KR20110116632A - Light emitting diode package substrate having part of side surface coated with reflective metals using mask and manufacturing method thereof - Google Patents

Light emitting diode package substrate having part of side surface coated with reflective metals using mask and manufacturing method thereof Download PDF

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Publication number
KR20110116632A
KR20110116632A KR1020100036162A KR20100036162A KR20110116632A KR 20110116632 A KR20110116632 A KR 20110116632A KR 1020100036162 A KR1020100036162 A KR 1020100036162A KR 20100036162 A KR20100036162 A KR 20100036162A KR 20110116632 A KR20110116632 A KR 20110116632A
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KR
South Korea
Prior art keywords
light emitting
emitting diode
opening
reflective
package substrate
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KR1020100036162A
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Korean (ko)
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정동희
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정동희
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention can be repeatedly used several times instead of the process of using expensive photoresist and exposure machine, forming a metal reflective layer in a desired pattern inside the opening by applying a mask having a three-dimensional shape, the metal reflective layer The present invention relates to a light emitting diode package substrate manufactured by forming a metal reflective layer only on a lower portion of an inclined surface of an opening in order to improve a weak bonding force with the encapsulant, and a manufacturing method thereof.
A light emitting diode package substrate in which a polymer is molded in a lead frame including a metal electrode according to an embodiment of the present invention includes a polymer housing having an opening for mounting a light emitting diode chip, And a reflective surface formed by coating a metal material on a reflective layer region of the bottom surface of the opening, wherein the reflective surface is formed only on the inclined surface corresponding to a part of the entire inclined surface of the opening.

Description

Light Emitting Diode Package Substrate Having Part of Side Surface Coated With Reflective Metals using Mask and Manufacturing Method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package substrate for a light emitting diode. In particular, the present invention relates to a package substrate for a light emitting diode, and may be repeatedly used several times instead of using an expensive photoresist and an exposure machine. A light emitting diode package substrate manufactured by forming a metal reflective layer in a desired pattern, and molding the polymer directly on the lead frame or forming a metal reflective layer only on a lower portion of the inclined surface of the opening in order to improve the weak adhesion between the polymer encapsulant and the polymer encapsulant. And a method for producing the same.

The light emitting diode is a structure in which an active layer is bonded between a p-type semiconductor layer and an n-type semiconductor layer, and when a forward voltage is applied, the light emitting diode recombines the excited electrons in the active layer to emit light. Such light emitting diodes are used as light emitting lamps of various electronic devices such as automobile dashboards, taillights, keyboards, traffic lights and LCD backlights.

Since these light emitting diodes are made in a chip form, they are often applied to a system (primarily a PCB) required in a package form mounted on a package substrate. BACKGROUND ART Package substrates for light emitting diodes, which are commonly used, include a metal electrode for supplying power, a housing (polymer or ceramic) that collects light forward, and a metal heat slug for dissipating heat generated from the device. (There is also a substrate without heat slug). The package substrate made of ceramic is excellent in durability against heat and light generated in the device, but is used only in special cases where high reliability is necessary because of its high price, and in most cases, a package substrate made of a polymer housing is used. However, the inner side of the opening in which the light emitting diode is mounted on the substrate having the polymer housing is affected by heat and short wavelength light generated from the device so that the color of the polymer turns black or leaks light due to cracks in the polymer. As a result, the phenomenon that the luminance gradually decreases with time occurs. When this happens, it becomes a serious problem in LCD-TV, monitor BLU, etc., which require high luminance reliability even after long time use.

In order to solve this problem, coating the metal on the side reflecting surface of the polymer housing opening prevents discoloration over time, thereby improving luminance reliability and increasing the light extraction efficiency by coating a metal with better reflection efficiency than polymer. Can be. However, as shown in FIG. 1, the polymer that insulates the metal electrodes on the bottom surface of the package substrate should not be coated, and the metal reflective layer on the side of the opening should have at least two areas electrically separated by the number of metal electrodes. do. In order to classify and coat the above-mentioned areas, a patterned barrier film is required to prevent the coating on a desired portion in advance. However, since the light emitting diode package substrate has a three-dimensional surface having a three-dimensional shape rather than a plane, it is not only a technically difficult problem but also expensive materials and materials when the existing PR (Photo Resist) or Dry Film PR is applied. The use of equipment (exposures) leads to a high cost and low productivity, which leads to a significant increase in price, which makes it more advantageous to use a packaging substrate with a high performance ceramic housing. Therefore, it is necessary to develop a metal coating method and a package substrate using the same in a desired form at a low cost.

In addition, as the use of light emitting diodes is changed from mobile phones to TVs or lighting, the required lifespan is dramatically increased, and thermal, optical, and mechanical shocks are also increased by using high current. Therefore, the demand for reliability, which means normal operation without damage when using the device for a long time, is increasing, and the TV manufacturers and the like are gradually increasing the reliability requirements. However, at this time, the metal (for example, silver) coated on the side has a very weak bonding force with the resin, which is an encapsulating material, compared to the polymer or ceramic. Therefore, when packaging the device, a gap may occur between the encapsulant and the reflective metal interface due to mechanical and thermal forces generated in the packaging process or by thermal, optical and mechanical impacts caused by long time use. In this case, ultraviolet rays generated from the device may be exposed, and if harmful substances such as moisture or sulfur in the air penetrate the inside of the device, damage to the device, damage to the coating metal, etc. may seriously affect reliability, such as reduced luminance. Can be. In addition, conventionally, the metal lead frame is silver plated and then polymer is molded. In this case, since the interfacial bonding force between silver and polymer is weak, fine cracks are generated at the interface due to mechanical, thermal shock during packaging or thermal, optical, and mechanical shock during use, and harmful substances from the outside penetrate and seriously affect the reliability of the device. Influences are occurring.

Accordingly, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is not to silver plate a metal lead frame in order to improve a weak interface property between silver (Ag) plated on the metal lead frame and the polymer housing. The polymer is molded and then plated on the polymer housing side slopes to improve the bond between metal and polymer interfaces. In this case, the silver plating process only needs to be performed once, thus simplifying the process and reducing costs. In addition, in order to improve the weak bonding force between the reflective metal (for example, silver) and the encapsulant, the polymer is directly molded into the lead frame, and the external harmfulness at the time of interfacial damage is minimized in a range that minimizes the deterioration of brightness and reliability. The upper part of the lateral inclined surface, which is the entrance to which the material is invaded, is not coated with reflective metal so that the encapsulant and the polymer are in direct contact with each other to prevent cracking or peeling of the interface, and foreign matter enters from the outside, thereby degrading the performance of the device or Disclosed is a package substrate for a light emitting diode and a method of manufacturing the same, which prevents damage and improves reliability of a packaged device.

In addition, a metal reflective layer is formed on a lower portion of the inclined surface of the opening of the polymer housing, and instead of using an expensive photoresist and an exposure machine, a mask having a three-dimensional shape is repeatedly applied. The present invention provides a light emitting diode package substrate having a metal reflective layer formed in a desired pattern inside an opening, and a method of manufacturing the same.

First, to summarize the features of the present invention, in order to achieve the object of the present invention as described above, a light emitting diode package substrate for molding a polymer in a lead frame containing a metal electrode according to an aspect of the present invention, It includes a polymer housing having an opening for mounting, and includes a reflecting surface formed by coating a metal material on the inclined surface inside the opening or the reflective layer region of the inclined surface and the bottom surface inside the opening, the total inclined surface inside the opening The reflective surface is formed only on the inclined surface corresponding to some of them.

The inside of the opening may be formed of a multi-stage inclined surface, and the reflective surface may be formed on at least one or more inclined surfaces except for the top inclined surface among the multi-sloped inclined surfaces.

The reflective surface may be formed on a portion of the top inclined surface.

The housing is formed by molding a polymer directly without forming a reflective metal layer on the leadframe.

The light emitting diode package substrate may further include a plurality of insulated metal electrodes formed on the bottom surface of the opening.

The light emitting diode package substrate may further include a heat slug formed on a bottom surface of the opening.

The reflective surface may include at least one of an adhesive layer, an intermediate layer, and a light reflection layer.

A three-dimensional mask having a through hole corresponding to the reflective layer region on the housing and having a protruding portion corresponding to a portion to be masked so as not to be coated other than the reflective layer region on a lower surface thereof, and having a metal material through the through hole Coating to form the reflective surface.

According to the LED package substrate and the manufacturing method thereof according to the present invention, by directly molding the polymer without silver (Ag) plating on the lead frame to enhance the bonding force between the metal lead frame and the housing polymer, and the upper portion of the side slope By not coating the metal, the polymer and the encapsulant are brought into direct contact, thereby preventing cracking or peeling of the interface between the reflective metal and the encapsulant, and preventing foreign substances from coming in from the outside and deteriorating the device's performance or damaging the device. . In addition, the silver plating process is performed at the time of plating the inclined surface after the polymer housing, thereby simplifying the process and reducing the cost. A metal reflective layer can be easily coated on a part of the inclined surface inside the opening in which the light emitting diode chip is mounted by closely attaching a mask to the package substrate without an expensive process such as photoresist and a complicated process.

1 is a perspective view of a light emitting diode package substrate according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view between AB of FIG. 1.
FIG. 3 is a cross-sectional view between ABs of a package in which a light emitting diode chip is mounted on the package substrate of FIG. 1.
4 is a view for explaining a manufacturing process of the LED package substrate according to an embodiment of the present invention.
5 is a top view of a mask according to an embodiment of the present invention.
6 is a cross-sectional view of a mask according to an embodiment of the present invention.
7 is a perspective view of a light emitting diode package substrate according to another embodiment of the present invention.
8 is a perspective view of a light emitting diode package substrate according to another embodiment of the present invention.
9 is a cross-sectional view of a light emitting diode package having a reflective surface on a portion of an inclined surface according to an embodiment of the present invention.
10 is a cross-sectional view of a light emitting diode package having a reflective surface on a portion of an inclined surface according to another embodiment of the present invention.
FIG. 11 is a cross-sectional view of a light emitting diode package having a reflective surface at a portion of a multi-stage inclined surface in a structure having a heat slug according to an embodiment of the present invention.
12 is a cross-sectional view of a light emitting diode package having a reflective surface in a portion of a multi-stage inclined surface in a structure having a heat slug according to another embodiment of the present invention.
FIG. 13 is a cross-sectional view of a light emitting diode package having a reflective surface at a portion of a multi-stage inclined surface in a structure having a heat slug according to another embodiment of the present invention.
14 is a view for explaining a conventional polymer molding method.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. Like reference numerals in the drawings denote like elements.

1 is a perspective view of a light emitting diode package 10 according to an embodiment of the present invention.

Referring to FIG. 1, a light emitting diode package substrate 10 according to an exemplary embodiment of the present invention directly contacts a mask 42 (see FIG. 4) on a polymer resin-based housing 11 having a groove formed therein. On the surface of the reflective layer, the reflective surface 12 and 13 are formed by coating a metal material with a predetermined coating method. The housing 11 portion including the side surface of the opening may be made of polymer resin, and in some cases, may be made of another material such as ceramic.

As can also be seen in FIG. 2, which shows a cross-sectional view between AB of FIG. 1, two metal electrodes formed to be electrically insulated from the bottom surface inside the opening of the package substrate 10 before the reflective surfaces 12, 13 are formed. Field 14 (more than two metal electrodes are also possible, as shown in FIG. 7), from the bottom surface 12 (exposed surface of the insulated electrodes) and the bottom surface 12 inside the opening of the housing 11. The reflective surface is formed on the inclined surface 13 to the upper surface of the housing 11. The reflective surfaces 12 and 13 have a structure in which at least one or more of the adhesive layer 21, the intermediate layer 22, and the light reflection layer 23 are sequentially coated with a metal material. As described below, the adhesive layer and the intermediate layer 22 may be omitted as necessary.

3 is a cross-sectional view between A-B of a package in which the light emitting diode chip 15 is mounted on the package substrate 10 of FIG. 1.

As shown in FIG. 3, the light emitting diode chip 15 is formed on the bottom surface of the inside of the opening of the housing 11 after the reflective surfaces 12 and 13 are formed, and the two metal electrodes 14 are respectively formed on the light emitting diode chip ( The wire bonding is performed with two terminals formed in 15). Of course, according to the characteristics and type of the light emitting diode chip 15 is used according to a variety of packaging methods that are commonly applied, such as one wire bonding or another method instead of wire bonding. At this time, if necessary, one of the electrodes of the light emitting diode chip 15 may be connected to the electrodes of the package substrate 10 through a zener diode. As described above, after the LED chip 15 is mounted, the inside of the opening 11 of the housing 11 may be filled with a transparent encapsulant material such as a transparent resin (including a polymer) or glass.

Accordingly, the light emitting diode chip 15 is operated and emitted to the side through the reflective surfaces 12 and 13 formed by directly placing the mask 42 (see FIG. 4) on the package substrate 10 according to the present invention. The light can be reflected to the front. The use of such reflective surfaces 12 and 13 can increase the light extraction efficiency from the light emitting diode chip 15, and as the use time of the device elapses, the side surface of the opening of the housing 11 made of a polymer resin is lighted. It is possible to prevent the discoloration gradually becoming black by heat or heat. That is, by using the reflective surfaces 12 and 13 to prevent discoloration, the luminance reliability is improved, and the increase in the luminance means that less power can be used to obtain the same luminance, and thus the heat dissipation design can be easily performed. have.

4 is a view for explaining a manufacturing process of the LED package substrate 10 according to an embodiment of the present invention.

As shown in Figure 4, in order to manufacture the LED package substrate 10 according to an embodiment of the present invention, first, two metals formed to be electrically insulated on the bottom surface inside each opening for mounting the LED chip The package substrate array 110 formed by molding each polymer (or ceramic) housing 11 to have the electrodes 14 is prepared. When molding the polymer into a lead frame made of the metal electrodes 14 to form the housing 11, unlike the conventional method (see FIG. 14), the material of the metal electrode 14, for example, Cu, Ni, By molding the polymer directly, such as Cr or an alloy thereof, it is possible to prevent cracking or peeling of the interface between the metal electrode 14 and the housing 11, and to prevent foreign substances from entering from outside and deteriorating the device performance or damaging the device. can do. However, the surface of the metal electrode 14 may be subjected to surface treatment for surface roughness, for example, plating treatment using Cu, Ni, Cr, or the like.

Next, the projecting portion 40 and the planar portion of the lower surface on each housing 11 in which an opening is formed in each portion of the package substrate array 110 in which the housing 11 is to be separated into each package substrate are formed. The mask 42 made of 41 is put on, and the reflective surfaces 12 and 13 are formed by coating a metal material on the reflective layer region by a predetermined coating method. 4 illustrates a process of manufacturing a plurality of package substrates in the form of an array, and after all processes are completed, may be separated into individual package substrates 10 along the cutting line 19.

As shown in FIG. 5, the mask 42 used herein has a through hole corresponding to the reflective layer region inside the opening of the package substrate 10, and a metal material passes through the through hole to allow the mask 42 to be disposed within the opening of the package substrate 10. By being deposited on the bottom surface 12 and the inclined surface 13, it is possible to form a reflective surface.

4 or 6, the lower surface of the mask is provided with a protruding portion 40, and the protruding portion 40 is formed on the bottom surface of the inside of the opening of the package substrate 10 except for the metal electrodes 12. The insulating surface 18 is also in close contact with the insulating portion of the inclined surface of the opening extending from the mask, so that the metal material is masked so that the coating of the reflective surface 13 is performed.

As such, the process of forming the reflective surfaces 12 and 13 on the reflective layer area by directly placing the mask 42 on the package substrate 10 includes the adhesive layer 21 and the intermediate layer 21 constituting the reflective surfaces 12 and 13. ), The light reflection layer 23 may be made in various ways. For example, the adhesive layer 21 and the intermediate layer 21 may be coated by a vacuum deposition method or an electroless chemical plating method. The light reflection layer 23 may be coated by vacuum deposition or electroplating. The vacuum deposition method or the electroless chemical plating method may be a method of coating the mask 42 on the package substrate 10, and the electroplating method may be performed without the mask 42. In some cases, prior to coating such an adhesive layer 21, in order to increase the adhesive force, a metal material on the bottom surface 12 inside the opening of the package substrate 10, that is, the exposed surface of the metal electrode 14. For example, a metal thin film (or a plurality of thin films) such as, for example, Ag, Pd, Au, Ni, Cu, Cr, Sn, or an alloy including at least any one thereof may be surface treated.

As such, in the present invention, a predetermined mask 42 having a three-dimensional structure is placed on the curved package substrate 10, and vacuum deposition (PVD, CVD, etc.) Since the reflective surface 13 may be coated by plating or chemical plating, a light emitting diode package having improved light extraction efficiency and luminance reliability may be easily provided at low cost. This improvement in light extraction efficiency means that less power can be used to obtain the same brightness, which reduces heat generation and facilitates heat dissipation design.

7 is a perspective view of a light emitting diode package substrate 70 according to another embodiment of the present invention. As shown in FIG. 7, the LED package substrate 70 according to another embodiment of the present invention includes metal electrodes 72 formed to electrically insulate the bottom surface of the opening of the housing made of a polymer or ceramic material. Two or more, for example four, in which case the bottom surface and the bottom inside the opening of the housing according to the method of the invention in which the mask 42 is placed directly on the package substrate and the reflective layer area is coated. The reflective surface 73 may be formed on the inclined surface from the surface to the upper surface of the package substrate. As shown in FIG. 2, the reflective surface 73 may be formed by sequentially coating at least one of the adhesive layer 21, the intermediate layer 22, and the light reflection layer 23 with a metal material.

8 is a perspective view of a light emitting diode package 80 according to another embodiment of the present invention.

As shown in FIG. 8, in the LED package substrate 80 according to another exemplary embodiment, a heat slug 84 is formed on a bottom surface of an opening of a housing made of a polymer or a ceramic. This includes the case where there are two or more metal electrodes 82 formed in each opening so as to be electrically insulated from the upper surface side of the package substrate. In this case, the reflective layer is placed directly on the package substrate. Reflective surfaces 83 can be formed on the bottom surface inside the opening of the housing and on the inclined surface from the bottom surface to the top surface of the package substrate in accordance with the inventive method of coating the area. In the substrate having the heat slug 84, the opening side metal reflective layer is composed of one region, which is insulated from the metal electrode and instead connected to the heat slug 84. Here, the reflective surface 83 may be formed by sequentially coating at least one of the adhesive layer 21, the intermediate layer 22, and the light reflection layer 23 with a metal material as shown in FIG. 2.

9 is a cross-sectional view of a light emitting diode package having a reflective surface on a portion of an inclined surface according to an embodiment of the present invention. 10 is a cross-sectional view of a light emitting diode package having a reflective surface on a portion of an inclined surface according to another embodiment of the present invention.

As shown in FIG. 9 or FIG. 10, in forming the reflective surface 13 using the mask 42, on the insulated metal electrode 14 of the bottom surface inside the opening of the housing 11 and the housing 11. The reflective surface 13 may be formed only on some of the inclined surfaces of the entire inclined surface of the opening.

As shown in FIG. 9, when the inside of the opening 11 of the housing 11 is formed of one inclined surface, a portion of the upper portion of the inclined surface including the upper surface of the substrate may be exposed without being coated with a metal material.

In addition, as shown in FIG. 10, in order to facilitate coating on the upper portion of the inclined surface, when the polymer is molded in a lead frame made of the metal electrode 14 to form the housing 11, it may be exposed without being coated with a metal material. By molding the polymer in a stepped shape (or any other shape) such that the upper part of the inclined surface of the housing 11 has a step with a wider opening area, the inside of the opening of the housing 11 can have a multi-stage inclined shape. . At this time, the surface of the stepped stepped irregularities can be increased to increase the surface area of the encapsulant and the polymer to prevent the harmful substances from entering easily. The lowermost inclined surface of the multi-stage inclined surface may be coated with a metallic material, and the upper portion of the inclined surface having a step with a wider opening area may be exposed without being coated with the metallic material.

However, FIG. 10 illustrates a two-stage inclined surface, but is not limited thereto. In the case of a three-stage or four-stage or more multistage inclined surface, the metal material is coated on the remaining inclined surfaces except for the top inclined surface. Thus, the reflective surface 13 may be formed. In addition, in some cases, the reflective surface 13 may be formed by coating a metallic material even on a part of the top inclined surface as described above.

By having the reflecting surface 13 in a part of the inclined surface in this way, the encapsulant 91 and the polymer housing 11 are in direct contact with the upper portion of the side inclined surface inside the opening of the housing 11, thereby making the side reflecting surface ( 13) prevents cracking or peeling of the interface between the metal coated on the sealing material and the encapsulant 91, and foreign matters from the outside can be prevented from deteriorating the performance of the device or from damaging the device.

In particular, in the present invention, when forming the housing 11 by molding a polymer in a lead frame made of a metal electrode 14, as shown in Figure 9, unlike the conventional method, for example, the material of the metal electrode 14, Molding the polymer directly to Cu, Ni, Cr, or an alloy thereof, prevents cracking or peeling of the interface between the metal electrode 14 and the housing 11, and foreign matter enters from the outside, thereby degrading the performance of the device or It was possible to prevent breakage. However, the surface of the metal electrode 14 may be subjected to surface treatment for surface roughness, for example, plating treatment using Cu, Ni, Cr, or the like.

Conventionally, as shown in FIG. 14, before forming a housing by molding a polymer in a lead frame made of a metal electrode, a reflective metal layer such as a silver (Ag) plating layer was formed on the metal electrode, and there was no special reflective surface on the inclined surface of the opening after molding. A reflection effect was achieved in the silver (Ag) plating layer exposed to the opening. However, in the case of coating the silver (Ag) plating layer on the metal electrode in this way, the bonding strength between the polymer and the polymer may be weak, which may result in cracking or peeling of the interface between the lead frame and the polymer. This may degrade or the element may be broken.

FIG. 11 is a cross-sectional view of a light emitting diode package having a reflective surface at a portion of a multi-stage inclined surface in a structure having a heat slug according to an embodiment of the present invention. 12 is a cross-sectional view of a light emitting diode package having a reflective surface in a portion of a multi-stage inclined surface in a structure having a heat slug according to another embodiment of the present invention. FIG. 13 is a cross-sectional view of a light emitting diode package having a reflective surface at a portion of a multi-stage inclined surface in a structure having a heat slug according to another embodiment of the present invention. Here again, when forming the housing 11 by molding a polymer in a lead frame made of the metal electrode 14, unlike the conventional method, the material of the metal electrode 14, for example, Cu, Ni, Cr, or their By molding the polymer directly on an alloy or the like, cracks or peeling of the interface can be prevented even between the metal electrode 14 and the housing 11, and foreign substances can be prevented from coming in from the outside, thereby degrading the performance of the device or damaging the device. The surface of the metal electrode 14 may be plated with a rough surface forming a surface roughness, for example, a plating process using Cu, Ni, Cr or the like.

11 to 13, even when the heat slug 92 is formed on the bottom surface of the opening 11 of the housing 11, the housing 11 is formed by forming the reflective surface 13 using the mask 42. The reflective surface 13 may be formed only on some of the inclined surfaces of the entire inclined surface of the opening. In some cases, the reflective surface 13 may be formed on the heat slug 92 of the bottom surface of the opening 11 of the housing 11.

As shown in FIG. 11, the inclined surface of the second stage includes the first inclined plane from the heat slug 92 to the metal electrode 14 and the second inclined plane from the metal electrode 14 to the upper surface of the substrate as shown in FIG. 11. In this case, the inclined surfaces other than the lowest inclined surface (first inclined surface) among the inclined surfaces including the upper surface of the substrate may be exposed without being coated with a metallic material.

In addition, as shown in FIG. 12, the reflective surface 13 may be formed by coating a metal material on a part of the uppermost inclined surface (the second inclined surface) including the lowest inclined surface (the first inclined surface).

Alternatively, as shown in FIG. 13, even when the inside of the opening of the housing 11 is formed of one inclined surface from the heat slug 92 to the metal electrode 14 and the inclined surface of the multi-stage form from the metal electrode 14 to the upper surface of the substrate. In addition, the inclined surfaces except the lowest inclined surface among the multi-stage inclined surfaces may be exposed without being coated with a metal material, or the reflective surface 13 may be formed by coating the metal material even a part of the top inclined surface including the lowest inclined surface.

In FIG. 13, one inclined plane from the heat slug 92 to the metal electrode 14 is illustrated, but in some cases, more inclined planes separated therebetween may be included, and the substrate from the metal electrode 14 may also be included. More multi-stage slopes may be included that are also separated between the top surfaces.

9 to 13, the polymer is directly molded into the lead frame made of the metal electrode 14, or the upper portion of the side inclined surface inside the opening of the housing 11 has the uncoated reflective surface 13. The metal electrode 14 and the polymer housing 11 are in direct contact without the silver plating layer, and the encapsulant 91 and the polymer housing 11 are in direct contact at the top of the inclined surface, so that the metal electrode 14 and the polymer housing ( 11) prevents cracking or peeling of the interface between the metal coated on the side reflection surface 13 and the encapsulant 91, and prevents foreign substances from entering the outside and deteriorating device performance or damaging the device. . The exposed surface where the encapsulant 91 and the polymer housing 11 are in direct contact with each other can be further improved to prevent the cracking or peeling of the interface by deforming to a flat surface or a surface having irregularities in any other form. .

As described above, the present invention has been described by way of limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains various modifications and variations from such descriptions. This is possible. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below but also by the equivalents of the claims.

10: LED package substrate
11: housing
12: bottom surface
13: reflective surface
14: metal electrode
21: adhesive layer
22: middle layer
23: light reflection layer
42: mask

Claims (8)

In the light emitting diode package substrate molded polymer on a lead frame containing a metal electrode,
A polymer housing having an opening for mounting the light emitting diode chip,
A reflective surface formed by coating a metal material on an inclined surface inside the opening or a reflective layer region of the inclined surface and the bottom surface of the opening,
The package board for a light emitting diode, characterized in that the reflective surface is formed only on the inclined surface corresponding to a part of the entire inclined surface in the opening. The method of claim 1,
The inside of the opening is made of a multi-stage inclined surface, the light emitting diode package substrate, characterized in that the reflective surface is formed on at least one or more inclined surfaces other than the top inclined surface of the multi-stage inclined surface. The method of claim 2,
The package board for a light emitting diode, characterized in that the reflective surface is formed on a portion of the top slope. The method of claim 1,
And a housing formed by molding a polymer directly without forming a reflective metal layer on the lead frame. The method according to any one of claims 1 to 4,
The package substrate for a light emitting diode further comprising a plurality of insulated metal electrodes formed on the bottom surface of the opening. The method according to any one of claims 1 to 4,
And a heat slug formed on a bottom surface of the opening. The method according to any one of claims 1 to 4,
The reflective surface is a light emitting diode package substrate, characterized in that at least one of an adhesive layer, an intermediate layer and a light reflection layer. The method according to any one of claims 1 to 4,
A three-dimensional mask having a through hole corresponding to the reflective layer region on the housing and having a protruding portion corresponding to a portion to be masked so as not to be coated other than the reflective layer region on a lower surface thereof, and having a metal material through the through hole The light emitting diode package substrate, characterized in that the coating to form the reflective surface.
KR1020100036162A 2010-04-20 2010-04-20 Light emitting diode package substrate having part of side surface coated with reflective metals using mask and manufacturing method thereof KR20110116632A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020017922A1 (en) * 2018-07-20 2020-01-23 엘지이노텍 주식회사 Light-emitting element package and light source module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020017922A1 (en) * 2018-07-20 2020-01-23 엘지이노텍 주식회사 Light-emitting element package and light source module
US11735702B2 (en) 2018-07-20 2023-08-22 Suzhou Lekin Semiconductor Co., Ltd. Light-emitting element package and light source module

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