KR20110066247A - Coater apparatus - Google Patents

Coater apparatus Download PDF

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Publication number
KR20110066247A
KR20110066247A KR1020090122808A KR20090122808A KR20110066247A KR 20110066247 A KR20110066247 A KR 20110066247A KR 1020090122808 A KR1020090122808 A KR 1020090122808A KR 20090122808 A KR20090122808 A KR 20090122808A KR 20110066247 A KR20110066247 A KR 20110066247A
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KR
South Korea
Prior art keywords
substrate
slit nozzle
nozzle
gap
slit
Prior art date
Application number
KR1020090122808A
Other languages
Korean (ko)
Inventor
최민석
Original Assignee
주식회사 케이씨텍
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Filing date
Publication date
Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020090122808A priority Critical patent/KR20110066247A/en
Publication of KR20110066247A publication Critical patent/KR20110066247A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
    • B05C5/004—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles the work consisting of separate rectangular flat articles, e.g. flat sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate coater device, comprising: a slit nozzle for applying a chemical liquid to a substrate from a discharge port elongated in a lateral direction; Two or more gap sensors provided to be spaced apart from each other in a horizontal direction of the nozzle to detect a distance from a discharge port of the nozzle to a stage positioned below the substrate; This measurement by measuring the gap between the stage, which is precisely maintained by the two or more gap sensors spaced apart from each other in the lateral direction of the slit nozzle, and maintains parallel to the substrate while the substrate is transported. Detecting the inclination angle of the slit nozzle in the transverse direction from the value, thereby correcting the inclination angle of the slit nozzle to the substrate so that the chemical liquid discharged from the discharge port of the slit nozzle is applied to a constant thickness along the transverse direction of the substrate Provides a coater device.

Description

Board Coater Device {COATER APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate coater device, and more particularly, to the surface of a substrate by precisely controlling the gap between the slit nozzle and the substrate to be processed in the step of applying the chemical liquid to the substrate to be processed from the slit nozzle. It relates to a substrate coater device for applying a chemical of a certain thickness.

In the process of manufacturing flat panel displays, such as LCD, the coating process of apply | coating chemical liquids, such as a resist liquid, to the surface of the to-be-processed substrate made from glass etc. is accompanied. Conventionally, when the size of the LCD was small, a spin coating method was used in which the chemical was applied to the surface of the substrate by rotating the substrate while applying the chemical to the center of the substrate.

However, as the size of the LCD screen becomes larger, the spin coating method is scarcely used, and a slit-shaped slit nozzle having a length corresponding to the width of the substrate to be processed and a slit nozzle A coating method of coating the surface of the substrate is used.

1 is a diagram showing the configuration of a conventional substrate coater equipment (1). As shown in the figure, the substrate G located on the stage 10 moves relative to the slit nozzle 20 located above the substrate G, and is applied to the chemical liquid discharged from the discharge port of the slit nozzle 20. The surface of the substrate G is thereby coated with the chemical liquid.

At this time, the gantry 30 fixing the slit nozzle 20 moves in the length direction of the substrate G and moves to the reference numeral 20d to adjust the gap with the substrate G, thereby adjusting the slit nozzle 20. Relative movement between the substrate G and the substrate G may be performed, and the stage 10 fixes the substrate G to move the slit nozzle 20 through the lower portion, or the substrate G floats on the stage 10. The relative movement of the slit nozzle 20 and the substrate G may be achieved by moving the substrate G through the lower portion of the nozzle 20 by a separate moving member.

At this time, the chemical liquid PR discharged from the slit nozzle 20 should be applied to the surface of the substrate G to a predetermined thickness, but at the time of applying the chemical liquid to the substrate G from the slit nozzle G, the substrate ( If the gap between G) and the slit nozzle 20 is not maintained, the variation occurs in the thickness of the chemical liquid PR applied to the surface of the substrate G. Therefore, the gap between the substrate G and the slit nozzle 20 should not only be constant in the gap along the relative movement direction (length direction) of the substrate G and the slit nozzle 20, but also the transverse of the substrate G. The clearance along the direction must also be constant.

Moreover, in recent years, as the image display apparatus has been enlarged, the size of the substrate to which the chemical liquid is applied has increased in size, and when the slit nozzle 20 cannot maintain a constant gap with the substrate G in the lateral direction, the substrate G is used. The problem that the thickness of the chemical liquid coating in the transverse direction becomes uneven becomes more serious.

However, as shown in Fig. 3, when the slit nozzle 20 is twisted by a minute angle indicated by the reference α in the lateral direction of the substrate G, the discharge hole 21 of the substrate G and the slit nozzle 20 The gaps d1 and d3 therebetween are not constant and are inclined, so that the chemical liquid PR applied to the surface of the substrate G is not evenly applied to the surface of the substrate G with a constant thickness. do.

In spite of this, conventionally, only keeping the gap between the slit nozzle 20 and the substrate G constant keeps the gap along the relative movement direction of the substrate G and the slit nozzle 20 constant. Recognizing, no means have been introduced into the substrate coater apparatus at all, in which the chemical liquid PR is not uniformly applied along the transverse direction of the substrate G.

In order to solve the problems described above, the present invention provides a surface of a substrate by precisely controlling the gap in the lateral direction between the slit nozzle and the substrate to be processed in the step of applying the chemical liquid from the slit nozzle to the substrate. It is an object of the present invention to provide a substrate coater apparatus for applying a chemical liquid having a constant thickness.

In order to achieve the above object, the present invention provides a substrate coater device for applying a chemical liquid to a surface of a substrate, comprising: a slit nozzle for applying the chemical liquid to a substrate from a discharge port formed in a lateral direction; Two or more measurement sensors spaced apart from each other in the transverse direction of the nozzle to detect a distance from a discharge port of the nozzle to a stage positioned below the substrate; It provides a substrate coater device comprising a. At this time, it is effective that the measurement sensor is a contactless gap sensor. Through this, it is possible to accurately grasp the position of deflection of the slit nozzle 120 and the like, and the inclination angle α of the slit nozzle 120 and By allowing the amount of deflection to be immediately corrected, defects in the slit nozzle and installation errors can be found in real time, thereby minimizing the defects in the substrate application process.

This is achieved by measuring the gap between the stage, which is precisely maintained by two or more gap sensors spaced apart from each other in the lateral direction of the slit nozzle, and which is kept parallel to the substrate while the substrate is being transported. This is for detecting the inclination angle of the nozzle in the transverse direction. Through this, the slit nozzle of the substrate coater device can accurately detect the inclination angle, thereby correcting the inclination angle of the slit nozzle.

At this time, the gap sensor is located at both ends in the lateral direction of the nozzles farthest away from each other, it is possible to more accurately measure the inclination angle of the slit nozzle even if measured by two gap sensors.

On the other hand, the gap sensor may be used for measuring the distance between the discharge hole of the substrate and the slit nozzle in the process of applying the chemical to the surface of the substrate. That is, the gap sensor is used to measure the angle of inclination of the slit nozzle in the transverse direction in the setting step before the slit nozzle applies the chemical liquid. It is used to measure the gap between the outlets.

Based on the inclination angle of the slit nozzle measured by the gap sensor as described above to adjust the slit nozzle to the horizontal state based on the value measured by the gap sensor so that the outlet of the slit nozzle is parallel to the surface of the stage. It further comprises a nozzle posture correction means.

At this time, the nozzle posture correcting means, the female screw formed on one side of the slit nozzle; An adjustment screw rod extending from one side of the slit nozzle; A drive motor for rotating the adjustment screw rod; Including, one side of the slit nozzle moves up and down in accordance with the rotation of the drive motor to adjust the horizontal state of the slit nozzle.

The nozzle posture correcting means further includes means for moving one end of the slit nozzle up and down. That is, both ends of the slit nozzle may be configured to move up and down, and one end of the slit nozzle may be configured to be rotatable and the other end to move up and down.

On the other hand, according to another field of the present invention, the present invention provides a method for adjusting the attitude of a slit nozzle of a substrate coater apparatus for applying a chemical liquid to the surface of a substrate by a slit coater having a discharge port formed in the transverse direction. A gap measuring step of measuring a distance to a stage positioned below the substrate, respectively; A slit nozzle posture adjusting step of adjusting the slit coater horizontally with the stage by moving at least one side of the slit coater up and down when the measured value exceeds a predetermined range; It provides a method for adjusting the attitude of the slit nozzle of the substrate coater apparatus, including.

At this time, the slit nozzle posture adjusting step is performed before applying the chemical liquid to the substrate, so that the substrate and the slit nozzle are arranged in parallel so that the chemical liquid is applied to the substrate from a discharge port of the slit nozzle to a certain thickness.

The gap measuring step may be a variety of sensors for measuring the distance of the two objects, but by a gap sensor fixed to both ends in the transverse direction to calculate the angle of inclination (α) of the slit nozzle more accurately Is done.

In addition, the gap measuring step may be performed by a gap sensor distributed in a plurality along the transverse direction of the slit nozzle to detect the amount of deflection of the slit nozzle.

At this time, the gap sensor may measure the inclination angle of the discharge port of the slit nozzle before applying the chemical to the substrate, but the gap between the substrate and the discharge port of the slit nozzle during the process of applying the chemical to the substrate. Measure By this, the gap sensor monitors whether the gap between the substrate and the discharge port of the slit nozzle is kept constant during the substrate application process.

As described above, the present invention provides a substrate coater apparatus for applying a chemical liquid to a surface of a substrate, comprising: a slit nozzle for applying the chemical liquid to a substrate from a discharge port formed long in the lateral direction; Two or more gap sensors provided to be spaced apart from each other in a horizontal direction of the nozzle to detect a distance from a discharge port of the nozzle to a stage positioned below the substrate; This measurement by measuring the gap between the stage, which is precisely maintained by the two or more gap sensors spaced apart from each other in the lateral direction of the slit nozzle, and maintains parallel to the substrate while the substrate is transported. Detecting the inclination angle of the slit nozzle in the transverse direction from the value, thereby correcting the inclination angle of the slit nozzle to the substrate so that the chemical liquid discharged from the discharge port of the slit nozzle is applied to a constant thickness along the transverse direction of the substrate Provides a coater device.

Through this, the present invention obtains the advantageous effect of uniformly adjusting the application state of the chemical liquid in the transverse direction of the substrate to be processed.

In addition, the present invention is able to accurately calculate the angle of inclination of the slit nozzle in the lateral direction, the amount of deflection, it is possible to accurately determine the location of the deflection, and to correct it immediately, so that the slit nozzle defective and installation error The advantage is found in real time to minimize defects in the substrate application process.

Hereinafter, the substrate coater apparatus 100 according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention.

4 is a front partial cross-sectional view showing a slit nozzle and a substrate configuration of a substrate coater device according to an embodiment of the present invention, FIG. 5 is an enlarged view of portion 'A' of FIG. 4, FIG. 6 is a side view of FIG. 7A to 7B are views showing the posture correcting configuration of the slit nozzle of the substrate coater apparatus of FIG. 4, and FIG. 8 is a flowchart showing the posture correcting procedure of the slit nozzle of the substrate coater apparatus of FIG.

As shown in the drawing, the substrate coater apparatus 100 according to the exemplary embodiment of the present invention includes a stage 110 supporting the substrate G and a substrate G disposed on the stage 110. The slit-shaped slit nozzle 120, which is a chemical liquid supply means for injecting the chemical liquid onto the surface of the substrate G while being relatively moved relative to the discharge port 121 of the slit nozzle 120, is spaced apart from each other in the lateral direction. Gap sensors 131, 132, 133, and 130 for measuring the gap between the substrate and the longitudinal direction (the direction indicated by 10d in FIG. 1) of the substrate coater apparatus 100 and the up and down direction (FIG. And a nozzle posture correcting means 150 for adjusting the posture of the slit nozzle 120.

The stage 110 may be configured as a chuck for transporting the substrate G in an adsorbed state, or may be configured as a floating stage for lifting and transporting the substrate G from the surface. However, no matter what form the stage 110 is, the substrate G is transferred in parallel with the stage 110.

The slit nozzle 120 receives a chemical liquid such as a photoresist liquid from a chemical liquid supply container and applies the chemical liquid to the surface of the substrate G through a discharge port 121 to a predetermined thickness.

In the gap sensor 130, a plurality of gap sensors are installed at the same height S from the discharge holes 121 along the lateral direction of the slit nozzle 120 to measure the distance X to the stage 110. That is, the first gap sensor 131 and the second gap sensor 132 are arranged at both ends of the slit nozzle 120 in the lateral direction, respectively, to measure the gaps X1 and X2 between the stages 110 and the slits. It detects whether the nozzle 120 is positioned at a posture of an angle α inclined in the lateral direction. In addition, the third gap sensor 133 is also arranged in the center portion of the slit nozzle 120 in the horizontal direction, so that the slit nozzle 120 together with the measured value of the first gap sensor 131 or the second gap sensor 132. By calculating the inclination angle α of the slit nozzle 120 compared with the inclination angle α of the slit nozzle 120 measured by the first gap sensor 131 and the second gap sensor 132 ( To calculate the inclination angle α of 120.

In addition, the gap X3 measured by the third gap sensor 133 may be used to accurately calculate the amount of deflection of the slit nozzle 120. Through this, it is possible to accurately determine the position of deflection of the slit nozzle 120, and to immediately correct the inclination angle α and the amount of deflection of the slit nozzle 120, thereby real-time defects and installation errors of the slit nozzle It can be found by minimizing the defect of the substrate coating process. To this end, although the third gap sensor 133 has been made of one in the figure, a plurality of gaps between the first gap sensor 131 and the third gap sensor 133 located at both ends of the slit nozzle 120. A plurality of third gap sensors 133 may be installed to be distributed.

As described above, the gap sensors 131 to 133 and 130 detect whether or not the attitude of the slit nozzle 120 is inclined before applying the chemical liquid to the surface of the substrate G. In the process of applying the chemical to the surface, the gap between the substrate G and the discharge port 121 of the slit nozzle 120 is monitored to ensure that the chemical is applied to the substrate G with a constant thickness.

The gantry 140 serves to move the slit nozzle 120 in the up and down directions in the fixed state of the slit nozzle 120. However, as the gantry 140 of the substrate coater device 100 according to the exemplary embodiment of the present invention is fixed to one end of the slit nozzle 120 by the hinge 123, the other end portion of the slit nozzle 120 is fixed. When the inclination angle α exceeds the allowable value of the slit nozzle 120 by adjusting the height, the other end of the slit nozzle 120 is moved up and down to rotate the slit nozzle 120 in the direction indicated by reference numeral 120r. Thereby assisting the slit nozzle 120 to be positioned in a position parallel to the stage 110.

As shown in FIGS. 4 and 5, the nozzle posture correcting unit 150 includes a vertical movement block 151 in which a block having a female screw portion penetrated is fixed to the other end of the slit nozzle 120, and the female screw portion and The adjustment screw rod 152 installed to engage and penetrate, the drive motor 153 fixed to the gantry 140 to drive the adjustment screw rod 152 to rotate, and the end of the adjustment screw rod 152 to be rotatable. It consists of a bearing 154 installed in the gantry 140 to support.

The nozzle posture correcting means 150 configured as described above has the control screw rod rotating in the forward and reverse directions 152d at the position as the drive motor 153 drives the adjustment screw rod 152 to rotate in the forward and backward directions 152d. The vertical movement block 151 engaged with the 152 is moved up and down, and the other end of the slit nozzle 120 is rotated in the direction indicated by 120r around the rotation center where the hinge 123 is installed, so that the slit nozzle 120 It is possible to correct the inclination angle α of).

Hereinafter, the operation of the substrate coater device 100 according to the embodiment of the present invention configured as described above will be described in detail.

Step 1 : As shown in Fig. 7A, at the same height of the slit nozzle 120 before starting the process of ejecting and applying the chemical liquid from the slit nozzle 120 to the surface of the processing target substrate (G) to be supplied. The fixed gap sensors 131-133 measure the gaps X1, X2, and X3 from the discharge port 121 to the surface of the stage 110 precisely installed in an absolute horizontal plane (S110).

At this time, since the gap sensors 131-133 are all installed at positions spaced apart by the same height S from the discharge holes 121 of the slit nozzle 120, the values measured by the gap sensors 131-133 are measured. It is regarded as the gaps X1, X2, and X3 from the discharge port 121 of the slit nozzle 120 to the surface of the stage 110.

Step 2 : If the gaps X1, X2, and X3 from the discharge port 121 of the slit nozzle 120 measured by the gap sensors 131 to 133 to the surface of the stage 110 are out of a predetermined allowable range, Since the slit nozzle 120 implies that the angle α inclined with respect to the surface of the stage 110 is out of the allowable range, the gap from the discharge port 121 of the slit nozzle 120 to the surface of the stage 110 ( The drive motor 153 is driven until X1, X2, X3 is within a predetermined allowable range, and the slit nozzle 120 is rotated in the direction indicated by reference numeral 120r to adjust the attitude of the slit nozzle 120. (S120).

On the other hand, the third gap sensor 133 measures the gap X3 of the central portion of the slit nozzle 120. Accordingly, it is not only possible to confirm whether the inclination angle α of the slit nozzle 120 measured by the first gap sensor 131 and the second gap sensor 132 is calculated correctly, as well as the slit nozzle 120. The exact numerical value of the local deflection of) can be calculated.

This allows the slit nozzle 120 to be calibrated in parallel with respect to the surface of the stage that remains parallel to the substrate G while the substrate G is transferred before the coating process of the substrate G is performed. When the deflection amount of the slit nozzle 120 is out of the allowable value, the defective slit nozzle 120 being used is replaced with a new slit nozzle 120 to detect whether the slit nozzle is badly installed or the bad slit nozzle is installed in real time. As it can be immediately taken action, it is possible to prevent the chemical liquid from being applied unevenly to the substrate in the transverse direction, thereby minimizing the defect of the substrate application process.

Step 3 : After the posture correcting step of the slit nozzle 120 is completed through Step 2, as shown in FIG. 7B, the surface of the substrate G is made while performing relative movement of the substrate G and the slit nozzle 120. When the process of applying the chemical to the start, the gap sensor (131-133; 130) fixed to the slit nozzle 120 is a gap (X1 ', between the discharge port 121 of the slit nozzle 120 from the substrate G), X2 ', X3') is continuously measured to monitor whether the gap between the slit nozzle 120 and the substrate G is outside the allowable range along the transverse direction (S130).

And while the chemical | medical solution is apply | coated to the surface of the to-be-processed substrate G, the clearance gap X1 ', X2', X3 'between the to-be-processed substrate G and the discharge port 121 of the slit nozzle 120 may set the tolerance range. In case of deviation, the substrate application process is stopped or the posture of the slit nozzle 120 thereafter is corrected to a more strict standard.

This monitors whether the gap between the processing target substrate G and the discharge port 121 of the slit nozzle 120 is kept constant even while the chemical liquid is applied to the surface of the processing target substrate G, so that the slit nozzle 120 The inclined angle α of the transverse direction is maintained within the allowable range, and the chemical liquid can be more reliably applied to the surface of the substrate G at a constant thickness.

Here, the substrate G is moved relative to the slit nozzle 120 while the substrate G is attached to the stage 110, or the substrate G is attached to the slit nozzle 120 while the substrate G is attached to the floating stage 110 ′. The gap sensor 130 continuously monitors the gaps X1 ', X2', and X3 'between the slit nozzle 120 and the substrate G even during the substrate coating process. While the inclination angle α of the transverse direction of 120 is maintained within the allowable range, the effect of applying the chemical liquid to the surface of the substrate G at a predetermined thickness more reliably may be realized in the same manner.

In the above, the preferred embodiments of the present invention have been described by way of example, but the scope of the present invention is not limited to these specific embodiments, and may be appropriately changed within the scope described in the claims.

1 is a perspective view showing the configuration of a conventional substrate coater apparatus

Figure 2 is a side view of Figure 1

3 is a view showing an inclined state of the slit nozzle of FIG.

Figure 4 is a front partial cross-sectional view showing the configuration of the slit nozzle and the substrate of the substrate coater apparatus according to an embodiment of the present invention

5 is an enlarged view of portion 'A' of FIG.

Figure 6 is a side view of Figure 4

7A to 7B show a posture correcting configuration of the slit nozzle of the substrate coater device of FIG.

FIG. 8 is a flowchart showing a posture correcting procedure of the slit nozzle of the substrate coater apparatus of FIG.

** Description of symbols for the main parts of the drawing **

100: substrate coater device 110: stage

120: slit nozzle 121: discharge port

123: hinge 130: gap sensor

140: gantry 150: nozzle posture correction means

151: vertical movement block 152: adjustment screw rod

153: drive motor G: substrate to be processed

X1, X2, X3: gap

Claims (13)

As a substrate coater apparatus which applies chemical | medical solution to the surface of a board | substrate A slit nozzle for applying a chemical to a substrate from a discharge port formed along the transverse direction; Two or more measurement sensors spaced apart from each other in the transverse direction of the nozzle to detect a distance from a discharge port of the nozzle to a stage positioned below the substrate; Substrate coater device, characterized in that configured to include. The method of claim 1, And said measuring sensor is a non-contact gap sensor. 3. The method of claim 2, And the gap sensor is positioned at both ends of the nozzle in the transverse direction. The method of claim 3, And at least one gap sensor is positioned at a central portion of the nozzle. 3. The method of claim 2, The gap sensor is a substrate coater device, characterized in that for measuring the gap between the discharge port of the substrate and the slit nozzle in the process of applying the chemical to the surface of the substrate. The method according to any one of claims 2 to 5, Nozzle posture correcting means for adjusting the slit nozzle to be in a horizontal state based on the value measured by the gap sensor; Substrate coater device, characterized in that it further comprises. The method of claim 6, wherein the nozzle posture correcting means A female screw portion formed at one side of the slit nozzle; An adjustment screw rod extending from one side of the slit nozzle; A drive motor for rotating the adjustment screw rod; Including, one side of the slit nozzle moves up and down in accordance with the rotation of the drive motor to correct the posture of the slit nozzle. The method of claim 6, And said nozzle posture correcting means further comprises means for moving one end of said slit nozzle up and down. A method of adjusting the attitude of a slit nozzle of a substrate coater device in which a chemical liquid is applied to a surface of a substrate by a slit coater having a discharge port formed to extend in a lateral direction. A gap measuring step of measuring a distance from a slit coater to a stage positioned below the substrate; A slit nozzle posture adjusting step of adjusting the slit coater horizontally with the stage by moving at least one side of the slit coater up and down when the measured value exceeds a predetermined range; A method of adjusting the attitude of the slit nozzle of the substrate coater device, characterized in that it comprises a. The method of claim 9, The slit nozzle posture adjusting step is a posture adjusting method of the slit nozzle of the substrate coater apparatus, characterized in that is performed before applying the chemical to the substrate. The method of claim 9, And the gap measuring step is performed by gap sensors located at both ends of the slit nozzle. The method of claim 9, And the gap measuring step is performed by a gap sensor distributed in a plurality along the lateral direction of the slit nozzle. The method according to any one of claims 9 to 12, And the gap sensor measures a gap between the substrate and a discharge port of the slit nozzle during the process of applying the chemical to the substrate.
KR1020090122808A 2009-12-11 2009-12-11 Coater apparatus KR20110066247A (en)

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KR1020090122808A KR20110066247A (en) 2009-12-11 2009-12-11 Coater apparatus

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210023428A (en) * 2019-08-23 2021-03-04 세메스 주식회사 Apparatus for dispensing droplet and apparatus for processing substrate having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210023428A (en) * 2019-08-23 2021-03-04 세메스 주식회사 Apparatus for dispensing droplet and apparatus for processing substrate having the same

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