KR20120100956A - 기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법 - Google Patents

기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법 Download PDF

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Publication number
KR20120100956A
KR20120100956A KR1020127010991A KR20127010991A KR20120100956A KR 20120100956 A KR20120100956 A KR 20120100956A KR 1020127010991 A KR1020127010991 A KR 1020127010991A KR 20127010991 A KR20127010991 A KR 20127010991A KR 20120100956 A KR20120100956 A KR 20120100956A
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KR
South Korea
Prior art keywords
substrate
board
tray
conveyance
support member
Prior art date
Application number
KR1020127010991A
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English (en)
Korean (ko)
Inventor
구니히로 가와에
다쿠야 야나가와
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20120100956A publication Critical patent/KR20120100956A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020127010991A 2009-10-28 2010-10-28 기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법 KR20120100956A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27274509P 2009-10-28 2009-10-28
US61/272,745 2009-10-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187002892A Division KR101982454B1 (ko) 2009-10-28 2010-10-28 기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법

Publications (1)

Publication Number Publication Date
KR20120100956A true KR20120100956A (ko) 2012-09-12

Family

ID=43922105

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187002892A KR101982454B1 (ko) 2009-10-28 2010-10-28 기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법
KR1020127010991A KR20120100956A (ko) 2009-10-28 2010-10-28 기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020187002892A KR101982454B1 (ko) 2009-10-28 2010-10-28 기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2011052683A1 (fr)
KR (2) KR101982454B1 (fr)
CN (2) CN109003917A (fr)
TW (1) TW201132570A (fr)
WO (1) WO2011052683A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101975278B1 (ko) * 2013-10-15 2019-05-07 주식회사 케이씨텍 기판 처리 장치
JP6858071B2 (ja) * 2017-05-09 2021-04-14 キヤノン株式会社 搬送装置、リソグラフィ装置及び物品の製造方法
CN112602021A (zh) * 2018-08-23 2021-04-02 Asml荷兰有限公司 衬底支撑件、光刻设备、衬底检查设备、器件制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3659520B2 (ja) * 1995-11-07 2005-06-15 大日本スクリーン製造株式会社 基板搬送装置
JPH11121580A (ja) * 1997-10-13 1999-04-30 Hitachi Ltd 板状物体の支持方法及び処理装置
KR100825691B1 (ko) 1999-07-26 2008-04-29 가부시키가이샤 니콘 기판지지장치 및 기판처리장치
JP2004273702A (ja) * 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置
TWI447840B (zh) * 2004-11-15 2014-08-01 尼康股份有限公司 基板搬運裝置、基板搬運方法以及曝光裝置
JP2007114570A (ja) * 2005-10-21 2007-05-10 Nikon Corp 基板ホルダ、露光装置及びデバイスの製造方法
JP2008124347A (ja) * 2006-11-14 2008-05-29 Murata Mach Ltd 枚葉搬送用トレイ
JP2008288506A (ja) * 2007-05-21 2008-11-27 Nikon Corp 調整方法、露光装置、及びデバイス製造方法
JP2009147042A (ja) * 2007-12-13 2009-07-02 Sharp Corp 基板受取方法および基板ステージ装置

Also Published As

Publication number Publication date
KR101982454B1 (ko) 2019-05-27
TW201132570A (en) 2011-10-01
WO2011052683A1 (fr) 2011-05-05
CN109003917A (zh) 2018-12-14
JPWO2011052683A1 (ja) 2013-03-21
CN104221137A (zh) 2014-12-17
CN104221137B (zh) 2018-08-03
KR20180014244A (ko) 2018-02-07

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