KR20120099962A - Chip on board type light emitting device - Google Patents

Chip on board type light emitting device Download PDF

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Publication number
KR20120099962A
KR20120099962A KR1020110018518A KR20110018518A KR20120099962A KR 20120099962 A KR20120099962 A KR 20120099962A KR 1020110018518 A KR1020110018518 A KR 1020110018518A KR 20110018518 A KR20110018518 A KR 20110018518A KR 20120099962 A KR20120099962 A KR 20120099962A
Authority
KR
South Korea
Prior art keywords
light emitting
dam
chip
emitting device
printed circuit
Prior art date
Application number
KR1020110018518A
Other languages
Korean (ko)
Inventor
반희정
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020110018518A priority Critical patent/KR20120099962A/en
Publication of KR20120099962A publication Critical patent/KR20120099962A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A chip on board type light emitting device is provided to simplify operation process by welding a light emitting diode chip and a dam on a printed circuit board with reflow soldering. CONSTITUTION: An electrode pattern is formed on the top surface of a printed circuit board(2). A light emitting diode chip(6) is mounted on the upper side of the printed circuit board. A plastic dam(4) comprises a hollow portion in inside. The plastic dam is welded to the printed circuit board by a synthetic resin adhesive. The inside of the plastic dam is filled with encapsulating material(8) in order to cover the light emitting diode chip. The encapsulating material comprises a phosphor. A connector housing is molded on the plastic dam. A coupling forming unit is formed on the inner circumferential face and the outer circumferential face of the plastic dam in order to combine an optic lens with the top of the plastic dam.

Description

CHIP ON BOARD TYPE LIGHT EMITTING DEVICE}

The present invention relates to a chip on board light emitting device, and more particularly, to a chip on board light emitting device including a light emitting diode chip and a dam on a printed circuit board.

Recently, a chip on board (COB) type light emitting diode package has been developed. In general, the chip-on-board LED package includes a structure in which the LED chip is mounted on a printed circuit board. The light emitting diode chip is electrically connected to the electrodes on the printed circuit board by, for example, wire bonding. In addition, a phosphor is used to convert the light emitted from the light emitting diode chip, and the phosphor is generally included in a light-transmissive encapsulant covering the light emitting diode chip. The encapsulant including the phosphor is generally formed to cover the light emitting diode chip by a dotting method.

In order to locally form the encapsulant with a resin containing a phosphor, first, a shape of a dam surrounding a light emitting diode chip is formed on a printed circuit board with a silicone resin or the like. To make the shape of the dam, a liquid or gel-like resin is applied or doped onto the printed circuit board to have a thickness.

However, such a conventional method is disadvantageous in that workability is inferior and it is difficult to make the dam thickness, dam shape and / or dam position uniform. In addition, there is a problem that a lot of failure occurs due to the low adhesion between the resin forming the dam and the printed circuit board.

Accordingly, the present invention is proposed to solve the problems of the prior art, to provide a chip-on-board light emitting device including a dam controlled in a uniform shape on a substrate (especially a printed circuit board).

According to an aspect of the present invention, a chip on board light emitting device includes a printed circuit board, a plastic dam pre-formed into a shape having a hollow portion inside, and then bonded to the printed circuit board, and mounted on the printed circuit board. It includes a light emitting diode chip located inside the plastic dam.

Preferably, the chip-on-board light emitting device may further include a translucent encapsulant filled inside the plastic dam to cover the light emitting diode chip. The light transmissive encapsulant may include a phosphor.

Preferably, the plastic dam is produced by injection molding.

Preferably, the housing is integrally molded with the plastic dam.

Preferably, the inner or outer circumference of the plastic dam includes a fastening shape for coupling an optical lens to the upper portion of the plastic dam.

According to another aspect of the present invention, a chip-on-board light emitting device includes a substrate, a dam bonded to the substrate by solder material, a light emitting diode chip mounted on the substrate and positioned inside the dam, and a phosphor. And a light-transmissive encapsulant which is filled inside the dam.

Preferably, the dam comprises a plastic injection molding having a hollow structure.

Preferably, the plastic injection molding is integrally molded with a connector housing.

Preferably, the inner or outer circumference of the plastic injection molding is formed with a fastening shape for coupling an optical lens (top).

Preferably, the substrate or the dam includes a metal material in contact with the solder material.

The chip-on-board light emitting device according to the present invention has the advantage that the shape, thickness and / or location of the dam disposed on the printed circuit board is uniform. In addition, according to the present invention, the bonding force of the dam to the printed circuit board is excellent and the defect is less likely. Also, in applications where the dam is bonded to a printed circuit board using SMT, other components such as a light emitting diode chip can be bonded to the printed circuit board together with the dam by reflow soldering, which reduces the number of operations. Contribute.

1 is a perspective view of a chip on board light emitting device according to an embodiment of the present invention;
FIG. 2 is an exploded perspective view showing the chip on board light emitting device shown in FIG. 1 with the encapsulation material removed; FIG.
3 is a cross-sectional view illustrating the chip on board light emitting device illustrated in FIGS. 1 and 2.
4 (a) and 4 (b) are diagrams for explaining an example of bonding the plastic dam 4 and the light emitting diode chip 6 to the printed circuit board 2 simultaneously using SMT.
5 is a plan view illustrating a chip on board light emitting device according to another embodiment of the present invention;
6 is a sectional view showing a chip on board light emitting device according to another embodiment of the present invention.
7 illustrates various types of dams applicable to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the same reference numerals denote the same components, and the width, length, thickness, etc. of the components may be exaggerated for convenience.

1 is a perspective view illustrating a chip on board light emitting device according to an exemplary embodiment of the present invention, and FIG. 2 is an exploded perspective view of the chip on board light emitting device illustrated in FIG. 1 with a sealing material removed. 3 is a cross-sectional view illustrating the chip on board type light emitting device illustrated in FIGS. 1 and 2.

As shown in Figs. 1, 2 and 3, the chip on board type light emitting device 1 according to the present embodiment includes a printed circuit board 2, a plastic dam 4, and a light emitting diode. The chip 6 and the transparent sealing material 8 are included.

Electrode patterns (not shown) electrically connected to the light emitting diode chip 6 are formed on the upper surface of the printed circuit board 2. For example, the electrodes of the light emitting diode chip 6 are electrically connected to the electrode patterns on the printed circuit board 2 by wire bonding or the like. In the present specification, the term 'printed circuit board' includes all kinds of substrates including an electrode or an electrode pattern that can be electrically connected to the light emitting diode chip 6.

The plastic dam 4 includes a plastic molding produced by injection molding plastic. In addition, the plastic dam 4 is formed in a substantially annular shape and has a hollow portion therein. Before joining the surface of the printed circuit board 2, the plastic dam 4 is molded into a shape determined by a mold, and thus can be formed in a desired uniform shape and uniform thickness. The plastic dam 4 is bonded onto the printed circuit board 2 by a solder material or a synthetic resin adhesive.

One or more LED chips 6 are mounted on the upper surface of the printed circuit board 2. The light emitting diode chip 6 may be bonded to the printed circuit board 2 by a solder material, and may be bonded to the printed circuit board 2 by a conductive or nonconductive adhesive. The light emitting diode chip 6 may be electrically connected to the electrode patterns of the printed circuit board 2 by bonding wires.

The light emitting diode chip 6 is located inside the plastic dam 4 on the printed circuit board 2, and the encapsulant 8 covers the light emitting diode chip 6 to cover the plastic dam 4. It is formed by filling in the inside. The encapsulant 8 includes a phosphor 8a (see FIG. 3) for wavelength converting light from the light emitting diode chip 6.

The plastic dam 4 is molded into a desired shape determined by a mold, for example, by injection molding before being bonded onto the printed circuit board 2, so that the dam thickness (or height) and the shape of the dam are uniform. Control is possible.

In addition, as described below through other embodiments, the plastic dam has a specific component such as a connector housing for connecting the external conductor and the light emitting device or a fastening shape for coupling the optical lens to the mold. It is possible to form integrally with (4). In addition, the plastic dam 4 may be bonded to the printed circuit board 2 using surface mount technology (SMT) using a solder material. In this case, the printed circuit may be formed by the SMT like the light emitting diode chip 6. Components mounted on the substrate 2 may be surface mounted on the printed circuit board 2 together with the plastic dam 4 at a time. In this case, a reflow soldering process may be usefully used.

4A and 4B show an example of bonding a plastic dam 4 and a light emitting diode chip 6 to a printed circuit board 2 simultaneously using SMT.

First, referring to FIG. 4A, a chip metal pad 2a and a dam metal pad 2b are formed on the surface of the printed circuit board 2. Solder cream 9 is coated with a solder material on the upper surfaces of the chip metal pad 2a and the dam metal pad 2b. It is preferable that the metal plating layer 4a is formed in the bottom face of the plastic dam 4. It is also conceivable to omit the metal plating layer 4a and solder using only the metal pad 2b for the dam and the solder material, or to solder using only the metal plating layer 4a and the solder material without the dam metal pad 2b. .

Referring to FIG. 4B, the light emitting diode chip 6 is on the metal pad 2a for solder cream, and the plastic dam 4 is a metal pad for dam 2b with solder cream. In the state of being on, for example, a reflow soldering process is carried out so that the solidified solder material 9 'after melting from the solder cream causes the light emitting diode chip 6 and the plastic dam 4 to be printed on the printed circuit board 2. ) Solidly and reliably.

5 is a plan view illustrating a chip on board light emitting device according to another embodiment of the present invention.

Referring to FIG. 5, the printed circuit board 2 is integrally provided with a connector terminal 21 on an upper surface thereof. In addition, the plastic dam 4 includes a connector housing 41 at least partially covering the connector terminal 21 on the printed circuit board 2. The side surface of the connector housing 41 is formed with a connector for allowing the connection of the conductive wire 10 to the connector terminal 21. The connector housing 41 is molded to have a certain shape depending on the shape of the mold during molding (particularly, injection molding) of the plastic dam 4 using the mold.

6 is a cross-sectional view illustrating a chip on board light emitting device according to another embodiment of the present invention.

Referring to FIG. 6, the chip-on-board light emitting device 1 according to the present embodiment further includes an optical lens 11. In the present embodiment, the optical lens 11 includes a hook-type first fastening shape 112 at the bottom. The plastic dam 4 has a second fastening feature 42 engaged with the hook structure of the first fastening feature 112 on its inner circumferential surface. The second fastening portion 42 is molded to have a certain shape by the shape of the mold during molding (particularly, injection molding) of the plastic dam 4 using the mold. In this embodiment, the fastening shape 42 on one side for fastening the optical lens 11 is formed on the inner circumferential surface of the plastic dam 4, but according to the structure and position of the fastening shape of the optical lens 11, the plastic dam ( Fastening features may be formed on the outer circumferential surface of 4). In addition, the fastening shape may be various shapes in addition to the hook shape shown in FIG.

Although only the circular plastic dams have been described above, plastic dams having triangles, squares, hexagons or other geometric shapes, as shown in FIG. 7, are also within the scope of the present invention, as shown in FIG. 7.

1: light emitting device 2: printed circuit board
4: dam 6: light emitting diode chip

Claims (11)

Printed circuit board;
A plastic dam which is pre-molded into a shape having a hollow part inside and bonded to the printed circuit board; And
And a light emitting diode chip mounted on the printed circuit board and positioned inside the plastic dam. The chip on board type light emitting device of claim 1, further comprising a translucent encapsulant filled inside the plastic dam so as to cover the light emitting diode chip. The chip on board light emitting device of claim 2, wherein the light-transmissive encapsulant comprises a phosphor. The chip on board light emitting device of claim 1, wherein the plastic dam is manufactured by injection molding. The chip on board type light emitting device according to any one of claims 1 to 4, wherein the plastic dam is integrally formed with a connector housing. 5. The chip on board type light emitting device according to claim 1, wherein the inner or outer circumference of the plastic dam includes a fastening shape for coupling an optical lens to the upper portion of the plastic dam. Device. Board;
A dam bonded to the substrate by solder material; And
A light emitting diode chip mounted on the substrate and positioned inside the dam; And
A chip-on-board light emitting device comprising a phosphor and a light-transmissive encapsulant filled in the dam. The chip on board type light emitting device of claim 7, wherein the dam comprises a plastic injection molding having a hollow structure. The chip on board type light emitting device according to claim 8, wherein the plastic injection molding is integrally molded with a connector housing. The chip on board type light emitting device according to claim 8, wherein the inner or outer circumference of the plastic injection molding includes a fastening shape for coupling an optical lens. The chip on board type light emitting device according to any one of claims 7 to 10, wherein the substrate or the dam includes a metal material in contact with the solder material.
KR1020110018518A 2011-03-02 2011-03-02 Chip on board type light emitting device KR20120099962A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110018518A KR20120099962A (en) 2011-03-02 2011-03-02 Chip on board type light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110018518A KR20120099962A (en) 2011-03-02 2011-03-02 Chip on board type light emitting device

Publications (1)

Publication Number Publication Date
KR20120099962A true KR20120099962A (en) 2012-09-12

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104315456A (en) * 2014-10-17 2015-01-28 深圳市国威源科技有限公司 LED (Light Emitting Diode) waterproof COB (Chip on Board) lens module
US10156752B2 (en) 2014-03-11 2018-12-18 Samsung Display Co., Ltd. Backlight unit and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10156752B2 (en) 2014-03-11 2018-12-18 Samsung Display Co., Ltd. Backlight unit and method of manufacturing the same
CN104315456A (en) * 2014-10-17 2015-01-28 深圳市国威源科技有限公司 LED (Light Emitting Diode) waterproof COB (Chip on Board) lens module

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