KR20140096852A

KR20140096852A - Light emitting device package

Info

Publication number: KR20140096852A
Application number: KR1020130009977A
Authority: KR
Inventors: 성기명
Original assignee: 엘지이노텍 주식회사
Priority date: 2013-01-29
Filing date: 2013-01-29
Publication date: 2014-08-06

Abstract

A light emitting device package according to an embodiment includes a lead frame; a light emitting device disposed on one surface of the lead frame; a reflector disposed to face the lead frame; and a support connecting the lead frame and the reflector, wherein the reflector includes multiple reflecting surfaces connected to each other.

Description

A light emitting device package

An embodiment relates to a light emitting device package.

LED (Light Emitting Diode) is a device that converts electrical signals into infrared, visible light or light using the characteristics of compound semiconductors. It is used in household appliances, remote controls, display boards, The use area of LED is becoming wider.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

LED semiconductors are grown by a process such as MOCVD or molecular beam epitaxy (MBE) on a substrate such as sapphire or silicon carbide (SiC) having a hexagonal system structure.

The light emitting device package is manufactured by manufacturing a light emitting device on a substrate, separating the light emitting device chip through dieseparation, which is a sawing process, and then diebonding the light emitting device chip to a package body. Wire bonding and molding can be performed, and the test can proceed.

As the fabrication process of the light emitting device chip and the packaging process are performed separately, various complex processes and various substrates may be required. It may be an important issue to make the light emitting device package have a directional angle in accordance with its use.

There is a need for research on a technique of forming a light emitting device package that reflects the light emitted from the light emitting device to form a necessary directivity angle.

The embodiment provides a light emitting device package in which a directivity angle is changed.

A light emitting device package according to an embodiment includes: a lead frame; A light emitting element disposed on one surface of the lead frame; A reflector disposed to face the lead frame; And a support for connecting the lead frame and the reflector, wherein the reflector includes a plurality of reflectors connected to each other.

In the light emitting device package according to the embodiment, the structure of the reflection plate may be diversified to form a directing angle at which light is emitted laterally.

The light emitting device package according to the embodiment can maximize the light extraction efficiency by forming a pattern that induces irregular reflection on the reflection plate within the range of the orientation angle of the light emitting device.

The light emitting device package according to the embodiment may change the shape of the reflection plate to make a directivity angle corresponding to the shape of the backlight unit.

FIG. 1 is a perspective view illustrating the structure of a light emitting device package according to one embodiment.
FIG. 2 is a cross-sectional view illustrating the structure of a light emitting device package according to one embodiment.
FIG. 3 is a cross-sectional view illustrating the structure of a light emitting device package according to one embodiment.
FIG. 4 is a cross-sectional view illustrating the structure of a light emitting device package according to one embodiment.
FIG. 5 is a cross-sectional view illustrating the structure of a light emitting device package according to one embodiment.
6 is a perspective view illustrating a liquid crystal display device including a light emitting device package according to one embodiment,
7A is a perspective view illustrating a lighting device including a light emitting device module according to an embodiment,
7B is a cross-sectional view illustrating a lighting device including a light emitting device module according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

Hereinafter, embodiments will be described in detail with reference to the drawings.

FIG. 1 is a perspective view illustrating a structure of a light emitting device package according to one embodiment, and FIG. 2 is a cross-sectional view illustrating a structure of a light emitting device package according to an embodiment.

1 and 2, a light emitting device package 100 according to an embodiment includes a light emitting device 120, a lead frame 110 electrically connected to the light emitting device, and a lead frame 110, A reflector 130 that reflects the light emitted from the light source 120 to have a directional angle parallel to the lead frame 110 and a support 140 that connects the lead frame 110 and the reflector 130 .

The lead frame 110 may include two electrodes electrically separated from each other. The lead frame 110 may be electrically connected to the light emitting device 120. The lead frame 110 may transmit the power supplied from the outside to the light emitting device 120.

The lead frame 110 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, platinum, tin, (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), and iron (Fe). The lead frame 110 may be formed to have a single layer or a multi-layer structure, but the present invention is not limited thereto.

The lead frame 110 may be surrounded by a body (not shown). The lead frame 110 may have two different electrical polarities, and the body (not shown) may be fixed so that the two lead frames 110 are spaced apart.

The body (not shown) may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG) (PA9T), syndiotactic polystyrene new geometry (SPS), metal materials, sapphire (Al ₂ O _3), beryllium oxide (BeO), is a printed circuit board (PCB, printed circuit board), it may be formed of at least one of ceramic. The body (not shown) may be formed by injection molding, etching, or the like, but is not limited thereto.

The light emitting device 120 may be disposed on one side of the lead frame. The light emitting device 120 may be a light emitting device that emits light such as red, green, blue, and white, or a UV (Ultra Violet) light emitting device that emits ultraviolet light. However, the present invention is not limited thereto. One or more light emitting devices 120 may be mounted.

The light emitting device 120 may be a horizontal type having all the electrical terminals formed on the upper surface thereof, a vertical type formed on the upper and lower surfaces, or a flip chip.

The reflector 130 may be opposed to the lead frame 110. The reflection plate 130 may be disposed in a direction in which the light emitting device package 120 emits light. The reflector 130 may be spaced apart from the lead frame 110. The reflector 130 may be connected to the lead frame 110 by a support 140.

The reflection plate 130 may reflect light emitted from the light emitting device 120. The reflection plate 130 may guide the light emitted from the light emitting device 120 in the lateral direction of the light emitting device package 100. For example, the reflection plate 130 may guide the light emitted from the light emitting device 120 in a direction parallel to the plane on which the light emitting device 120 of the lead frame 110 is disposed.

The reflection plate 130 may form the reflection surface 132 on the upper surface. The reflection plate 130 may form a plurality of reflection surfaces 132. For example, the reflection plate 130 may have a shape in which the four reflective surfaces 132 form a tilt angle and connected thereto.

The reflection plate 130 may be made of a metal. For example, the reflection plate 130 may be formed of a metal material such as Ti, Cu, Ni, Au, Cr, Ta, Pt, ), Tin (Sn), silver (Ag), phosphorous (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium ), Ruthenium (Ru), iron (Fe), but is not limited thereto.

The upper surface of the reflection plate 130 may form an angle of inclination. The height of the reflection plate 130 may vary depending on the position. For example, the reflector 130 may have the largest thickness at the center portion and may have a smaller thickness at the side.

The reflection plate 130 may include four reflective surfaces 132 on its upper surface. The four reflecting surfaces 132 can contact one vertex. For example, the four reflecting surfaces 132 may be formed in a rectangular shape when viewed from above, but the present invention is not limited thereto.

A reflective layer (not shown) including a material that reflects light may be disposed on the reflective plate 130. A reflective layer (not shown) may be disposed on the reflective surface 132 of the reflective plate 130. The reflective layer (not shown) may include a material corresponding to the wavelength emitted by the light emitting device 120. For example, the reflective layer (not shown) may include silver (Ag) when the light emitted by the light emitting element 120 is close to the blue region, and the light emitted by the light emitting element 120 is close to the ultraviolet region In this case, aluminum (Al) may be included but not limited thereto.

The support member 140 can support the reflection plate 130 and the lead frame 110. The support member 140 can adjust the distance between the reflection plate 130 and the lead frame 110. The support 140 may include an insulating material. The support member 140 may electrically separate the reflection plate 130 and the lead frame 110.

For example, the support 140 may be formed of an insulating material, or may be electrically isolated from the outside by disposing an insulating material on both ends of the metallic material. In addition, the support 140 may comprise a transparent material. The support member 140 may be formed in a cylindrical shape or a rectangular parallelepiped shape, but is not limited thereto.

The surface between the supports 140 can block the light according to the direction in which the light is transmitted, thereby limiting light emission and concentrating the light to a desired place. That is, the support member 140 may block one to three walls depending on the direction of light.

An encapsulant (not shown) may be disposed between the reflector 130 and the lead frame 110. An encapsulant (not shown) may be filled between the reflector 130 and the lead frame 110, and may include a phosphor (not shown). The encapsulant (not shown) may be formed of transparent silicone, epoxy, or other resin material. An encapsulant (not shown) may be filled between the reflector 130 and the lead frame 110, and then the encapsulant may be ultraviolet or thermally cured.

The phosphor (not shown) may be selected according to the wavelength of the light emitted from the light emitting device 120, so that the light emitting device package 100 can realize white light.

The phosphor (not shown) included in the encapsulant (not shown) may emit blue light, blue light, fluorescent light, green light emitting fluorescent material, yellow light emitting fluorescent material, One of the light-emitting fluorescent substance, the orange light-emitting fluorescent substance, and the red light-emitting fluorescent substance may be applied.

The phosphor (not shown) may be excited by the light having the first light emitted from the light emitting device 120 to generate the second light. For example, when the light emitting element 320 is a blue light emitting diode and the phosphor (not shown) is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light emitted from the blue light emitting diode As the yellow light generated by excitation by blue light is mixed, the light emitting device package 100 can provide white light.

When the light emitting element 120 is a green light emitting diode, the magenta phosphor or the blue and red phosphors (not shown) are mixed. When the light emitting element 120 is a red light emitting diode, a cyan phosphor or a mixture of blue and green phosphors For example.

The phosphor (not shown) may be a known one such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

3 is a cross-sectional view illustrating the structure of a light emitting device package according to one embodiment.

Referring to FIG. 3, the reflection plate 130 may form a reflection pattern in a region 134 located within a range of the orientation angle of the light emitting device 120. The size of the region 134 where the reflection pattern is formed may vary depending on the distance between the reflection plate 130 and the light emitting device 120. The directivity angle of the light emitting device 120 may be between 110 and 120 degrees, but is not limited thereto.

The roughness of the upper surface of the reflection plate 130 may change according to the portion. The reflector 130 may have different roughness depending on whether the roughness of the upper surface on which the reflective surface is formed is within the range of the orientation angle of the light emitting device 120.

The reflection plate 130 can maintain a smooth surface for regular reflection of light when the reflection surface is located outside the directional angle range (b) of the light emitting device 120.

The reflection plate 130 may form a reflection pattern that diffusely reflects light in a region 1.2 to 1.3 times the width of the light emitting device from the center. For example, the reflection plate 130 may be 1.2 to 1.3 times as wide as the width of the light emitting device from the vertical center of the light emitting device 120 to the horizontal. For example, the reflection plate 130 may form a reflection pattern within a range (a) located within the directing angle of the light emitting element 120. [ The length of the cross section of the reflection plate 130 on which the pattern is formed may be 1.2 to 1.3 times the width of the light emitting device.

When the reflection pattern is formed only in the range of 1.2 times the width of the light emitting element from the center, the reflection plate 130 has a small effect of improving the light extraction amount that can be obtained by irregularly reflecting the amount of light that is straight from the light emitting element 120 If a reflection pattern is formed in a range exceeding 1.3 times, a reflection pattern may be formed on an unnecessary portion, which may waste the process, and may not help the light quantity.

4 is a cross-sectional view illustrating the structure of a light emitting device package according to an embodiment.

Referring to FIG. 4, the upper surface of the reflection plate 130 may have a curvature.

The reflection plate 130 can change the directivity angle of the light emitting device package by changing the shape of the upper surface. The thickness of the reflective plate 130 may be greater than the thickness of the other side of the reflective plate 130, and a curvature may be formed on the upper surface of the reflective plate 130 to allow the light emitting device package to emit light only in one side.

For example, when the parasitic surface from the vicinity of the lead frame 110 to the reflection plate 130 is formed by maximizing the thickness of one side of the reflection plate 130 and minimizing the thickness of the other side, In the present embodiment.

5 is a cross-sectional view illustrating a structure of a light emitting device package according to an embodiment.

Referring to FIG. 5, the height of the reflection plate 130 may change linearly from one side to the other side.

The thickness of the reflector 130 can be maximized on one side and the thickness of the other side can be minimized. The light emitting device package may have a directing angle to the other side. The height of the reflection plate 130 linearly changes from one side to the other side, and the linearity of the amount of light within the directivity angle of the light emitting device package can be maintained.

6 is a perspective view illustrating a liquid crystal display including a light emitting device package according to one embodiment.

The liquid crystal display panel 610 can display an image using light provided from the backlight unit 670. The liquid crystal display panel 610 may include a color filter substrate 612 and a thin film transistor substrate 614 facing each other with a liquid crystal therebetween.

The color filter substrate 612 can realize the color of an image to be displayed through the liquid crystal display panel 610.

The thin film transistor substrate 614 is electrically connected to a printed circuit board 618 on which a plurality of circuit components are mounted through a driving film 617. The thin film transistor substrate 614 can apply a driving voltage provided from the printed circuit board 618 to the liquid crystal in response to a driving signal provided from the printed circuit board 618. [

The thin film transistor substrate 614 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 670 includes a light emitting element module 620 that outputs light, a light guide plate 630 that changes the light provided from the light emitting element module 620 into a surface light source and provides the light to the liquid crystal display panel 610, A plurality of films 666, 652 and 664 for uniformly distributing the luminance of light provided from the light guide plate 630 and improving the vertical incidence property and a reflection sheet 630 for reflecting light emitted to the rear of the light guide plate 530 to the light guide plate 630 647).

The light emitting device module 620 may include a substrate 622 to mount a plurality of light emitting device packages 624 and a plurality of light emitting device packages 624 to form a module.

The light emitting device package 624 includes a light emitting element (not shown).

The light emitting device module 620 may have a directional angle in a direction parallel to the upper surface of the substrate 622. The light emitting device module 620 may irradiate light so that the light emitting device module 620 is parallel to the surface on which the light emitting device package 624 of the substrate 622 is disposed. The light emitting device module 620 may be disposed such that the upper surface of the substrate 622 and the upper surface of the light guide plate 630 are parallel to each other.

The backlight unit 670 includes a diffusion film 666 for diffusing light incident from the light guide plate 630 toward the liquid crystal display panel 610 and a prism film 652 for condensing the diffused light to improve vertical incidence And may include a protective film 664 for protecting the prism film 652. [

FIG. 7A is a perspective view showing an illumination system 400 including a light emitting device according to an embodiment, and FIG. 7B is a cross-sectional view showing a D-D 'cross-section of the illumination system of FIG. 7A.

7B is a cross-sectional view of the lighting system 400 of FIG. 7A cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

7A and 7B, the lighting system 400 may include a body 410, a cover 430 coupled to the body 410, and a finishing cap 450 positioned at opposite ends of the body 410 have.

The light emitting device module 443 is coupled to a lower surface of the body 410. The body 410 is electrically connected to the light emitting device package 444 through the upper surface of the body 410, And may be formed of a metal material having excellent heat dissipation effect, but is not limited thereto.

The light emitting device package 444 includes a light emitting element (not shown).

The light emitting device package 444 may be mounted on the substrate 442 in a multi-color, multi-row manner to form a module. The light emitting device package 444 may be mounted at equal intervals or may be mounted with various spacings as needed. As the substrate 442, MCPCB (Metal Core PCB) or FR4 PCB can be used.

The cover 430 may be formed in a circular shape so as to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 can protect the internal light emitting element module 443 from foreign substances or the like. The cover 430 may include diffusion particles to prevent glare of light generated in the light emitting device package 444 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 430 A prism pattern or the like may be formed on the surface. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 430.

The light generated from the light emitting device package 444 is emitted to the outside through the cover 430 so that the cover 430 should have excellent light transmittance and sufficient heat resistance to withstand the heat generated from the light emitting device package 444 The cover 430 may be made of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like .

The finishing cap 450 is located at both ends of the body 410 and can be used for sealing the power supply unit (not shown). The finishing cap 450 is formed with the power pin 452, so that the lighting system 400 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

The configuration and the method of the embodiments described above are not limitedly applied, but the embodiments may be modified so that all or some of the embodiments are selectively combined so that various modifications can be made. .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: lead frame
120: Light emitting device package
130: reflector
132: Reflecting surface
140: Support

Claims

Lead frame;
A light emitting element disposed on one surface of the lead frame;
A reflector disposed to face the lead frame; And
And a support for connecting the lead frame and the reflector,
Wherein the reflection plate includes a plurality of reflection surfaces connected to each other.

The method according to claim 1,
Wherein the support comprises an insulating material.

The method according to claim 1,
And a reflective layer disposed on the reflective plate and including a material corresponding to a wavelength emitted by the light emitting device.

The method according to claim 1,
Wherein the reflection plate includes four reflection surfaces on an upper surface thereof,
Wherein one vertex of each of the four reflective surfaces is in contact with each other.

The method according to claim 1,
Wherein the reflection plate forms a reflection pattern in a region located within a range of a directional angle of the light emitting element.

The method according to claim 1,
Wherein the reflection plate has a roughness of an upper surface that changes according to a portion thereof.

The method according to claim 1,
Wherein the reflection plate has a curvature on an upper surface thereof.

The method according to claim 1,
Wherein the reflection plate linearly changes in height from one side to the other side.

The method according to claim 1,
Wherein the reflection plate forms a reflection pattern that irregularly reflects light in a region 1.2 to 1.3 times the width of the light emitting device from the center.