JPWO2011052683A1 - 基板搬送装置、露光装置、基板支持装置及びデバイス製造方法 - Google Patents

基板搬送装置、露光装置、基板支持装置及びデバイス製造方法 Download PDF

Info

Publication number
JPWO2011052683A1
JPWO2011052683A1 JP2011538481A JP2011538481A JPWO2011052683A1 JP WO2011052683 A1 JPWO2011052683 A1 JP WO2011052683A1 JP 2011538481 A JP2011538481 A JP 2011538481A JP 2011538481 A JP2011538481 A JP 2011538481A JP WO2011052683 A1 JPWO2011052683 A1 JP WO2011052683A1
Authority
JP
Japan
Prior art keywords
substrate
tray
unit
support member
vibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011538481A
Other languages
English (en)
Japanese (ja)
Inventor
國博 河江
國博 河江
卓也 柳川
卓也 柳川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JPWO2011052683A1 publication Critical patent/JPWO2011052683A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011538481A 2009-10-28 2010-10-28 基板搬送装置、露光装置、基板支持装置及びデバイス製造方法 Pending JPWO2011052683A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US27274509P 2009-10-28 2009-10-28
US61/272,745 2009-10-28
PCT/JP2010/069177 WO2011052683A1 (fr) 2009-10-28 2010-10-28 Appareil de transport de substrat, appareil d'exposition, appareil de soutien de substrat et procédé de fabrication d'un dispositif

Publications (1)

Publication Number Publication Date
JPWO2011052683A1 true JPWO2011052683A1 (ja) 2013-03-21

Family

ID=43922105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011538481A Pending JPWO2011052683A1 (ja) 2009-10-28 2010-10-28 基板搬送装置、露光装置、基板支持装置及びデバイス製造方法

Country Status (5)

Country Link
JP (1) JPWO2011052683A1 (fr)
KR (2) KR101982454B1 (fr)
CN (2) CN109003917A (fr)
TW (1) TW201132570A (fr)
WO (1) WO2011052683A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101975278B1 (ko) * 2013-10-15 2019-05-07 주식회사 케이씨텍 기판 처리 장치
JP6858071B2 (ja) * 2017-05-09 2021-04-14 キヤノン株式会社 搬送装置、リソグラフィ装置及び物品の製造方法
CN112602021A (zh) * 2018-08-23 2021-04-02 Asml荷兰有限公司 衬底支撑件、光刻设备、衬底检查设备、器件制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3659520B2 (ja) * 1995-11-07 2005-06-15 大日本スクリーン製造株式会社 基板搬送装置
JPH11121580A (ja) * 1997-10-13 1999-04-30 Hitachi Ltd 板状物体の支持方法及び処理装置
KR100825691B1 (ko) 1999-07-26 2008-04-29 가부시키가이샤 니콘 기판지지장치 및 기판처리장치
JP2004273702A (ja) * 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置
TWI447840B (zh) * 2004-11-15 2014-08-01 尼康股份有限公司 基板搬運裝置、基板搬運方法以及曝光裝置
JP2007114570A (ja) * 2005-10-21 2007-05-10 Nikon Corp 基板ホルダ、露光装置及びデバイスの製造方法
JP2008124347A (ja) * 2006-11-14 2008-05-29 Murata Mach Ltd 枚葉搬送用トレイ
JP2008288506A (ja) * 2007-05-21 2008-11-27 Nikon Corp 調整方法、露光装置、及びデバイス製造方法
JP2009147042A (ja) * 2007-12-13 2009-07-02 Sharp Corp 基板受取方法および基板ステージ装置

Also Published As

Publication number Publication date
KR101982454B1 (ko) 2019-05-27
TW201132570A (en) 2011-10-01
WO2011052683A1 (fr) 2011-05-05
CN109003917A (zh) 2018-12-14
KR20120100956A (ko) 2012-09-12
CN104221137A (zh) 2014-12-17
CN104221137B (zh) 2018-08-03
KR20180014244A (ko) 2018-02-07

Similar Documents

Publication Publication Date Title
JP6780732B2 (ja) 搬送装置、露光装置、及びデバイス製造方法
JP6245308B2 (ja) 基板搬送方法、デバイス製造方法、基板搬送装置および露光装置
JP5469852B2 (ja) 搬送装置、搬送方法、露光装置、露光方法、及びデバイス製造方法
JP6486140B2 (ja) 搬送ハンド、リソグラフィ装置及び被搬送物を搬送する方法
JP6442563B1 (ja) 搬送ハンド、搬送装置、リソグラフィ装置、物品の製造方法及び保持機構
CN111566782A (zh) 基板处理装置和基板处理方法
JP2019016801A (ja) 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2011052683A1 (fr) Appareil de transport de substrat, appareil d'exposition, appareil de soutien de substrat et procédé de fabrication d'un dispositif
JP5730664B2 (ja) 電子部品実装機
JP5471088B2 (ja) 基板保持部材、基板搬送装置、基板搬送方法、ステージ装置、露光装置及びデバイス製造方法
WO2011049133A1 (fr) Appareil supportant un substrat, élément supportant un substrat, appareil de transfert de substrat, appareil d'exposition et procédé de fabrication de dispositif
CN111615739A (zh) 基板处理装置、以及基板处理方法
JP2010267807A (ja) 基板保持装置、ステージ装置、露光装置、及びデバイス製造方法
JP2023077250A (ja) 基板保持装置、リソグラフィ装置、基板保持方法、および物品の製造方法
JP2011113086A (ja) 受け渡し機構、ステージ装置、搬送装置、露光装置、及びデバイス製造方法
JP2024040937A (ja) 基板搬送機構、リソグラフィ装置及び物品の製造方法
JP2023077671A (ja) 接合装置、及び接合方法
JP2011086764A (ja) 基板支持部材、搬送装置、露光装置、及びデバイス製造方法