KR20110041053A - Substrate processing apparatus, and method for separating substrate supporter assembly from processing module of substrate processing apparatus - Google Patents
Substrate processing apparatus, and method for separating substrate supporter assembly from processing module of substrate processing apparatus Download PDFInfo
- Publication number
- KR20110041053A KR20110041053A KR1020090098059A KR20090098059A KR20110041053A KR 20110041053 A KR20110041053 A KR 20110041053A KR 1020090098059 A KR1020090098059 A KR 1020090098059A KR 20090098059 A KR20090098059 A KR 20090098059A KR 20110041053 A KR20110041053 A KR 20110041053A
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- KR
- South Korea
- Prior art keywords
- moving part
- substrate
- support assembly
- substrate support
- transfer
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for performing a predetermined process for a substrate.
The present invention provides a transfer structure for forming a transfer path to which a transfer robot for transporting a substrate or a tray loaded with a plurality of substrates; And a plurality of process modules, each of which is provided on one side of the transfer structure to perform substrate processing in an isolated state from the outside, including a module body and a substrate support assembly detachably coupled downwardly from the module body. Disclosed is a substrate processing apparatus, characterized in that the substrate support assembly of each process module is separated from the module main body and installed so as to be movable to a transfer passage of the transfer structure.
Description
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for performing a predetermined process for a substrate.
A substrate processing apparatus is a device for performing a predetermined process for a substrate, comprising: a transfer structure for forming a transfer passage through which a transfer robot for transferring a substrate moves; Installed on one side of the transfer structure is configured to include a plurality of process modules for performing a substrate treatment in a closed processing space.
Substrates processed by the substrate processing apparatus include semiconductor wafers, glass panels for LCD panels, and solar cell substrates.
The substrate processing apparatus includes a vacuum processing apparatus that performs a vacuum treatment under a predetermined vacuum pressure. For example, after mounting a solar cell substrate on a substrate support, the substrate is covered with a cover member having a plurality of openings formed on the substrate. There is a vacuum treatment apparatus for performing a vacuum treatment to form fine irregularities on the surface of the.
Meanwhile, the process module includes a module main body and a substrate support assembly detachably coupled downward from the module main body.
In the conventional substrate processing apparatus, when the crane is installed at the time of maintenance, such as replacing or repairing the substrate support assembly of the process module, the module body (generally the upper lead) is separated from the substrate support assembly fixed by the crane and moved. If the crane is not installed, the substrate support assembly is separated from the fixed module body and moved to a space where work is easily performed.
In particular, when the crane is not installed, the conventional substrate processing apparatus, as shown in FIG. 1, separates a separation space capable of separating the
Therefore, the conventional substrate processing apparatus has a problem in that the installation space occupied by the entire apparatus is limited due to the existence of the separation space secured on one side of each process module.
An object of the present invention to solve the above problems, by using a transfer path to move the transfer robot for separation and movement of the substrate support assembly substrate processing apparatus unnecessary separation space to be installed on one side of each module process and The present invention provides a method for separating a substrate support assembly from a process module of a substrate processing device.
The present invention was created in order to achieve the object of the present invention as described above, the present invention is a transfer structure for forming a transfer path for moving the transfer robot for transporting a substrate or a tray loaded with a plurality of substrates; And a plurality of process modules, each of which is provided on one side of the transfer structure to perform substrate processing in an isolated state from the outside, including a module body and a substrate support assembly detachably coupled downwardly from the module body. Disclosed is a substrate processing apparatus, characterized in that the substrate support assembly of each process module is separated from the module main body and installed so as to be movable to a transfer passage of the transfer structure.
A first moving part installed to support the substrate support assembly and movably installed in the transfer passage from the module main body; The first moving part supporting the substrate support assembly may be configured to include a second moving part installed to support the first moving part when the first moving part is moved to the transfer path and movably installed along the transfer path.
The transfer path may be provided with a guide rail for guiding the movement of the transfer robot, and the second moving part may be installed to move along the guide rail.
The first moving part may further include an elevating part for elevating the substrate support assembly.
The elevating unit is a main elevating unit for elevating the substrate support assembly; Is installed on the upper or lower portion of the main lift portion may include a micro lift portion for fine lifting the substrate support assembly.
When the first moving part is moved to the transfer passage, a first auxiliary moving part may be additionally installed to connect the first moving part and the second moving part to guide the movement of the first moving part.
The first auxiliary moving part may be hinged with any one of the first moving part and the second moving part so as to be expanded when necessary to connect the first moving part and the second moving part.
When the first moving part is discharged to the outside of the transfer structure, the first moving part and the carrier which is movable from the outside of the transfer structure and the second moving part by connecting the second moving part to guide the movement of the first moving
The second auxiliary moving part may be hinged with any one of the carrier and the second moving part so as to be expanded when necessary to connect the carrier and the second moving part.
The transfer structure may further include a door communicating with the outside, and the substrate support assembly may be discharged to the outside through the door.
The door may be installed at one end or one side of the transfer passage based on the transfer passage.
The present invention also comprises a transfer structure for forming a transfer passage for moving the transfer robot for transporting a substrate or a tray loaded with a plurality of substrates; Substrate processing comprising a module body, a substrate support assembly detachably coupled downward from the module body and performing substrate processing in an isolated state from the outside, and including a plurality of process modules respectively installed on one side of the transfer structure. A method of separating a substrate support assembly of a process module of an apparatus, comprising: a separation step of separating the substrate support assembly downward from a module body of the process module; A moving step of moving the substrate support assembly separated from the module main body into a transfer passage of the transfer structure; Disclosed is a substrate support assembly separation method of a process module of a substrate processing apparatus, characterized in that it comprises a discharge step of discharging the substrate support assembly transferred to the transfer path through the door of the transfer structure installed to communicate with the outside. .
The substrate processing apparatus includes a first moving part installed to support a substrate support assembly and movably installed from the module main body to the transfer passage; And a second moving part installed to support the first moving part when the first moving part supporting the substrate support assembly is moved to the transfer path and movably installed along the transfer path. The first moving part may be discharged to the outside to discharge the substrate support assembly to the outside, or the second moving part may be discharged to the outside to discharge the substrate support assembly to the outside.
The substrate support assembly separation method of the substrate processing apparatus and the processing module of the substrate processing apparatus according to the present invention utilizes a transfer passage to which the transfer robot moves for separation and movement of the substrate support assembly. Since space is unnecessary, there is an advantage that the installation space of the device can be minimized by minimizing the space between each process module.
In particular, since the substrate processing apparatus is installed in a so-called clean room that maintains a clean state, minimizing the installation space of the apparatus reduces the overall equipment space for processing the substrate, thereby ultimately increasing the cost of semiconductor manufacturing, LCD panel manufacturing, and solar cell manufacturing. There is an advantage that can be saved.
Hereinafter, a substrate support assembly separation method of a substrate processing apparatus and a process module of the substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
Figure 2 is a plan view showing the configuration of a substrate processing apparatus according to the present invention, Figure 3 is a side cross-sectional view showing the configuration of a process module of the substrate processing apparatus of Figure 1, Figures 4a to 4c is a process of the substrate processing apparatus of FIG. Side cross-sectional views illustrating a process of separating and discharging the substrate support assembly from the module to the outside, and FIG. 5 is a plan view illustrating a structure of a substrate processing apparatus according to another embodiment of the present invention.
An embodiment of the present invention will be described by taking a vacuum processing apparatus for performing vacuum processing in a vacuum state, which is one of substrate processing apparatuses.
Vacuum processing apparatus according to an embodiment of the present invention, as shown in Figures 2 and 3, the
Here, each of the modules is preferably maintained in a clean state, and the other modules except the
In addition, a
The
The
The
The
Meanwhile, the
The
The
The
On the other hand, the
As an example of the module
The
The
The
The
For example, as shown in FIG. 3, the
The
Here, the lower electrode is grounded to the
The
In addition, the
The
At this time, the
In this case, the
At this time, the distance (D) between the
The
The
The
The
Meanwhile, the vacuum processing apparatus may be installed at one side of the
The buffer module is temporarily stored only in the
On the other hand, when the repair, replacement, etc. of the
Therefore, as shown in FIGS. 2 and 3, the
At this time, the
In this case, an
The first moving
In addition to the combination of the guide member and the wheel, the first moving
Meanwhile, the first moving
The
On the other hand, the
The
In addition, the
Meanwhile, the
The second moving
The second moving
Meanwhile, when the
At this time, the moving
As described above, the
At this time, the method of discharging to the outside of the
Meanwhile, the
In particular, the
Meanwhile, the
The
The
The
Therefore, the
Meanwhile, the first moving
Therefore, when the first moving
Any one of the first moving
In addition, when the first moving
The second auxiliary moving part 580 is expanded when necessary, and hinged to any one of the
The separation process of the substrate support assembly in the substrate processing apparatus having the above configuration will be described below with reference to FIGS. 4A to 4C.
Separation process of the
In the separation step, as shown in Figure 4a, after separating the fastening member by operating the
In the moving step, as shown in FIGS. 4A and 4B, the separated lifting
In the discharging step, as illustrated in FIGS. 4B and 4C, the substrate supporting assembly is moved along the
In this case, the
Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.
1 is a plan view showing a conventional substrate processing apparatus.
2 is a plan view showing the configuration of a substrate processing apparatus according to the present invention.
3 is a side cross-sectional view illustrating a configuration of a process module of the substrate processing apparatus of FIG. 1.
4A to 4C are side cross-sectional views illustrating a process of separating and discharging the substrate support assembly from the process module of the substrate processing apparatus of FIG. 2.
5 is a plan view showing the configuration of a substrate processing apparatus according to another embodiment of the present invention.
***** Explanation of symbols for main parts of drawing *****
100: substrate exchange module 300: transfer structure
400: process module
510: first moving unit 520: second moving unit
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090098059A KR20110041053A (en) | 2009-10-15 | 2009-10-15 | Substrate processing apparatus, and method for separating substrate supporter assembly from processing module of substrate processing apparatus |
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KR1020090098059A KR20110041053A (en) | 2009-10-15 | 2009-10-15 | Substrate processing apparatus, and method for separating substrate supporter assembly from processing module of substrate processing apparatus |
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KR20110041053A true KR20110041053A (en) | 2011-04-21 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107507796A (en) * | 2017-07-30 | 2017-12-22 | 江苏鲁汶仪器有限公司 | A kind of wafer transmission system |
-
2009
- 2009-10-15 KR KR1020090098059A patent/KR20110041053A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107507796A (en) * | 2017-07-30 | 2017-12-22 | 江苏鲁汶仪器有限公司 | A kind of wafer transmission system |
CN107507796B (en) * | 2017-07-30 | 2019-10-25 | 江苏鲁汶仪器有限公司 | A kind of wafer transmission system |
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