KR20110026626A

KR20110026626A - Chip leveling apparatus

Info

Publication number: KR20110026626A
Application number: KR1020090084362A
Authority: KR
Inventors: 민건식
Original assignee: 민건식
Priority date: 2009-09-08
Filing date: 2009-09-08
Publication date: 2011-03-16
Also published as: KR101171786B1

Abstract

The present invention relates to a leveling device for inserting multiple chips at the same height into a carrier plate. According to the present invention, a chip leveling device for equally adjusting the protruding height of a plurality of chips inserted into a carrier plate, comprising: a lifting device; A first pressing plate having a first surface coupled to the elevating device and a second surface facing the first surface, a first surface and a second surface facing the first surface, the first surface and the second surface A second pressing plate having a plurality of through holes penetrating the surface, the first pressing plate being coupled to the first pressing plate in a state where the first surface is spaced apart from the second surface of the first pressing plate at regular intervals; An elastomeric plate disposed between the second surface of the first pressing plate and the first surface of the second pressing plate, and inserted into the through hole of the second pressing plate, one end of which is directed in the direction of the second surface of the second pressing plate. An upper head comprising a plurality of protruding pressure pins; And a base plate disposed on a moving path of the elevating device and having a flat plate disposed in a direction perpendicular to the moving path of the elevating device, and a support member supporting the carrier plate at a predetermined distance from the flat plate. Provided is a chip leveling device comprising a.

Description

Chip leveling device {CHIP LEVELING APPARATUS}

The present invention relates to a device for forming external electrodes on a plurality of chips, and more particularly, to a leveling device for inserting a plurality of chips at the same height into the carrier plate.

Chip components such as multilayer ceramic capacitors, chip inductors, and chip resistors expose internal electrodes at both ends. External electrodes are formed at both ends of the chip component to easily connect the internal electrodes to terminals of the substrate on which the chip component is mounted. The external electrode is formed by applying a paste of a metal powder, a glass frit, a binder and a solvent to both ends of the chip, followed by drying and sintering.

There are various methods of applying external electrodes on both ends of the chip, but after inserting a plurality of chip components into a rubber carrier plate in which a plurality of through holes are formed, and fixing them to a lifting device The carrier plate is lowered using this elevating device, and a method of applying an external electrode spread on a surface plate with a constant thickness to a chip is mainly used. Such an external electrode coating method has an advantage in that external electrodes can be formed on a plurality of chips at a time.

In this method, a method of inserting a chip into a carrier plate in which a plurality of through holes is formed will be described with reference to FIGS. 1A to 1D. First, the guide plate 20 in which the tapered through hole 21 is formed is prepared at a position corresponding to the position where the through hole 11 of the carrier plate 10 is formed. The upper part of the through hole 21 has a larger diameter than the through hole 11 formed in the carrier plate 10, and the lower part has the same diameter as the through hole 11 formed in the carrier plate 10. Next, the fixing pin 22 formed at the edge of the guide plate 20 is inserted into the fixing hole 12 formed at the edge of the carrier plate 10 to guide the guide plate 20 and the carrier plate ( 10) (FIG. 1A). Next, the chip C is supplied to the top of the guide plate 20 by using a hopper, and vibration is applied to the carrier plate 10 and the guide plate 20 so that the chip C is inserted into the guide plate 20. (b). Next, the pressure is applied to the chip C by using a press device 1 having a plurality of pins 2 formed at a position corresponding to the through hole 11 of the carrier plate 10. (C) to insert the chip (C) that was inserted in the carrier plate 10. Finally, the guide plate 20 is separated from the carrier plate 10 (d).

The conventional method of inserting the chip into the carrier plate has the following problems. There are variations in the size of the chips inserted into the carrier plate. This deviation causes a difference in the elastic force applied in the process of inserting the chips into the carrier plate through hole. In addition, when the number of times of use of the carrier plate is large, there is a variation in the size of the through hole of the carrier plate.

When pressure is applied to the chip using a press device, the heights at which the chips protrude from the carrier plate are the same at the moment of the pressure being maintained. However, when the pressure is removed, the chip may be pushed out again when the chip size is large and the diameter of the through hole is small, so that the elastic force applied to the chip is large. And in the opposite case, the chip is not pushed out. As a result, a large deviation occurs in the height of the chip exposed on the carrier plate.

This variation causes variation in the thickness of the external electrode when the external electrode is applied, and eventually becomes a major factor causing quality variation of the external electrode.

The present invention is to improve the above problems, according to the present invention, a chip leveling device for equally adjusting the protruding height of the plurality of chips inserted in the carrier plate, lifting device; A first pressing plate having a first surface coupled to the elevating device and a second surface facing the first surface, a first surface and a second surface facing the first surface, the first surface and the second surface A second pressing plate having a plurality of through holes penetrating the surface, the first pressing plate being coupled to the first pressing plate while being spaced apart from the second surface of the first pressing plate at regular intervals; An elastomeric plate disposed between the second surface of the first pressing plate and the first surface of the second pressing plate, and inserted into the through hole of the second pressing plate, one end of which is directed in the direction of the second surface of the second pressing plate. An upper head comprising a plurality of protruding pressure pins; And a base plate disposed on a moving path of the elevating device and having a flat plate disposed in a direction perpendicular to the moving path of the elevating device, and a support member supporting the carrier plate at a predetermined distance from the flat plate. Provided is a chip leveling device comprising a.

The chip leveling device according to the present invention can reduce the variation in coating thickness of the external electrode by making the protrusion height of the chips inserted into the carrier plate constant, thereby reducing the quality variation of the external electrode.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shape and the like of the elements in the drawings are exaggerated to emphasize a more clear description, and the elements denoted by the same reference numerals in the drawings means the same elements.

2 is a cross-sectional view of a chip leveling device according to an embodiment of the present invention, and FIGS. 3 and 4 are enlarged cross-sectional views of a portion of the chip leveling device shown in FIG.

Referring to FIG. 2, the chip leveling device according to an embodiment of the present invention includes a lifting device 40, an upper head 50, and a base plate 60.

The elevating device 40 is installed on a frame (not shown) to elevate the upper head 50. The lifting device 40 is composed of a servomotor 41, a lead screw 42, a ball nut 43, a carriage 44, and a linear motion guide 45. The servomotor 41 is mounted to provide a driving force to an overhead frame 46 provided on the upper portion of the frame. The lead screw 42 is connected to the servo motor 41 so as to be rotated by the drive of the servo motor 41. The ball nut 43 is mounted to the lead screw 42 so that the ball nut 43 can be screwed along the lead screw 42. The carriage 44 is coupled to the ball nut 43 to move up and down. The linear motion guide 45 is composed of a plurality of guide bars 45a. The guide bars 45a are disposed in the overhead frame 46 and penetrate the carriage 44 to guide the linear movement of the carriage 44. The linear motion guide 45 is mounted to slide along the guide rails 621 and the guide rails 621 capable of guiding the linear motion of the carriage 44. 44 may be composed of a pair of slides.

The upper head 50 includes a first pressing plate 51, a second pressing plate 52, an elastomeric plate 53, and a pressing pin 54.

The first pressing plate 51 is coupled to the carriage 44 by a plurality of support bars 47. The first pressing plate 51 includes a main body portion 511 and a circumferential portion 512 extending downward from the main body portion 511. The thread 513 is formed in the circumference 512.

The second pressing plate 52 is coupled to the circumference 512 of the first pressing plate 51. The second pressing plate 52 has a bolt hole 522 for inserting the bolt 523 in the edge portion. The bolt 523 is fastened to the thread 513 formed on the first pressing plate 51 through the bolt hole 522 to couple the first pressing plate 51 and the second pressing plate 52 to each other. In addition, a plurality of through holes 524 are formed in the second pressing plate 52. The through hole 524 is inclined so as to decrease in diameter as it progresses from the upper surface of the second pressing plate 52 to the center portion of the second pressing plate 52.

The elastomeric plate 53 is disposed in an inner space surrounded by the main body 511, the circumference 512, and the second pressure plate 52 of the first pressure plate 51. FIG. 5 is a plan view of the elastomer plate 53 installed in the chip leveling device shown in FIG. 2, and FIG. 6 is a cross-sectional view of the elastomer plate 53 shown in FIG. 5 and 6, the elastomeric plate 53 is divided into a plurality of zones equal to the number of through holes 524 of the second pressing plate 52. The boundary 531 dividing each zone is formed by cutting the upper and lower surfaces in the shape of a wedge, and the thickness thereof is thinner than that of the rest. The boundary 531 functions to minimize the pressure applied to each zone to the other zones.

The pressing pin 54 is inserted into each of the plurality of through holes 524 formed in the second pressing plate 52. The upper end of the pressing pin 54 is in contact with the elastomeric plate 53, and the lower end protrudes from the through hole 524 of the second pressing plate 52. Like the second pressing plate 52 through-hole 524, the pressing pin 54 can be inserted into the through-hole 524 of the second pressing plate 52, so that the diameter becomes smaller as it proceeds from the upper end to the middle. Picture shape.

Springs 56 are installed at both edges of the second pressing plate 52, and the guide plate 60 is coupled to the springs 56. The spring 56 provides an elastic force in a direction away from the second pressing plate 52 with the guide plate 60. The guide plate 60 serves to guide and accommodate the lower end of the pressing pin 54, and has a plurality of through holes 551.

The base plate 60 has a main body portion 61 and a circumferential portion 62 extending upward from an upper surface of the main body portion 61. The flat plate 611 is formed in the center part of the upper surface of the main-body part 61. As shown in FIG. The circumferential portion 62 is formed with a pair of guide rails 621 capable of guiding the carrier plate 10. A groove formed in the carrier plate 10 is inserted into the guide rail 621 so that the carrier plate 10 is installed in the base plate 60, and although not shown, the carrier plate 10 may be configured to fix the carrier plate 10 through a clamp unit. have. The guide rail 621 supports the carrier plate 10 spaced apart from the flat plate 611 at regular intervals.

Hereinafter, the operation of the chip leveling device according to an embodiment of the present invention having such a configuration will be described.

The chip C is inserted into the carrier plate 10 by the method shown in FIG. 1. As described above, the protruding height of the chips C inserted into the carrier plate 10 may vary depending on the size of the chip C, the size of the through hole 11 of the carrier plate 10, and the like. The groove 12 formed on the side of the carrier plate 10 into which the chip C is inserted is inserted into the guide rail 621 formed in the circumferential portion 62 of the base plate 60. When the carrier plate 10 is mounted on the base plate 60 in this way, as shown in FIG. 3, the bottom surface of the carrier plate 10 is spaced apart from the plate 611 formed at the center of the base plate 60 at regular intervals. In this state, the chip C protrudes from the upper surface of the carrier plate 10.

Next, when the servo motor 41 is driven in one direction and the lead screw 42 is rotated, the ball nut 43 is screwed down along the lead screw 42 which is rotated, and the ball nut 43 and the carriage ( 44) descends together. Guide bars 45a of the linear motion guide 45 guide the lowering of the carriage 44 in a linear motion. The upper head 50, 50 descends with the carriage 44.

When the upper head 50 is lowered, the pressing pin 54 is inserted into the carrier plate 10 to come into contact with the protruding chip C. If the lowering is continued, the chip C penetrates the carrier plate 10. It moves through the hole and protrudes to the lower surface of the carrier plate 10. At this time, the guide plate 60 accommodates the projected lower end of the pressing pin 54 serves to prevent the direction is changed when the pressing pin 54 is in contact with the chip (C). If it is lowered further, the protruding end of some chips (C) is in contact with the flat plate 611 of the base plate 60, the remaining chips (C) is not in contact with the flat plate 611 of the base plate 60 Become. If it is lowered further in this state, the chip (C) that one end touches the plate 611 of the base plate 60 can no longer be lowered, there is a risk of breakage. However, in the present invention, since the upper end of the pressing pin 54 is in contact with the elastic elastomer plate 53, the pressure is applied to the chip C while the elastomer plate 53 is compressed to prevent damage. Therefore, the upper head 50 may descend until all the chips C touch the plate 611. As described above, the elastomer plate 53 is divided into a plurality of zones, and the boundary portion 531 dividing each zone is formed by cutting the top and bottom surfaces in a wedge shape, so that the pressure applied to one zone is applied to the elastomer plate ( The advantage is that it can reduce the effect on the other zones. When the upper head 50 descends until all the chips C reach the flat plate 611, the state shown in FIG. 4 is obtained. In this state, when the upper head 50 is raised and the carrier plate 10 is separated from the base plate 60, the carrier plate 10 into which the chips C protruding at a constant height are inserted can be obtained. When the carrier plate 10 is mounted on a conventional external electrode coating device and the external electrode is coated, the thickness variation of the external electrode can be reduced.

7 is an enlarged cross-sectional view of a portion of a chip leveling apparatus according to another embodiment of the present invention. Since the embodiment shown in FIG. 7 differs only from the base plate shown in FIG. 2, the description of other parts will be omitted and only the base plate will be described. The base plate 160 of this embodiment includes a main body 161 and a circumferential portion 162 extending upward from an upper surface of the main body 161. The flat plate 1611 is formed in the center part of the upper surface of the main-body part 161. As shown in FIG. A spacer 1621 is provided at the edge portion of the flat plate 1611. The spacer 1621 supports the carrier plate 10 spaced apart from the flat plate 1611 at regular intervals. The spacer 1621 is installed to be replaced so that a different thickness can be used depending on the size of the chip.

The embodiments described above are merely to describe the preferred embodiments of the present invention, the scope of the present invention is not limited to the described embodiments, it is within the technical spirit and claims of the present invention Various modifications, variations, or substitutions will be made by those skilled in the art, and such embodiments should be understood to be within the scope of the present invention.

1A to 1D are process diagrams for explaining a method of inserting a chip into a carrier plate.

2 is a cross-sectional view of a chip leveling device according to an embodiment of the present invention.

3 and 4 are enlarged cross-sectional views of a portion of the chip leveling device shown in FIG.

5 is a plan view of an elastomeric plate installed in the chip leveling device shown in FIG.

6 is a cross-sectional view of the elastomer plate shown in FIG. 5

7 is an enlarged cross-sectional view of a portion of a chip leveling device according to another embodiment of the present invention;

♣ Explanation of symbols for the main parts of the drawing

10: carrier plate 20: induction plate

40: lifting device 50: upper head

51: first pressing plate 52: second pressing plate

53: elastomer plate 54: pressure pin

55: guide plate 56: spring

60, 160: base plate

Claims

A chip leveling device for equally adjusting the protruding height of a plurality of chips inserted in a carrier plate,

Lifting device;

A first pressing plate having a first surface coupled to the elevating device and a second surface facing the first surface;

A first surface and a second surface facing the first surface, and a plurality of through holes penetrating through the first and second surfaces, wherein the first surface is constant with the second surface of the first pressing plate. A second pressing plate coupled to the first pressing plate at a spaced interval;

An elastomeric plate disposed between the second surface of the first pressing plate and the first surface of the second pressing plate;

An upper head inserted into the through hole of the second pressing plate, the upper head including a plurality of pressing pins, one end of which protrudes toward the second surface of the second pressing plate; And

A flat plate disposed in a moving path of the elevating device and disposed in a direction perpendicular to the moving path of the elevating device;

A base plate having a support member for supporting the carrier plate at a predetermined distance from the flat plate;

Chip leveling device comprising a.

The method of claim 1,

The elastomer plate,

The chip leveling device is divided into a plurality of sections corresponding to the pressing pins, the boundary of each section is thinner than the remaining portion.

The method of claim 2,

The through-holes of the second pressing plate is inclined so as to decrease in diameter as it proceeds from the first surface of the second pressing plate to the second surface direction.

The method of claim 3,

A guide plate having a plurality of through holes for receiving a plurality of pressing pins protruding from the second pressing plate;

And an elastic member connecting the guide plate to the pressure plate and providing an elastic force in a direction away from the guide plate and the second pressing plate.

The method of claim 4, wherein

The support member is a chip leveling device, characterized in that the spacer disposed on the edge of the plate.