JPWO2011052683A1 - 基板搬送装置、露光装置、基板支持装置及びデバイス製造方法 - Google Patents
基板搬送装置、露光装置、基板支持装置及びデバイス製造方法 Download PDFInfo
- Publication number
- JPWO2011052683A1 JPWO2011052683A1 JP2011538481A JP2011538481A JPWO2011052683A1 JP WO2011052683 A1 JPWO2011052683 A1 JP WO2011052683A1 JP 2011538481 A JP2011538481 A JP 2011538481A JP 2011538481 A JP2011538481 A JP 2011538481A JP WO2011052683 A1 JPWO2011052683 A1 JP WO2011052683A1
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- tray
- unit
- support member
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27274509P | 2009-10-28 | 2009-10-28 | |
US61/272,745 | 2009-10-28 | ||
PCT/JP2010/069177 WO2011052683A1 (fr) | 2009-10-28 | 2010-10-28 | Appareil de transport de substrat, appareil d'exposition, appareil de soutien de substrat et procédé de fabrication d'un dispositif |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2011052683A1 true JPWO2011052683A1 (ja) | 2013-03-21 |
Family
ID=43922105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011538481A Pending JPWO2011052683A1 (ja) | 2009-10-28 | 2010-10-28 | 基板搬送装置、露光装置、基板支持装置及びデバイス製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2011052683A1 (fr) |
KR (2) | KR101982454B1 (fr) |
CN (2) | CN109003917A (fr) |
TW (1) | TW201132570A (fr) |
WO (1) | WO2011052683A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101975278B1 (ko) * | 2013-10-15 | 2019-05-07 | 주식회사 케이씨텍 | 기판 처리 장치 |
JP6858071B2 (ja) * | 2017-05-09 | 2021-04-14 | キヤノン株式会社 | 搬送装置、リソグラフィ装置及び物品の製造方法 |
CN112602021A (zh) * | 2018-08-23 | 2021-04-02 | Asml荷兰有限公司 | 衬底支撑件、光刻设备、衬底检查设备、器件制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3659520B2 (ja) * | 1995-11-07 | 2005-06-15 | 大日本スクリーン製造株式会社 | 基板搬送装置 |
JPH11121580A (ja) * | 1997-10-13 | 1999-04-30 | Hitachi Ltd | 板状物体の支持方法及び処理装置 |
KR100825691B1 (ko) | 1999-07-26 | 2008-04-29 | 가부시키가이샤 니콘 | 기판지지장치 및 기판처리장치 |
JP2004273702A (ja) * | 2003-03-07 | 2004-09-30 | Nikon Corp | 搬送装置及び搬送方法、露光装置 |
TWI447840B (zh) * | 2004-11-15 | 2014-08-01 | 尼康股份有限公司 | 基板搬運裝置、基板搬運方法以及曝光裝置 |
JP2007114570A (ja) * | 2005-10-21 | 2007-05-10 | Nikon Corp | 基板ホルダ、露光装置及びデバイスの製造方法 |
JP2008124347A (ja) * | 2006-11-14 | 2008-05-29 | Murata Mach Ltd | 枚葉搬送用トレイ |
JP2008288506A (ja) * | 2007-05-21 | 2008-11-27 | Nikon Corp | 調整方法、露光装置、及びデバイス製造方法 |
JP2009147042A (ja) * | 2007-12-13 | 2009-07-02 | Sharp Corp | 基板受取方法および基板ステージ装置 |
-
2010
- 2010-10-27 TW TW099136627A patent/TW201132570A/zh unknown
- 2010-10-28 CN CN201810725930.1A patent/CN109003917A/zh active Pending
- 2010-10-28 JP JP2011538481A patent/JPWO2011052683A1/ja active Pending
- 2010-10-28 KR KR1020187002892A patent/KR101982454B1/ko active IP Right Grant
- 2010-10-28 WO PCT/JP2010/069177 patent/WO2011052683A1/fr active Application Filing
- 2010-10-28 KR KR1020127010991A patent/KR20120100956A/ko not_active Application Discontinuation
- 2010-10-28 CN CN201080049093.7A patent/CN104221137B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR101982454B1 (ko) | 2019-05-27 |
TW201132570A (en) | 2011-10-01 |
WO2011052683A1 (fr) | 2011-05-05 |
CN109003917A (zh) | 2018-12-14 |
KR20120100956A (ko) | 2012-09-12 |
CN104221137A (zh) | 2014-12-17 |
CN104221137B (zh) | 2018-08-03 |
KR20180014244A (ko) | 2018-02-07 |
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