a "nucleating agent for direct laser structuring " (hereinafter, simply referred to as " nucleating agent ") capable of forming metal nuclei by a laser. Upon receiving the laser, the nucleating agent contained in the resin molded article is decomposed to produce metal nuclei. In addition, the area to be plated irradiated with the laser has a surface roughness. Due to the presence of such metallic nuclei and surface roughness, the area to be plated which is laser modified is suitable for plating.
레이저 직접 구조화 공정을 사용하면, 수지 성형체의 3차원 형상 위에 전기/전자 회로를 빠르고 경제적으로 형성할 수 있다. 구체적인 예를 들면, 레이저 직접 구조화 공정은, 휴대용 전자기기의 안테나, RFID 안테나, 등의 제조에 활용될 수 있다.By using the laser direct structuring process, the electric / electronic circuit can be formed quickly and economically on the three-dimensional shape of the resin molded article. As a specific example, the laser direct structuring process can be utilized for manufacturing an antenna of a portable electronic device, an RFID antenna, and the like.
레이저 직접 구조화 공정용 수지 조성물은, 레이저 직접 구조화 공정에 의하여 그 표면이 상기와 같이 개질될 수 있는 수지 성형체를 제조하기 위한 조성물을 지칭한다. 그에 따라, 레이저 직접 구조화 공정용 조성물은 핵 생성제를 함유한다.The resin composition for a laser direct structuring process refers to a composition for producing a resin molded article whose surface can be modified as described above by a laser direct structuring process. Accordingly, the composition for the laser direct structuring process contains a nucleating agent.
종래의 레이저 직접 구조화 공정용 조성물의 핵 생성제로서는, 스피넬 구조를 갖는 금속 산화물(등록특허 10-0716486, 공개특허 10-2010-0055474); 구리 크롬 옥사이드 스피넬과 같은 중금속 복합 산화물 스피넬(공개특허 10-2011-0009684); 구리 하이드록사이드 포스페이트, 인산구리, 황산구리 또는 티오시안산제1구리와 같은 구리 염(공개특허 10-2011-0009684, 공개특허 10-2011-0018319);등이 알려져 있다.Examples of the nucleating agent of the conventional composition for laser direct structuring process include metal oxides having a spinel structure (Patent No. 10-0716486; Heavy metal complex oxide spinels such as copper chromium oxide spinel (Patent Publication No. 10-2011-0009684); Copper salts such as copper hydroxide, phosphate, copper phosphate, copper sulfate or cuprous thiocyanate (see Patent Document 10) are known.
그러나, 스피넬 구조의 구리 크롬 산화물은 흑색 안료로도 사용될 만큼 그 색상이 매우 검다. 따라서, 스피넬 구조의 구리 크롬 산화물은 수지 성형체에 대하여 요구되는 색상이 검은색 또는 회색일 경우에만 적용이 가능하다. 수지 성형체에 대하여 흑색 및 회색 외의 다양한 색상이 요구되는 경우, 스피넬 구조의 구리 크롬 산화물을 핵 생성제로서 적용하면, 원하는 색상의 수지 성형체를 얻는 것이 매우 어렵다. However, the copper chromium oxide of the spinel structure is very dark in color, so that it can also be used as a black pigment. Therefore, the copper chromium oxide of the spinel structure is applicable only when the color required for the resin molded article is black or gray. When various colors other than black and gray are required for a resin molded article, it is very difficult to obtain a resin molded article of a desired color by applying a copper chromium oxide having a spinel structure as a nucleating agent.
인산 구리 화합물은 대체적으로 옅은 녹색 또는 청색 계열의 색상을 갖는다. 그에 따라, 수지 성형체에 대하여 녹색 또는 청색 계열의 색상이 요구되는 경우에는, 인산 구리 화합물을 핵 생성제로서 적용하는 것을 고려해볼 수 있다. 그러나, 인산 구리 화합물(예를 들어, Cu2P2O7·H2O, 4CuO·P2O5·H2O, 등)은, 수지 성형체 성형 과정의 온도 및 압력 하에서, 결정수를 방출할 수 있다. 방출된 결정수는, 조성물 중의 수지 또는 첨가제와 같은 다른 성분과 반응하거나, 성형 후에도 수지 성형체 내에 잔류할 수 있다. 그에 따라, 수지 성형체의 물성이 저하되거나, 수지 성형체의 색상 또는 표면 상태가 저하될 수 있다. 특히, 이러한 문제점은, 예를 들어, 폴리카보네이트, 폴리아미드, 폴리부틸렌테레프탈레이트 등과 같은 수분에 민감한 고분자가 조성물에 포함된 경우 더욱 심각하게 발생할 수 있다.Copper phosphate compounds generally have a light green or blue color. Accordingly, when green or blue-based hue is required for a resin molded article, it may be considered to apply a copper phosphate compound as a nucleating agent. However, copper phosphate compounds (for example, Cu 2 P 2 O 7 .H 2 O, 4CuO. P 2 O 5 .H 2 O, etc.) emit crystalline water under the temperature and pressure of the resin molding process can do. The released crystal water may react with other components such as a resin or an additive in the composition, or may remain in the resin molding after molding. As a result, the physical properties of the resin molded article may deteriorate and the hue or surface state of the resin molded article may deteriorate. Particularly, this problem may occur more seriously when the composition contains, for example, a water-sensitive polymer such as polycarbonate, polyamide, polybutylene terephthalate and the like.
구리 하이드록사이드 포스페이트 화합물은 인산 구리와 수산화 구리가 결합되어 있는 화합물이다. 구리 하이드록사이드 포스페이트는 결정수 대신에 수산화 구리를 함유하고 있어서, 수지 성형체 성형과정에서도, 수분을 방출하지 않는다. 또한, 구리 하이드록사이드 포스페이트는 매우 옅은 녹색의 색상을 갖는다. 그에 따라, 구리 하이드록사이드 포스페이트는 수지 성형체에 함유되는 착색제의 색상 재현력을 저하시키지 않으며, 그에 따라, 원하는 색상의 수지 성형체를 얻는 것이 매우 용이해진다.The copper hydroxide phosphate compound is a compound in which copper phosphate and copper hydroxide are bonded. The copper hydroxide phosphate contains copper hydroxide instead of the crystal water, so that it does not emit moisture even in the molding process of the resin molding. Also, the copper hydroxide phosphate has a very light green color. Accordingly, the copper hydroxide film does not lower the color reproduction ability of the colorant contained in the resin molded article, and it becomes very easy to obtain a resin molded article of a desired color.
그러나, 수지 성형체에 원하는 색상을 부여하기 위하여 수지 성형체에 함유되는 안료 및 염료와 같은 착색제는 입사된 광선을 반사하거나 흡수하여 색상을 나타낸다. LDS 공정시 수지 성형체에 조사되는 레이저 전자기파 방사선 역시 착색제에 의해 반사되거나 흡수된다. 그에 따라, 착색제의 존재하에서는, 수지 성형체 내부로 레이저 전자기파 방사선이 전달되는 깊이가 줄어들게 되고, 결국, 레이저 전자기파 방사선에 의한 핵 생성제(예를 들어, 구리 하이드록사이드 포스페이트)의 반응 효율이 현저히 저하될 수 있다.However, coloring agents such as pigments and dyes contained in a resin molding to impart a desired color to the resin molded body reflect or absorb the incident light to exhibit color. The laser electromagnetic radiation irradiated to the resin molding during the LDS process is also reflected or absorbed by the colorant. Accordingly, in the presence of the colorant, the depth to which the laser electromagnetic wave radiation is transmitted to the inside of the resin molded body is reduced, and as a result, the reaction efficiency of the nucleating agent (for example, copper hydroxide phosphate) .
본 발명에서는, 수지 성형체의 색상 재현력을 저하시키지 않고, 수지 성형체 성형과정에서 결정수를 방출하지 않으면서도, 레이저 전자기파 방사선에 의한 핵 생성제의 핵 생성 반응을 효과적으로 발생시킬 수 있는 개선된 레이저 직접 구조화 공정용 수지 조성물을 제공하고자 한다.In the present invention, it is possible to provide an improved laser direct structuring capable of effectively generating a nucleation reaction of a nucleating agent by laser electromagnetic wave radiation without releasing crystal water in the process of molding a resin molding without lowering the color reproduction capability of the resin molding To provide a process resin composition.
본 발명의 일 측면에 따른 레이저 직접 구조화 공정용 수지 조성물의 일 구현예는, One embodiment of the resin composition for a direct laser structuring process according to one aspect of the present invention comprises:
열가소성 고분자; Thermoplastic polymers;
착색제;coloring agent;
구리 하이드록사이드 포스페이트(copper hydroxide phosphates); 및Copper hydroxide phosphates; And
투명 무기 충전제;를 포함한다. And a transparent inorganic filler.
본 발명의 다른 측면에 따른 레이저 직접 구조화 공정용 수지 성형체의 일 구현예는, 본 발명의 일 측면에 따른 레이저 직접 구조화 공정용 수지 조성물로부터 제조된 레이저 직접 구조화 공정용 수지 성형체이다.One embodiment of the resin molded article for direct laser structuring process according to another aspect of the present invention is a resin molded article for direct laser structured process produced from the resin composition for direct laser structured process according to one aspect of the present invention.
본 발명의 또 다른 측면에 따른 도체부를 갖는 수지 구조물의 일 구현예는,One embodiment of a resin structure having a conductor portion according to yet another aspect of the present invention,
본 발명의 다른 측면에 따른 레이저 직접 구조화 공정용 수지 성형체; 및A resin molding for a direct laser structuring process according to another aspect of the present invention; And
상기 수지 성형체의 표면의 적어도 일부에 부착되어 있는 금속층;을 포함한다.And a metal layer adhered to at least a part of the surface of the resin molded article.
구리 하이드록사이드 포스페이트는 핵 생성제의 역할을 한다. 즉, LDS 공정시 수지 성형체에 조사되는 레이저 전자기파 방사선에 의하여, 구리 하이드록사이드 포스페이트는 금속 핵을 형성하고, 이 금속 핵은, 이어지는 도금 단계에서, 수지 성형체 표면에 대한 금속 층의 정착을 촉진한다. Copper hydroxide phosphate acts as a nucleating agent. That is, by the electromagnetic radiation of the laser beam irradiated on the resin molded body during the LDS process, the copper hydroxide film forms metal nuclei, which promote the fixation of the metal layer to the surface of the resin mold in the subsequent plating step .
구리 하이드록사이드 포스페이트는 인산 구리와 수산화 구리가 결합되어 있는 화합물이다. 구리 하이드록사이드 포스페이트는 결정수 대신에 수산화 구리를 함유하고 있어서, 수지 성형체 성형과정에서도, 수분을 방출하지 않는다.Copper hydroxide phosphate is a compound in which copper phosphate and copper hydroxide are bonded. The copper hydroxide phosphate contains copper hydroxide instead of the crystal water, so that it does not emit moisture even in the molding process of the resin molding.
또한, 구리 하이드록사이드 포스페이트는 매우 옅은 녹색의 색상을 갖는다. 그에 따라, 구리 하이드록사이드 포스페이트는 수지 성형체에 함유되는 착색제의 색상 재현력을 저하시키지 않으며, 그에 따라, 원하는 색상의 수지 성형체를 얻는 것이 매우 용이해진다.Also, the copper hydroxide phosphate has a very light green color. Accordingly, the copper hydroxide film does not lower the color reproduction ability of the colorant contained in the resin molded article, and it becomes very easy to obtain a resin molded article of a desired color.
투명 무기 충전제는, 레이저 직접 구조화 공정 수행시, 레이저 전자기파 방사선을 수지 성형체 내부로 침투시키는 역할을 할 수 있다. 수지 성형체에 원하는 색상을 부여하기 위하여 수지 성형체에 함유되는 안료 및 염료와 같은 착색제는 입사된 광선을 반사하거나 흡수하여 색상을 나타낸다. LDS 공정시 수지 성형체에 조사되는 레이저 전자기파 방사선 역시 착색제에 의해 반사되거나 흡수된다. 그에 따라, 착색제의 존재하에서는, 수지 성형체 내부로 레이저 전자기파 방사선이 전달되는 깊이가 줄어들게 되고, 결국, 레이저 전자기파 방사선에 의한 핵 생성제(즉, 구리 하이드록사이드 포스페이트)의 반응 효율이 저하될 수 있다. 그러나, 투명 무기 충전제가 레이저 전자기파 방사선을 수지 성형체 내부로 침투시키는 역할을 함에 따라, 본 발명의 조성물로 성형된 수지 성형체에 있어서는, 착색제의 존재에도 불구하고, 레이저 전자기파 방사선에 의한 핵 생성제(즉, 구리 하이드록사이드 포스페이트)의 반응 효율이 현저하게 상승될 수 있다.The transparent inorganic filler can serve to penetrate the laser electromagnetic wave radiation into the inside of the resin mold when the laser direct structuring process is carried out. Colorants such as pigments and dyes contained in the resin molding to impart a desired color to the resin molded body reflect or absorb the incident light to exhibit color. The laser electromagnetic radiation irradiated to the resin molding during the LDS process is also reflected or absorbed by the colorant. Accordingly, in the presence of the colorant, the depth to which the laser electromagnetic wave radiation is transferred into the resin molded body is reduced, and as a result, the reaction efficiency of the nucleating agent (that is, copper hydroxide phosphate) by the laser electromagnetic wave radiation may be lowered . However, since the transparent inorganic filler plays a role of penetrating the laser electromagnetic wave radiation into the inside of the resin molded article, in the resin molded article molded from the composition of the present invention, the nucleating agent by laser electromagnetic radiation , Copper hydroxide phosphate) can be remarkably increased.
이하에서는, 본 발명의 일 측면에 따른 레이저 직접 구조화 공정용 수지 조성물의 일 구현예를 더욱 상세히 설명한다. 레이저 직접 구조화 공정용 수지 조성물의 일 구현예는, 열가소성 고분자; 착색제; 구리 하이드록사이드 포스페이트(copper hydroxide phosphates); 및 투명 무기 충전제;를 포함한다.
Hereinafter, one embodiment of the resin composition for a direct laser structuring process according to one aspect of the present invention will be described in more detail. One embodiment of the resin composition for a laser direct structuring process comprises a thermoplastic polymer; coloring agent; Copper hydroxide phosphates; And a transparent inorganic filler.
열가소성 수지는 조성물의 매트릭스 역할을 한다. 즉, 열가소성 수지 매트릭스 중에 착색제, 구리 하이드록사이드 포스페이트 및 투명 무기 충전제가 분산되어 있다. 열가소성 수지는, 예를 들면, 폴리프로필렌, 폴리카보네이트, 폴리아미드, 폴리부틸렌테레프탈레이트, ABS(아크릴로니트릴-부타디엔-스티렌) 수지, 폴리(아릴렌 에테르), LCP(liquid crystal polymer) 수지, 또는 이들의 블렌드일 수 있다. 바람직한 예를 들면, 열가소성 수지는, 폴리카보네이트, 폴리아미드, 폴리부틸렌 테레프탈레이트, 또는 이들의 혼합물일 수 있는데, 이들 수지는 레이져 가공시 발생하는 열을 잘 견딜 수 있다.The thermoplastic resin serves as a matrix of the composition. That is, the colorant, copper hydroxide phosphate and transparent inorganic filler are dispersed in the thermoplastic resin matrix. Examples of the thermoplastic resin include polypropylene, polycarbonate, polyamide, polybutylene terephthalate, ABS (acrylonitrile-butadiene-styrene) resin, poly (arylene ether) Or blends thereof. As a preferable example, the thermoplastic resin may be polycarbonate, polyamide, polybutylene terephthalate, or a mixture thereof, and these resins can withstand heat generated during laser processing.
착색제는, 예를 들면, 안료 또는 염료일 수 있다. 안료는, 예를 들면, 무기 안료 또는 유기 안료일 수 있다. 무기 안료로서는, 예를 들면, 산화아연, 이산화티타늄, 산화철 등과 같은 금속 산화물 또는 복합 금속 산화물; 황화아연 등과 같은 술피드; 알루미네이트; 나트륨 술포실리케이트; 술페이트; 크로메이트; 카본 블랙; 아연 페라이트; 울트라마린 블루; 피그먼트 브라운 24; 피그먼트 레드 101; 피그먼트 옐로우 119; 등이 사용될 수 있다. 유기 안료로서는, 예를 들면, 아조, 디아조, 퀴나크리돈, 페릴렌, 나프탈렌 테트라카르복실산, 플라반트론, 이소인돌린온, 테트라클로로이소인돌론, 안트라퀴논, 안탄트론, 디옥사진, 프탈로시아닌, 아조 레이크(lake), 피그먼트 블루 60, 피그먼트 레드 122, 피그먼트 레드 149, 피그먼트 레드 177, 피그먼트 레드 179, 피그먼트 레드 202, 피그먼트 바이올렛 29, 피그먼트 블루 15, 피그먼트 그린 7, 피그먼트 옐로우 147, 피그먼트 옐로우 150, 등이 사용될 수 있다. 또는, 안료로서 이러한 안료 중 2종 이상을 포함하는 혼합물이 사용될 수도 있다. 염료로서는, 예를 들면, 쿠마린 460(청색), 쿠마린 6(녹색), 나일 레드, 란타나이드 복합체, 탄화수소 및 치환된 탄화수소 염료, 폴리시클릭 방향족 탄화수소, 신틸레이션 염료(바람직하게는 옥사졸 및옥사디아졸), 아릴- 또는 헤테로아릴-치환된 폴리(2-8 올레핀), 카르보시아닌 염료, 프탈로시아닌 염료, 옥사진 염료, 카르보스티릴 염료, 포르피린 염료, 아크리딘 염료, 안트라퀴논 염료, 아릴메탄 염료, 아조 염료, 디아조늄 염료, 니트로 염료, 퀴논 이민 염료, 테트라졸륨 염료, 티아졸 염료, 페릴렌 염료, 페린온 염료, 비스-벤즈옥사졸릴티오펜(BBOT), 크산텐 염료, 형광 염료(예를 들어, 근적외선 파장에서 흡수하고 가시선 파장에서 방출하는 반스톡스(anti-stokes) 전이 염료 등), 발광 염료(예를 들어, 5-아미노-9-디에틸이미노벤조 페녹사조늄 퍼클로레이트), 7-아미노-4-메틸카르보스티릴, 7-아미노-4-메틸쿠마린, 3-(2'-벤즈이미다졸릴)-7-N,N-디에틸아미노쿠마린, 3-(2'-벤조티아졸릴)-7-디에틸아미노쿠마린; 2-(4-비페닐릴)-5-(4-t-부틸페닐)-1,3,4-옥사디아졸, 2-(4-비페닐)-6-페닐벤즈옥사졸-1,3; 2,5-비스-(4-비페닐릴)-1,3,4-옥사디아졸; 2,5-비스-(4-비페닐릴)-옥사졸; 4,4'-비스-(2-부틸옥틸옥시)-p-쿼터페닐; p-비스(o-메틸스티릴)-벤젠; 5,9-디아미노벤조(a)페녹사조늄 퍼클로레이트; 4-디시아노메틸렌-2-메틸-6-(p-디메틸아미노스티릴)-4H-피란; 1,1'-디에틸-2,2'-카르보시아나이드 요오다이드; 3,3'-디에틸-4,4',5,5'-디벤조티아트리카르보시아나이드 요오다이드; 7-디에틸아미노-4-메틸쿠마린; 7-디에틸아미노-4-트리플루오로메틸쿠마린; 2,2'-디메틸-p-쿼터페닐; 2,2-디메틸-p-테르페닐; 7-에틸아미노-6-메틸-4-트리플루오로메틸쿠마린; 7-에틸아미노-4-트리플루오로메틸쿠마린; 나일 레드; 로다민 700; 옥사진 750; 로다민 800; IR 125; IR 144; IR 140; IR 132; IR26; IR5; 디페닐헥사트리엔; 디페닐부타디엔; 테트라페닐부타디엔; 나프탈렌; 안트라센; 9,10-디페닐안트라센; 피렌; 크리센; 루브렌; 코로넨; 페난트렌 등이 사용될 수 있다. 또는 염료로서, 이러한 염료 중 2종 이상을 포함하는 혼합물이 사용될 수도 있다.The colorant may be, for example, a pigment or a dye. The pigment may be, for example, an inorganic pigment or an organic pigment. Examples of the inorganic pigments include metal oxides or composite metal oxides such as zinc oxide, titanium dioxide, iron oxide and the like; Sulfides such as zinc sulphide; Aluminate; Sodium sulfosilicate; Sulfate; Chromate; Carbon black; Zinc ferrite; Ultra marine blue; Pigment Brown 24; Pigment Red 101; Pigment Yellow 119; Etc. may be used. Examples of the organic pigments include azo pigments such as azo, diazo, quinacridone, perylene, naphthalene tetracarboxylic acid, flavanthrone, isoindolinone, tetrachloroisoindolone, anthraquinone, anthanthrone, Phthalocyanine, Azo lake, Pigment Blue 60, Pigment Red 122, Pigment Red 149, Pigment Red 177, Pigment Red 179, Pigment Red 202, Pigment Violet 29, Pigment Blue 15, Green 7, Pigment Yellow 147, Pigment Yellow 150, and the like can be used. Alternatively, a mixture containing two or more of these pigments as pigments may be used. Examples of the dye include coumarin 460 (blue), coumarin 6 (green), nile red, lanthanide complex, hydrocarbon and substituted hydrocarbon dye, polycyclic aromatic hydrocarbon, scintillation dye (preferably oxazole and oxadiazole ), Aryl- or heteroaryl-substituted poly (2-8 olefins), carbocyanine dyes, phthalocyanine dyes, oxazine dyes, carbostyryl dyes, porphyrin dyes, acridine dyes, anthraquinone dyes, arylmethane dyes , Azo dyes, diazonium dyes, nitro dyes, quinone imine dyes, tetrazolium dyes, thiazole dyes, perylene dyes, perynone dyes, bis-benzoxazolylthiophenes (BBOT), xanthene dyes, (For example, 5-amino-9-diethyliminobenzophenoxazonium perchlorate), 7 (for example, 5-amino-9-diethyliminobenzophenoxazonium perchlorate) absorbing at near infrared wavelengths and emitting at visible wavelengths, - Amino-4-methylcarbostyril, 7- (2'-benzimidazolyl) -7-N, N-diethylaminocoumarin, 3- ) -7-diethylaminocoumarin; 2- (4-biphenylyl) -6- phenylbenzoxazole-1,3- ; 2,5-bis- (4-biphenyl) -1,3,4-oxadiazole; 2,5-bis- (4-biphenylyl) -oxazole; 4,4'-bis- (2-butyloctyloxy) -p-quarterphenyl; p-bis (o-methylstyryl) -benzene; 5,9-diaminobenzo (a) phenoxazonium perchlorate; 4-dicyanomethylene-2-methyl-6- (p-dimethylaminostyryl) -4H-pyran; 1,1'-diethyl-2,2'-carbocyanide iodide; 3,3'-diethyl-4,4 ', 5,5'-dibenzothiatricarbocyanide iodide; 7-diethylamino-4-methylcoumarin; 7-diethylamino-4-trifluoromethylcoumarin; 2,2'-dimethyl-p-quaterphenyl; 2,2-dimethyl-p-terphenyl; 7-ethylamino-6-methyl-4-trifluoromethylcoumarin; 7-ethylamino-4-trifluoromethylcoumarin; Nile Red; Rhodamine 700; Jade picture 750; Rhodamine 800; IR 125; IR 144; IR 140; IR 132; IR26; IR5; Diphenylhexatriene; Diphenylbutadiene; Tetraphenylbutadiene; naphthalene; anthracene; 9,10-diphenylanthracene; Pyrene; Chrysene; Rubrene; Coronene; Phenanthrene and the like can be used. Or as a dye, a mixture containing two or more of these dyes may be used.
착색제의 사용량은, 열가소성 수지 100 중량부를 기준으로 하여, 약 0.1 중량부 내지 약 10 중량부일 수 있다. 착색제의 사용량이 너무 작으면, 색상균일도의 저하가 발생할 수 있다. 착색제의 사용량이 너무 크면, 수지물성의 저하와 레이저 가공성의 저하가 발생할 수 있다. The amount of the colorant to be used may be about 0.1 part by weight to about 10 parts by weight based on 100 parts by weight of the thermoplastic resin. If the amount of the colorant used is too small, the color uniformity may be lowered. If the amount of the colorant used is too large, the properties of the resin may be deteriorated and the laser processability may be deteriorated.
구리 하이드록사이드 포스페이트는, 예를 들면, Cu3(PO4)2·2Cu(OH)2, Cu3(PO4)2·Cu(OH)2, 또는 이들의 혼합물일 수 있다. The copper hydroxide phosphate can be, for example, Cu 3 (PO 4 ) 2 .2Cu (OH) 2 , Cu 3 (PO 4 ) 2 .Cu (OH) 2 , or a mixture thereof.
구리 하이드록사이드 포스페이트의 사용량이 너무 작으면, 레이저와의 반응이 충분이 일어나지 않아 후공정에서, 예를 들면 도금불량 등과 같은 문제점이 발생할 수 있다. 구리 하이드록사이드 포스페이트의 사용량이 너무 크면, 수지물성의 저하가 발생할 수 있다. 구리 하이드록사이드 포스페이트의 사용량은, 열가소성 수지 100 중량부를 기준으로 하여, 약 0.1 중량부 내지 약 10 중량부일 수 있다.If the amount of the copper hydroxide phosphate used is too small, the reaction with the laser does not occur sufficiently, which may cause problems such as poor plating in the subsequent step. If the amount of the copper hydroxide phosphate used is too large, the resin properties may deteriorate. The amount of the copper hydroxide phosphate to be used may be about 0.1 part by weight to about 10 parts by weight based on 100 parts by weight of the thermoplastic resin.
투명 무기 충전제는, 예를 들면, 유리 섬유, 유리 비드, 유리 버블, 유리 박편, 석영 입자, 또는 이들의 혼합물일 수 있다. 투명 무기 충전제의 평균입자크기는, 예를 들면, 약 10 ㎛ 내지 약 20 ㎛일 수 있다. 투명 무기 충전제가 유리 섬유인 경우, 그 평균직경은, 예를 들면, 약 10 ㎛ 내지 약 20 ㎛일 수 있고, 그 평균길이는, 예를 들면, 약 1 mm 내지 약 10 mm 일수 있다. The transparent inorganic filler may be, for example, glass fiber, glass bead, glass bubble, glass flake, quartz particles, or a mixture thereof. The average particle size of the transparent inorganic filler can be, for example, from about 10 microns to about 20 microns. When the transparent inorganic filler is glass fiber, the average diameter may be, for example, from about 10 탆 to about 20 탆, and the average length may be, for example, from about 1 mm to about 10 mm.
투명 무기 충전제의 사용량이 너무 작으면, 레이저 직접 구조화 공정 수행시, 레이저 전자기파 방사선이 수지 성형체 내부로 잘 침투되지 못하여, 구리 하이드록사이드 포스페이트와 레이저와의 반응이 충분이 일어나지 않는다. 투명 무기 충전제의 사용량이 너무 크면, 수지물성의 저하가 발생할 수 있다. 투명 무기 충전제의 사용량은, 열가소성 수지 100 중량부를 기준으로 하여, 약 1 중량부 내지 약 50 중량부일 수 있다.When the amount of the transparent inorganic filler used is too small, the laser electromagnetic wave radiation does not sufficiently penetrate into the resin molded body during the direct laser structuring process, so that the reaction between the copper hydroxide phosphate and the laser does not occur sufficiently. If the amount of the transparent inorganic filler used is too large, the physical properties of the resin may be deteriorated. The amount of the transparent inorganic filler to be used may be about 1 part by weight to about 50 parts by weight based on 100 parts by weight of the thermoplastic resin.
레이저 직접 구조화 공정용 수지 조성물의 또 다른 구현예는, 예를 들어, 열 안정제, 가공 안정제, 항산화제, 광 안정제, 가소제, 대전방지제, 이형제, UV 흡수제, 윤활제, 발포제, 유동 촉진제, 난연제 및 불투명 무기 충전제 중에서 선택되는 1종 이상의 첨가제를 더 포함할 수 있다.Another embodiment of the resin composition for a laser direct structuring process is a resin composition for a laser direct structuring process, which can be obtained, for example, from heat stabilizers, process stabilizers, antioxidants, light stabilizers, plasticizers, antistatic agents, release agents, UV absorbers, lubricants, foaming agents, flow promoters, And at least one additive selected from inorganic fillers.
열 안정제로서는, 예를 들면, 유기 포스파이트(예를 들어, 트리페닐 포스파이트, 트리스-(2,6-디메틸페닐)포스파이트, 트리스-(혼합된 모노- 및 디-노닐페닐)포스파이트 등); 포스포네이트(예를 들어, 디메틸벤젠 포스포네이트 등); 포스페이트(예를 들어, 트리메틸 포스페이트 등); 등이 사용될 수 있다. 또는, 열 안정제로서, 이러한 열 안정제 중 2종 이상을 포함하는 혼합물이 사용될 수도 있다. 열 안정제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.01 내지 약 1 중량부일 수 있다. Examples of the heat stabilizer include organic phosphites (e.g., triphenyl phosphite, tris- (2,6-dimethylphenyl) phosphite, tris- (mixed mono- and di-nonylphenyl) phosphite ); Phosphonates (e.g., dimethylbenzenephosphonate and the like); Phosphates (e.g., trimethyl phosphate and the like); Etc. may be used. Alternatively, as the heat stabilizer, a mixture containing two or more of these heat stabilizers may be used. The amount of the heat stabilizer to be used may be, for example, about 0.01 to about 1 part by weight based on 100 parts by weight of the thermoplastic resin.
항산화제로서는, 예를 들면, 유기 포스파이트(예를 들어, 트리스(노닐 페닐)포스파이트, 트리스(2,4-디-t-부틸페닐)포스파이트, 비스(2,4-디-t-부틸페닐)펜타에리트리톨 디포스파이트, 디스테아릴 펜타에리트리톨 디포스파이트 등); 알킬화 모노페놀 또는 폴리페놀; 폴리페놀과 디엔의 알킬화 반응 생성물(예를 들어, 테트라키스[메틸렌(3,5-디-t-부틸-4-히드록시히드로신나메이트)]메탄 등); 파라크레졸 또는 디시클로펜타디엔의 부틸화 반응 생성물; 알킬화 히드로퀴논; 히드록시화 티오디페닐 에테르; 알킬리덴-비스페놀; 벤질 화합물; 베타-(3,5-디-t-부틸-4-히드록시페닐)프로피온산과 1가 또는 다가 알코올과의 에스테르; 베타-(5-tert-부틸-4-히드록시-3-메틸페닐)프로피온산과 1가 또는 다가 알코올과의 에스테르; 티오알킬 또는 티오아릴 화합물의 에스테르(예를 들어, 디스테아릴티오프로피오네이트, 디라우릴티오프로피오네이트, 디트리데실티오디프로피오네이트, 옥타데실-3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트, 펜타에리트리틸-테트라키스[3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트 등); 베타-(3,5-디-tert-부틸-4-히드록시페닐)프로피온산 등의 아미드; 등이 사용될 수 있다. 또는 항산화제로서는, 이러한 항산화제 중 2종 이상을 포함하는 혼합물이 사용될 수도 있다. 항산화제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.01 내지 약 1 중량부일 수 있다. Examples of the antioxidant include organic phosphites such as tris (nonylphenyl) phosphite, tris (2,4-di-t-butylphenyl) phosphite, bis (2,4- Butylphenyl) pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, etc.); Alkylated monophenols or polyphenols; Methylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate)] methane, etc.); The butylation reaction product of paracresol or dicyclopentadiene; Alkylated hydroquinone; Hydroxyated thiodiphenyl ether; Alkylidene-bisphenol; Benzyl compounds; Esters of beta - (3,5-di-t-butyl-4-hydroxyphenyl) propionic acid with mono- or polyhydric alcohols; Esters of beta - (5-tert-butyl-4-hydroxy-3-methylphenyl) propionic acid with mono- or polyhydric alcohols; Esters of thioalkyl or thioaryl compounds (for example, distearyl thiopropionate, dilauryl thiopropionate, ditridecyl thiodipropionate, octadecyl-3- (3,5-di-tert -Butyl-4-hydroxyphenyl) propionate, pentaerythrityl-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate and the like); Amide such as beta - (3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid; Etc. may be used. As the antioxidant, a mixture containing two or more of these antioxidants may be used. The amount of the antioxidant to be used may be, for example, about 0.01 to about 1 part by weight based on 100 parts by weight of the thermoplastic resin.
광 안정제로서는, 예를 들면, 2-(2-히드록시-5-메틸페닐)벤조트리아졸, 2-(2-히드록시-5-tert-옥틸페닐)벤조트리아졸, 2-히드록시-4-n-옥톡시벤조페논, 또는 이들의 혼합물이 사용될 수 있다. 광 안정제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.01 내지 약 1 중량부일 수 있다. Examples of the light stabilizer include 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- (2-hydroxy- n-octoxybenzophenone, or a mixture thereof may be used. The amount of the light stabilizer to be used may be, for example, about 0.01 to about 1 part by weight based on 100 parts by weight of the thermoplastic resin.
가소제로서는, 예를 들면, 디옥틸-4,5-에폭시-헥사히드로프탈레이트, 트리스-(옥톡시카르보닐에틸)이소시아누레이트, 트리스테아린, 에폭시화 대두유, 또는 이들의 혼합물이 사용될 수 있다. 가소제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.01 내지 약 1 중량부일 수 있다. As the plasticizer, for example, dioctyl-4,5-epoxy-hexahydrophthalate, tris- (octoxycarbonylethyl) isocyanurate, tristearin, epoxidized soybean oil, or a mixture thereof may be used. The amount of the plasticizer to be used may be, for example, about 0.01 to about 1 part by weight based on 100 parts by weight of the thermoplastic resin.
대전방지제로서는, 예를 들면, 글리세롤 모노스테아레이트, 나트륨 스테아릴 설포네이트, 나트륨 도데실벤젠설포네이트, 탄소 섬유, 탄소 나노섬유, 탄소 나노튜브, 카본블랙, 또는 이들의 혼합물이 사용될 수 있다. 대전방지제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.1 내지 약 10 중량부일 수 있다. As the antistatic agent, for example, glycerol monostearate, sodium stearyl sulfonate, sodium dodecylbenzene sulfonate, carbon fiber, carbon nanofiber, carbon nanotube, carbon black, or a mixture thereof may be used. The amount of the antistatic agent to be used may be, for example, about 0.1 to about 10 parts by weight based on 100 parts by weight of the thermoplastic resin.
이형제로서는, 예를 들면, 금속 스테아레이트, 스테아릴 스테아레이트, 펜타에리트리톨 테트라스테아레이트, 밀납, 몬탄 왁스, 파라핀 왁스, 또는 이들의 혼합물이 사용될 수 있다. 이형제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.1 내지 약 10 중량부일 수 있다. As the release agent, for example, metal stearate, stearyl stearate, pentaerythritol tetrastearate, wax, montan wax, paraffin wax, or a mixture thereof may be used. The amount of the releasing agent to be used may be, for example, about 0.1 to about 10 parts by weight based on 100 parts by weight of the thermoplastic resin.
UV 흡수제로서는, 예를 들면, 히드록시벤조페논; 히드록시벤조트리아졸; 히드록시벤조트리아진; 시아노아크릴레이트; 옥사닐리드; 벤조옥사진온; 2-(2H-벤조트리아졸-2-일)-4-(1,1,3,3-테트라메틸부틸)페놀(CYASORBTM 5411); 2-히드록시-4-n-옥틸옥시벤조페논(CYASORBTM 531); 2-[4,6-비스(2,4-디메틸페닐)-1,3,5-트리아진-2-일]-5-(옥틸옥시)페놀(CYASORBTM 1164); 2,2'-(1,4-페닐렌)비스(4H-3,1-벤즈옥사진-4-온)(CYASORBTM UV-3638); 1,3-비스[(2-시아노-3,3-디페닐아크릴로일)옥시]-2,2-비스[[(2-시아노-3,3-디페닐아크릴로일)옥시]메틸]프로판(UVINULTM 3030); 2,2'-(1,4-페닐렌)비스(4H-3,1-벤즈옥사진-4-온); 1,3-비스[(2-시아노-3,3-디페닐아크릴로일)옥시]-2,2-비스[[(2-시아노-3,3-디페닐아크릴로일)옥시]메틸]프로판; 나노 크기 무기 물질(예를 들어, 산화티타늄, 산화세륨 및 산화아연(입자 크기가 모두 100 나노미터 미만임) 등), 또는 이들의 혼합물이 사용될 수 있다. UV 흡수제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.01 내지 약 1 중량부일 수 있다. As the UV absorber, for example, hydroxybenzophenone; Hydroxybenzotriazole; Hydroxybenzotriazine; Cyanoacrylate; Oxanilide; Lt; / RTI > 2- (2H-benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol (CYASORB TM 5411); 2-hydroxy-4-n-octyloxybenzophenone (CYASORB TM 531); 2- [4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol (CYASORB TM 1164); 2,2 '- (1,4-phenylene) bis (4H-3,1-benzoxazin-4-one) (CYASORB ™ UV-3638); Bis [(2-cyano-3,3-diphenylacryloyl) oxy] -2,2-bis [ Methyl] propane (UVINUL TM 3030); 2,2 '- (1,4-phenylene) bis (4H-3,1-benzoxazin-4-one); Bis [(2-cyano-3,3-diphenylacryloyl) oxy] -2,2-bis [ Methyl] propane; Nanosized inorganic materials (e.g., titanium oxide, cerium oxide, and zinc oxide (all of the particle size are less than 100 nanometers), etc.), or mixtures thereof. The amount of the UV absorber to be used may be, for example, about 0.01 to about 1 part by weight based on 100 parts by weight of the thermoplastic resin.
윤활제로서는, 예를 들면, 지방산 에스테르(예를 들어, 알킬 스테아릴 에스테르, 예를 들면 메틸 스테아레이트 등); 메틸 스테아레이트와 친수성 및 소수성 계면 활성제, 예컨대 폴리에틸렌 글리콜 중합체, 폴리프로필렌 글리콜 중합체 및 이들의 공중합체의 혼합물(예를 들어, 적당한 용매 중의 메틸 스테아레이트와 폴리에틸렌-폴리프로필렌 글리콜 공중합체); 또는 이들의 혼합물이 사용될 수 있다. 윤활제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.1 내지 약 10 중량부일 수 있다. As the lubricant, for example, fatty acid esters (for example, alkylstearyl esters such as methyl stearate); Methyl stearate and hydrophilic and hydrophobic surfactants such as polyethylene glycol polymers, polypropylene glycol polymers and mixtures of these copolymers (e.g., methyl stearate and polyethylene-polypropylene glycol copolymer in a suitable solvent); Or a mixture thereof may be used. The amount of the lubricant to be used may be, for example, about 0.1 to about 10 parts by weight based on 100 parts by weight of the thermoplastic resin.
발포제로서는, 예를 들면, 비등점이 낮은 할로탄화수소 및 이산화탄소를 발생하는 발포제; 실온에서 고체이고 그 분해 온도보다 높은 온도로 가열할 경우 질소, 이산화탄소, 암모니아 기체와 같은 기체를 발생하는 발포제, 예를 들면 아조디카본아미드, 아조디카본아미드의 금속 염, 4,4'-옥시비스(벤젠설포닐히드라지드), 중탄산나트륨, 탄산암모늄 등, 또는 이러한 발포제 중 1종 이상을 포함하는 혼합물이 사용될 수 있다. 발포제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.01 내지 약 10 중량부일 수 있다. As the foaming agent, for example, a blowing agent which generates halohydrocarbons and carbon dioxide having a low boiling point; When heated to a temperature higher than the decomposition temperature of the solid at room temperature, foaming agents which generate gases such as nitrogen, carbon dioxide and ammonia gas, such as azodicarbonamide, metal salts of azodicarbonamide, 4,4'-oxy Bis (benzenesulfonyl hydrazide), sodium bicarbonate, ammonium carbonate, or the like, or a mixture containing at least one of these foaming agents may be used. The amount of the blowing agent to be used may be, for example, about 0.01 to about 10 parts by weight based on 100 parts by weight of the thermoplastic resin.
유동 촉진제로서는, 예를 들면, 저분자량 탄화수소 수지가 사용될 수 있다. 저분자량 탄화수소 수지는 석유 C5 내지 C9 공급원료로부터 유도된 것들로서, 이들은 석유 크래킹으로부터 얻은 불포화 C5 내지 C9 단량체로부터 유도된다. 그 예로는, 올레핀, 예컨대 펜텐, 헥센, 헵텐 등; 디올레핀, 예컨대 펜타디엔, 헥사디엔 등; 시클릭 올레핀과 디올레핀, 예컨대 시클로펜탄, 시클로펜타디엔, 시클로헥센, 시클로헥사디엔, 메틸 시클로펜타디엔 등; 시클릭 디올레핀 디엔, 예컨대 디시클로펜타디엔, 메틸 시클로펜타디엔 이합체 등; 및 방향족 탄화수소, 예컨대 비닐톨루엔, 인덴, 메틸리덴 등일 수 있다. 또한, 저분자량 탄화수소 수지는 부분적으로 또는 완전히 수소첨가된 것일 수 있다. 유동 촉진제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 0.01 내지 약 10 중량부일 수 있다. As the flow promoter, for example, a low molecular weight hydrocarbon resin may be used. Low molecular weight hydrocarbon resins are derived from petroleum C5 to C9 feedstocks, which are derived from unsaturated C5 to C9 monomers derived from petroleum cracking. Examples thereof include olefins such as pentene, hexene, heptene and the like; Diolefins such as pentadiene, hexadiene and the like; Cyclic olefins and diolefins such as cyclopentane, cyclopentadiene, cyclohexene, cyclohexadiene, methylcyclopentadiene and the like; Cyclic diolefin dienes such as dicyclopentadiene, methylcyclopentadiene dimer and the like; And aromatic hydrocarbons such as vinyltoluene, indene, methylidene, and the like. In addition, the low molecular weight hydrocarbon resin may be partially or fully hydrogenated. The amount of the flow promoter may be, for example, about 0.01 to about 10 parts by weight based on 100 parts by weight of the thermoplastic resin.
불투명 무기 충전제는, 예를 들면, 추가의 충격 강도를 부여하거나 및/또는 열가소성 조성물의 최종 선택된 특성에 근거할 수 있는 추가의 특성을 제공하도록 선택될 수 있다. 불투명 무기 충전제는, 예를 들면, TiO2; 섬유, 예컨대 석면, 탄소 섬유 등; 실리케이트 및 실리카 분말, 예컨대 알루미늄 실리케이트(뮬라이트), 합성 칼슘 실리케이트, 지르코늄 실리케이트, 발연 실리카, 결정질 실리카 그래파이트, 천연 실리카 샌드 등; 붕소 분말, 예컨대 질화붕소 분말, 보론 실리케이트 분말 등; 알루미나; 산화마그네슘(마그네시아); 황산칼슘(무수물, 이수화물 또는 삼수화물 형태); 탄산칼슘, 예컨대 쵸크, 석회석, 대리석, 합성 침전 탄산칼슘 등; 탈크, 예를 들면 섬유상, 모듈식, 침상, 층상 탈크 등; 규회석; 표면 처리된 규회석; 실리케이트 구형체, 세노스피어(cenosphere), 알루미노실리케이트(아모스피어) 등; 고령토, 예컨대 경질 고령토, 연질 고령토, 하소된 고령토, 중합제 매트릭스 수지와의 상용성을 도모하기 위하여 관련 분야에 공지된 각종 코팅을 포함하는 고령토 등; 단결정 섬유 또는 "휘스커(whisker)", 예컨대 실리콘 카바이드, 알루미나, 보론 카바이드, 철, 니켈, 구리 등; 설파이드, 예컨대 황화몰리브덴, 황화아연 등; 바륨 화합물, 예컨대 바륨 티타네이트, 바륨 페라이트, 황산바륨, 중섬광석 등; 금속 및 금속 산화물, 예컨대 입자상 또는 섬유상의 알루미늄, 청동, 아연, 구리 및 니켈 등; 박편형 충전제, 예컨대 실리콘 카바이드 박편, 알루미늄 디보라이드 박편, 알루미늄 박편, 스틸 박편 등; 섬유상 충전제, 예컨대 무기 단섬유, 예를 들면 1종 이상의 알루미늄 실리케이트, 산화알루미늄, 산화마그네슘 및 황산칼슘 반수화물 등; 및 추가의 충전제 및 보강제, 예컨대 운모, 점토, 장석, 연진, 필라이트, 석영, 규암, 진주암, 트리폴리, 규조토, 카본 블랙 등, 또는 이러한 충전제 또는 보강제 중 1종 이상을 포함하는 혼합물을 들 수 있다. 충전제 및 보강제를 실란으로 표면 코팅 처리하여 접착력 및 중합체 매트릭스 수지와의 분산성을 향상시킬 수 있다. 또한, 보강 충전제는 모노필라멘트 또는 멀티필라멘트 섬유 형태로 제공될 수 있다. 불투명 무기 충전제의 사용량은, 예를 들면, 열 가소성 수지 100 중량부를 기준으로 하여, 약 1 내지 약 50 중량부일 수 있다. Opaque inorganic fillers can be selected, for example, to provide additional impact strength and / or provide additional properties that may be based on the final selected properties of the thermoplastic composition. Opaque inorganic fillers include, for example, TiO2; Fibers such as asbestos, carbon fibers and the like; Silicates and silica powders such as aluminum silicate (mullite), synthetic calcium silicate, zirconium silicate, fumed silica, crystalline silica graphite, natural silica sand and the like; Boron powder such as boron nitride powder, boron silicate powder and the like; Alumina; Magnesium oxide (magnesia); Calcium sulfate (in the form of an anhydride, dihydrate or trihydrate); Calcium carbonate such as chalk, limestone, marble, synthetic precipitated calcium carbonate and the like; Talc, e.g., fibrous, modular, acicular, lamellar talc; Wollastonite; Surface treated wollastonite; Silicate spheres, cenosphere, aluminosilicate (amosphere) and the like; Kaolins, such as hard kaolin, soft kaolin, calcined kaolin, kaolin containing various coatings known in the art for compatibility with polymeric matrix resins; Single crystal fibers or "whiskers" such as silicon carbide, alumina, boron carbide, iron, nickel, copper and the like; Sulfides such as molybdenum sulfide, zinc sulfide and the like; Barium compounds such as barium titanate, barium ferrite, barium sulfate, heavy rare earth ore and the like; Metal and metal oxides such as particulate or fibrous aluminum, bronze, zinc, copper and nickel; Flake-like fillers such as silicon carbide flakes, aluminum diboride flakes, aluminum flakes, steel flakes and the like; Fibrous fillers such as inorganic short fibers such as one or more of aluminum silicate, aluminum oxide, magnesium oxide and calcium sulfate hemihydrate; And mixtures comprising at least one of the following fillers and reinforcing agents such as mica, clay, feldspar, quartz, fillite, quartz, quartz, perlite, tripoly, diatomaceous earth, carbon black and the like or such fillers or reinforcing agents . The filler and the reinforcing agent may be surface-coated with silane to improve the adhesive strength and the dispersibility with the polymer matrix resin. The reinforcing filler may also be provided in the form of monofilament or multifilament fibers. The amount of the opaque inorganic filler to be used may be, for example, about 1 to about 50 parts by weight based on 100 parts by weight of the thermoplastic resin.
본 발명의 일 측면에 따른 레이저 직접 구조화 공정용 수지 조성물의 구현예들은, 열가소성 수지를 형성하기 위한 성분들을 블렌딩하는 공지의 다양한 방법을 사용하여 제조될 수 있다. 예를 들면, 공개특허 10-2011-0018319에 개시된 다음과 같은 방법이 사용될 수 있다. 먼저, 성분들을 먼저 고속 혼합기에서 배합한다. 다른 저전단 방법으로 이러한 배합 단계를 수행할 수 있으며, 그러한 방법의 예서는 수동 혼합을 들 수 있으나, 이에 제한되는 것은 아니다. 이어서, 배합물을 호퍼를 통해서 이축 압출기의 네크부(throat) 내로 공급한다. 또한, 1종 이상의 성분을 사이드 충전기를 통해서 네크부 및/또는 하류에서 압출기 내로 직접 공급함으로써 조성물 내로 혼입시킬 수도 있다. 압출기는 일반적으로 조성물을 유동시키는데 필요한 온도보다 높은 온도에서 작동시킨다. 압출물을 즉시 수조에서 급냉시키고 펠릿을 성형한다. 압출물을 절단할 경우에 제조된 펠릿은 필요에 따라 길이가 1/4 인치 이하일 수 있다. 이러한 과정을 통하여, 본 발명의 일 측면에 따른 레이저 직접 구조화 공정용 수지 조성물을 펠릿의 형태로 얻을 수 있다.Implementations of the resin composition for a direct laser structuring process in accordance with an aspect of the present invention may be prepared using a variety of known methods of blending components for forming a thermoplastic resin. For example, the following method disclosed in Patent Document 10-2011-0018319 can be used. First, the components are first blended in a high-speed mixer. Other blending steps can be performed with other low shear methods, examples of which include, but are not limited to, manual blending. The blend is then fed through a hopper into the throat of a twin-screw extruder. It is also possible to incorporate one or more components into the composition by feeding directly into the extruder at the neck and / or downstream via a side filler. The extruder generally operates at a temperature higher than the temperature required to flow the composition. The extrudate is immediately quenched in a water bath and the pellets are molded. The pellets produced when cutting the extrudate may be no more than 1/4 inch in length if desired. Through this process, a resin composition for direct laser structuring according to one aspect of the present invention can be obtained in the form of pellets.
이하에서는, 본 발명의 다른 측면에 따른 레이저 직접 구조화 공정용 수지 성형체의 일 구현예를 상세하게 설명한다. 레이저 직접 구조화 공정용 수지 성형체의 일 구현예는, 열가소성 고분자; 착색제; 구리 하이드록사이드 포스페이트(copper hydroxide phosphates); 및 투명 무기 충전제;를 포함한다. Hereinafter, one embodiment of a resin molded article for a direct laser structured process according to another aspect of the present invention will be described in detail. One embodiment of the resin molded article for the laser direct structuring process comprises a thermoplastic polymer; coloring agent; Copper hydroxide phosphates; And a transparent inorganic filler.
레이저 직접 구조화 공정용 수지 성형체의 다른 구현예는, 예를 들어, 열 안정제, 가공 안정제, 항산화제, 광 안정제, 가소제, 대전방지제, 이형제, UV 흡수제, 윤활제, 발포제, 유동 촉진제, 난연제 및 불투명 무기 충전제 중에서 선택되는 1종 이상의 첨가제를 더 포함할 수 있다.Other embodiments of the resin moldings for laser direct structuring processes include, for example, heat stabilizers, process stabilizers, antioxidants, light stabilizers, plasticizers, antistatic agents, release agents, UV absorbers, lubricants, foaming agents, flow promoters, And one or more additives selected from fillers.
본 발명의 다른 측면에 따른 레이저 직접 구조화 공정용 수지 성형체의 구현예들은, 예를 들어, 본 발명의 일 측면에 따른 레이저 직접 구조화 공정용 수지 조성물을 사용하는 압출 성형, 사출 성형, 등의 공정을 통하여 제조될 수 있다. Embodiments of the resin molded article for direct laser structuring process according to another aspect of the present invention include, for example, processes such as extrusion molding, injection molding, and the like using the resin composition for direct laser structuring process according to one aspect of the present invention ≪ / RTI >
이하에서는, 본 발명의 또 다른 측면에 따른 "도체부를 갖는 수지 구조물"을 상세하게 설명한다. 도체부를 갖는 수지 구조물의 일 구현예는, Hereinafter, a "resin structure having a conductor portion" according to another aspect of the present invention will be described in detail. One embodiment of a resin structure having a conductor portion comprises:
열가소성 고분자, 착색제, 구리 하이드록사이드 포스페이트 및 투명 무기 충전제를 포함하는, 본 발명의 다른 측면에 따른 레이저 직접 구조화 공정용 수지 성형체; 및A resin molding for a direct laser structuring process according to another aspect of the present invention, comprising a thermoplastic polymer, a colorant, copper hydroxide phosphate and a transparent inorganic filler; And
상기 수지 성형체의 표면의 적어도 일부에 부착되어 있는 금속층;을 포함한다.And a metal layer adhered to at least a part of the surface of the resin molded article.
상기 금속층은, 예를 들면, Cu, Ni, Au, Ag, 이들의 합금, 또는 이들의 적층체일 수 있다. 상기 금속층의 두께는, 예를 들면, 약 6 내지 약 18 ㎛일 수 있다.The metal layer may be, for example, Cu, Ni, Au, Ag, an alloy thereof, or a laminate thereof. The thickness of the metal layer may be, for example, from about 6 to about 18 micrometers.
본 발명의 또 다른 측면에 따른 "도체부를 갖는 수지 구조물"은, 예를 들면, 다음과 같은 방법으로 제조될 수 있다. The "resin structure having a conductor portion" according to another aspect of the present invention can be produced, for example, by the following method.
먼저, 본 발명의 다른 측면에 따른 레이저 직접 구조화 공정용 수지 성형체의 표면의 일부에 레이저 전자기파 방사선을 조사하여, 상기 표면의 일부를 개질한다. 개질된 상기 표면의 일부에는, 구리 하이드록사이드 포스페이트로부터 유래하는 구리 금속 핵이 형성되어 있다. 이때, 레이저 전자기파 방사선의 매질은, 예를 들면, YAG(yttrium aluminum garnet), YVO4(yttrium orthovanadate), YB(ytterbium), CO2, 등이 사용될 수 있다. 레이저 전자기파 방사선의 파장은, 예를 들면, 532 nm, 1064 nm, 1090 nm, 9.3 ㎛, 10.6 ㎛, 등이 사용될 수 있다. 레이저 전자기파 방사선으로 가공시 3차원 형상을 인식하여 가공하는 알고리즘(예를 들어, 3차원 형상의 부품을 3D 인식 프로그램으로 인식하여 높이별 10 단계로 분리하여 레이저의 가공 높이를 제어하는 방식)이 사용될 수 있다. 레이저 전자기파 방사선으로 가공시에 도금의 밀착성을 높이기 위하여 해칭 형상을 일정 피치(0.02 mm ~ 0.1 mm)가 있는 정방형 격자 배열로 라인 가공할 수 있다. 레이저 전자기파 방사선으로 가공면(도금면)과 비가공면의 도금 균일성을 위한 외곽 라인 가공을 추가적으로 실시할 수 있다. 레이저 전자기파 방사선의 출력치는, 예를 들면, 약 2 W 내지 약 30 W일 수 있다.First, a part of the surface of the resin molding for laser direct structuring process according to another aspect of the present invention is irradiated with laser electromagnetic wave radiation to modify a part of the surface. In some of the modified surfaces, copper metal nuclei derived from copper hydroxide phosphate are formed. At this time, for example, YAG (yttrium aluminum garnet), YVO4 (yttrium orthovanadate), YB (ytterbium), CO 2 , etc. may be used as the medium of the laser electromagnetic wave radiation. The wavelength of the laser electromagnetic wave radiation may be, for example, 532 nm, 1064 nm, 1090 nm, 9.3 μm, 10.6 μm, and the like. (For example, a method of recognizing a three-dimensional shape component as a 3D recognition program and separating the three-dimensional shape into ten steps by height to control the processing height of the laser) . In order to improve the adhesion of the plating during laser beam machining, it is possible to line the hatching shape into a square lattice array with a constant pitch (0.02 mm to 0.1 mm). It is possible to additionally perform machining of outer lines for plating uniformity between the machined surface (plated surface) and the non-machined surface by the use of the laser electromagnetic wave radiation. The output value of the laser electromagnetic wave radiation may be, for example, about 2 W to about 30 W.
그 다음, 개질된 표면을 갖는 상기 수지 성형체의 표면을 도금한다. 이때, 레이저 전자기파 방사선으로 개질된 상기 수지 성형체의 표면의 일부에만 금속층이 정착된다. 도금은, 예를 들면, 무전해 도금, 등의 방식으로 수행될 수 있다. Then, the surface of the resin molded article having the modified surface is plated. At this time, the metal layer is fixed only on a part of the surface of the resin molded article modified by the laser electromagnetic wave radiation. The plating may be performed by, for example, electroless plating, or the like.
본 발명의 또 다른 측면에 따른 "도체부를 갖는 수지 구조물"은, 예를 들면, 휴대용 전자기기용 안테나, RFID용 안테나, 자동차용 전장품류, 백색 가전 제품류. NFC안테나, 케이블 대체 부품, 반도체 IC 복합 부품, 등으로 사용될 수 있다. According to another aspect of the present invention, a "resin structure having a conductor portion" includes, for example, an antenna for a portable electronic device, an antenna for RFID, an electric device for automobiles, NFC antennas, cable replacement parts, semiconductor IC composite parts, and the like.
<실시예><Examples>
실시예Example 1 One
실시예 1에서는 수지 구조체로서, 하기 표 1과 같은 조성을 갖는 수지 조성물을 사용하여 사출성형한 수지 성형체(스마트폰 안테나 베이스)를 사용하였다. In Example 1, a resin molding (smartphone antenna base) injection molded by using a resin composition having the composition shown in Table 1 below was used as the resin structure.
(Cu3(PO4)2·2Cu(OH)2)Copper hydroxide phosphate
(Cu 3 (PO 4 ) 2 .2Cu (OH) 2 )
이러한 수지 구조체의 표면의 도금대상영역(안테나 패턴)에 레이저를 조사하여, 도금대상영역 전체를 일정한 깊이로 깍아 내었다. 레이저 공정 조건은 하기 표 2와 같았다.The area to be plated (antenna pattern) on the surface of the resin structure was irradiated with a laser to scrape the entire plating target area to a certain depth. The laser processing conditions were as shown in Table 2 below.
그 다음, 이렇게 처리된 수지 구조체에 대하여 도금 공정을 수행하였다. 먼저, 수지 구조체를 초음파로 전처리하여, 수지 구조체 표면의 먼지 및 기포를 제거하였다. 초음파 처리 공정 조건은 하기 표 3과 같다.Then, the resin structure thus treated was subjected to a plating process. First, the resin structure was pretreated with an ultrasonic wave to remove dust and bubbles on the surface of the resin structure. The conditions of the ultrasonic treatment process are shown in Table 3 below.
그 다음, 수지 구조체를 촉매 부여용 처리액에 담그어서, 촉매 부여 공정을 수행하였다. 촉매 부여 공정의 조건은 하기 표 4와 같다.Then, the resin structure was immersed in the treatment solution for catalyst addition, and the catalyst addition step was carried out. The conditions of the catalyst application process are shown in Table 4 below.
Preparation of treatment liquid for catalyst application
그 다음, 수지 구조체를 무전해 동 스트라이크용 도금액에 담그어서, 구리층을 형성하였다. 구리층 형성 공정의 조건은 하기 표 5와 같다.Then, the resin structure was immersed in a plating liquid for electroless copper strike to form a copper layer. Conditions of the copper layer forming process are shown in Table 5 below.
(PEG 20000)Polyethylene glycol
(PEG 20000)
이렇게 제조된 "도체부를 갖는 수지 구조물"을 탈이온수로 수세한 후, X자 커팅 시험법으로 도금 상태를 관찰하였다 (X자 커팅 시험법 : 도금층에 2 mm 간격의 격자형 배열의 선들을 따라 커팅선을 긋는다. 그 위에 접착 테이프를 붙인 후, 접착 테이프를 수직 방향으로 들어낸다. 접착 테이프에 달라 붙어서 도금층 조각이 전혀 벗겨져 나오지 않으면 합격이다). 이로부터, 비교적 높은 착색제 함량에도 불구하고, 수지 구조체(스마트폰 안테나 베이스) 표면의 도금 대상 영역(안테나 패턴)에 구리층이 견고하게 도금되었음을 확인할 수 있었다.The thus-prepared "resin structure having a conductor part" was washed with deionized water, and then the state of plating was observed by X-cut test (X-cut test method: cutting along the lines of grid- After sticking the adhesive tape on it, pull out the adhesive tape in the vertical direction, and if it sticks to the adhesive tape and the piece of the plated layer does not peel off at all, it passes. From this, it can be confirmed that the copper layer was firmly plated on the area to be plated (antenna pattern) on the surface of the resin structure (smartphone antenna base), despite the comparatively high colorant content.
Claims (12)
착색제;
구리 하이드록사이드 포스페이트(copper hydroxide phosphates); 및
투명 무기 충전제;를 포함하는
레이저 직접 구조화 공정용 수지 조성물.Thermoplastic polymers;
coloring agent;
Copper hydroxide phosphates; And
A transparent inorganic filler;
Resin composition for laser direct structuring process.
제 10 항에 따른 레이저 직접 구조화 공정용 수지 성형체; 및
상기 수지 성형체의 표면의 적어도 일부에 부착되어 있는 금속층;을 포함하는,
도체부를 갖는 수지 구조물.A resin structure having a conductor portion,
A resin molded article for a direct laser structured process according to claim 10; And
And a metal layer adhered to at least a part of a surface of the resin molded article,
A resin structure having a conductor portion.
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Cited By (2)
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WO2016175437A1 (en) * | 2015-04-30 | 2016-11-03 | 롯데첨단소재 주식회사 | Polycarbonate resin composition and molded product prepared by means of same |
KR101940030B1 (en) * | 2018-06-08 | 2019-01-18 | 이원준 | Laser direct structuring resin with improved heat dissipation performance |
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2014
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016175437A1 (en) * | 2015-04-30 | 2016-11-03 | 롯데첨단소재 주식회사 | Polycarbonate resin composition and molded product prepared by means of same |
KR101940030B1 (en) * | 2018-06-08 | 2019-01-18 | 이원준 | Laser direct structuring resin with improved heat dissipation performance |
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