KR20110072651A

KR20110072651A - Led light module

Info

Publication number: KR20110072651A
Application number: KR1020090129675A
Authority: KR
Inventors: 김동섭; 명관 이
Original assignee: 김동섭
Priority date: 2009-12-23
Filing date: 2009-12-23
Publication date: 2011-06-29

Abstract

The present invention relates to an LED (LIGHT EMITTING DIODE) lighting device, in particular, one or more LED is mounted, the PCB having a heat dissipation hole for LED heat dissipation at the position where the heat dissipation surface of the LED; One or more LEDs mounted to the PCB; A connection terminal mounted on the PCB and making an electrical connection with the LED; And a heat dissipation fin formed at an outside thereof, forming a pipe-shaped space therein, to form a heat pipe, and at least one LED contact portion protruding from a hole in the PCB to directly contact the heat dissipation surface of the LED. It is a LED lighting module characterized in that the technical configuration characterized in that it is integrally configured including a cooling means.

The present invention, in particular, the heat pipe is configured inside, and the cooling means and the LED and the PCB and the PCB is formed integrally formed integrally with the heat dissipation fins on the outside, the heat generated from the LED is subjected to a one-step thermal contact step By being configured to be delivered to the heat sink fin of the cooling means, first, there is an effect that can efficiently emit heat generated from the LED, second, the light efficiency and life of the LED is long due to the stable heat dissipation, third, the cooling means There is an effect of reducing the size, and fourth, there is an effect that can easily design and manufacture the LED lighting device by modularizing the LED lighting.

Description

LED lighting module {LED LIGHT MODULE}

The present invention relates to an LED (LIGHT EMITTING DIODE) lighting device, and in particular, the cooling means, the PCB (PRINTED CIRCUIT BOARD: printed circuit board) and the LED is configured integrally, but the heat generated from the LED is released through the cooling means By minimizing the thermal contact step until the end, the heat generated by the LED can be efficiently released.

In addition, by integrating and modularizing the LED, the PCB and the cooling means to facilitate the design of the lighting device, and to reduce the size of the cooling means.

As technology advances, white LEDs are developed following RED, GREEN, and BLUE LEDs, and the LED application field is used to display incandescent lamps, fluorescent lamps, etc. The range of application is being gradually expanded to next generation eco-friendly lighting.

LED lighting has many advantages, such as being able to produce a variety of colors, low carbon dioxide emission, low power consumption, long life, small size, thin film, etc., the development is accelerating.

However, due to the characteristics of LED, about 70% to 80% or more of the input power is converted into thermal energy to increase the temperature of the LED, which increases the LED's light efficiency and reduces the lifetime of the LED. It is essential that a technology capable of dissipating heat effectively.

In addition, the output of LEDs is continuously increasing, and even if the temperature of the LED is reduced by only 10 degrees, the lifespan can be doubled.

The technology of dissipating heat generated from LED can be divided into the method of increasing the heat dissipation efficiency of the LED package itself and the method of increasing the heat dissipation efficiency of the lighting equipment equipped with LED. Recently, the heat pipe manufacturing technology It is absorbed by LED heat dissipation technology to improve heat dissipation efficiency.

Republic of Korea Patent No. 10-0658701 "Light emitting element with heat pipe" (hereinafter referred to as "Line Invention 1") and Republic of Korea Patent No. 10-0608918 "Light emitting element with heat pipe" (hereinafter "Line "Invention 2") and Korean Patent Registration No. 10-090610 "Power LED Package" (hereinafter referred to as "Pre-Invention 3") is a method of increasing the heat radiation efficiency of the LED package itself, Silver heat pipes are placed adjacent to the LED electrodes to increase heat dissipation efficiency.Preliminary Invention 2 configures the LED electrodes themselves as heat pipes to increase the heat dissipation efficiency of the LEDs. It is to increase the heat dissipation efficiency.

These pre-registered inventions are very useful inventions to improve the external heat transfer efficiency of the LED package itself.

However, in the case of LED, not only a technology that emits heat generated by the LED itself but also a cooling technology that performs efficient cooling by receiving the heat emitted from the LED, and heat dissipation efficiency in a lighting fixture using the LED is needed. This is even more important.

Republic of Korea Patent Application No. 10-2007-0010134 "LED lighting assembly with a cooling device using a heat pipe" (hereinafter referred to as "first invention") is a light fixture using an LED, the heat radiation fin is formed on the heat pipe side By combining the portion, and the LED assembly on the heat absorbing surface of the heat pipe is to effectively release the heat generated from the LED.

Figure 2 is a perspective view showing an embodiment of the present invention, Figure 3 is a schematic cross-sectional view taken along the line a-a 'of Figure 2, wherein reference numeral 10 is a heat pipe, 11 is a through hole (12) is an endothermic surface, (14) is a sealing surface, (16) is a side surface, (18) is an inner tube member, (20) is an LED assembly, (21) is an LED, (22) is a PCB, (24) ) Denotes a thermal pad, 26 denotes an electric wire, 30 denotes a heat radiating portion, 32 denotes a cylindrical portion, 34 denotes a cooling fin, and 40 denotes an electrical connection portion.

However, in the conventional heat dissipation technology, heat dissipation is not performed efficiently because the heat generated from the LED reaches the cooling fins is large, and thus, the temperature of the LED is increased and the size of the cooling means including the cooling fins. There was a problem such as increases.

This will be described as follows.

As is well known, when one object transfers heat to another object, heat resistance occurs at the contact surface.

That is, no matter how smooth the two surfaces are in contact with each other, the enlarged view is not a surface contact but a point contact, and the heat transfer characteristics of the two objects inevitably result in thermal resistance at the contact surface.

Therefore, thermal grease is used to fill the voids between the surfaces making point contact, so that heat is transferred well, but this is not the ultimate solution, and the best method is to minimize the thermal contact step as much as possible.

However, the prior art, including the above-described prior invention has a lot of thermal contact steps to the heat radiation fins that emit heat generated from the LED, so that the heat radiation efficiency is lowered, and thus, there is a problem that the cooling means including the heat radiation fins must be increased. There is a problem that the temperature is increased to reduce the light efficiency and life.

For example, the present invention has three stages of thermal contact steps ranging from "LED and PCB", "heat absorbing surface of PCB and heat pipe", and "heat pipe and heat dissipation part".

For reference, the heat pipe is generally composed of a closed vessel in the form of a pipe, an evaporator, a condenser, and a wick (capillary structure for returning the working fluid in the condensate to the evaporator). Sealed after the injection of the fluid, the working fluid filled in the pipe is a technology to cool the surrounding objects in the process of repeated evaporation and condensation.

These heat pipes have a wick-free thermal siphon (THERMOSYPHON), a groove wick type grooved inside the heat pipe, and a metal mesh (SCREEN MESH), depending on the structure of the wick, which directly affects the performance and price of the heat pipe. ) Can be divided into 4 types: screen wick type using sinter and sintered powder wick type which can be used regardless of gravity direction.

An object of the present invention is to solve the above-described problems, in particular, the cooling means is formed inside the heat pipe, and the LED and the PCB integrally configured by the module, the heat generated from the LED is the heat radiation fin of the cooling means It is to provide a "LED lighting module" that can be efficiently released heat generated by the LED by having only one thermal contact step to be transmitted to.

That is, a heat dissipation hole is formed in a portion where the heat dissipation surface of the LED contacts the PCB on which the LED is mounted, and a heat pipe is formed by forming an internal space in the form of a pipe in the cooling means body in which the heat dissipation fin is formed. By integrally protruding the LED contact portion inserted into the hole of the PCB in the lower heat absorbing portion, the heat dissipation surface of the LED is in direct contact with the LED contact portion of the cooling means (heat contact in step 1) to release heat.

In order to achieve the above object, the present invention "LED lighting module",

A PCB having one or more LEDs mounted thereon and having a heat dissipation hole for LED heat dissipation at a position where the heat dissipation surface of the LED contacts;

One or more LEDs mounted to the PCB;

A connection terminal mounted on the PCB and making an electrical connection with the LED; And,

Cooling means formed with a heat dissipation fin on the outside, forming a pipe-shaped space therein to form a heat pipe, and at least one LED contact portion protruding into the hole of the PCB to directly contact the heat dissipation surface of the LED It is characterized in that the technical configuration is configured integrally, including;

The cooling means,

One or more heat dissipation fins formed integrally with the outside of the pillar-shaped body;

An inner space formed in a pipe shape in the body;

At least one LED contact part formed to protrude integrally with the same thickness as the PCB thickness below the body to directly contact the heat dissipation surface of the LED through the heat dissipation hole of the PCB;

A sealing cover mounted on an upper end of the inner space to seal the inner space and having a discharge hole configured to discharge air at one side thereof;

A stopper for blocking the discharge hole formed in the sealing cover;

Injecting a working fluid into the interior space, and discharges the air in the interior space through the discharge hole to a low pressure and then sealed, heat absorbed from the LED through the LED contact portion to radiate heat through the heat radiation fins do.

The cooling means forms a heat dissipation fin on the outside of the body, a heat pipe (thermal siphon) in the inside, and an LED contact portion that directly contacts the heat dissipation surface of the LED through the heat dissipation hole of the PCB at the bottom of the body, thereby forming the LED and the heat dissipation fin. Characterized in that the heat contact step between the step 1 to increase the heat dissipation efficiency.

The cooling means is configured to form a wick along the inner wall of the inner space.

The structure of the wick is a metal mesh (SCREEN MESH), metal powder sintered (SINTERED METAL), groove (GROOVE), pipe (ARTERY), flat plate (SLAB), composite wick (COMPOSITE WICK), single groove (MONO-GROOVE) It is characterized by consisting of either.

The cooling means is characterized by configuring the heat pipe by configuring the wick inside the body.

As the working fluid injected into the inner space, it is preferable to use a known working fluid such as distilled water, methanol, acetone, and the like.

The lower portion of the cooling means is characterized in that the heat dissipation fins are not formed outside the body or the lower portion is thinner than the upper portion to form an air inflow path through which air is introduced.

The air inlet is to increase the heat radiation efficiency by freeing the air inlet from the cooling means.

This cooling means is to improve the heat dissipation efficiency by forming an air inlet path in the lower portion of the cooling means when the LED lighting module according to the present invention is mounted (see Fig. 7).

The cooling means, characterized in that further comprises a; closing cover fitted into the inner space of the upper portion of the sealing cover.

This closing cover is to protect the sealing cover and the stopper and to enhance the aesthetic appearance.

The pipe-shaped inner space formed in the body of the cooling means is characterized in that the heat pipe is formed in two or more of the respective inner spaces.

The cooling means forms a plurality of internal spaces in one body, and then constitutes a heat pipe in each of the internal spaces, and mounts the LEDs to correspond to each of the heat pipes (internal spaces) one by one to heat heat generated from the LEDs. It is to radiate heat effectively.

The present invention "LED lighting module", in particular, the heat pipe is configured inside, the cooling means and the LED and the PCB and the heat dissipation fin is integrally configured to form a module, but the heat generated in the LED is heat in one step By constructing the contact step to be transferred to the heat sink fin of the cooling means, firstly, the heat generated from the LED can be efficiently discharged, and second, the light efficiency and lifespan of the LED are long due to stable heat dissipation. In addition, there is an effect of reducing the size of the cooling means, and fourth, there is an effect that the design and manufacturing of the LED lighting device is easy by modularizing the LED lighting.

When the technical idea of the present invention "LED lighting module" will be described in detail with reference to the embodiment as follows.

In the description, the same or similar names and symbols are used for components having the same or similar components and functions.

This embodiment will be described as an example of forming a heat pipe by forming an inner space of a pipe shape inside the cylindrical body made of aluminum, and configured a heat radiation fin on the outside of the body.

In addition, in the present embodiment, an internal space and a heat pipe are formed inside the cooling means, and one LED contact portion is formed below the cooling means to radiate one LED.

In addition, in the present embodiment, the lower portion of the cooling means will be described as an example in which the heat dissipation fin is not formed for air inflow.

In this embodiment, an example in which no wick is configured will be described.

The reason why the present embodiment is configured as described above is that other embodiments according to the spirit of the present invention can be easily understood from the present embodiment.

Hereinafter, the configuration of the present embodiment will be described in detail with reference to the accompanying drawings.

First, as shown in FIGS. 1 and 4, a plurality of heat dissipation fins 111 are integrally formed with the body 112 on the outside of the cylindrical aluminum body 112, and a predetermined portion of the lower portion of the body 112 is located at the bottom. It forms only up to, and forms the inner space 118 of the pipe shape inside the body 112, the lower portion 114 of the body 112 has the same thickness as the thickness (d) of the PCB 120, LED ( The LED contact portion 115 having an area equal to the size of the heat dissipation surface 141 of the 140 is formed by protruding.

That is, a protrusion (LED contact portion) having a predetermined size is formed on the lower portion 114 through extrusion or die casting, etc., and a heat dissipation fin 111 is formed on the outside, and has an inner space 118 in the form of a pipe. .

Thereafter, a working fluid (for example, distilled water) is placed in the inner space 118, and the upper end of the inner space 118 is sealed with a sealing cover 116, and then the discharge hole 116a formed in the sealing cover 116 is closed. By discharging the air in the internal space 118 through it to be a low pressure (for example, 0.1 atm).

In addition, after sealing the discharge hole (116a) by using the stopper 117 to cover the closing cover 113 to configure the cooling means (110).

The PCB 120 is configured by forming a heat dissipation hole 121 having the same size as the heat dissipation surface 141 at a position where the heat dissipation surface 141 of the LED 140 contacts.

After mounting the LED 140 on the PCB 120 so that the heat dissipation surface 141 is located in the heat dissipation hole 121, the connection terminal 130 which makes an electrical connection with the LED 140 is mounted.

Thereafter, the LED contact portion 115 of the cooling means 110 is inserted into the heat dissipation hole 121 to fix the PCB 120 so that the heat dissipation surface 141 of the LED 120 and the LED contact portion 115 come into close contact with each other. The LED heat dissipation module 100 according to the present embodiment is configured.

At this time, it is preferable to apply thermal grease between the heat dissipation surface 141 and the LED contact portion 115.

The PCB 120 and the cooling means 110 are fixed by fastening the screw 122 to the screw hole 113 as shown in FIG.

In FIG. 5, four screw holes on the outer surface of the PCB 120 are screw holes used to fix the LED heat dissipation module elsewhere, and the four screw holes inside the PCB 120 are connected to the cooling means 110. FIG. It is a screw hole used for fixing (the screw hole formed in the cooling means is not shown).

Hereinafter, the operation and the effect of the present embodiment configured as described above with reference to the accompanying drawings as follows.

First, when power is applied through the connection terminal 130, power is applied to the LED 140 making an electrical connection with the connection terminal 130, the LED 140 emits light.

When the LED 140 emits heat, heat is generated, and the generated heat is transferred to the LED contact unit 115 through the heat dissipation surface 141 of the LED 140.

Then, the temperature of the LED contact portion 115 rises, the temperature rises above a certain temperature, when the temperature of the working fluid injected into the internal space 118 rises above a certain temperature, the working fluid is evaporated.

When distilled water is used as the working fluid, and the atmospheric pressure of the internal space 118 is 0.1 atm, evaporation is performed at about 60 degrees Celsius.

On the other hand, the evaporated working fluid is in contact with the body 112 in which the heat dissipation fins 111 are integrally discharged and condensed.

The working fluid returned to the liquid phase returns to the LED contact portion 115 (heat absorbing portion) by gravity, and repeats the above process to release heat.

At this time, the thermal contact step between the LED 140 and the heat dissipation fin 111 has only one step of the thermal contact step consisting of the "heat dissipation surface and the LED contact portion of the LED" so as to radiate heat by transferring heat with a minimum thermal resistance. Therefore, the heat radiation efficiency is increased.

The process is described in detail again as follows.

As described above, the feature of the present invention is that the thermal contacting step of the LED 140 and the cooling means 110 is one step.

That is, as shown in Figure 4, by forming a heat dissipation hole 121 in the PCB 120 to mount the LED 140 to position the heat dissipation surface 141 of the LED 140 in the heat dissipation hole 121 and The LED contact part having the same thickness as the thickness d of the PCB 120 on the lower part 114 of the body 112 of the cooling means 110 and inserted into the heat dissipation hole 121 to contact the heat dissipation surface 141. After the 115 is formed, the LED contact portion 115 is inserted into the heat dissipation hole 121 and fixed to be in close contact with the heat dissipation surface 141. The thermal contact step between the LED 140 and the cooling means 110 is 1. The stage is finished.

In other words, the LED contact portion 115 and the body 112, and the heat dissipation fins 111 are formed integrally, there is no other thermal contact step, and by providing an internal space 118 inside the body to form a heat pipe, The heat contacting step until the heat generated from the LED 140 reaches the heat dissipation fins 111 is completed in one step.

Then, when the LED 140 emits light, heat generated in the LED 140 is directly transmitted to the working fluid through the LED contact unit 115, and when the temperature of the working fluid rises, the working fluid evaporates. Heat dissipation is performed by the operating principle of the heat pipe of overcondensation.

At this time, since only one heat contact step until the heat generated from the LED 140 is discharged through the heat radiation fins 111 is minimized, the heat resistance is minimized to increase the heat radiation efficiency.

In addition, since the heat of the LED 140 is rapidly released and the temperature of the LED is stabilized, the light efficiency is increased, the life is long, and the size of the cooling means can be reduced.

Since the operation principle of the heat pipe is well known, its detailed description is omitted.

7 is a perspective view showing a plurality of LED lighting module mounted using the connecting plate 150, as shown in the drawing does not form a heat radiation fin in the lower portion of the cooling means due to the air inflow is made smooth cooling efficiency It is shown to rise.

This will be described as follows.

As is well known, if heat is radiated from the top, air rises from the bottom to fill the insufficient air.

Therefore, as shown in FIG. 7, when the air inflow path is formed in the lower portion of the cooling means, natural air flow is maintained to increase the heat radiation efficiency.

Arrows in FIG. 7 represent air flow.

As described above, this embodiment minimizes the thermal contact step until the heat emitted from the LED reaches the heat dissipation fin in one step, thereby increasing the heat dissipation efficiency and light efficiency of the LED, extending the lifespan, and reducing the size of the cooling means. It is a very useful invention that is easy to manufacture and design because the LED, PCB and cooling means are integrated in the form of a module (just install the number of LED lighting modules according to the present invention according to the amount of light desired when designing a lighting device).

However, in the above embodiment, the cooling means is a cylindrical shape, and the material was described as an example of aluminum, but the technical spirit of the present invention is not limited thereto.

That is, it can be manufactured in the form of a square pillar or other shape, as well as the material can be configured using other materials with high thermal conductivity including copper.

In addition, in the above embodiment was described as an example in which one LED contact unit is configured to mount one LED under the cooling means, but the technical idea of the present invention is not limited thereto.

That is, it turns out that a plurality of LED contacts can be formed to mount a plurality of LEDs.

In addition, in the above embodiment, the heat pipe is formed by forming one internal space inside the body as an example, but the technical spirit of the present invention is not limited thereto.

That is, as shown in Figure 6a (plan view) and Figure 6b (c-c 'cross-sectional view), after forming a plurality of internal spaces inside the body, it was found that the heat pipe can be configured in each of the internal spaces Put it.

In addition, in the above embodiment, the heat pipe using the internal space has been described as an example of configuring a thermal siphon having no wick on the inner space side, but the technical spirit of the present invention is not limited thereto.

That is, it turns out that the heat pipe can be configured by forming a wick on the inner space side.

In addition, in the above embodiment, the distilled water was used as the working fluid as an example, but the technical spirit of the present invention is not limited thereto.

In other words, methanol, acetone, distilled water, mercury, He, N2, CHClF2, NH3, CCl2F2, CClF2-CClF2, CCl3F, CCl2F-CClF2 can be configured using a known working fluid.

In addition, in the above embodiment, the binding of the PCB and the cooling means has been described by using the screw and the screw hole as an example, but the technical spirit of the present invention is not limited thereto.

1 is a perspective view showing the configuration of the present invention "LED lighting module";

2 is a perspective view showing the configuration of the present invention;

3 is a cross-sectional view taken along line a-a 'of FIG. 2;

4 is a schematic cross-sectional view of the line b-b 'of FIG. 1;

5 is a schematic perspective view showing the configuration of a PCB according to the present invention;

6 is a view showing another configuration of the "LED lighting module" of the present invention,

Figure 6a is a plan view,

6B is a cross-sectional view taken along line c-c 'of FIG. 6A;

7 is a perspective view showing a plurality of the "LED lighting module" of the present invention.

Explanation of symbols on the main parts of the drawings

100: LED lighting module 110: cooling means

111: heat radiation fin 112: body

113: closing cover 114: lower

115: LED contact portion 116: sealing cover

116a: discharge hole 117: stopper

118: Interior 119: Wick

120: PCB 121: heat sink

122: screw 113: screw hole

130: connection terminal 140: LED

141: heat dissipation surface 142: electrode

143: light emitting unit 150: connecting plate

Claims

One or more LEDs mounted to the PCB;

Cooling means formed with a heat dissipation fin on the outside, forming a pipe-shaped space therein to form a heat pipe, and at least one LED contact portion protruding into the hole of the PCB to directly contact the heat dissipation surface of the LED LED lighting module characterized in that it is integrally configured to include.

The method of claim 1, wherein the cooling means,

An inner space formed in a pipe shape in the body;

A stopper for blocking the discharge hole formed in the sealing cover;

Injecting a working fluid into the inner space, and discharges the air in the inner space through the discharge hole to a low pressure and then sealed, heat absorbed from the LED through the LED contact portion to radiate heat through the heat radiation fins LED lighting module.

The LED lighting module according to claim 1, wherein the cooling means forms a wick along an inner wall of the inner space.

The LED lighting module according to claim 1, wherein the lower portion of the cooling means does not form a heat radiation fin on the outside of the body, or the lower portion is thinner than the upper portion to form an air inflow path through which air is introduced.

The LED lighting module of claim 2, wherein the cooling means further comprises a closing cover fitted into an inner space above the sealing cover.

The LED lighting module according to claim 1, wherein the pipe-shaped inner space formed on the body of the cooling means is formed of two or more pipes to form heat pipes in the respective inner spaces.