KR20130114830A - Substrate transport apparatus - Google Patents

Substrate transport apparatus Download PDF

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Publication number
KR20130114830A
KR20130114830A KR1020120037172A KR20120037172A KR20130114830A KR 20130114830 A KR20130114830 A KR 20130114830A KR 1020120037172 A KR1020120037172 A KR 1020120037172A KR 20120037172 A KR20120037172 A KR 20120037172A KR 20130114830 A KR20130114830 A KR 20130114830A
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South Korea
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substrate
hand
present
support
grip member
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KR1020120037172A
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Korean (ko)
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KR101414136B1 (en
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박동석
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주식회사피에스디이
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Priority to KR1020120037172A priority Critical patent/KR101414136B1/en
Publication of KR20130114830A publication Critical patent/KR20130114830A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A substrate transfer device is provided to rapidly and safely transfer a substrate by transferring the substrate after the substrate is stably fixed. CONSTITUTION: An arm part (200) is installed on a base (100). The arm part transfers a substrate. The substrate is loaded on a hand (300) which includes a bottom support part and a grip member. The substrate is received on the bottom support part. The grip member clamps the upper edge of the substrate.

Description

기판 반송 장치{SUBSTRATE TRANSPORT APPARATUS}[0001] SUBSTRATE TRANSPORT APPARATUS [0002]

본 발명은 기판 처리 장치에 관한 것으로, 보다 상세하게는 기판을 반송시키기 위한 기판 반송 장치에 관한 것이다. The present invention relates to a substrate processing apparatus, and more particularly, to a substrate transfer apparatus for transferring a substrate.

일반적으로 평판 표시 장치, 반도체 소자 그리고 발광 소자의 제조에 이용되는 기판은 포토(Photo)공정, 애싱(Ashing)공정, 박막증착공정, 식각공정 등과 같은 다수의 단위공정을 반복 수행하게 된다. In general, a flat panel display, a semiconductor device, and a substrate used for manufacturing a light emitting device are repeatedly subjected to a plurality of unit processes such as a photo process, an ashing process, a thin film deposition process, and an etching process.

기판은 상기 단위 공정들이 수행되는 챔버들 사이를 이동하거나 상기 단위 공정이 수행되는 동안 상기 챔버들 내부에서 이동된다. 이러한 기판의 이동은 기판 반송 장치에 의해 이루어지며, 기판 반송 장치는 기판을 안전하면서도 신속하게 이송시키기 위해 기판을 고정한다. The substrate is moved between the chambers in which the unit processes are performed or is moved inside the chambers during the unit process. Such movement of the substrate is carried out by a substrate transfer apparatus, and the substrate transfer apparatus fixes the substrate to transfer the substrate safely and quickly.

종래의 기판 반송 장치에서 기판을 고정하는 방식에는 기판을 진공으로 흡착하는 방식, 유체의 흐름을 이용하여 기판을 공중부양시키는 방식 그리고 기판 주변 부분을 직접 파지하는 방식 등이 있다.The conventional method of fixing the substrate in the substrate transfer apparatus includes a method of vacuum-sucking the substrate, a method of levitating the substrate by using the flow of the fluid, and a method of directly grasping the periphery of the substrate.

그러나, 상기와 같은 기판 고정 방식은 두께가 얇은 초박형 기판이나 다수의 관통홀(관통 비아홀)들이 형성된 기판을 고정하는데 어려움이 있다.However, such a substrate fixing method has a difficulty in fixing an ultra-thin substrate having a small thickness or a substrate having a plurality of through holes (through-via holes).

본 발명의 실시예들은 초박형 기판이나 관통홀들이 형성된 기판을 안정적으로 고정할 수 있는 기판 반송 장치를 제공하는데 있다.Embodiments of the present invention provide a substrate transfer apparatus capable of stably fixing a substrate on which an ultra-thin substrate or through holes are formed.

본 발명의 목적은 여기에 제한되지 않으며, 언급되지 않은 또 다른 목적들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

본 발명의 일 측면에 따르면, 베이스; 상기 베이스에 설치되고, 기판을 반송시키도록 접히거나 펼쳐지는 아암부; 및 상기 아암부의 선단에 설치되고, 기판이 탑재되는 핸드를 포함하되; 상기 핸드는 기판이 놓여지는 하부 지지대; 및 상기 하부 지지대에 안착된 기판의 상면 가장자리를 클램핑하는 그립부재를 포함하는 기판 반송 장치가 제공될 수 있다.According to an aspect of the invention, the base; An arm portion provided on the base and folded or unfolded to convey the substrate; And a hand provided at a front end of the arm portion and on which the substrate is mounted; The hand includes a lower support on which the substrate is placed; And a grip member for clamping a top edge of the substrate that is seated on the lower support.

또한, 상기 그립 부재는 기판의 상면 가장자리를 누르도록 상기 하부 지지대와 대향되게 설치되는 상부 지지대; 및 상기 상부 지지대를 상하로 이동시키기 위한 구동부를 포함할 수 있다.Further, the grip member may include an upper supporter installed to oppose the lower supporter so as to press a top edge of the substrate; And a driving unit for moving the upper support vertically.

본 발명에 의하면, 초박형 기판이나 관통홀들이 형성된 기판을 안정적으로 고정한 상태에서 반송할 수 있다. According to the present invention, a substrate on which an ultra-thin substrate or through holes are formed can be transported while being stably fixed.

도 1은 본 발명의 일 실시예에 따른 기판 반송 장치를 보여주는 사시도이다.
도 2는 도 1에 도시된 핸드의 사시도이다.
도 3 및 도 4는 도 2에 도시된 핸드의 측면도 및 정면도이다.
도 5는 기판이 그립된 상태를 보여주는 핸드의 단면도이다.1 is a perspective view showing a substrate transfer apparatus according to an embodiment of the present invention.
2 is a perspective view of the hand shown in Fig.
3 and 4 are a side view and a front view of the hand shown in Fig.
5 is a cross-sectional view of the hand showing a state in which the substrate is gripped;

본 명세서에서 사용되는 용어와 첨부된 도면은 본 발명을 용이하게 설명하기 위한 것이므로, 본 발명이 용어와 도면에 의해 한정되는 것은 아니다.The terms and accompanying drawings used herein are for the purpose of illustrating the present invention easily, and the present invention is not limited by the terms and drawings.

본 발명에 이용되는 기술 중 본 발명의 사상과 밀접한 관련이 없는 공지의 기술에 관한 자세한 설명은 생략한다. The detailed description of known techniques which are not closely related to the idea of the present invention among the techniques used in the present invention will be omitted.

본 명세서에 기재되는 실시예는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 본 발명을 명확히 설명하기 위한 것이므로, 본 발명이 본 명세서에 기재된 실시예로 한정되는 것은 아니며, 본 발명의 범위는 본 발명의 사상을 벗어나지 아니하는 수정예 또는 변형예를 포함하는 것으로 해석되어야 한다.Since the embodiments described herein are intended to clearly describe the present invention to those skilled in the art, the present invention is not limited to the embodiments described herein, but the scope of the present invention Should be construed as including modifications or variations without departing from the spirit of the invention.

이하에서는 본 발명에 따른 기판 반송 장치의 핸드의 일 실시예에 관하여 설명한다. Hereinafter, an embodiment of the hand of the substrate transfer apparatus according to the present invention will be described.

도 1은 본 발명의 일 실시예에 따른 기판 반송 장치를 보여주는 사시도이다. 도 2 내지 도 4는 도 1에 도시된 핸드의 사시도, 측면도 그리고 정면도이다. 1 is a perspective view showing a substrate transfer apparatus according to an embodiment of the present invention. 2 to 4 are a perspective view, a side view, and a front view of the hand shown in Fig.

도 1 내지 도 4를 참조하면, 기판 반송 장치(10)는 베이스(100), 아암부(200) 그리고 핸드(300)를 포함한다.1 to 4, the substrate transfer apparatus 10 includes a base 100, an arm portion 200, and a hand 300.

베이스(100)는 상하 운동 및/또는 회전 운동을 제공할 수 있다. 베이스(100)는 주행장치(미도시됨)에 의해 X축 또는 Y축으로 이동될 수 있다. The base 100 may provide up and down movement and / or rotational movement. The base 100 can be moved in the X axis or the Y axis by a traveling device (not shown).

아암부(200)는 베이스(100)에 결합된다. 아암부(200)는 기판(W)을 이송하기 위해 펼쳐지거나 접혀지는 동작을 제공할 수 있으며, 또한 상하 방향으로 상승 또는 하강 동작을 제공할 수 있다. The arm portion 200 is coupled to the base 100. The arm portion 200 may provide an unfolded or folded motion for transferring the substrate W and may also provide an up or down movement in the up and down direction.

핸드(300)는 아암부(200)의 선단에 결합된다. 핸드(300)에는 기판(W)이 탑재된다. 핸드(300)는 하부 지지대(310) 및 그립부재(320)를 포함한다. The hand 300 is coupled to the front end of the arm portion 200. The hand W 300 is mounted on the hand 300. The hand 300 includes a lower support 310 and a grip member 320.

하부 지지대(310)는 아암부(200)의 선단에 고정되는 고정 플레이트(312)와, 원호형으로 형성된 하부 핑거(314)를 포함한다. 하부 핑거(314)는 그 형태에 있어 지지하고자 하는 기판(W)의 직경에 맞춰지고, 기판을 그 측부 가장자리에서 대략 3/4까지 에워싸게 제공된다. 하부 핑거(314)는 단차진 제1지지면(316)을 갖는다. 제1지지면(316)에는 기판의 저면 가장자리가 안착된다. The lower support 310 includes a fixing plate 312 fixed to the tip of the arm 200 and a lower finger 314 formed in an arc shape. The lower finger 314 is adapted to the diameter of the substrate W to be supported in its configuration and is provided so as to surround the substrate by about 3/4 of its side edge. The lower finger 314 has a stepped first support surface 316. The bottom edge of the substrate is seated on the first support surface 316.

그립부재(320)는 하부 지지대(310)에 안착된 기판의 상면 가장자리를 클램핑한다. 그립부재(320)는 상부 지지대(322) 및 구동부(328)를 포함한다. The grip member 320 clamps the top edge of the substrate that is seated on the lower support 310. The grip member 320 includes an upper support table 322 and a driving unit 328. [

상부 지지대(322)는 기판(W)의 상면 가장자리를 누르도록 하부 지지대(310)와 대향되게 위치된다. 상부 지지대(322)는 기판의 패터닝된 상면과의 접촉을 회피할 수 있도록 원호형으로 형성된 상부 핑거(324)를 포함한다. 상부 핑거(324)는 그 형태에 있어 하부 핑거(314)와 대향되게 제공된다. 즉, 상부 핑거(324)는 지지하고자 하는 기판의 직경에 맞춰지고, 기판을 그 측부 가장자리에서 대략 3/4까지 에워싸게 제공될 수 있다. 상부 핑거(324)는 저면에 단차진 제2지지면(326)을 갖으며, 제2지지면(326)은 기판의 상면 가장자리를 지지한다. The upper support 322 is positioned opposite the lower support 310 so as to press the upper surface edge of the substrate W. [ The upper support 322 includes an upper finger 324 formed in an arcuate shape to avoid contact with the patterned upper surface of the substrate. The upper finger 324 is provided to face the lower finger 314 in that form. That is, the upper finger 324 may be provided to fit the diameter of the substrate to be supported, and to surround the substrate by about 3/4 of its side edge. The upper finger 324 has a stepped second support surface 326 at the bottom and a second support surface 326 supports the upper surface edge of the substrate.

구동부(328)는 상부 지지대(322)를 상하로 이동시키기 위한 것이다. 구동부(328)는 하부 지지대(310)의 고정 플레이트(312) 상에 설치된다. 상부 지지대(322)는 구동부(328)에 의해 다운되어 하부 지지대(310)에 놓여진 기판(W)을 클램핑하거나 또는 구동부(328)에 의해 업되어 하부 지지대(310)에 놓여진 기판을 언클램핑한다. The driving unit 328 is for moving the upper support 322 up and down. The driving unit 328 is installed on the fixing plate 312 of the lower support 310. The upper support 322 is lowered by the driving part 328 to clamp the substrate W placed on the lower support 310 or is lifted up by the driving part 328 to unclamp the substrate placed on the lower support 310.

도 3 내지 도 5에 도시된 바와 같이, 핸드(300)는 하부 지지대(310)와 상부 지지대(322)를 이용하여 기판(W)의 가장자리를 상하 방향에서 그립함으로써, 측방향에서 그립하는 기존 그립 방식에 비해 기판에 휨이 발생되지 않고 안정적으로 기판을 고정할 수 있다. 특히, 본 발명은 기판을 파지할 때 기판 가장자리를 상부와 하부에서 맞대어 그립함으로써, 진공 흡착 방식이나 유체 흐름을 이용한 공중부양 방식으로는 고정할 수 없는 관통홀들이 형성된 기판을 안정적으로 그립할 수 있다. 여기서, 관통홀들이 형성된 기판은 실리콘 관통 비아(through-silicon via,TSV) 기술에 의해 관통전극용 홀들이 형성된 기판일 수 있다. 3 to 5, the hand 300 can grip the edge of the substrate W in the vertical direction by using the lower support 310 and the upper support 322, The substrate can be stably fixed without causing warpage on the substrate. Particularly, according to the present invention, when gripping a substrate, the substrate edge is held and gripped at the top and the bottom, thereby stably gripping the substrate having the through holes which can not be fixed by the vacuum suction method or the floating method using the fluid flow . Here, the substrate on which the through-holes are formed may be a substrate on which holes for through-electrodes are formed by a through-silicon via (TSV) technique.

상술한 바와 같이, 본 발명의 기판 반송 장치(10)는 실리콘 관통 비아(through-silicon via,TSV) 기술에 의해 기판 상에 관통전극용 홀들을 형성하는 공정 설비 또는 초박형 기판을 취급하는 설비에서 기판을 반송하는데 매우 적합하다. As described above, the substrate transfer apparatus 10 of the present invention can be applied to a process equipment for forming holes for penetrating electrodes on a substrate by means of a silicon-through-silicon (TSV) Lt; / RTI >

10: 기판 반송 장치
100 : 베이스
200 : 아암부
300 : 핸드 10: substrate transfer device
100: Base
200: arm arm
300: Hand

Claims (2)

기판 반송 장치에 있어서:
베이스;
상기 베이스에 설치되고, 기판을 반송시키도록 접히거나 펼쳐지는 아암부; 및
상기 아암부의 선단에 설치되고, 기판이 탑재되는 핸드를 포함하되;
상기 핸드는
기판이 놓여지는 하부 지지대; 및
상기 하부 지지대에 안착된 기판의 상면 가장자리를 클램핑하는 그립부재를 포함하는 기판 반송 장치.A substrate transfer apparatus comprising:
Base;
An arm portion provided on the base and folded or unfolded to convey the substrate; And
And a hand installed at the tip of the arm portion and on which the substrate is mounted;
The hand
A lower support on which the substrate is placed; And
And a grip member for clamping an upper edge of the substrate seated on the lower support. 제1항에 있어서,
상기 그립 부재는
기판의 상면 가장자리를 누르도록 상기 하부 지지대와 대향되게 설치되는 상부 지지대; 및
상기 상부 지지대를 상하로 이동시키기 위한 구동부를 포함하는 기판 반송 장치.
The method of claim 1,
The grip member
An upper support installed to face the lower support so as to press an upper edge of the substrate; And
And a driving part for moving the upper support up and down.
KR1020120037172A 2012-04-10 2012-04-10 Substrate transport apparatus KR101414136B1 (en)

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US20180261490A1 (en) * 2015-05-19 2018-09-13 Verselus, Llc Apparatus for transporting an object from one location to another location in a manufacturing environment

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