KR20130006045A - Laser machining apparatus and method - Google Patents

Laser machining apparatus and method Download PDF

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Publication number
KR20130006045A
KR20130006045A KR1020110067848A KR20110067848A KR20130006045A KR 20130006045 A KR20130006045 A KR 20130006045A KR 1020110067848 A KR1020110067848 A KR 1020110067848A KR 20110067848 A KR20110067848 A KR 20110067848A KR 20130006045 A KR20130006045 A KR 20130006045A
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KR
South Korea
Prior art keywords
laser
workpiece
cooling fluid
laser head
laser beam
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Application number
KR1020110067848A
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Korean (ko)
Inventor
도상회
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도상회
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Priority to KR1020110067848A priority Critical patent/KR20130006045A/en
Publication of KR20130006045A publication Critical patent/KR20130006045A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0736Shaping the laser spot into an oval shape, e.g. elliptic shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38Selection of media, e.g. special atmospheres for surrounding the working area
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

PURPOSE: A laser processing machine and a processing method are provided to improve a processing speed by performing reciprocating scribing and to perform the scribing and full cutting so that a separate process and facilities for breaking are not necessary. CONSTITUTION: A laser processing machine comprises a laser head(300) and a cooling fluid sprayer. The laser head divides laser beam incident from a laser generator into a plurality of emitted laser beams(L1,L2,L3,L4), thereby irradiating the divided laser beams to a surface of a workpiece(W). The cooling fluid sprayer is positioned in a machining direction at a lower side of the laser head, thereby forming a scribing line on the surface of the workpiece by spraying cooling fluid to the workpiece.

Description

Laser machining apparatus and method

The present invention relates to a laser processing apparatus and method for forming a scribing line on a workpiece using a laser.

A brittle material represented by glass, in particular, a translucent brittle material, is used in various fields such as exterior panels of buildings as well as substrates of flat panel display devices such as liquid crystal panels and plasma display panels. The glass can be mechanically cut using a diamond wheel or the like. However, this mechanical cutting method implies the possibility that the glass surface may be contaminated or damaged by small debris generated during cutting. In addition, minute cracks may occur near the cutting line, and due to the nature of the brittle material, when a force is applied to the cracks, the whole material may be cracked. Therefore, a post-treatment process such as polishing to remove fine cracks around the cutting line may be added to increase the processing cost.

Recently, a method of forming a scribing line by applying a thermal stress to a brittle material using a laser and then applying a physical or thermal shock to the material to cut along the scribing line has been proposed and used.

In such a laser processing apparatus, the shape of the laser beam is long in one direction, and the processing direction must be aligned with the direction of the laser beam, that is, the longitudinal direction. For example, if the laser beam is in the X direction, machining in the X direction is possible. Machining in the Y direction is impossible. To machine in the Y direction, the table on which the workpiece is mounted must be rotated about the Z axis to align the machining direction with the length of the laser beam. When the workpiece is small, it is easy to rotate the table, but when the workpiece is large, the table is not easy to rotate. In addition, when the table is rotated, a rotation area corresponding to the diagonal length of the table must be secured, thereby increasing the size and working space of the processing apparatus. In addition, when rotating the table itself, it takes time to rearrange the position of the laser beam with respect to the workpiece, and an error may occur in the alignment of the laser beam, thereby reducing the precision of machining.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a laser processing apparatus and a processing method capable of processing in a variety of directions quickly and precisely, and can suppress the increase in processing apparatus and work space. .

The laser processing apparatus according to the present invention comprises: a laser head for dividing an incident laser beam incident from a laser generator into a plurality of output laser beams and irradiating the surface of the workpiece; And a cooling fluid injector positioned downstream of the laser head in a processing direction to inject a cooling fluid into the workpiece, so as to form a scribing line on the surface of the workpiece. It can be rotated about the optical axis of the incident laser beam.

An optical axis of the first emission laser beam, which is first divided among the plurality of emission laser beams, may be coincident with the optical axis of the incident laser beam.

The laser head comprises: a plurality of beam splitters for dividing the incident laser beam into the plurality of output laser beams; The elliptical shape of the plurality of output laser beams, a plurality of cylindrical lens movable in the optical axis direction; may include. The plurality of cylindrical lenses may be moved individually. The plurality of cylindrical lenses may be moved simultaneously as one assembly. The plurality of cylindrical lenses may form the plurality of output laser beams in a symmetrical form in the processing direction.

A second cooling fluid injector, which is located on the opposite side of the cooling fluid injector with the laser head interposed therebetween, rotates together with the laser head.

At least one of the plurality of output laser beams may be irradiated to the workpiece after cooling on the downstream side of the cooling fluid injector based on the processing direction to cause thermal shock to divide the workpiece along the scribing line. have.

Laser processing method according to the present invention, to form a scribing line on the surface of the workpiece and the laser head for dividing the incident laser beam irradiated from the laser generator into a plurality of output laser beam to irradiate the surface of the workpiece And a cooling fluid injector positioned downstream of the laser head in the processing direction and injecting a cooling fluid to the workpiece, wherein the laser head and the cooling fluid injector emit the laser beam. Rotating a plurality of output laser beams in a processing direction by rotating about an optical axis of the plurality of output laser beams; Irradiating a laser beam onto the workpiece while moving the laser head and the cooling fluid injector relative to the workpiece; And spraying a cooling fluid onto the workpiece irradiated with the laser beam to form a scribing line.

The processing method may further include performing reciprocating scribing in the processing direction by rotating the laser head and the cooling fluid injector 180 degrees about the optical axis.

The processing method may include irradiating at least one of the plurality of output laser beams to the workpiece after cooling at a downstream side of the cooling fluid injector with reference to the processing direction to cause thermal shock to perform the thermal shock along the scribing line. Dividing the workpiece; may be further provided.

According to the laser processing apparatus and method according to the present invention described above, the following effects can be obtained.

First, fast and precise machining in any machining direction is possible. The increase in the processing apparatus and the work space can be suppressed.

Secondly, reciprocating scribing is possible, thereby improving processing speed.

Third, scribing and full-cutting are possible, which saves additional processes and equipment for braking.

1 is a block diagram of an embodiment of a laser processing apparatus according to the present invention.
FIG. 2 is a perspective view illustrating an example of a configuration for dividing an incident laser beam into a plurality of output laser beams and shaping them in the form of spot beams for scribing; FIG.
3 is a perspective view showing an example of a configuration for moving the cylindrical lens in the optical axis direction.
4 is a perspective view showing another example of the configuration for moving the cylindrical lens in the optical axis direction.
5 to 8 show examples of the form of a spot beam irradiated onto a workpiece.
9 is a block diagram of an embodiment of a laser head rotatable about an optical axis of an exit laser beam.
10 is a perspective view of one embodiment of a structure for rotating a laser head about an optical axis of an exit laser beam;
11 and 12 illustrate a process of forming a scribing line in the X direction.
13 and 14 illustrate a process of forming a scribing line in the Y direction.
15 illustrates a process of forming a scribing line in an arbitrary direction.
16 is a schematic diagram of one embodiment of a laser head capable of full-cutting.
17 is a block diagram of an embodiment of a laser processing apparatus according to the present invention capable of reciprocating scribing.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the laser processing apparatus according to the present invention.

1 is a block diagram showing an embodiment of a laser processing apparatus according to the present invention. The laser processing apparatus shown in FIG. 1 applies a laser beam to a surface of a brittle material such as glass, for example, and then cuts the surface of the workpiece using heat stress generated by spraying a cooling fluid. It is a device for forming a scribe line.

The laser beam and the workpiece are moved relative to the scribing process. Here, relative movement means that when the workpiece is moved in the machining direction and the laser beam is positioned at a fixed position, when the laser beam is moved in the machining direction and the workpiece is positioned at a fixed position, the laser beam and the workpiece are opposite to each other. Includes cases that are moved in the direction. Of course, the laser beam and the workpiece are moved in the same direction, but the speed is different.

1, a table 100 on which a workpiece W is placed, a laser generator 200 for generating a laser beam, a laser head 300 for irradiating the workpiece W with a laser beam, A cooling fluid injector 401 is shown for injecting cooling fluid into the workpiece W after irradiation of the beam for criving.

As the laser generator 200, generating a laser beam of a wavelength band that can be absorbed by the workpiece W may be employed. In general, for example, a CO 2 laser may be employed as the laser generator 200. Although not shown in the drawings, a laser output detector, a laser driver, and a laser generator 200 that detect the output of the laser beam generated by the laser generator 200 and control the laser generator 200 to have a uniform output. A controller for turning on / off may be further provided. The laser output detector, the laser driver, and the controller may be integrally provided in the laser generator 200 or may be provided in a controller (not shown) for controlling a processing process.

The cooling fluid injector 401 may be in the form of a nozzle capable of intermittent, and may be supplied with the cooling fluid from the cooling fluid providing means not shown. The cooling fluid injector 401 is positioned behind the laser head 300 based on the processing direction, for example, the X1 direction.

Depending on the workpiece | work W, it is necessary to form the initial crack used as the starting point of a scribing line. The laser processing apparatus of this embodiment may further include an initial crack former 501 for forming an initial crack which is a starting point of the scribing line. In this embodiment, the initial crack former 501 is configured to move with the laser head 300. The initial crack former 501 is located in front of the laser head 300 with respect to the processing direction, for example, the X1 direction. The initial crack former 501 may form an initial crack by applying a mechanical processing force to the workpiece (W). For example, the initial crack former 501 may be a diamond wheel, but the scope of the present invention is not limited thereto. For example, the initial crack former 501 may form the initial crack by irradiating the workpiece (W) with a UV laser beam. The initial crack former 501 does not necessarily need to be moved together with the laser head 300, but may be installed so as to be capable of moving only within the extent that the initial crack may be formed at the position where the scribing line is to be formed. .

In this embodiment, the laser head 300, the cooling fluid injector 401, and the initial crack former 501 are coupled to the first movable body 10, and the first movable body 10 extends in the X direction. The movable body 20 may be installed to be moved in the X direction.

The second movable body 20 is supported by the support members 31 and 32 extending in the direction perpendicular to the X direction, that is, the direction perpendicular to the ground in FIG. 1, and is Y-direction along the support members 31 and 32. Can be moved to.

Referring to FIG. 2, the laser head 300 divides the incident laser beam L incident from the laser generator 200 into a plurality of output laser beams L1, L2, L3, and L4 aligned in the processing direction, thereby processing the workpiece. Check in (). To this end, the laser head 300 is provided with a plurality of beam splitters 301-304 for dividing the incident laser beam L into a plurality of output laser beams L1, L2, L3, L4. The plurality of beam splitters 301-304, for example, transmits and reflects a portion of the incident laser beam depending on its reflection / transmittance. The incident laser beam L is sequentially divided into the first to fourth output laser beams L1, L2, L3, L4 by the plurality of beam splitters 301-304. In the present embodiment, a case is described in which the four laser beams L1, L2, L3, and L4 are divided. However, the scope of the present invention is not limited thereto. If necessary, the number of exit laser beams can be adjusted by adjusting the number of beam splitters.

The light intensities of the split laser beams L1, L2, L3, L4 may be the same or different according to the reflectance of each of the beam splitters 301, 302, 303, 304. FIG. In this embodiment, the incident laser beam L is divided so that the light intensities of the output laser beams L1, L2, L3, L4 are the same. To this end, the reflectivity of the beam splitters 301, 302, 303, 304 may be selected to be 25%, 34%, 50%, 100%, respectively. Then, the light intensity of the emission laser beams L1, L2, L3, L4 becomes 25% of the intensity of the incident laser beam L, respectively. The beam splitter 304 with 100% reflectivity is substantially a reflecting mirror, but is referred to herein as a beam splitter with 100% reflectivity in order to maintain functional consistency. In the above-described example, the case in which the incident laser beam L is divided such that the light intensity of the output laser beams L1, L2, L3, and L4 is the same has been described. However, the scope of the present invention is not limited thereto. If necessary, the light intensity of at least one of the output laser beams L1, L2, L3, L4 may be different from the rest, and for this purpose, beam splitters 301, 302, 303, 304 having an appropriate reflectance may be used. Can be selected. For example, beamsplitters 301, 302, 303, 304 may be replaceable.

The cylindrical lenses 311-314 shape the plurality of output laser beams L1, L2, L3, L4 into elliptical beams. In this embodiment, cylindrical lenses 311, 312, 313 and 314 having curvatures in the Y direction are employed to form long elliptical beams in the X1 and X2 directions. Thereby, four elliptical spot beams whose long axes are directed in the X direction can be irradiated to the workpiece W, as indicated by reference numerals Ls1, Ls2, Ls3, Ls4 in FIG. Although not shown in FIG. 2, a cylindrical lens (not shown) having a curvature in the X direction may be further employed to adjust the length of the long axis of the spot beams Ls1, Ls2, Ls3, and Ls4 as necessary. In FIG. 2, four elliptical spot beams Ls1, Ls2, Ls3, and Ls4 are shown spaced apart from each other. However, this is for convenience of description and the scope of the present invention is not limited to the form shown in FIG. 2. . The four elliptical spot beams Ls1, Ls2, Ls3, and Ls4 may be arranged so that adjacent beams contact each other, and a predetermined amount may be arranged to overlap each other.

By moving the cylindrical lenses 311, 312, 313, 314 in the optical axis direction, that is, in the Z direction of FIG. 2, the length of the short axis of the elliptical spot beams Ls1, Ls2, Ls3, Ls4 can be adjusted. The cylindrical lenses 311, 312, 313, and 314 may each move in the optical axis direction. For example, as shown in FIG. 3, one end of the cylindrical lens 311 is supported by the guide member 321 provided in the optical axis direction, that is, the Z direction, and the other end of the lead screw 322 is also provided in the Z direction. Can be supported). By rotating the lead screw 322 in this configuration, the cylindrical lens 311 can be moved in the Z direction to adjust the length in the short axis direction of the spot beam Ls1. The actuator 323 shown in FIG. 3 may be a manual actuating mechanism capable of manually rotating the lead screw 322. For example, the actuator 323 may be a micrometer-integrated manual operation mechanism capable of precisely adjusting the moving distance of the cylindrical lens 311. Actuator 323 may also be an electric actuator such as a rotating motor. In FIG. 3, only the configuration for moving the cylindrical lens 311 is disclosed, but the length of the short axis may be adjusted using the same configuration as the remaining cylindrical lenses 312, 313, and 314. Furthermore, in the case of further comprising a cylindrical lens having a curvature in the Y direction, the length of the long axis of the spot beams Ls1, Ls2, Ls3, and Ls4 is also moved by moving the cylindrical lens in the optical axis direction Z by the same configuration. You can also adjust. The structure for moving the cylindrical lens 311 shown in FIG. 3 in the optical axis direction is merely an example, and the scope of the present invention is not limited by this structure itself, and the cylindrical lens (in addition to the structure shown in FIG. 3) There may be various examples for moving 311 in the optical axis direction. For example, the actuator 323 may be a linear motor capable of linear motion. In this case, the cylindrical lens 311 may be supported by a guide rail (not shown) extending in the optical axis direction.

In addition, the cylindrical lenses 311, 312, 313, 314 may be moved in the optical axis direction as a whole. For example, as shown in FIG. 4, the cylindrical lenses 311, 312, 313, 314 are disposed in the holder 330, and the holder 330 is a guide member 321 and a lead screw ( 322 may be supported. By such a configuration, the length of the spot beams Ls1, Ls2, Ls3, and Ls4 in the short axis direction can be adjusted by moving the holder 330 in the Z direction using the manual or electric actuator 323. When the processing conditions are changed, the cylindrical lenses 311, 312, 313, 314 may be replaced as a whole or individually.

By the above-described configuration, the shape of the spot beams Ls1, Ls2, Ls3, and Ls4 may be adjusted to obtain an optimum processing speed and quality according to conditions such as the material and thickness of the workpiece W. FIG. This is called beam shaping. The shape of the spot beams Ls1, Ls2, Ls3, Ls4 is optimal in consideration of the material and thickness of the workpiece W by selecting the cylindrical lenses 311, 312, 313, 314 and adjusting the position in the Z direction. It can be adjusted to be suitable for obtaining scribing quality. For example, the shape of the spot beams Ls1, Ls2, Ls3, and Ls4 may be the shape shown in FIGS. 5 to 8. As shown in Fig. 5, the length of the short axis of the spot beam Ls1 located on the most upstream side when the scribing operation is performed in the X1 direction is made small, and the short axis of the spot beams Ls2, Ls3, Ls4 is reduced. The length can be made larger. Such a form increases the relative light intensity of the spot beam Ls1 with respect to the spot beams Ls2, Ls3, and Ls4. That is, by increasing the light density of the spot beam Ls1 and increasing the irradiated light energy per unit area, the surface temperature of the workpiece W is quickly increased and the light density of the following spot beams Ls2, Ls3, and Ls4 is reduced. To maintain the elevated temperature.

As another example, the shape of the spot beam increases the length of the short axis of the spot beam Ls1 located at the most upstream side when performing the scribing operation in the X1 direction, as shown in FIG. The length of the short axis of Ls2, Ls3, Ls4) can also be made small. Such a form is a form which raises the temperature of the workpiece | work W gradually.

As another example, as shown in FIG. 7, the shape of the spot beams Ls1, Ls2, Ls3, and Ls4 may be the same, and the workpiece W may be heated to a uniform light density.

As another example, as shown in FIG. 8, the spot beams Ls1 and Ls4 located at the outside may be the same, and the spot beams Ls2 and Ls4 located at the inside may be the same. That is, the shape of the spot beams Ls1, Ls2, Ls3, and Ls4 may be symmetrical with respect to the machining direction.

The shape of the spot beams Ls1, Ls2, Ls3, Ls4 is not limited to the above-described examples, and the physical properties of the workpiece such as the material and thickness of the workpiece W, and the plurality of exit laser beams L1, L2, L3, L4. ) Can be appropriately determined according to conditions such as light intensity and scribing working speed. Such adjustment of the beam shape adjusts the focal length by moving the cylindrical lenses 311, 312, 313, 314 individually or entirely in the optical axis direction Z by the structure shown in FIG. 3 or 4. It is possible by doing. Of course, when the cylindrical lens and the actuator for adjusting the length of the long axis of the spot beams Ls1, Ls2, Ls3, Ls4 are further provided, You can also adjust the length.

The laser processing apparatus of this embodiment is not only capable of processing in the X direction, which is the alignment direction of the plurality of output laser beams L1, L2, L3, L4, but also machining in any direction not parallel to the Y direction or the X direction perpendicular thereto. It is also possible. To this end, in this embodiment, the laser head 300 is installed on the first movable body 10 to be rotated in the Z-axis direction. At this time, the laser head 300 is rotated around the optical axis of the incident laser beam L incident to the laser head 300 in the Z direction. If the center of rotation of the laser head 300 is spaced apart from the optical axis of the incident laser beam L, when the radar head 300 is rotated, the incident position of the incident laser beam L with respect to the first beam splitter 301 is changed. Very complex optics are required to compensate for this. Therefore, the structure of the optical system can be made very simple by rotating the laser head 300 about the optical axis of the incident laser beam L. FIG.

The optical axis of the first output laser beam L1 is the incident laser beam L so that the position of the first output laser beam L1 first divided from the incident laser beam L does not change even when the laser head 300 is rotated. ) Coincides with the optical axis. According to such a configuration, even if the laser head 300 is rotated, the position of the first output laser beam L1, which is a standard for starting processing, does not change, so that the alignment and processing operations are very quick and easy, and the processing precision It may also not be degraded.

As an example of a structure for rotating the laser head 300, referring to FIG. 9, the first movable body 10 has a hollow cylindrical shape in which an incident laser beam L passes through and extends in the Z direction. A supporter 11 may be provided. The housing 350 of the laser head 300 is installed to be rotatable to the supporter 11 via the bearing 12. The laser head 300 can be rotated using, for example, a timing belt. As an example, as shown in FIG. 10, the fixing pulley 351 is formed in the housing 350 about the optical axis of the incident laser beam L, and the fixing pulley 351 using the timing belt 13. ) And the driving motor 14 provided in the first movable body 10. Of course, the fixed pulley 351 is formed in the supporter 11 and the drive motor 14 is provided in the laser head 300 may be connected to the fixed pulley 351 and the drive motor 14 using the timing belt 13. have. Examples of the structure for rotating the laser head 300 is not limited to this, various equivalent structures may be employed.

The cooling fluid injector 401 may be coupled to the housing 350 of the laser head 300 and rotate together with the laser head 300, for example. If necessary, the initial crack former 501 may also be coupled to the housing 350 of the laser head 300 and rotate together with the laser head 300.

In addition, although not shown in the drawings, the laser head 300, the cooling fluid injector 401, and the initial crack former 501 are coupled to an unshown holder, and the holder is rotatably coupled to the supporter 11. May be

Now, the laser processing operation method by the above-mentioned structure is demonstrated.

<Scribing work in the X direction>

A case where the scribing operation is performed in the X1 direction will be described with reference to FIG. 11. When the shaping of the spot beams Ls1, Ls2, Ls3, and Ls4 is completed in consideration of the thickness, the material, the processing speed, and the like of the workpiece W, the first movable body 10 is moved in the X1 direction. The initial crack former 501 located on the upstream side in the X1 direction with respect to the laser head 300 is lowered toward the workpiece W. FIG. When the initial crack former 501 reaches the start position of scribing, the initial crack former 501 applies a mechanical machining force to the surface of the workpiece W to form the initial crack C1 as shown in FIG. 9. Let's do it. The length of the initial crack C1 may be, for example, within 1 mm, but the scope of the present invention is not limited thereto. Upon completion of the initial crack C1 formation, the initial crack former 501 is spaced apart from the surface of the workpiece W. FIG.

As the first movable member 10 moves in the X1 direction, the spot beams Ls1, Ls2, Ls3, and Ls4 irradiated from the laser head 300 are irradiated onto the surface of the workpiece W. As shown in FIG. Then, the surface of the workpiece W irradiated with the spot beams Ls1, Ls2, Ls3, and Ls4 has a property of expanding in a direction perpendicular to the X1 direction as the temperature increases. However, in areas other than the areas to which the spot beams Ls1, Ls2, Ls3, and Ls4 are irradiated, the temperature is low, thereby preventing expansion, thereby compressing stresses to the areas where the spot beams Ls1, Ls2, Ls3, and Ls4 are irradiated. Is generated, and tensile stress is generated in a direction perpendicular to the direction of the compressive stress.

Subsequently, the cooling fluid is irradiated to the workpiece W from the cooling fluid injector 400 located on the downstream side in the X1 direction with respect to the laser head 301. Then, the workpiece W is cooled while the workpiece W is cooled, and the crack proceeds from the initial crack C1 to the first processing direction X1 by the tensile stress at this time. The crack proceeds from the initial crack C1 in the direction heated by the laser head 300, whereby the workpiece W is generated with the scribing line SL1 in the X1 direction. Since the depth of the scribing line SL1 is shallower than the thickness of the workpiece W, the workpiece W is not completely cut. When the formation of the first scribing line SL1 having a desired length on the workpiece W is completed, the laser head 301 and the first fluid injector 401 stop the irradiation of the beam and the injection of the cooling fluid, respectively. By repeating such an operation, the scribing line SL1 can be formed in the X1 direction.

<Reciprocating scribing operation in the X direction>

After forming the scribing line SL1 in the X1 direction as shown in FIG. 11, the laser head 300 is moved to the position shown in FIG. 11 to form a scribing line spaced therefrom. After moving, the scribing operation must be performed again in the X1 direction. However, according to the laser processing apparatus of the present embodiment capable of rotating the laser head 300, reciprocating scribing is possible.

Referring to FIG. 12, after the scribing line SL1 is formed, the laser head 300 is moved in the Y direction, and then the driving motor 14 is driven to move the laser head 300 to the incident laser beam L. Referring to FIG. Rotate 180 degrees around the optical axis. Then, the initial crack former 501, the laser head 300, and the cooling fluid injector 401 are aligned in the X2 direction. Of course, the plurality of spot beams Ls1, Ls2, Ls3, Ls4 are also aligned under the same conditions as when machining in the X1 direction in the X2 direction. Therefore, when the shape of the spot beams Ls1, Ls2, Ls3, Ls4 is not symmetric with respect to the machining direction, for example, even if the shape of the spot beams Ls1, Ls2, Ls3, Ls4 is shown in FIG. No need for reshaping In this state, while moving the laser head 300 in the X2 direction, the initial crack C2 is formed by the same process as described with reference to FIG. 11, followed by the irradiation of the laser beam and the spraying of the cooling fluid. SL2) can be formed.

As described above, a plurality of X-scribing lines spaced apart from each other in the Y direction by repeating the processes of FIGS. 11 and 12 may be quickly and uniformly formed by a reciprocating scribing process. In addition, if the laser generator of the same output is employed and the moving speeds of the first and second movable bodies 10 and 20 are the same, it means that twice as much scribing lines can be formed as compared with the prior art. This fast work speed can lower the cost of processing, significantly improving the price competitiveness of the scribing industry. In particular, it is possible to respond quickly and competitively to the demand for cutting glass for substrates of small and large display devices, which is increasing in recent years.

<Scribing in the Y direction>

Next, for example, when the scribing line is to be formed in the Y direction, according to the prior art, the spot beam is rotated about the center axis 101 in the Z-axis direction to be processed according to the conventional technique. It should match the alignment direction of (Ls1, Ls2, Ls3, Ls4). In this case, as described above, when the size of the workpiece W is large, it is never easy to rotate the table 100. In addition, when the table 100 is rotated, a rotation area corresponding to the diagonal length of the table 100 must be secured, thereby increasing the size and working space of the processing apparatus. In addition, when the table 100 itself is rotated, it takes time to rearrange the position of the laser beam with respect to the workpiece, and an error may occur in the position alignment, thereby reducing the precision of machining. However, according to the laser processing apparatus of this embodiment, the scribing operation in the Y direction is possible without increasing the apparatus and the work space by rotating the laser head 300.

First, the drive motor 14 is operated to rotate the laser head 300 by 90 degrees in the state shown in FIG. Then, the plurality of output laser beams L1, L2, L3, L4 are aligned in the Y1 direction, which is the processing direction. As shown in FIG. 13, while the laser head 300 and / or the workpiece W are moved in the Y1 direction, the initial crack C3 is formed, the laser beam is irradiated, and the cooling fluid is sprayed to spray the Y1 direction. The scribe line SL3 may be formed.

<Reciprocating scribing operation in Y direction>

Referring to FIG. 14, after the scribing line SL3 is formed, the laser head 300 is moved in the X direction, and then the driving motor 14 is driven to move the laser head 300 to the incident laser beam L. Referring to FIG. Rotate 180 degrees around the optical axis. Then, the initial crack former 501, the laser head 300, and the cooling fluid injector 401 are aligned in the Y2 direction, which is the processing direction. Of course, the plurality of spot beams Ls1, Ls2, Ls3, Ls4 are also aligned under the same conditions as in the Y1 direction in the Y2 direction. Therefore, when the shape of the spot beams Ls1, Ls2, Ls3, Ls4 is not symmetric with respect to the machining direction, for example, even if the shape of the spot beams Ls1, Ls2, Ls3, Ls4 is shown in FIG. No need for reshaping In this state, while moving the laser head 300 in the Y2 direction to form an initial crack (C4) by the same process as described in Figure 13, and then the scribing line ( SL4) can be formed.

As described above, the scribing lines in the Y direction spaced apart from each other in the X direction by repeating the processes of FIGS. 13 and 14 may be quickly and uniformly formed by a reciprocating scribing process.

<Scribing work in any direction>

In the above-described embodiment, only the scribing operation in the X direction or the Y direction has been described, but the scope of the present invention is not limited thereto. For example, the direction of the scribing operation can be any direction within the XY plane. To this end, the laser head 300 is rotated about the Z axis in the direction to be processed to align the plurality of spot beams Ls1, Ls2, Ls3, and Ls4 in the direction S to be processed. Thereafter, the scribing line SL5 in the S direction may be formed by forming the initial crack C5, irradiating the laser beam, and spraying the cooling fluid while moving the laser head 300 in the S direction. For the reciprocating scribing operation, the laser head 300 only needs to be rotated 180 degrees in the state shown in FIG. 15.

<Full cutting>

Pull-cutting applies a thermal shock to the workpiece W after forming the scribing line to grow cracks along the scribing line in the thickness direction of the workpiece W to divide the workpiece W along the scribing line. Or breaking.

16 shows an example of a laser cutting apparatus capable of full-cutting. In the embodiment of the laser processing apparatus shown in FIG. 16, the laser head 300a is configured such that at least one of the plurality of output laser beams split from the incident laser beam L is irradiated onto the workpiece W after the cooling fluid is injected. This is different from the embodiment of the laser processing apparatus shown in Figs. 1 to 10 in that respect. Referring to FIG. 16, the incident laser beam L is divided into a plurality of output laser beams L1, L2, L3, L4, and L5, and the first to fourth output laser beams L1, L2, L3, and L4 are The fifth emission laser beam L5 is divided by the beam splitter 305 and irradiated onto the surface of the workpiece W after the cooling fluid is injected through the lens 315 to form a scribing line. It is to apply thermal shock to (W). In this case, the configuration of the fifth emission laser beam L5 for full-cutting is not particularly limited, and cracks of the scribing line may grow in the thickness direction of the workpiece W according to the kind or property of the workpiece W. You just have the right strength. This configuration enables braking almost simultaneously with scribing. The processing shown in Figs. 11 to 15 is also possible by the laser processing apparatus shown in Fig. 16, and overlapping description is omitted.

As such, since the scribing operation and the braking operation can be performed by an integrated process, the cutting speed can be significantly improved, and the cutting processing cost and the equipment cost can be reduced.

<Other embodiments capable of reciprocating scribing operation>

As another embodiment capable of reciprocating scribing, a method of installing a cooling fluid injector on both sides of the laser head 300 may be considered. Of course, the initial crack former may also be disposed on both sides of the laser head 300. Referring to FIG. 17, a first cooling fluid injector 401 is installed at one side of the laser head 300, and a second cooling fluid injector opposite to the first cooling fluid injector 401 based on the laser head 300. 402 is provided. For example, when the scribing operation is performed in the X1 direction, that is, when the movable body 10 is moved in the X1 direction, the first cooling fluid injector 401 located downstream of the laser head 300 is turned on ( The second cooling fluid injector 402 located on the upstream side of the cooling fluid is turned OFF, and vice versa when the scribing operation is performed in the X2 direction. First and second initial crack formers 501 and 502 may be located at both sides of the laser head 300, respectively. For example, when the scribing operation is performed in the X1 direction, that is, when the movable body 10 is moved in the X1 direction, the first initial crack former 501 located upstream of the laser head 300 is operated. When scribing is performed in the X2 direction, the reverse is true.

By the above-described configuration, for example, the scribing line (FIG. 11: SL1) is formed in the X1 direction and then the scribe head is moved in the X2 direction without moving the laser head 300. An ice line (FIG. 12: SL2) may be formed. When forming a scribing line in the Y direction or in any direction (FIG. 13: SL3, FIG. 14: SL4, FIG. 15: SL5), the laser head 300 is rotated so that a plurality of spot beams Ls1, Ls2, Ls3 is formed. After aligning Ls4) in the machining direction, a reciprocating scribing operation is possible.

In this case, in order to ensure uniformity of the reciprocating scribing operation, the conditions of the spot beams Ls1, Ls2, Ls3, and Ls4 need to be the same during the reciprocating scribing operation. To this end, as described above, the cylindrical beams 311, 312, 313, and 314 may be moved in the optical axis direction between the reciprocating scribing operations to adjust the shape of the spot beams Ls1, Ls2, Ls3, and Ls4. . Of course, when the shape of the spot beams Ls1, Ls2, Ls3, Ls4 is symmetric in the processing direction as shown in Figs. 7 and 8, such adjustment or shaping is not necessary. Therefore, in consideration of the material and thickness of the workpiece W, it is preferable to adjust the processing conditions, for example, the distribution of the light intensity, the processing speed, and the like so that the shape of the plurality of spot beams becomes symmetrical in the processing direction as much as possible. .

While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments, rather than to limit the scope of the invention. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

10 ...... First movable body 20 ...... Second movable body
31, 32 ...... Support member 100 ...... Table
200 ...... laser generator 300, 300a ...... laser head
301, 302, 303, 304, 305 ...... beam splitter
311, 312, 313, 314, 315 ...... cylindrical lens
321 ... guide member 322 ... lead screw
323 ...... actuator 401, 402 ...... cooling fluid injector
501, 502 ...... Initial Crack Former

Claims (11)

A laser head for dividing the incident laser beam incident from the laser generator into a plurality of output laser beams and irradiating the surface of the workpiece;
And a cooling fluid injector positioned downstream of the laser head in a processing direction to inject a cooling fluid to the workpiece, so as to form a scribing line on the surface of the workpiece.
And the laser head and the cooling fluid injector can be rotated about an optical axis of the incident laser beam.
The method of claim 1,
And the optical axis of the first output laser beam split first among the plurality of output laser beams coincides with the optical axis of the incident laser beam.
According to claim 1 or 2, wherein the laser head,
A plurality of beam splitters for dividing the incident laser beam into the plurality of output laser beams;
A laser processing apparatus, comprising: a plurality of cylindrical lens to move in the direction of the optical axis, for shaping the plurality of output laser beams in an elliptical shape.
The method of claim 3,
And said plurality of cylindrical lenses are movable individually.
The method of claim 3,
And said plurality of cylindrical lenses are movable simultaneously as one assembly.
The method of claim 3,
And said cylindrical cylindrical lenses shape said plurality of output laser beams in a symmetrical form in said processing direction.
The method of claim 3,
And a second cooling fluid injector positioned opposite to the cooling fluid injector with the laser head interposed therebetween and being rotated together with the laser head.
The method of claim 3,
At least one of the plurality of output laser beams is irradiated to the workpiece after cooling on the downstream side of the cooling fluid injector based on the processing direction to cause thermal shock to divide the workpiece along the scribing line. Laser processing device characterized in that.
In order to form a scribing line on the surface of the workpiece and the laser head for dividing the incident laser beam irradiated from the laser generator into a plurality of output laser beams and irradiating the surface of the workpiece, A laser processing method of a laser processing apparatus comprising a cooling fluid injector positioned downstream and injecting a cooling fluid to the workpiece.
Aligning the plurality of exit laser beams in a processing direction by rotating the laser head and the cooling fluid injector about an optical axis of the exit laser beam;
Irradiating a laser beam onto the workpiece while moving the laser head and the cooling fluid injector relative to the workpiece;
And spraying a cooling fluid onto the workpiece irradiated with the laser beam to form a scribing line.
10. The method of claim 9,
And reciprocating scribing in the processing direction by rotating the laser head and the cooling fluid injector 180 degrees about the optical axis.
10. The method of claim 9,
Dividing the workpiece along the scribing line by irradiating at least one of the plurality of output laser beams to the workpiece after cooling at a downstream side of the cooling fluid injector based on the processing direction to cause thermal shock Laser processing method characterized by further comprising.
KR1020110067848A 2011-07-08 2011-07-08 Laser machining apparatus and method KR20130006045A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9387552B2 (en) 2014-07-15 2016-07-12 Samsung Display Co., Ltd. Laser annealing apparatus and laser annealing method using the same
CN106001944A (en) * 2016-07-27 2016-10-12 广东工业大学 Device and device for punching though laser beam
CN109420845A (en) * 2017-08-25 2019-03-05 佳能株式会社 The manufacturing method of laser processing device, control device, laser processing and imaging device
CN110556320A (en) * 2019-09-12 2019-12-10 常州时创能源科技有限公司 Silicon wafer dividing device and dividing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9387552B2 (en) 2014-07-15 2016-07-12 Samsung Display Co., Ltd. Laser annealing apparatus and laser annealing method using the same
CN106001944A (en) * 2016-07-27 2016-10-12 广东工业大学 Device and device for punching though laser beam
CN109420845A (en) * 2017-08-25 2019-03-05 佳能株式会社 The manufacturing method of laser processing device, control device, laser processing and imaging device
US11179803B2 (en) 2017-08-25 2021-11-23 Canon Kabushiki Kaisha Laser processing apparatus, control apparatus, laser processing method, and method of producing image forming apparatus
CN109420845B (en) * 2017-08-25 2022-05-27 佳能株式会社 Laser processing apparatus, control apparatus, laser processing method, and method of manufacturing image forming apparatus
CN110556320A (en) * 2019-09-12 2019-12-10 常州时创能源科技有限公司 Silicon wafer dividing device and dividing method

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