KR20140103734A - Radiation structure and using the same straight tube type led fluorescent lamp - Google Patents

Abstract

A radiation structure is disclosed. The radiation structure is configured to comprise: an LED mounting unit on which an LED module is mounted; and a heat radiation unit for radiating heat caused by heat generation of the LED module. The LED mounting unit is formed in a plate shape based on the cross-section of the radiation structure and the heat radiation unit is configured to include a hemisphere forming unit disposed on the LED mounting unit and heat radiating fins protruded from the surface of the hemisphere forming unit. The LED mounting unit and the hemisphere forming unit are connected to each other through a first extension portion which is extended toward the rear surface of the hemisphere forming unit from both sides of the LED mounting unit. A second extension portion is formed on the both sides of the LED mounting unit and extended in a direction away from the LED mounting unit from the first extension portion. A coupling groove is formed between the hemisphere forming unit and the second extension portion in order to combine a diffusing lens portion for diffusing light emitted from the LED module.

Description

TECHNICAL FIELD [0001] The present invention relates to a heat dissipating structure, and a straight tube type fluorescent lamp using the same. BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

More particularly, the present invention relates to a heat dissipation structure capable of improving heat dissipation performance and an introductory LED fluorescent lamp using the same.

An LED (Light-Emitting Diode) is a device that converts current into light by injecting a minority carrier by PN junction or the like and recombining it with a large number of carriers to emit energy equivalent to a transition to light. The device has a semi-permanent lifetime of LED, its price is low, and the power consumption is about 20% smaller than that of a general light bulb.

LED has advantages such as fast processing speed and low power consumption, and is environmentally friendly and energy saving effect, it is becoming a next generation strategic product.

In recent years, a COB (Chip On Board) type LED module in which a plurality of chips are integrated and mounted on a substrate is widely used in order to manufacture a lighting device with higher output. The COB is a structure in which a chip, which is an LED element, is directly connected to a printed circuit board (PCB) to connect more LEDs in a small space. However, in case of COB type LED module, the heat dissipation structure is required because the heat density per unit area is high and the heat density is very large. Therefore, the installation of the heat radiation structure in the lighting apparatus using the LED module is essentially required.

Since the heat radiation structure used in the lighting apparatus is preferably made of a material having heat resistance to withstand the heat continuously emitted in the lighting apparatus, the heat radiation structure is generally manufactured using an aluminum material having excellent heat resistance and capable of withstanding high temperature . However, in consideration of the strength of aluminum, most of the heat-radiating structures are manufactured with a thicker thickness. As a result, there has been a problem that the heat radiation structure becomes heavy.

On the other hand, in order to increase the heat radiation performance of the heat radiation structure, it is necessary to design the heat radiation fins formed in the heat radiation structure. That is, the heat radiation performance of the heat radiation structure is determined to be high and low by designing and manufacturing the heat radiation structure capable of increasing the heat radiation performance by selecting the width of the heat radiation fins, the distance between the heat radiation fins, and the height of the heat radiation fins. Also, the structural design of the heat dissipation fin may affect the weight of the heat dissipation structure. Therefore, in designing the heat dissipation structure, the width of the heat dissipation fin, the distance between the heat dissipation fin, and the height of the dissipation fin must be actively considered.

Accordingly, the present inventor has solved all the problems associated with conventional heat dissipating structures, and developed a heat dissipating structure capable of improving heat dissipation performance and reducing weight.

According to an embodiment of the present invention, there is provided a heat dissipating structure including: an LED mounting part on which an LED module is mounted; And a heat dissipating unit for dissipating heat due to heat generated by the LED module, wherein the LED mount unit is plate-shaped with respect to a cross-section of the heat dissipating structure, and the heat dissipating unit is positioned on the LED mount And a plurality of heat dissipating fins protruded from surfaces of the hemispherical upper portion and the hemispherical upper portion are connected to each other through a first extending portion extending from both sides of the LED seating portion toward the back surface of the hemispherical top portion And a second extending portion extending from the first extending portion in a direction away from the LED seating portion is formed on both sides of the LED seating portion, and for coupling the diffusion lens portion for diffusing the light emitted from the LED module, And a second extending portion The grooves are being formed.

For example, the ratio w / d of the width w of each of the radiating fins to the distance d between the radiating fins is 1.0.

As another example, the ratio h / d of the height h of the radiating fins to the distance d between the radiating fins is 0.5.

As another example, when the ratio w / d of the width w of each radiating fin to the spacing d between the radiating fins is 1.0 and the ratio h of the height h of each radiating fin to the spacing d between the radiating fins / d is 0.5.

And the heat dissipation structure is made of an anodized magnesium material.

Meanwhile, the straight tube type fluorescent lamp according to the embodiment of the present invention includes a heat dissipation unit including an LED seating part, heat dissipation heat generated from the heat generated by the LED module, and a radiating fin protruding from the surface of the hemispherical upper part, Wherein the heat dissipation structure includes a coupling groove formed on both sides of the seat portion, wherein a ratio h / d of a height h of the radiating fins to an interval d between the radiating fins is 0.5; An LED module mounted on the LED seating part and configured by arranging a plurality of LED chips on a circuit board; A lens cover having both ends coupled to the coupling groove to be coupled to the heat dissipating structure and diffusing light emitted from the LED module; And a side cap coupled to a side surface of the heat radiating structure and the lens cover, the side cap being electrically connected to the LED module and coupled to a lamp socket to which a power cable is connected to apply power to the LED module .

And a ratio (h / d) of a height (h) of each of the radiating fins to an interval (d) between the radiating fins is 0.5.

Further, the heat dissipation structure is made of an anodized magnesium material.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view for explaining a heat radiation structure according to an embodiment of the present invention; FIG.
2 is a side view of the heat dissipation structure shown in Fig.
FIG. 3 is a graph showing heat dissipation characteristics of the heat dissipating structure shown in FIG.
FIG. 4 is a graph showing heat dissipation characteristics of the heat dissipating structure shown in FIG. 2 according to the height variation of the heat dissipating fin.
FIG. 5 is an exploded perspective view illustrating an introductory LED fluorescent lamp using the heat dissipating structure shown in FIG. 1. FIG.

Hereinafter, a heat dissipating structure according to an embodiment of the present invention and an intaglio LED fluorescent lamp using the same will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

* Explanation of heat dissipation structure

FIG. 1 is a perspective view for explaining a heat-radiating structure according to an embodiment of the present invention, and FIG. 2 is a side view of the heat-radiating structure shown in FIG.

1 and 2, the heat radiation structure 100 according to the embodiment of the present invention is formed to be long in the horizontal direction and includes an LED mounting part 110 and a heat radiating part 111.

The LED mounting portion 110 is an area where the LED module is mounted. For example, the LED mounting portion 110 may have a rectangular plate shape extending in the horizontal direction. And the LED module is mounted on one surface of the plate.

The heat radiating portion 111 is an area for radiating heat due to the heat generated by the LED module mounted on the LED mounting portion 110. The heat dissipating unit 111 is located above the LED mounting unit 110 and includes a hemispherical top 111a and radiating fins 111b to dissipate heat due to the heat generated by the LED module mounted on the LED mounting unit 110.

The hemispherical portion 111a has a hemispherical shape curved at a predetermined curvature. The hemispherical upper portion 111a may be formed to have a larger radius than the width of the LED mounting portion 110 so that heat can be widely emitted to the periphery of the hemispherical upper portion 111a.

The hemispherical upper portion 111a is connected to the LED mounting portion 110. For example, the hemispherical upper portion 111a and the LED mounting portion 110 may be connected to each other through the first extension portion 120 extending to the hemispherical upper portion 111a and the LED mounting portion 110. [ The first extension portion 120 extends from both sides of the LED mounting portion 110 toward the hemispherical back surface. The first extension part 120 can transfer heat generated by the LED module to the hemispherical part 111a from the LED mounting part 110. [

The radiating fins 111b are arranged on the surface of the hemispherical upper portion 111a and protrude upward from the surface of the hemispherical upper portion 111a to emit heat transmitted to the hemispherical upper portion 111a. For example, the radiating fins 111b may have a semicircular or polygonal cross-sectional shape. Preferably, the shape of the radiating fins 111b may be semicircular in order to dissipate the heat in multiple directions. If the shape of the radiating fins 111b is polygonal, the direction in which the heat can be radiated by the angled corners may be limited.

Meanwhile, when the heat dissipation structure 100 according to the embodiment of the present invention is installed in the straight tube type fluorescent lamp, a region where a diffusion lens portion for diffusing light emitted from the LED module mounted on the LED mounting portion 110 is formed . In order to form the region, a second extending portion 130 extending from the first extending portion 120 in a direction away from the LED mounting portion 110 is formed on both sides of the LED mounting portion 110, 130 are formed between the second extension portion 130 and the hemispherical portion 111a. The diffusion lens unit may be coupled to the coupling groove 140.

The heat dissipation structure 100 according to the embodiment of the present invention has an arrangement structure of the heat dissipation fins 111b for effective heat dissipation. To this end, the heat dissipation characteristics of the heat dissipation fins 111b are determined by measuring the heat dissipation characteristics of the heat dissipation fins 111b and the heat dissipation characteristics of the heat dissipation fins 111b according to the height variation, (111b). In FIG. 2, measurement areas of the width w, spacing d, and height h of the radiating fin 111b are shown.

FIG. 3 is a graph showing heat dissipation characteristics of the heat dissipating structure shown in FIG. 2 according to changes in the spacing of the heat dissipating fins. FIG. 4 is a graph showing heat dissipation characteristics according to height variation of the heat dissipating fin of FIG.

In order to measure the heat dissipation characteristics according to the arrangement structure of the radiating fins 111b, an LED module corresponding to a heat source was mounted on the LED mounting portion 110. [ The LED module has a power consumption of 4 W and 5 sets of 4 W LED modules as a set of COB (Chip On Board) type. The difference between the temperature Tt of the LED mounting part 110 and the end temperature Th of the width w of the radiating fin 111b in the thermally stabilized state after the power is supplied to the LED module for three hours is defined as? . The lower the value of? TC, the better the heat dissipation characteristics.

The width w of the heat dissipation fins is fixed to 1 mm and the interval d of the heat dissipation fins 111b is changed to adjust the ratio w / d of the heat dissipation fins 111b Was measured. The measurement result is referred to the graph of Fig. As shown in the graph of FIG. 3, when the w / d ratio was 1.0, the lowest ΔTC value of ΔTc was 5.5, and the heat dissipation characteristics were the best.

Next, in order to measure the heat radiation characteristics according to the height variation of the heat radiation fins 111b, the distance d of the heat radiation fins was fixed to 1 mm and the height h of the heat radiation fins 111b was changed, TC values were measured. The measurement result is referred to the graph of Fig. As shown in the graph of FIG. 4, when the h / d ratio was 0.5, the lowest ΔTC value of ΔTC was 4.5 and the best heat dissipation characteristics were obtained.

In arranging the heat dissipation fins 111b according to the measurement results of the heat dissipation characteristics, the heat dissipation fins 111b may be arranged such that the w / d ratio is 1.0, or the heat dissipation fins 111b may be arranged such that the h / d ratio is 0.5. More preferably, the heat radiating fins 111b can be arranged such that the w / d ratio is 1.0 and the h / d ratio is 0.5.

If the heat dissipating structure 100 according to the embodiment of the present invention has an arrangement structure of the heat dissipating fins 111b that are limited to such optimum values, not only the heat dissipating performance is improved, but also the heat dissipation efficiency of the conventional direct heat dissipating structure The weight of the straight tube LED fluorescent lamp in which the heat radiation structure 100 according to the present invention is used can be reduced as compared with a fluorescent lamp.

Table 1 below is a table comparing and measuring the weight of each of the conventional straight LED fluorescent lamps (comparative example) and the straight LED fluorescent lamps (example) using the heat radiation structure 100 of the present invention having the same brightness. The same scales were used for measuring the weight of each straight tube LED fluorescent lamp.

Driving (W) LED temperature (℃) Weight of heat dissipation structure (g) Fluorescent weight (g) Comparative Example 20 55 250 350 Example 20 55 150 250

As shown in Table 1, the weight of the heat radiation structure 100 of the present invention is 150 g, whereas the weight of the heat radiation structure 100 is reduced by 100 g compared with the conventional one, The weight of the LED fluorescent lamp weighed 350 g, whereas the weight of the straight LED fluorescent lamp using the heat radiation structure 100 of the present invention was 250 g, which showed a weight saving effect of about 30%.

Meanwhile, the heat dissipating structure 100 according to the embodiment of the present invention is made of an anodized magnesium (Mg) material. Anodized magnesium refers to the formation of magnesium oxide on the surface of magnesium metal.

Generally, the heat-radiating structure is made of an aluminum material. When an aluminum material is used, the weight of the heat-radiating structure is increased. In order to solve these drawbacks, we are developing a technology to reduce weight by fabricating a heat dissipation structure with magnesium (Mg) material. Magnesium has a disadvantage in that the heat dissipation characteristics are lower than that of aluminum although it is lighter than aluminum. However, the heat dissipation structure 100 of the present invention can solve such a problem by using an anodized magnesium (Mg) as mentioned above.

Table 2 below shows a heat dissipating structure using aluminum and an intuitive LED fluorescent lamp using the same (Comparative Example 1), a heat dissipating structure using general magnesium, an intuitive LED fluorescent lamp using the heat dissipating structure (Comparative Example 2), and anodized magnesium The heat-radiating structure of the present invention and the straight tube LED fluorescent lamp (examples) using the same. The same heat balance structure and the balance for measuring the weight of the straight tube LED fluorescent lamp were used.

Driving power (W) LED temperature (℃) Weight of heat dissipation structure (g) Fluorescent weight (g) Comparative Example 1 (AL) 20 55 250 350 Comparative Example 2 (Mg) 20 65 126 126 Example 20 55 126 126

As shown in Table 2, the heat dissipating structure of Comparative Example 2 in which magnesium was used had a weight saving effect of about 50% as compared with the heat dissipating structure of Comparative Example 1 in which aluminum was used, but the heat dissipating property was lower than that of the heat dissipating structure of Comparative Example 1 Respectively. In the case of the heat-dissipating structure 100 of the present invention using the anodized magnesium of the embodiment of the present invention, the heat-dissipating property was maintained at the same level as that of the comparative example 1 while the weight was reduced to about 50% . In addition, the weight of the straight tube LED fluorescent lamp using the heat radiation structure of the present invention was reduced by about 34%.

Therefore, the heat dissipating structure 100 according to the embodiment of the present invention may be made of anodized magnesium without using aluminum used for the conventional heat dissipating structures. Accordingly, the heat dissipating structure 100, It is possible to further reduce the weight of the straight tube LED fluorescent lamp using the LED 100.

The use of the heat-radiating structure 100 according to the embodiment of the present invention has various advantages as follows.

1. Improved heat dissipation performance

The heat dissipation performance can be improved since the heat dissipation fin 111b has an array structure of optimized heat dissipation fin 111b with a width w, an interval d and a height h. This can increase the lifetime of an intuitive LED fluorescent lamp.

In addition, since the heat dissipation structure 100 is made of anodized magnesium, the heat dissipation efficiency can be improved by 10% or more as compared with the case of using general magnesium, and the heat dissipation performance can be improved as the heat dissipation structure 100 can have the same heat dissipation as aluminum .

2. Process simplification

Since only the spacing d and height h of the radiating fins 111b can be sufficiently standardized to achieve the effect of improving the heat radiation performance, there is no difficulty in the process. If the specifications are met, the cost is reduced through mass production, It can be simplified.

3. Lightweight

The heat dissipation structure 100 is characterized in that the heat dissipation structure 100 has an arrangement structure of the heat dissipation fins 111b optimized in the width w, the interval d and the height h of the heat dissipation fins 111b and the heat dissipation structure 100 is made of anodized magnesium, The weight of the structure 100 can be significantly reduced, thereby making it possible to reduce the weight of the heat radiation structure 100 and the straight tube LED fluorescent lamp using the same.

4. Improve convenience

Since the heat dissipating performance of the heat dissipating structure 100 is improved and the weight of the heat dissipating structure 100 can be improved as described above, the weight of the straight type LED fluorescent lamp using the heat dissipating structure 100 of the present invention is lighter and longer, The cycle can be further increased, so that it can be used for a long time once installed, and the efficiency is improved according to the improved heat radiation performance, so that it is possible to provide highly efficient convenience.

5. Reduced number of parts

The heat dissipation structure 100 may be standardized so as to have an arrangement structure of the optimized heat dissipation fins 111b and the replacement cycle of the intrusive type LED fluorescent lamp may be increased and ultimately the number of components may be reduced .

6. Cost reduction

Taking all the advantages mentioned above into consideration, it will ultimately provide the effect of cost reduction.

Description of the straight tube LED fluorescent lamp using the heat dissipating structure of the present invention

Prior to the description of the straight tube LED fluorescent lamp of the present invention, the term 'straight tube type' means a tube type and a long type extending in the horizontal direction.

FIG. 5 is an exploded perspective view illustrating an introductory LED fluorescent lamp using the heat dissipating structure shown in FIG. 1. FIG. The straight tube LED fluorescent lamp shown in Fig. 5 has both sides symmetrical to each other, and only one side is shown in Fig.

5, an LED lamp 10 according to an embodiment of the present invention includes a heat dissipating structure 100 including an LED mounting portion 110, a heat dissipating portion 111, and a coupling groove 140, an LED module 200, a lens cover 300, and a side cap 400.

Since the heat dissipation structure 100 is substantially the same as the heat dissipation structure 100 described with reference to FIG. 1, a detailed description thereof will be omitted.

The LED module 200 is mounted on the LED mounting portion 110. For example, the LED module 200 may be screwed to the LED mounting portion 110, and is not particularly limited thereto. The LED module 200 may include a plurality of LED chips 202 arranged on a circuit board 201. For example, the LED module 200 may be a COB (Chip On Board) type module in which a light emitting diode is directly formed on a printed circuit board (PCB), has a predetermined output, Lt; / RTI >

The lens cover 300 is in the form of a hollow tube with both open sides and an opening 301 extending in the horizontal direction is formed on one side. The cross-sectional shape of the lens cover 300 to achieve this shape may be, for example, a C shape. The heat radiation structure 100 may be positioned in the lens cover 300 through the opening 301. At this time, the heat dissipating unit 111 of the heat dissipating structure 100 may be exposed to the outside of the lens cover 300. Thereby, the heat emitted from the heat radiation structure 100 can be emitted to the outside of the lens cover 300. [ Although not shown, the lens cover 300 may be provided with a light diffusion unit to increase the brightness of light emitted from the LED module 200. For example, the light diffusing portion may include a reflector, and a lens member for increasing the brightness of light reflected by the reflector.

The side cap 400 is coupled to both open sides of the lens cover 300 to seal the inside of the lens cover 300. For example, the side cap 400 may be fixed to the heat dissipating structure 100 through a screw. The side cap 400 is provided with a power supply pin 111b protruding toward the outside of the side cap 400 for supplying an external power source to the LED module 200. [ Driver circuits (not shown) may be connected to both sides of the LED module 200 so that an external power source is supplied to the LED module 200 through the power supply pin 111b. The driving circuit unit may be electrically connected to the power supply pin 111b. Thereby, power can be supplied to the LED module 200.

Since the straight tube LED fluorescent lamp 10 according to the embodiment of the present invention uses the heat radiation structure 100 described with reference to FIGS. 1 to 4, the effect of the heat radiation structure 100 of the present invention, that is, , Process simplification, weight reduction, convenience improvement, reduction in the number of parts, and cost reduction. These effects can be achieved by the structural features of the heat-dissipating structure 100, and thus the description of the heat-dissipating structure 100 of the present invention will be omitted.

The description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features presented herein.

Claims (8)

An LED seating part on which the LED module is seated; And a heat dissipation unit for dissipating heat due to heat generation of the LED module,
In view of the cross-section of the heat-radiating structure,
Wherein the LED seating portion is plate-
Wherein the heat dissipation unit includes a hemispherical upper portion positioned above the LED mount portion and radiating fins protruded from a surface of the hemispherical upper portion,
Wherein the LED seating portion and the hemispherical top portion are connected to each other through a first extending portion extending from both sides of the LED seating portion toward the back surface of the hemispherical upper portion,
A second extending portion extending from the first extending portion in a direction away from the LED seating portion is formed on both sides of the LED seating portion,
And an engaging groove is formed between the hemispherical upper portion and the second extending portion for engaging a diffusion lens portion for diffusing light emitted from the LED module.
Heat dissipation structure. The method according to claim 1,
Wherein a ratio w / d of a width (w) of each of the radiating fins to an interval (d) between the radiating fins is 1.0.
Heat dissipation structure. The method according to claim 1,
Wherein a ratio (h / d) of a height (h) of each of the radiating fins to an interval (d) between the radiating fins is 0.5.
Heat dissipation structure. The method according to claim 1,
Wherein a ratio w / d of a width w of each of the radiating fins to an interval d between the radiating fins is 1.0,
Wherein a ratio (h / d) of a height (h) of each of the radiating fins to an interval (d) between the radiating fins is 0.5.
Heat dissipation structure. 5. The method according to any one of claims 1 to 4,
Wherein the heat dissipation structure is made of an anodized magnesium material.
Heat dissipation structure. A heat dissipation portion including heat dissipation portions for dissipating heat due to heat generated by the LED module and protruding from the surface of the hemispherical upper portion and coupling recesses formed on both sides of the LED mount portion, Wherein a ratio h / d of a height h of the radiating fins to an interval d between the radiating fins is 0.5;
An LED module mounted on the LED seating part and configured by arranging a plurality of LED chips on a circuit board;
A lens cover having both ends coupled to the coupling groove to be coupled to the heat dissipating structure and diffusing light emitted from the LED module; And
And a side cap coupled to a side surface of the heat dissipating structure and the lens cover, the side cap being electrically connected to the LED module and coupled to a lampholder to which a power cable is connected to apply power to the LED module.
Intuitive LED fluorescent light. The method according to claim 6,
Wherein a ratio (h / d) of a height (h) of each of the radiating fins to an interval (d) between the radiating fins is 0.5.
Intuitive LED fluorescent light. The method according to claim 6,
Wherein the heat dissipation structure is made of an anodized magnesium material.
Intuitive LED fluorescent light.

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