KR20110104223A - Gap structure of usim chip for mobile communication terminal test - Google Patents

Gap structure of usim chip for mobile communication terminal test Download PDF

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Publication number
KR20110104223A
KR20110104223A KR1020100023236A KR20100023236A KR20110104223A KR 20110104223 A KR20110104223 A KR 20110104223A KR 1020100023236 A KR1020100023236 A KR 1020100023236A KR 20100023236 A KR20100023236 A KR 20100023236A KR 20110104223 A KR20110104223 A KR 20110104223A
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KR
South Korea
Prior art keywords
gap
chip
copper foil
terminal
card
Prior art date
Application number
KR1020100023236A
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Korean (ko)
Inventor
김재봉
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김재봉
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Publication date
Application filed by 김재봉 filed Critical 김재봉
Priority to KR1020100023236A priority Critical patent/KR20110104223A/en
Publication of KR20110104223A publication Critical patent/KR20110104223A/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04T—INDEXING SCHEME RELATING TO STANDARDS FOR ELECTRIC COMMUNICATION TECHNIQUE
    • H04T2001/00—Standards for wireless communication networks
    • H04T2001/113—SIM, USIM

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The present invention has excellent durability to prevent the damage of the pattern formed on the inspection core chip repeatedly using one core chip as the presence of the inspection core chip is directly mounted for each mobile communication terminal to be produced. It relates to a gap structure of a SIM chip for a mobile communication terminal inspection.
That is, a part of one corner of the card main body 11 is removed to form the identification part 13, and if necessary, a drawing means 12 is formed at the center of the identification part 13 side, and the entire surface of the PCB 21 is formed. A plurality of copper foils 22 separated by a single gap 26 are formed to form a pattern, and the memory chip 23 is bonded to the silicon film 24 on the other surface. ) Simultaneous card for simplicity test for mobile communication terminal equipped with the simplicity chip 20 configured to connect the copper foil plate 22 to each connecting wire 25 to conduct The total area of the copper foil plate 22 is kept wider by minimizing the distance between the entire gaps 26 separating the copper foil plate 22 formed on the entire surface of the PCB 20 of one side of the chip 20. Is connected to the copper foil plate 22 of the core chip 20, and the terminal progress surface 30 proceeds. ), The gap 26 held inside is formed as an enlarged gap 26 for keeping the width wide.

Description

Gap structure of USIM chip for mobile communication terminal test

The present invention relates to an inspection chip for checking whether the SIM card of the mobile communication terminal is realized in the manufacturing process of the mobile communication terminal using the SIM card which is a card type module. By mounting the inspection core chip directly on each terminal to check whether it is realized, the damage of the pattern formed on the inspection core chip that uses one core chip repeatedly prevents damage to the durability of the inspection chip of the mobile terminal having excellent durability. It relates to the gap structure.

In general, the USIM-universal subscriber identity module card is a universal subscriber identity module that not only provides various services such as authentication, charging, and security functions to subscribers, but also implements various functions such as global roaming and e-commerce. The card is used in a third generation mobile communication (WCDMA) terminal.

The SIM card for a conventional mobile communication terminal (hereinafter referred to as a terminal) is configured by mounting a SIM card having a size similar to a thumb on a card body configured in a rectangular card shape that maintains an area of a thumb size and thin thickness. As the card body is inserted into and fixed inside a normal asynchronous third generation terminal (WCDMA), the Usim card of Usim card is directly connected to an internal device having both electrical and electronic functions constituting a mobile communication terminal. It also has the role of a Sim IC and a function of a universal IC card (UIIC) that can carry functions such as a transportation card or a credit card.

At this time, the universal IC card is to ensure the integrity and security of all personal information data through the security support of various multiple applications.

It consists of a small CPU and a memory, and the CPU identifies the user with the encryption / decryption function and the memory can be used as a storage space for additional services. In particular, with OTA-over the air technology, if banking or card service approval is obtained, the service can be installed wirelessly without issuing a separate chip.

As shown in FIG. 10, the inspection simsim card for maintaining the same shape and function as the simsim card used and configured as described above is a thumb size area and thin thickness mounted on one surface of a rectangular simsim chip 20 It is produced by forming a drawing unit 12 by removing a part of the corner of one side of the rectangular card body 11 to maintain the form and forming the withdrawal means 12 in the center of the identification unit 13 side as necessary The SIM chip 20 is maintained at the bottom of each mobile communication terminal so that the identification unit 13 side is partially exposed to the inside of the terminal so that the terminal can check whether the SIM card is realized.

That is, the inspection SIM card is installed on all the terminals produced and completed to check whether the SIM card is realized, so that the inspection card is repeatedly installed and discharged in as many as tens of thousands of terminals.

In this case, the Usim chip mounted on the Usim card is coated with a plurality of copper foils 22 separated by a gap 26 having a predetermined width on one entire surface of the PCB 21 to maintain a thin thickness with a certain area of the rectangle. The pattern is formed and the memory chip 23 is bonded to the silicon film 24 on the other surface, and the memory chip 23 and the copper foil 22 are connected to each other by the connecting wires 25 so as to be conductive. Is universal.

In addition, the U-sim card socket (2) is built in the terminal so that the U-sim card and the main board of the terminal main body is connected to the U SIM card, the socket mold 100 and the socket formed in a plate shape as shown in FIG. The socket housing 200 composed of a support part formed by engaging the mold 100 with an open insertion part and a locking jaw, and an entry-side connection terminal part 310 and a support part side provided at the entrance side of the socket mold 100. Consists of the support side connecting terminal portion 320 provided in the, and is formed in a state in which each of the connecting terminal portion 310, 320 and the connecting terminal portion 320 is lifted to have a contact elastic force, the copper foil plate of the SIM card It is common to comprise a plurality of connection terminals (3).

In the process of inserting and discharging the SIM card configured as described above into the SIM card socket configured as described above, the connection terminal of the SIM card socket moves to the surface of the SIM chip in close contact with the upper copper plate of the SIM card by elastic force. Therefore, the connection terminal proceeds in the same state as moving in close contact with the copper foil and the gap, so that the side end separated by the gap of the copper foil, which is weaker than the connection terminal, is pushed toward the center of the gap, so that the side of the copper foil is pushed together. The ends are in close contact with each other so that the functions of the core chip are lost and can no longer be produced and used for inspection in the finished terminal.

As a result, the Usim card with the new Usim chip for inspection is used. As a result, more Usim cards for inspection are produced and consumed. As a result, the gap between Usimsim chips is widened to prevent the conduction of the copper plate due to the connection terminal. As a result, the gap between the copper foils is narrowed and the durability of the SIM chip is weakened. As a result, the production and management cost of the inspection SIM card required for checking whether the SIM card is realized or not is increased. Although there are problems such as increasing, the SIM card makers and related companies are not able to suggest a solution to fundamental problems.

Therefore, in the present invention, in order to eliminate the above problems, the gap between the entire gaps separating the copper foils formed on the entire surface of the PCB is narrowed so that the entire area of the copper foils becomes wider, thereby increasing the rigidity of the copper foils. As a result, the entire Usim chip is more firmly maintained, thereby strengthening the durability of the Usim chip, and forming an enlarged gap that maintains a wide gap between the terminal traveling surface where the connecting terminal constituting the socket contacts the copper thin plate of the Usim chip. Movement to prevent the copper foil plates from being connected to each other due to the wide distance of the expansion gap even if both sides of the expansion gap are lost due to the progress of the connecting terminal. In order to provide a SIM chip for inspection of communication terminals, the above problem is to be solved.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

The identification portion 13 is formed by removing a portion of one corner of the rectangular card body 11 which maintains the size of the thumb and the thin thickness, and withdraws means 12 at the center of the identification portion 13 side as necessary. Forming a pattern by covering a plurality of copper thin plates 22 separated by gaps 26 of a single width across the entire surface of the PCB 21 to maintain a thin thickness with a rectangular area. The core chip 20 is formed by binding the memory chip 23 to the silicon film 24 on the surface, and connecting the memory chip 23 and the copper foil 22 to each other by the connecting wires 25. A total gap 26 separating the copper thin plates 22 formed on one surface of the PCB plate 21 of the SIM card 20 for SIM card for the presence or absence of a mobile communication terminal mounted on one surface of the card body 11. The total area of the copper foil plate 22 is further increased by minimizing the distance The gaps 26 are maintained in the terminal progress surface 30 which is maintained in contact with the copper foil plate 22 of the core chip 20. The present invention relates to a gap structure of a SIM card for SIM card for checking whether a mobile communication terminal is realized.

As described above, the gap structure of the UCC chip for inspecting the mobile communication terminal of the present invention minimizes the distance of the total gap separating the copper plate formed on one surface of the PCB, thereby maintaining the total area of the copper plate more wide. Due to the rigidity of the copper plate, the U-SIM chip is more durable than the U-SIM chip. By preventing the, it is possible to prevent the damage of the SIM chip by preventing the cutting of the connection wire to connect the memory chip and the copper plate to conduct even if the operation and coupling the SIM card to the terminal frequently.

In addition, when the connecting terminal constituting the socket is formed with an enlarged gap for widening the gap maintained in the terminal progress surface which is in contact with the copper thin plate of the SIM chip, the SIM card is connected to the terminal and detached. Even though the connecting terminal moves to the center of the magnification gap while pressing and depressing the copper foil plate side end that is held on both sides of the magnification gap while being moved in close contact with the terminal traveling surface, the copper foil plate separated by the magnification gap due to the distance between both ends of the magnification gap is too far. It is to be able to prevent the contact or contact with each other to further extend the service life of the SIM card.

As a result, it can be applied to a larger number of terminals each produced as a single SIM card, which is durable and long in life, thereby reducing consumption of inspection SIM card in the process of producing and inspecting a mobile communication terminal, as well as inspection time. It can reduce the cost and improve the quality of mobile communication terminal, which is a necessity of modern people, and reduce the production cost. It is a great invention that is expected and useful.

1 is a perspective view of a sim card for inspection of one preferred embodiment equipped with the present invention.
Figure 2 is an exploded perspective view showing a preferred embodiment of the present invention.
Figure 3 is a front configuration diagram of the inspection simsim card showing a preferred embodiment equipped with the present invention.
Figure 4 is a cross-sectional view and enlarged view showing a preferred embodiment of the present invention.
Figure 5 is a perspective view showing a preferred terminal application state of the SIM card equipped with the present invention.
Figure 6 (a) (b) is a cross-sectional view showing a preferred embodiment of the present invention.
7A is a cross-sectional configuration diagram showing a state in which a conventional SIM chip is changed by a connection terminal, and (B) is a cross-sectional configuration diagram showing a state in which a SIM chip of the present invention is changed by a connection terminal.
8 is a surface view showing a change according to the use state of the conventional Usim chip.
(A) is the state diagram before use and (B) is the state diagram after use.
9 is a surface view showing a change according to the state of use of the chip of the present invention
(A) is the state diagram before use and (B) is the state diagram after use.
Figure 10 (a) (b) is a perspective view showing a preferred configuration of a conventional inspection simsim card.
11 is a perspective view showing a preferred configuration of a conventional socket.

In general, the inspection Usim card as shown in Figure 1 to remove the portion of the corner of one side of the rectangular card body 11 to maintain the area of the thumb size and thin thickness to form the identification unit 13, as necessary The drawing means 12 is formed in the center of the identification part 13 side, and the concentric chip 20 is mounted on one surface of the card main body 11 so as to be formed in the same manner as the conventional concentric card 10.

As shown in FIG. 2, a plurality of copper foils 22 separated by a gap 26 having a uniform width are formed on the entire surface of the PCB 21 to maintain a thin thickness with a certain area of a quadrangle as shown in FIG. 2. ) To form a pattern and bind the memory chip 23 to the silicon film 24 on the other surface, and connect the memory chip 23 and the copper plate 22 to the respective connecting wires 25. When mounted on the SIM card 10, the SIM card 20 is embedded so that one surface of the card main body 11 is recessed to expose the copper foil 22 to the external surface. It is preferable to fix it.

At this time, the total area of the copper foil plate 22 is further maintained by minimizing the distance of the entire gap 26 separating the copper foil plate 22 formed on the entire surface of the PCB 21 of the core chip 20. However, the connecting terminal 3 constituting the socket 2 maintains the wide gap 26 held in the terminal traveling surface 30, which proceeds in contact with the copper foil plate 22 of the core chip 20. An enlarged gap 26 is formed.

The inspection sim card 10 configured as described above is inserted into a socket (2) embedded in the conventional terminal (1) produced as shown in FIG. 5 to check whether the sim card is applied to the terminal (1) To be able to inspect.

That is, as shown in FIG. 6, the copper foil plate 22 side is maintained at the connection terminal 3 side of the socket 2 so that the SIM card 10 is inserted into the socket 2 so that the connection terminal 3 has elastic force. ) Is kept in close contact with the surface of the copper foil 22 coated on the core chip 20, so that the connection terminal 3 pressurizes the copper foil 22 in proportion to the elastic force of the connection terminal 3. Therefore, a phenomenon such as that the connecting terminal 3 moves on the surface of the copper foil 22 is generated in the copper foil 22.

At this time, in order to distinguish the copper foils 22, the PCB 26 is covered with a phenomenon such that the connection terminal 3 moves even with the gap 26 that maintains the distance between the copper foils 22. The end of the copper foil plate 22 due to the slight height difference between the thickness of the copper foil plate 22 and the gap 26 formed on the surface of the PCB 21 and the strength difference between the copper foil plate 22 and the connecting terminal 3. Due to the additional connection terminal 3 is recessed to the center of the gap 26, the process of inserting and discharging the SIM card 10 into the socket (2) is repeated many times, as shown in Figure 8 End portions of both ends of the copper foil 22 adjacent to each other between the gaps 26 separating the copper foils 22 are recessed toward the center of the gap 26 so that the copper foils 22 on both sides recessed with each other are in contact with each other. Will become conductive while losing the function of the SIM chip will not be able to use the SIM card 10 to be.

To prevent this, if the width of the gap 26 is configured to be wide and the distance between the copper foils 22 adjacent to each other is configured to be far, the ends of the copper foils 22 recessed by the connection terminals 3 do not come into contact with each other. Although the surface of the copper foil plate 22, which maintains the rigidity of the core chip 20, may be narrowed, the PCB 21, which maintains the core chip 20, may be bent or bent at a portion where the gap 26 is formed. As the phenomenon occurs and the probability of disconnection of the connection wires of the SIM chip 20 increases, it can be seen that the structure of the gap 26 can not be arbitrarily widened.

However, the area where the terminal progress surface 30 through which the connection terminal 3 proceeds in close contact with the front surface of the core chip 20 is always formed within a predetermined area, so that the terminal progress surface 30 is shown in FIG. 9. When the enlarged gaps 26 having the wider distances of the gaps 26 are formed in the gaps 26 to be formed than the terminal advance surfaces 30, the terminal progress surfaces 30 are formed in the amount of the terminal advance surfaces 30. Even if the connection terminal 3 passing through the surface 30 recesses the end portion of the copper foil 22, the copper foils 22 held on both sides of the enlargement gap 26 are separated from each other due to the wide distance of the enlargement gap 26. Not only does not contact, but also to narrow the overall distance of the gap 26 to improve the rigidity of the core chip 20 to maintain the effect of improving the durability to create a dual advantage.

Thus, the gap structure of the UCC chip for mobile communication terminal inspection of the present invention, which is configured and used as described above, improves the durability of the SIM chip and allows more use of the UCC card for inspection that requires a large number of repetitive tasks. It is an advantageous invention to reduce the production of the SIM card to be applied and to facilitate and ease the repetitive mounting and withdrawal process of the operator.

1: mobile terminal 2: socket
3: access terminal 10: SIM card
11: card body 12: withdrawal means
13: identification unit 20: SIM chip
21: Fish plate 22: Copper plate
23: memory chip 24: silicon film
25: connecting wire 26: gap
27: enlargement gap 30: terminal advance surface

Claims (1)

The identification portion 13 is formed by removing a portion of one corner of the rectangular card body 11 which maintains the size of the thumb and the thin thickness, and withdraws means 12 at the center of the identification portion 13 side as necessary. Forming a patternon by covering a plurality of copper foils 22 separated by gaps 26 of a single width across the entire surface of the PCB 21 to maintain a thin thickness with a rectangular constant area. The core chip 20 is formed by binding the memory chip 23 to the silicon film 24 on the surface thereof, and connecting the memory chip 23 and the copper foil 22 to each other by the connection wires 25. In the gap structure of the SIM card for the SIM card for checking whether the mobile communication terminal is mounted on one surface of the card main body 11;

The total area of the copper foil plate 22 is kept wider by minimizing the distance of the entire gap 26 separating the copper foil plate 22 formed on the entire surface of the PCB 21 of the SIMP chip 20. The terminal 3 in the gap 26 is formed in the gap 26 where the terminal 3 is formed in contact with the copper foil plate 22 of the core chip 20. Of the SIM card for the SIM card for the mobile communication terminal realization inspection, characterized in that the expansion gap 26 is formed by the number of the terminal progress surface 30 while maintaining the wide width 26 while keeping the distance of the gap 26 wide. Gap structure.
KR1020100023236A 2010-03-16 2010-03-16 Gap structure of usim chip for mobile communication terminal test KR20110104223A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100023236A KR20110104223A (en) 2010-03-16 2010-03-16 Gap structure of usim chip for mobile communication terminal test

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Application Number Priority Date Filing Date Title
KR1020100023236A KR20110104223A (en) 2010-03-16 2010-03-16 Gap structure of usim chip for mobile communication terminal test

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KR20110104223A true KR20110104223A (en) 2011-09-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110308058A (en) * 2019-08-13 2019-10-08 上海电气核电设备有限公司 A kind of heat preservation tooling in low-temperature impact test slot

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110308058A (en) * 2019-08-13 2019-10-08 上海电气核电设备有限公司 A kind of heat preservation tooling in low-temperature impact test slot

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