KR20130006045A - Laser machining apparatus and method - Google Patents
Laser machining apparatus and method Download PDFInfo
- Publication number
- KR20130006045A KR20130006045A KR1020110067848A KR20110067848A KR20130006045A KR 20130006045 A KR20130006045 A KR 20130006045A KR 1020110067848 A KR1020110067848 A KR 1020110067848A KR 20110067848 A KR20110067848 A KR 20110067848A KR 20130006045 A KR20130006045 A KR 20130006045A
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- workpiece
- cooling fluid
- laser head
- laser beam
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
The present invention relates to a laser processing apparatus and method for forming a scribing line on a workpiece using a laser.
A brittle material represented by glass, in particular, a translucent brittle material, is used in various fields such as exterior panels of buildings as well as substrates of flat panel display devices such as liquid crystal panels and plasma display panels. The glass can be mechanically cut using a diamond wheel or the like. However, this mechanical cutting method implies the possibility that the glass surface may be contaminated or damaged by small debris generated during cutting. In addition, minute cracks may occur near the cutting line, and due to the nature of the brittle material, when a force is applied to the cracks, the whole material may be cracked. Therefore, a post-treatment process such as polishing to remove fine cracks around the cutting line may be added to increase the processing cost.
Recently, a method of forming a scribing line by applying a thermal stress to a brittle material using a laser and then applying a physical or thermal shock to the material to cut along the scribing line has been proposed and used.
In such a laser processing apparatus, the shape of the laser beam is long in one direction, and the processing direction must be aligned with the direction of the laser beam, that is, the longitudinal direction. For example, if the laser beam is in the X direction, machining in the X direction is possible. Machining in the Y direction is impossible. To machine in the Y direction, the table on which the workpiece is mounted must be rotated about the Z axis to align the machining direction with the length of the laser beam. When the workpiece is small, it is easy to rotate the table, but when the workpiece is large, the table is not easy to rotate. In addition, when the table is rotated, a rotation area corresponding to the diagonal length of the table must be secured, thereby increasing the size and working space of the processing apparatus. In addition, when rotating the table itself, it takes time to rearrange the position of the laser beam with respect to the workpiece, and an error may occur in the alignment of the laser beam, thereby reducing the precision of machining.
The present invention has been made to solve the above problems, and an object of the present invention is to provide a laser processing apparatus and a processing method capable of processing in a variety of directions quickly and precisely, and can suppress the increase in processing apparatus and work space. .
The laser processing apparatus according to the present invention comprises: a laser head for dividing an incident laser beam incident from a laser generator into a plurality of output laser beams and irradiating the surface of the workpiece; And a cooling fluid injector positioned downstream of the laser head in a processing direction to inject a cooling fluid into the workpiece, so as to form a scribing line on the surface of the workpiece. It can be rotated about the optical axis of the incident laser beam.
An optical axis of the first emission laser beam, which is first divided among the plurality of emission laser beams, may be coincident with the optical axis of the incident laser beam.
The laser head comprises: a plurality of beam splitters for dividing the incident laser beam into the plurality of output laser beams; The elliptical shape of the plurality of output laser beams, a plurality of cylindrical lens movable in the optical axis direction; may include. The plurality of cylindrical lenses may be moved individually. The plurality of cylindrical lenses may be moved simultaneously as one assembly. The plurality of cylindrical lenses may form the plurality of output laser beams in a symmetrical form in the processing direction.
A second cooling fluid injector, which is located on the opposite side of the cooling fluid injector with the laser head interposed therebetween, rotates together with the laser head.
At least one of the plurality of output laser beams may be irradiated to the workpiece after cooling on the downstream side of the cooling fluid injector based on the processing direction to cause thermal shock to divide the workpiece along the scribing line. have.
Laser processing method according to the present invention, to form a scribing line on the surface of the workpiece and the laser head for dividing the incident laser beam irradiated from the laser generator into a plurality of output laser beam to irradiate the surface of the workpiece And a cooling fluid injector positioned downstream of the laser head in the processing direction and injecting a cooling fluid to the workpiece, wherein the laser head and the cooling fluid injector emit the laser beam. Rotating a plurality of output laser beams in a processing direction by rotating about an optical axis of the plurality of output laser beams; Irradiating a laser beam onto the workpiece while moving the laser head and the cooling fluid injector relative to the workpiece; And spraying a cooling fluid onto the workpiece irradiated with the laser beam to form a scribing line.
The processing method may further include performing reciprocating scribing in the processing direction by rotating the laser head and the cooling fluid injector 180 degrees about the optical axis.
The processing method may include irradiating at least one of the plurality of output laser beams to the workpiece after cooling at a downstream side of the cooling fluid injector with reference to the processing direction to cause thermal shock to perform the thermal shock along the scribing line. Dividing the workpiece; may be further provided.
According to the laser processing apparatus and method according to the present invention described above, the following effects can be obtained.
First, fast and precise machining in any machining direction is possible. The increase in the processing apparatus and the work space can be suppressed.
Secondly, reciprocating scribing is possible, thereby improving processing speed.
Third, scribing and full-cutting are possible, which saves additional processes and equipment for braking.
1 is a block diagram of an embodiment of a laser processing apparatus according to the present invention.
FIG. 2 is a perspective view illustrating an example of a configuration for dividing an incident laser beam into a plurality of output laser beams and shaping them in the form of spot beams for scribing; FIG.
3 is a perspective view showing an example of a configuration for moving the cylindrical lens in the optical axis direction.
4 is a perspective view showing another example of the configuration for moving the cylindrical lens in the optical axis direction.
5 to 8 show examples of the form of a spot beam irradiated onto a workpiece.
9 is a block diagram of an embodiment of a laser head rotatable about an optical axis of an exit laser beam.
10 is a perspective view of one embodiment of a structure for rotating a laser head about an optical axis of an exit laser beam;
11 and 12 illustrate a process of forming a scribing line in the X direction.
13 and 14 illustrate a process of forming a scribing line in the Y direction.
15 illustrates a process of forming a scribing line in an arbitrary direction.
16 is a schematic diagram of one embodiment of a laser head capable of full-cutting.
17 is a block diagram of an embodiment of a laser processing apparatus according to the present invention capable of reciprocating scribing.
Hereinafter, with reference to the accompanying drawings will be described embodiments of the laser processing apparatus according to the present invention.
1 is a block diagram showing an embodiment of a laser processing apparatus according to the present invention. The laser processing apparatus shown in FIG. 1 applies a laser beam to a surface of a brittle material such as glass, for example, and then cuts the surface of the workpiece using heat stress generated by spraying a cooling fluid. It is a device for forming a scribe line.
The laser beam and the workpiece are moved relative to the scribing process. Here, relative movement means that when the workpiece is moved in the machining direction and the laser beam is positioned at a fixed position, when the laser beam is moved in the machining direction and the workpiece is positioned at a fixed position, the laser beam and the workpiece are opposite to each other. Includes cases that are moved in the direction. Of course, the laser beam and the workpiece are moved in the same direction, but the speed is different.
1, a table 100 on which a workpiece W is placed, a
As the
The
Depending on the workpiece | work W, it is necessary to form the initial crack used as the starting point of a scribing line. The laser processing apparatus of this embodiment may further include an initial crack former 501 for forming an initial crack which is a starting point of the scribing line. In this embodiment, the initial crack former 501 is configured to move with the
In this embodiment, the
The second
Referring to FIG. 2, the
The light intensities of the split laser beams L1, L2, L3, L4 may be the same or different according to the reflectance of each of the
The cylindrical lenses 311-314 shape the plurality of output laser beams L1, L2, L3, L4 into elliptical beams. In this embodiment,
By moving the
In addition, the
By the above-described configuration, the shape of the spot beams Ls1, Ls2, Ls3, and Ls4 may be adjusted to obtain an optimum processing speed and quality according to conditions such as the material and thickness of the workpiece W. FIG. This is called beam shaping. The shape of the spot beams Ls1, Ls2, Ls3, Ls4 is optimal in consideration of the material and thickness of the workpiece W by selecting the
As another example, the shape of the spot beam increases the length of the short axis of the spot beam Ls1 located at the most upstream side when performing the scribing operation in the X1 direction, as shown in FIG. The length of the short axis of Ls2, Ls3, Ls4) can also be made small. Such a form is a form which raises the temperature of the workpiece | work W gradually.
As another example, as shown in FIG. 7, the shape of the spot beams Ls1, Ls2, Ls3, and Ls4 may be the same, and the workpiece W may be heated to a uniform light density.
As another example, as shown in FIG. 8, the spot beams Ls1 and Ls4 located at the outside may be the same, and the spot beams Ls2 and Ls4 located at the inside may be the same. That is, the shape of the spot beams Ls1, Ls2, Ls3, and Ls4 may be symmetrical with respect to the machining direction.
The shape of the spot beams Ls1, Ls2, Ls3, Ls4 is not limited to the above-described examples, and the physical properties of the workpiece such as the material and thickness of the workpiece W, and the plurality of exit laser beams L1, L2, L3, L4. ) Can be appropriately determined according to conditions such as light intensity and scribing working speed. Such adjustment of the beam shape adjusts the focal length by moving the
The laser processing apparatus of this embodiment is not only capable of processing in the X direction, which is the alignment direction of the plurality of output laser beams L1, L2, L3, L4, but also machining in any direction not parallel to the Y direction or the X direction perpendicular thereto. It is also possible. To this end, in this embodiment, the
The optical axis of the first output laser beam L1 is the incident laser beam L so that the position of the first output laser beam L1 first divided from the incident laser beam L does not change even when the
As an example of a structure for rotating the
The cooling
In addition, although not shown in the drawings, the
Now, the laser processing operation method by the above-mentioned structure is demonstrated.
<Scribing work in the X direction>
A case where the scribing operation is performed in the X1 direction will be described with reference to FIG. 11. When the shaping of the spot beams Ls1, Ls2, Ls3, and Ls4 is completed in consideration of the thickness, the material, the processing speed, and the like of the workpiece W, the first
As the first
Subsequently, the cooling fluid is irradiated to the workpiece W from the cooling fluid injector 400 located on the downstream side in the X1 direction with respect to the
<Reciprocating scribing operation in the X direction>
After forming the scribing line SL1 in the X1 direction as shown in FIG. 11, the
Referring to FIG. 12, after the scribing line SL1 is formed, the
As described above, a plurality of X-scribing lines spaced apart from each other in the Y direction by repeating the processes of FIGS. 11 and 12 may be quickly and uniformly formed by a reciprocating scribing process. In addition, if the laser generator of the same output is employed and the moving speeds of the first and second
<Scribing in the Y direction>
Next, for example, when the scribing line is to be formed in the Y direction, according to the prior art, the spot beam is rotated about the
First, the
<Reciprocating scribing operation in Y direction>
Referring to FIG. 14, after the scribing line SL3 is formed, the
As described above, the scribing lines in the Y direction spaced apart from each other in the X direction by repeating the processes of FIGS. 13 and 14 may be quickly and uniformly formed by a reciprocating scribing process.
<Scribing work in any direction>
In the above-described embodiment, only the scribing operation in the X direction or the Y direction has been described, but the scope of the present invention is not limited thereto. For example, the direction of the scribing operation can be any direction within the XY plane. To this end, the
<Full cutting>
Pull-cutting applies a thermal shock to the workpiece W after forming the scribing line to grow cracks along the scribing line in the thickness direction of the workpiece W to divide the workpiece W along the scribing line. Or breaking.
16 shows an example of a laser cutting apparatus capable of full-cutting. In the embodiment of the laser processing apparatus shown in FIG. 16, the
As such, since the scribing operation and the braking operation can be performed by an integrated process, the cutting speed can be significantly improved, and the cutting processing cost and the equipment cost can be reduced.
<Other embodiments capable of reciprocating scribing operation>
As another embodiment capable of reciprocating scribing, a method of installing a cooling fluid injector on both sides of the
By the above-described configuration, for example, the scribing line (FIG. 11: SL1) is formed in the X1 direction and then the scribe head is moved in the X2 direction without moving the
In this case, in order to ensure uniformity of the reciprocating scribing operation, the conditions of the spot beams Ls1, Ls2, Ls3, and Ls4 need to be the same during the reciprocating scribing operation. To this end, as described above, the
While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments, rather than to limit the scope of the invention. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.
10 ...... First
31, 32 ......
200 ......
301, 302, 303, 304, 305 ...... beam splitter
311, 312, 313, 314, 315 ...... cylindrical lens
321 ...
323 ......
501, 502 ...... Initial Crack Former
Claims (11)
And a cooling fluid injector positioned downstream of the laser head in a processing direction to inject a cooling fluid to the workpiece, so as to form a scribing line on the surface of the workpiece.
And the laser head and the cooling fluid injector can be rotated about an optical axis of the incident laser beam.
And the optical axis of the first output laser beam split first among the plurality of output laser beams coincides with the optical axis of the incident laser beam.
A plurality of beam splitters for dividing the incident laser beam into the plurality of output laser beams;
A laser processing apparatus, comprising: a plurality of cylindrical lens to move in the direction of the optical axis, for shaping the plurality of output laser beams in an elliptical shape.
And said plurality of cylindrical lenses are movable individually.
And said plurality of cylindrical lenses are movable simultaneously as one assembly.
And said cylindrical cylindrical lenses shape said plurality of output laser beams in a symmetrical form in said processing direction.
And a second cooling fluid injector positioned opposite to the cooling fluid injector with the laser head interposed therebetween and being rotated together with the laser head.
At least one of the plurality of output laser beams is irradiated to the workpiece after cooling on the downstream side of the cooling fluid injector based on the processing direction to cause thermal shock to divide the workpiece along the scribing line. Laser processing device characterized in that.
Aligning the plurality of exit laser beams in a processing direction by rotating the laser head and the cooling fluid injector about an optical axis of the exit laser beam;
Irradiating a laser beam onto the workpiece while moving the laser head and the cooling fluid injector relative to the workpiece;
And spraying a cooling fluid onto the workpiece irradiated with the laser beam to form a scribing line.
And reciprocating scribing in the processing direction by rotating the laser head and the cooling fluid injector 180 degrees about the optical axis.
Dividing the workpiece along the scribing line by irradiating at least one of the plurality of output laser beams to the workpiece after cooling at a downstream side of the cooling fluid injector based on the processing direction to cause thermal shock Laser processing method characterized by further comprising.
Priority Applications (1)
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KR1020110067848A KR20130006045A (en) | 2011-07-08 | 2011-07-08 | Laser machining apparatus and method |
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KR1020110067848A KR20130006045A (en) | 2011-07-08 | 2011-07-08 | Laser machining apparatus and method |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9387552B2 (en) | 2014-07-15 | 2016-07-12 | Samsung Display Co., Ltd. | Laser annealing apparatus and laser annealing method using the same |
CN106001944A (en) * | 2016-07-27 | 2016-10-12 | 广东工业大学 | Device and device for punching though laser beam |
CN109420845A (en) * | 2017-08-25 | 2019-03-05 | 佳能株式会社 | The manufacturing method of laser processing device, control device, laser processing and imaging device |
CN110556320A (en) * | 2019-09-12 | 2019-12-10 | 常州时创能源科技有限公司 | Silicon wafer dividing device and dividing method |
-
2011
- 2011-07-08 KR KR1020110067848A patent/KR20130006045A/en not_active Application Discontinuation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9387552B2 (en) | 2014-07-15 | 2016-07-12 | Samsung Display Co., Ltd. | Laser annealing apparatus and laser annealing method using the same |
CN106001944A (en) * | 2016-07-27 | 2016-10-12 | 广东工业大学 | Device and device for punching though laser beam |
CN109420845A (en) * | 2017-08-25 | 2019-03-05 | 佳能株式会社 | The manufacturing method of laser processing device, control device, laser processing and imaging device |
US11179803B2 (en) | 2017-08-25 | 2021-11-23 | Canon Kabushiki Kaisha | Laser processing apparatus, control apparatus, laser processing method, and method of producing image forming apparatus |
CN109420845B (en) * | 2017-08-25 | 2022-05-27 | 佳能株式会社 | Laser processing apparatus, control apparatus, laser processing method, and method of manufacturing image forming apparatus |
CN110556320A (en) * | 2019-09-12 | 2019-12-10 | 常州时创能源科技有限公司 | Silicon wafer dividing device and dividing method |
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