KR20130027377A - Led light with high heat radiating property - Google Patents

Led light with high heat radiating property Download PDF

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Publication number
KR20130027377A
KR20130027377A KR1020110090920A KR20110090920A KR20130027377A KR 20130027377 A KR20130027377 A KR 20130027377A KR 1020110090920 A KR1020110090920 A KR 1020110090920A KR 20110090920 A KR20110090920 A KR 20110090920A KR 20130027377 A KR20130027377 A KR 20130027377A
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South Korea
Prior art keywords
led
heat transfer
transfer plate
radiant heat
heat
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KR1020110090920A
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Korean (ko)
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김영철
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소닉스자펜 주식회사
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Priority to KR1020110090920A priority Critical patent/KR20130027377A/en
Priority to PCT/KR2011/009952 priority patent/WO2013035940A1/en
Publication of KR20130027377A publication Critical patent/KR20130027377A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V1/00—Shades for light sources, i.e. lampshades for table, floor, wall or ceiling lamps
    • F21V1/14—Covers for frames; Frameless shades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/0075—Fastening of light sources or lamp holders of tubular light sources, e.g. ring-shaped fluorescent light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PURPOSE: An LED lamp with a high heat radiation property is provided to reduce an operation temperature of an LED by rapidly transmitting radiant heat from the LED to the outside. CONSTITUTION: A heat sink(1) is attached to a rear side of an LED substrate(2). A circular radiant heat transfer tube(1a) is formed in the center of the heat sink. A plurality of heat radiation protrusions(1b) are formed on a rear side of the heat sink to maximize a heat radiation area. A circular radiant heat transfer plate(3) efficiently distributes and discharges radiant heat from a front side of the LED substrate and is combined with a circular radiant heat transfer plate fixture(4). The circular radiant heat transfer plate fixture is screwed to a transparent cover member fixture(6) combined with an upper side of a transparent cover member(5).

Description

방열특성이 우수한 엘이디 전구{LED LIGHT WITH HIGH HEAT RADIATING PROPERTY}LED Bulb with Excellent Heat Dissipation {LED LIGHT WITH HIGH HEAT RADIATING PROPERTY}

본 발명은 엘이디 전구에 관한 것으로, 보다 상세하게는, 엘이디에서 방출되는 복사열을 외부로 빠르게 전달함으로서 엘이디의 작동온도를 낮추고, 이에 따라 엘이디 전원회로의 전압과 전류가 안정되어 전원회로의 발열을 낮춰 오랜 시간이 지나도록 안정적으로 사용할 수 있는 방열특성이 우수한 엘이디 전구에 관한 것이다.
The present invention relates to an LED bulb, and more particularly, by rapidly transmitting the radiant heat emitted from the LED to the outside to lower the operating temperature of the LED, thereby to stabilize the voltage and current of the LED power supply circuit to lower the heat generation of the power supply circuit The present invention relates to an LED bulb having excellent heat dissipation characteristics that can be stably used for a long time.

종래 일반적인 대용량 엘이디 전구에 사용되고 있는 엘이디는 작동과정에서 발생하는 많은 복사열로 인해 엘이디기판의 온도가 상승함으로서 전원회로의 전압변동이 다시 엘이디에 공급되는 전압과 전류의 변화 또는 전원회로의 온도상승으로 이어져 장기간 사용 시 매우 많은 문제점을 유발시키고 있다.LED, which is used in general large-capacity LED bulbs, increases the temperature of the LED substrate due to a large amount of radiant heat generated during the operation process. Long-term use causes a lot of problems.

엘이디 전구에서 발생하는 복사열은 엘이디 전면에서 발생하는 복사열과 배면에서 발생하는 복사열로 구분할 수 있다. 통상적으로 엘이디 전면에서 발생하는 복사열은 전체 복사열의 20~30 %를 이루고 배면에서 발생하는 복사열은 70~80 %에 이른다. Radiation heat generated by LED bulbs can be classified into radiation heat generated from the front of the LED and radiation heat generated from the back of the LED. Normally, radiant heat generated from the front of the LED makes up 20-30% of the total radiant heat and 70-80% of radiant heat generated from the back.

하지만, 종래 일반적인 엘이디 전구는 이러한 발열양상을 고려하지 않아, 오로지 발생된 복사열이 투명 플라스틱을 통하여 외부로 방출되도록 하는 구조만을 채택하여 오히려 배면에서 더욱 많이 발생하는 복사열에 의한 위험성이 매우 높은 문제가 있다.
However, the conventional general LED light bulb does not consider such a heat generation pattern, and adopts only a structure in which generated radiant heat is emitted to the outside through the transparent plastic, but there is a problem that the risk of radiation heat generated more from the rear is rather high. .

본 발명이 해결하고자 하는 과제는 전술한 바와 같은 문제점들을 해결하기 위해 안출된 것으로서, 그 목적은 엘이디에서 방출되는 복사열을 외부로 빠르게 전달함으로서 엘이디의 작동온도를 낮추고, 이에 따라 엘이디 전원회로의 전압과 전류가 안정되어 전원회로의 발열을 낮춰 오랜 시간이 지나도록 안정적으로 사용할 수 있는 엘이디 전구를 제공함에 있다.
The problem to be solved by the present invention is to solve the problems as described above, the purpose is to quickly transfer the radiant heat emitted from the LED to the outside to lower the operating temperature of the LED, according to the voltage of the LED power supply circuit It is to provide an LED bulb that can be used stably for a long time because the current is stabilized to lower the heat generation of the power circuit.

상기한 바와 같은 본 발명의 기술적 과제는 다음과 같은 수단에 의해 달성되어진다.The technical problem of the present invention as described above is achieved by the following means.

(1) 엘이디가 상면에 장착된 엘이디기판; 상기 엘이디기판을 커버하는 투명 커버부재; 및 상기 엘이디기판의 배면과 부착되고, 상기 배면에서 발생하는 복사열을 외부로 방출하는 원형복사열전달관이 중앙에 형성된 방열판을 포함하는 엘이디 전구.
(1) an LED substrate having an LED mounted on the top surface thereof; A transparent cover member covering the LED substrate; And a heat dissipation plate attached to a rear surface of the LED substrate and having a circular radiation heat transfer tube disposed at the center thereof to radiate radiant heat generated from the rear surface to the outside.

(2) 제 1항에 있어서,(2) The method according to claim 1,

상기 엘이디의 측면을 포위하도록 설치되며, 엘이디 측면으로 발생하는 열을 외부로 방출하는 원형복사열전달판이 상기 엘이디기판에 고정된 것을 특징으로 하는 엘이디 전구.
The LED bulb is installed to surround the side of the LED, characterized in that the circular radiation heat transfer plate for emitting heat generated by the LED side to the outside is fixed to the LED substrate.

(3) 제 1항에 있어서, (3) The method according to claim 1,

상기 투명커버부재를 수용하고, 투명커버부재의 상부에 결합되는 투명커버고정대와 나사결합되며, 상기 원형복사열전달판과 고정수단으로 체결고정되는 원형복사열전달판고정대를 포함하는 엘이디 전구.
LED bulb containing the circular cover heat transfer plate guide for receiving the transparent cover member, screwed with the transparent cover guide coupled to the upper portion of the transparent cover member, and fastened by the circular radiation heat transfer plate and the fixing means.

(4) 제 1항에 있어서,(4) The method according to 1,

엘이디기판과 방열판은 그라파이트 양면테이프로 접착된 것을 특징으로 하는 엘이디 전구.
The LED substrate and the heat sink are LED bulbs, characterized in that bonded with a graphite double-sided tape.

(5) 제 1항에 있어서, (5) The method according to claim 1,

상기 원형복사열전달판의 내면 및 방열판의 배면에 복사열의 외부방출을 가속화하기 위한 카본이 증착된 것을 특징으로 하는 엘이디 전구.LED bulb, characterized in that the carbon is deposited on the inner surface of the circular radiation heat transfer plate and the back of the heat sink to accelerate the external emission of radiant heat.

본 발명에 의하면, 엘이디에서 방출되는 복사열을 외부로 빠르게 전달함으로서 엘이디의 작동온도를 낮추고, 이에 따라 엘이디 전원회로의 전압과 전류가 안정되어 전원회로의 발열을 낮춰 오랜 시간이 지나도록 안정적으로 사용할 수 있는 엘이디 전구를 제공할 수 있다.
According to the present invention, by rapidly transmitting the radiant heat emitted from the LED to the outside to lower the operating temperature of the LED, accordingly the voltage and current of the LED power supply circuit is stabilized to lower the heat generated in the power supply circuit can be used stably for a long time. Can provide LED bulbs.

도 1은 본 발명에 따른 엘이디 전구의 분해사시도이다.
도 2는 본 발명에 따른 엘이디 전구의 측단면도(a) 및 절단면을 갖는 결합사시도(b)이다.
도 3은 본 발명에 따른 엘이디 전구의 결합사시도를 나타낸다.1 is an exploded perspective view of the LED bulb according to the present invention.
Figure 2 is a side cross-sectional view (a) and a combined perspective view (b) of the LED bulb in accordance with the present invention.
Figure 3 shows a combined perspective view of the LED bulb according to the present invention.

본 발명은 엘이디가 상면에 장착된 엘이디기판; 상기 엘이디기판을 커버하는 투명 커버부재; 및 상기 엘이디기판의 배면과 부착되고, 상기 배면에서 발생하는 복사열을 외부로 방출하는 원형복사열전달관이 중앙에 형성된 방열판을 포함하는 엘이디 전구를 제공한다.The present invention is an LED substrate is mounted on the LED upper surface; A transparent cover member covering the LED substrate; And a heat dissipation plate attached to a rear surface of the LED substrate and having a circular radiation heat transfer tube configured to radiate radiant heat generated from the rear surface to the outside.

이하, 본 발명의 내용을 실시예를 도시한 도면을 참조하여 보다 상세하게 설명하면 다음과 같다.Hereinafter, the content of the present invention will be described in more detail with reference to the drawings showing embodiments.

도 1은 본 발명에 따른 엘이디 전구의 분해사시도이고, 도 2는 본 발명에 따른 엘이디 전구의 측단면도(a) 및 절단면을 갖는 결합사시도(b)이다.1 is an exploded perspective view of an LED bulb according to the present invention, Figure 2 is a side cross-sectional view (a) and a combined perspective view (b) having a cut surface of the LED bulb according to the present invention.

본 발명에 따른 엘이디 전구는 엘이디기판(2)의 배면에 부착되는 방열판(1)을 포함한다. The LED bulb according to the present invention includes a heat sink (1) attached to the back of the LED substrate (2).

상기 본 발명에 따른 방열판(10)은 엘이디기판(2)의 배면에서 발생하는 복사열을 효율적으로 외부로 방출하기 위해 엘이디기판(2)의 배면과 부착되어진다. 이때 엘이디기판(2)의 배면과 방열판(1)의 상면간 부착을 위해 다양한 결합부재가 채택될 수 있으나, 바람직하게는 그라파이트 양면테이프를 사용하는 것이 방열효과를 극대화하기 위해 좋다. The heat sink 10 according to the present invention is attached to the rear surface of the LED substrate 2 in order to efficiently radiate radiant heat generated from the rear surface of the LED substrate 2 to the outside. In this case, a variety of coupling members may be adopted for attachment between the back surface of the LED substrate 2 and the top surface of the heat dissipation plate 1, but preferably, a graphite double-sided tape is used to maximize the heat dissipation effect.

이때 그라파이트 양면테이프는 전기도체성을 지닌 물질을 사용하여 두께 0.25~0.3mm로 그 양면에 그라파이트를 고점도로 증착한 것을 사용할 수 있다. In this case, the graphite double-sided tape may be one having a high viscosity of graphite on both sides with a thickness of 0.25˜0.3 mm using a material having electrical conductivity.

이러한 그라파이트 양면테이프의 일면에 엘이디기판(20)의 배면을 부착시키고, 타면에 방열판(10)의 상면을 부착하여 양자를 결합시킨 후 고정나사를 이용하여 방열판(1) 및 엘이디기판(2)을 견고하게 고정시킬 수 있다.Attach the back surface of the LED substrate 20 to one surface of the graphite double-sided tape, and attach the upper surface of the heat sink 10 to the other surface to combine the two and then heat the heat sink 1 and the LED substrate 2 using a fixing screw. It can be fixed firmly.

본 발명에서 상기 방열판(1)은 그 중앙에 원형복사열전달관(1a)이 형성되어 엘이디기판(2)의 배면에서 방출되는 상당량의 복사열을 이곳을 통해 외부로 방출시킬 수 있도록 한다. In the present invention, the heat dissipation plate 1 has a circular radiation heat transfer tube 1a formed at the center thereof so as to emit a considerable amount of radiant heat emitted from the back of the LED substrate 2 to the outside.

방열판의 배면에는 방열면적을 극대화하기 위해 방열돌부(1b)가 다수 형성되어 있다. 방열판은 가볍고 열방출특성이 우수한 알루미늄 재질이 사용될 수 있으며, 그 전면에는 열전도특성이 우수한 구리가 증착되어질 수 있다.A plurality of heat dissipation protrusions 1b are formed on the rear surface of the heat dissipation plate to maximize the heat dissipation area. The heat sink may be made of a light aluminum material having excellent heat dissipation characteristics, and copper may be deposited on the front surface of the heat sink.

바람직하게는 상기 방열판의 배면 또는/및 원형복사열전달관의 내면에 복사열 방출을 극대화하기 위해 카본층을 증착할 수 있다.Preferably, the carbon layer may be deposited on the rear surface of the heat sink and / or the inner surface of the circular radiation heat transfer tube to maximize radiant heat emission.

본 발명에서는 바람직하게는 상기 엘이디기판(2)의 전면으로 발생하는 복사열을 효과적으로 분산시켜 배출하도록 엘이디의 측면을 포위하는 방식으로 원형복사열전달판(3)을 설치한다.In the present invention, the circular radiant heat transfer plate 3 is installed in such a way as to surround the side surface of the LED so as to effectively disperse and discharge radiant heat generated on the front surface of the LED substrate 2.

상기 원형복사열전달판(30)은 엘이디기판에 부착된 엘이디의 가장자리를 포위하도록 소정의 높이를 갖는 원형의 판형(혹은 띠형)으로 이루어지며, 엘이디에서 전면으로 발생하는 복사열의 상당량을 측면으로 흡수하여 외부로 방출하는 기능을 수행한다.The circular radiation heat transfer plate 30 is formed in a circular plate shape (or strip shape) having a predetermined height so as to surround the edge of the LED attached to the LED substrate, and absorbs a considerable amount of radiant heat generated from the LED to the front side to the side. It performs the function of emitting to the outside.

상기 원형복사열전달판(3)은 엘이디기판(2)의 가장자리와 결합하는 부착면(3a)이 내주연에 형성되어 상기 엘이디기판과 고정나사결합 등을 이용하여 고정될 수 있도록 한다.The circular radiation heat transfer plate 3 has an attachment surface 3a coupled to the edge of the LED substrate 2 to be formed on the inner circumference thereof so that the circular radiation heat transfer plate 3 can be fixed using the LED substrate and the fixing screw coupling.

또한 상기 원형복사열전달판(3)은 그 상부 외주연에 후술하는 원형복사열전달판 고정대(4)와 결합되는 요홈부(3b)가 형성되어 상기 원형복사열전달판 고정대(4)에 결합되어 고정나사 등을 이용하여 고정될 수 있도록 한다.In addition, the circular radiation heat transfer plate 3 has a recess 3b which is coupled to the circular radiation heat transfer plate holder 4 to be described later on the upper outer circumference thereof, and is coupled to the circular radiation heat transfer plate holder 4 to fix the screw. It can be fixed using the back.

본 발명에 따른 엘이디전구의 엘이디기판 상에는 엘이디에서 방출되는 빛을 효율적으로 투과시킬 수 있는 투명커버부재(5)가 원형복사열전달판 고정대(4)의 수납홈(4a)에 안착되어진다.On the LED substrate of the LED bulb according to the present invention, a transparent cover member 5 capable of efficiently transmitting light emitted from the LED is seated in the receiving groove 4a of the circular radiation heat transfer plate holder 4.

또한 상기 원형복사열전달판 고정대(4)는 투명커버부재(5)의 상부에 결합되는 투명커버부재 고정대(6)와 나사결합되어진다.
In addition, the circular radiation heat transfer plate holder (4) is screwed with the transparent cover member holder (6) coupled to the upper portion of the transparent cover member (5).

도 3은 본 발명에 따른 엘이디 전구의 결합사시도로서, 꼭지쇠(7)가 말단에 부착된 하우징(8)이 방열판의 후단에 결합되어진 형태의 엘이디 전구 제품을 형상화한 것이다. 3 is a perspective view of the LED bulb according to the present invention, in which the housing 8 having the clasp 7 attached to the distal end is shaped as an LED bulb product having a shape coupled to the rear end of the heat sink.

이러한 구성의 본 발명에 따른 엘이디 전구는 엘이디에서 방출되는 복사열을 외부로 빠르게 전달함으로서 엘이디의 작동온도를 낮추고, 이에 따라 엘이디 전원회로의 전압과 전류가 안정되어 전원회로의 발열을 낮춰 오랜 시간이 지나도록 안정적으로 사용할 수 있게 해준다.LED bulb according to the present invention in such a configuration to lower the operating temperature of the LED by quickly transferring the radiant heat emitted from the LED to the outside, accordingly the voltage and current of the LED power supply circuit is stabilized to lower the heat generation of the power supply circuit for a long time So that it can be used stably.

실시예로 상기와 같은 구성의 본 발명에 따른 80 와트 대용량 엘이디 전구를 대상으로 실온에서 6시간을 연속적으로 가동시켜 실험한 수치는 하기 표 1에 나타낸 바와 같이 대조구인 종래기술의 일반적인 엘이디 전구(원형복열전달관이 없는 방열판이 부착된 형태)에 비하여 복사열 방출 및 방열효과가 매우 우수하고, 전원회로의 전압과 전류가 매우 안정적으로 공급, 가동되었음을 확인할 수 있었다.
As an example, the numerical values tested by continuously operating the 80-watt large-capacity LED light bulbs according to the present invention as described above for 6 hours at room temperature are shown in Table 1 below. Compared with the heat sink without the double heat transfer tube), the radiant heat emission and heat dissipation effect is excellent, and the voltage and current of the power circuit are supplied and operated stably.

실험수치Experimental value 항목Item 실시예Example 비교예Comparative example 1. 엘이디기판 온도1. LED substrate temperature 63~65도63-65 degrees 85~88도85-88 degrees 2. 전원회로내부온도2. Temperature inside power circuit 58~62도58-62 degrees 69~72도69-72 degrees 3. 전력소모량3. Power Consumption 80~82와트80-82 watts 80~88와트80-88 watts

상기 표 1의 결과에서 확인할 수 있듯이, 본 발명에 따른 엘이디전구가 종래 일반구성의 엘이디전구에 비하여 복사열을 방열하는 효과가 매우 높다는 것을 확인할 수 있었다.
As can be seen from the results of Table 1, it was confirmed that the LED bulb according to the present invention has a very high effect of dissipating radiant heat as compared to the LED bulb of the conventional general configuration.

상기와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. It can be understood that

1: 방열판
1a: 원형복사열전달관
2: 엘이디기판
3: 원형복사열전달판
4: 원형복사열전달관 고정대
5: 투명커버부재
6: 투명커버부재 고정대
7: 꼭지쇠
8: 하우징 1: heat sink
1a: circular radiation heat transfer tube
2: LED substrate
3: circular radiation heat transfer plate
4: circular radiation heat transfer tube holder
5: transparent cover member
6: transparent cover member holder
7: clasp
8: housing

Claims (5)

엘이디가 상면에 장착된 엘이디기판; 상기 엘이디기판을 커버하는 투명 커버부재; 및 상기 엘이디기판의 배면과 부착되고, 상기 배면에서 발생하는 복사열을 외부로 방출하는 원형복사열전달관이 중앙에 형성된 방열판을 포함하는 엘이디 전구.LED substrate mounted on the upper surface of the LED; A transparent cover member covering the LED substrate; And a heat dissipation plate attached to a rear surface of the LED substrate and having a circular radiation heat transfer tube disposed at the center thereof to radiate radiant heat generated from the rear surface to the outside. 제 1항에 있어서,
상기 엘이디의 측면을 포위하도록 설치되며, 엘이디 측면으로 발생하는 열을 외부로 방출하는 원형복사열전달판이 상기 엘이디기판에 고정된 것을 특징으로 하는 엘이디 전구.The method of claim 1,
The LED bulb is installed to surround the side of the LED, characterized in that the circular radiation heat transfer plate for emitting heat generated by the LED side to the outside is fixed to the LED substrate. 제 1항에 있어서,
상기 투명커버부재를 수용하고, 투명커버부재의 상부에 결합되는 투명커버고정대와 나사결합되며, 상기 원형복사열전달판과 고정수단으로 체결고정되는 원형복사열전달판고정대를 포함하는 엘이디 전구.The method of claim 1,
LED bulb containing the circular cover heat transfer plate guide for receiving the transparent cover member, screwed with the transparent cover guide coupled to the upper portion of the transparent cover member, and fastened by the circular radiation heat transfer plate and the fixing means. 제 1항에 있어서,
엘이디기판과 방열판은 그라파이트 양면테이프로 접착된 것을 특징으로 하는 엘이디 전구.The method of claim 1,
The LED substrate and the heat sink are LED bulbs, characterized in that bonded with a graphite double-sided tape. 중앙원형복사열전달판의 내면 및 방열판의 배면에 복사열의 외부방출을 가속화하기 위한 카본이 증착된 것을 특징으로 하는 엘이디 전구.LED bulb, characterized in that the carbon is deposited on the inner surface of the central radiant heat transfer plate and the back of the heat sink to accelerate the external emission of radiant heat.
KR1020110090920A 2011-09-07 2011-09-07 Led light with high heat radiating property KR20130027377A (en)

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KR1020110090920A KR20130027377A (en) 2011-09-07 2011-09-07 Led light with high heat radiating property
PCT/KR2011/009952 WO2013035940A1 (en) 2011-09-07 2011-12-21 Led bulb having superior heat dissipating properties

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104180350A (en) * 2014-09-05 2014-12-03 东莞市闻誉实业有限公司 LED (Light Emitting Diode) lamp with flat type radiator
CN104180351A (en) * 2014-09-05 2014-12-03 东莞市闻誉实业有限公司 LED lamp with plate type radiator

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5182634B2 (en) * 2008-09-22 2013-04-17 東芝ライテック株式会社 lighting equipment
KR101021722B1 (en) * 2008-12-10 2011-03-15 한국광기술원 Illuminator
KR100932192B1 (en) * 2009-05-26 2009-12-16 김용철 A led light apparatus having the advanced radiation of heat
KR101055743B1 (en) * 2010-06-23 2011-08-11 엘지전자 주식회사 Lighting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104180350A (en) * 2014-09-05 2014-12-03 东莞市闻誉实业有限公司 LED (Light Emitting Diode) lamp with flat type radiator
CN104180351A (en) * 2014-09-05 2014-12-03 东莞市闻誉实业有限公司 LED lamp with plate type radiator

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