KR20100120852A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
KR20100120852A
KR20100120852A KR1020090039696A KR20090039696A KR20100120852A KR 20100120852 A KR20100120852 A KR 20100120852A KR 1020090039696 A KR1020090039696 A KR 1020090039696A KR 20090039696 A KR20090039696 A KR 20090039696A KR 20100120852 A KR20100120852 A KR 20100120852A
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South Korea
Prior art keywords
light emitting
emitting diode
main body
bolt
pcb
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KR1020090039696A
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Korean (ko)
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KR101055293B1 (en
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이용균
고영근
양경석
하우경
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(주)옵토세미
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Priority to KR1020090039696A priority Critical patent/KR101055293B1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: An LED lamp is provided to obtain a cooling effect by combining a transparent member and a cover having a plurality of vents with the coupling part of a body. CONSTITUTION: The screw part(2) of a metal socket(1) is coupled in the screw part of a base(3). A power PCB(5) is attached to the bottom of a base through a bolt and is combined with a bolt hole of a body through a fixed boss. A plurality of light emitting diodes(15) are combined with the bottom of the body having a plurality of radiation rib and a heat transmission rib through the bolt. A transparent body(17) is arranged on the body.

Description

발광다이오드 램프{LED lamp}Light Emitting Diode Lamp {LED lamp}

본 발명은 발광다이오드 램프에 관한 것으로, 상세하게는 금속 베이스가 나사조임으로 체결되는 소켓에 전원용 PCB를 설치하면서 본체의 상면에 결합하고 외면의 방열용 리브와 내면의 열전달용 리브를 형성한 알루미늄 재질의 본체의 저면에는 발광 다이오드용 PCB와 투명체 및 커버를 차례로 결합하도록 함으로써 발광 다이오드를 점등하는 중에 발생되는 열을 효과적으로 배출하도록 한 발광다이오드 램프에 관한 것이다.The present invention relates to a light emitting diode lamp, and in detail, an aluminum material having a heat dissipation rib on an outer surface and a heat transfer rib on an inner surface, coupled to an upper surface of a main body while installing a power supply PCB in a socket where a metal base is fastened by screwing. The bottom of the main body of the present invention relates to a light emitting diode lamp for effectively dissipating the heat generated during the lighting of the light emitting diode by combining the light emitting diode PCB, the transparent body and the cover in turn.

일반적으로 백열등(白熱燈)은 실내,외 조명에 주로 사용되는 대표적인 전기부품으로 백열전구와, 이를 고정시켜주는 소켓(socket)으로 구성되는데, 백열전구가 어둠을 밝히는 빛을 발생하는 기능을 원활히 발휘하기 위해서는 외부전원과 전기적으로 연결된 소켓에 조립되어야만 한다.In general, incandescent lamp (白 전기) is a typical electric component mainly used for indoor and outdoor lighting and consists of an incandescent light bulb and a socket (fixed) to fix it, the incandescent light bulb to show the light to brighten the darkness smoothly This must be assembled in a socket that is electrically connected to an external power source.

이러한 백열등을 구성하는 백열전구는,Incandescent bulbs constituting such incandescent lamps,

질소와 아르곤과 같은 비활성기체가 봉입되는 유리구와,Glass spheres containing inert gas such as nitrogen and argon;

전류가 흐르면 열을 발생하고, 열이 높아지면 빛을 발생하도록 가는 텅스텐 선을 코일모양으로 감아서 만든 필라멘트(filament)와,A filament made by winding a tungsten wire coiled so as to generate heat when current flows, and generating light when heat increases,

이를 상단에 지지하도록 상기 유리구 내부에 설치되고, 상기 필라멘트와 전기적으로 연결되는 도입선이 내장된 유리스템과,A glass stem installed inside the glass sphere so as to support it at an upper end thereof, and having a built-in lead line electrically connected to the filament;

베이스전극부를 하단에 형성하고, 둥근나사머리형 나사부를 외부면에 형성한 베이스 등으로 이루어져 있다.The base electrode part is formed at the lower end, and the base etc. which formed the round screw head part on the outer surface are comprised.

그러나 상기의 백열등은 형광등에 비해 수명이 짧고, 전기소모량이 큰 단점으로 그 사용이 제한되는 경향이 있다.However, the incandescent lamp has a shorter lifespan than a fluorescent lamp and its use tends to be limited due to a large amount of electricity consumption.

즉, 화장실이나 다용도실 또는 세면장과 같이 형광등을 사용하기에는 공간이 작은 실내에서만 백열등을 사용하고 있는 실정이다.In other words, incandescent lamps are used only in rooms where the space is small to use fluorescent lamps such as a toilet, a utility room or a washroom.

그러므로 종래 실내 조명을 위한 할로겐 전구보다 에너지 소모가 적으며 수명이 길고 다양한 조명 효과를 얻을 수 있는 LED를 이용한 램프들도 많이 개발되고 있다.Therefore, many lamps using LEDs, which consume less energy than conventional halogen bulbs for indoor lighting, have a long lifetime and obtain various lighting effects.

상기의 LED 램프는 내측면에 반사층이 형성된 램프 하우징 내부에 LED들 및 PCB가 구비되어 LED에서 발광된 빛이 렌즈를 통해 조사되도록 형성하였다.The LED lamp is provided with LEDs and a PCB inside a lamp housing in which a reflective layer is formed on an inner surface thereof so that light emitted from the LED is irradiated through the lens.

그리고, 램프 하우징의 하부에는 PCB로 전원을 공급하기 위한 전극핀을 인출하기 위한 인출공이 형성되며, PCB와 램프 하우징 사이의 공간에는 접착제가 충전되어 전극핀 및 PCB를 고정하였다.In addition, a drawing hole for drawing the electrode pin for supplying power to the PCB is formed in the lower part of the lamp housing, and an adhesive is filled in the space between the PCB and the lamp housing to fix the electrode pin and the PCB.

상술된 구조의 LED 램프에서는 LED의 전면부에 반사층을 형성하기 위한 공간을 확보해야 하므로 LED를 램프 하우징 내부의 하부면에 장착해야 하는 제약이 따르는 단점이 있었다.In the LED lamp having the above-described structure, it is necessary to secure a space for forming a reflective layer on the front surface of the LED, which has a disadvantage in that the LED must be mounted on the lower surface inside the lamp housing.

이에 따라 2004년 7월 23일자 실용신안등록출원 제20-2004-0021113호(구동안정화부 기능이 내장된 엘이디 칩 램프)가 제안되었으며,Accordingly, Utility Model Registration Application No. 20-2004-0021113 dated July 23, 2004 (LED chip lamp with built-in long-term purification function) was proposed.

이는, 도 1에 도시한 것과 같이, 상면에는 복수개의 LED 칩(101)들이 실장되고, 저면에는 상기 LED 칩(101)들로 구동전원을 공급하는 인쇄회로전극이 형성되는 발광부(100);As shown in FIG. 1, the light emitting unit 100 includes a plurality of LED chips 101 mounted on an upper surface thereof, and a printed circuit electrode configured to supply driving power to the LED chips 101 on a lower surface thereof;

상기 인쇄회로전극을 통해 상기 LED 칩들로 상기 구동전원을 공급하고 상기 LED 칩(101)들이 점등시 상기 구동전원을 안정적으로 유지시키는 구동안정화부(110);A driving stabilizer 110 for supplying the driving power to the LED chips through the printed circuit electrode and stably maintaining the driving power when the LED chips 101 are lit;

외부로부터 전원전압을 인가받아 상기 구동안정화부(110)로 공급하는 전원공급부(120);A power supply unit 120 that receives a power voltage from an external source and supplies the power to the driving stabilizer 110;

상기 전원공급부(120)와 상기 구동안정화부(110)를 전기적으로 연결시켜주는 연결단자(130)를 구비하며,It is provided with a connection terminal 130 for electrically connecting the power supply unit 120 and the drive stabilization unit 110,

상기 발광부(100) 및 구동안정화부(110)는 램프 하우징(50) 내부에 구비되는 것을 특징으로 하는 구동안정화부 기능이 내장된 LED칩 램프.The light emitting unit 100 and the driving stabilizer 110 is a LED chip lamp with a built-in driving stabilizer function, characterized in that provided in the lamp housing (50).

그러나 상기와 같은 종래의 LED 조명등 및 LED 조명장치에 의하여서는 외부로부터 전원을 공급받아 LED를 점등시키면서 실내를 밝게 하는 중에 다수의 LED에서 발생하는 열을 외부로 배출하기 위한 구성이 전혀 없으므로 고장의 원인이 되는 문제점이 있었다.However, the conventional LED lamps and LED lighting apparatuses as described above have no configuration for discharging heat generated from a plurality of LEDs to the outside while lighting the LED while receiving power from the outside to cause the failure. There was a problem becoming.

이에 본 발명은 상기한 바와 같은 종래의 문제점을 해소하기 위한 것으로, 금속 베이스가 나사조임으로 체결되는 소켓에 전원용 PCB를 설치하면서 본체의 상면에 결합하고 외면의 방열용 리브와 내면의 열전달용 리브를 형성한 알루미늄 재질의 본체의 저면에는 발광 다이오드용 PCB와 투명체 및 커버를 차례로 결합하도록 함으로써 발광 다이오드를 점등하는 중에 발생되는 열을 효과적으로 배출하도록 한 발광다이오드 램프를 제공하는 것을 그 목적으로 한다.Therefore, the present invention is to solve the conventional problems as described above, the metal base is coupled to the upper surface of the main body while installing the power supply PCB to the socket fastened by screwing and the heat dissipation ribs on the outer surface and the ribs for heat transfer on the inner surface. An object of the present invention is to provide a light emitting diode lamp having a light emitting diode PCB, a transparent body, and a cover, which are sequentially bonded to the bottom surface of the formed aluminum body to effectively discharge heat generated while the light emitting diode is turned on.

상기 목적을 달성하기 위한 본 발명의 발광다이오드 램프는,The light emitting diode lamp of the present invention for achieving the above object,

도면에 도시하지 않은 플러그에 결합하여 외부로부터 전원을 공급받는 금속 소켓의 나사부가 베이스의 나사부에 나사조임으로 체결되도록 하고,It is coupled to the plug not shown in the drawing so that the threaded portion of the metal socket which is supplied with power from the outside by screwing to the threaded portion of the base,

상기 베이스의 저면에는 전원용 PCB를 볼트로 부착하면서 볼트공을 형성한 고정보스를 통하여 본체의 상면 고정보스의 볼트공에 볼트로 결합하고,Attach the power PCB to the bottom of the base with bolts and bolt to the bolt holes of the high information of the upper surface of the body through the high information to form a bolt hole,

외면에 다수의 방열용 리브를 영문 "S"형으로 형성하면서 내면에 열전달용 리브를 다수 형성한 알루미늄 재질의 본체의 저면 결합부위에는 발광 다이오드용 PCB를 볼트로 체결하면서 결합하고,The light emitting diode PCB is bolted to the bottom coupling part of the main body made of aluminum, in which a plurality of heat dissipation ribs are formed in the English "S" shape and the heat transfer ribs are formed on the inner surface.

상기 본체의 결합부위에 투명체를 위치하면서 다수의 통기공이 형성된 커버를 차례로 결합하도록 함으로써 내부의 열전달용 리브와 외면의 방열용 리브를 통한 방열과 함께 통기공을 통한 공기에 의한 냉각이 동시에 이루어져 발광 다이오드 를 점등하는 중에 발생하는 열을 효율적으로 냉각할 수 있도록 구성함을 특징으로 한다.By placing the transparent body on the coupling portion of the main body in order to combine the cover formed with a plurality of vent holes in order to radiate heat through the heat through the inner ribs and the heat dissipation ribs on the outer surface with the cooling by air through the ventilation at the same time It is characterized in that it is configured to efficiently cool the heat generated while the diode is turned on.

상기의 본 발명에 따른 발광다이오드 램프에 의하여서는 외부로부터 전원을 공급받는 금속 소켓을 나사조임으로 체결한 베이스의 저면에는 전원용 PCB를 부착하면서 본체의 상면에 볼트로 결합하고,The light emitting diode lamp according to the present invention is coupled to the upper surface of the main body by attaching a power supply PCB to the bottom surface of the base fastened by screwing the metal socket receiving power from the outside,

외면에 다수의 방열용 리브를 영문 "S"형으로 형성하면서 내면에 열전달용 리브를 다수 형성한 알루미늄 재질의 본체의 저면 결합부위에는 발광 다이오드용 PCB를 볼트로 체결하면서 결합하여 발광 다이오드를 점등하는 중에 발생하는 열을 열전달에 의한 방열로 냉각시키도록 하고,The light emitting diode is lighted by fastening the LED PCB with bolts to the bottom joining part of the aluminum body where a large number of heat dissipation ribs are formed on the outer surface in the English "S" shape and the heat transfer ribs are formed on the inner surface. Cool the heat generated during heat dissipation by heat transfer,

상기 본체의 결합부위에 투명체를 위치하면서 다수의 통기공이 형성된 커버를 차례로 결합하여 공기에 의한 냉각도 함께 이루어져 발광 다이오드를 점등하는 중에 발생하는 열을 효율적으로 냉각할 수 있는 효과가 있다.Positioning the transparent body on the coupling portion of the main body by combining the cover formed with a plurality of ventilation holes in order to cool by air also has the effect of efficiently cooling the heat generated during the lighting of the LED.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

본 발명에 따른 발광다이오드 램프는,The light emitting diode lamp according to the present invention,

도면에 도시하지 않은 플러그에 결합하여 외부로부터 전원을 공급받는 금속 소켓(1)의 나사부(2)가 베이스(3)의 나사부(4)에 나사조임으로 체결되도록 하고,The screw portion 2 of the metal socket 1, which is supplied with power from the outside by being coupled to a plug not shown in the drawings, is fastened to the screw portion 4 of the base 3 by screwing.

상기 베이스(3)의 저면에는 전원용 PCB(5)를 볼트로 부착하면서 볼트공을 형성한 고정보스(6)를 통하여 본체(10)의 상면 고정보스(11)의 볼트공에 볼트로 결합하고,The bottom surface of the base 3 is attached to the bolt hole of the upper high intelligence 11 of the upper surface of the main body 10 through the high information 6 to form a bolt hole while attaching the power supply PCB (5) with a bolt,

외면에 다수의 방열용 리브(12)를 영문 "S"형으로 형성하면서 내면에 열전달용 리브(13)를 다수 형성한 알루미늄 재질의 본체(10)의 저면 결합부위(20)에는 다수의 발광 다이오드(15)를 부착한 발광 다이오드용 PCB(14)를 볼트로 체결하면서 결합하고,A plurality of light emitting diodes are formed at the bottom coupling portion 20 of the main body 10 made of aluminum, in which a plurality of heat dissipation ribs 12 are formed in an English “S” shape and a plurality of heat transfer ribs 13 are formed on an inner surface thereof. (15) attached to the light emitting diode PCB (14) while fastening with a bolt,

상기 본체(10)의 결합부위(20)에 투명체(17)를 위치하면서 저면의 고정보스(16)에 형성한 볼트공에 다수의 통기공(19)이 형성된 커버(18)를 볼트로 결합하여 구성한 것이다.The cover 18 formed with a plurality of vent holes 19 is bolted to the bolt holes formed in the high information 16 on the bottom while the transparent body 17 is positioned at the coupling portion 20 of the main body 10. It is made up.

상기 소켓(1)과 전원용 PCB(5) 및 발광 다이오드용 PCB(14)는 도면에 도시하지 않은 케이블을 통하여 전기적으로 연결하도록 한다.The socket 1 and the power supply PCB 5 and the light emitting diode PCB 14 are electrically connected to each other via a cable (not shown).

상기와 같이 구성한 본 발명의 발광다이오드 램프는,The light emitting diode lamp of the present invention configured as described above,

도면에 도시하지 않은 플러그에 결합하여 외부로부터 전원을 공급받는 금속 소켓(1)의 나사부(2)를 베이스(3)의 나사부(4)에 나사조임으로 체결하도록 함으로써 종래의 프레스로 찍어서 가공하는 방식에 비하여 조립이 용이해지도록 한다.A method of dipping into a conventional press by screwing the threaded portion 2 of the metal socket 1, which is supplied with power from the outside to the threaded portion 4 of the base 3, by coupling to a plug not shown in the drawings. Compared to the ease of assembly.

상기 베이스(3)의 저면에는 전원용 PCB(5)를 볼트로 부착하면서 볼트공을 형성한 고정보스(6)를 통하여 본체(10)의 상면 고정보스(11)의 볼트공에 볼트로 결합한다.The bottom surface of the base 3 is attached to the bolt hole of the upper high intelligence 11 of the upper surface of the main body 10 through the high information 6 formed with a bolt hole while attaching the power supply PCB 5 with the bolt.

외면에 다수의 방열용 리브(12)를 영문 "S"형으로 형성하면서 내면에 열전달용 리브(13)를 다수 형성한 알루미늄 재질의 본체(10)의 저면 결합부위(20)에는 다수의 발광 다이오드(15)를 부착한 발광 다이오드용 PCB(14)를 볼트로 체결하면서 결합함으로써 발광 다이오드(15)를 점등하는 중에 발생하는 열을 열전달용 리브(13)와 본체(1) 및 외면의 방열용 리브(12)를 통하여 열전달에 의한 방열로 냉각시키도록 한다.A plurality of light emitting diodes are formed at the bottom coupling portion 20 of the main body 10 made of aluminum, in which a plurality of heat dissipation ribs 12 are formed in an English “S” shape and a plurality of heat transfer ribs 13 are formed on an inner surface thereof. The heat generating rib 13 and the main body 1 and the heat dissipation rib on the outer surface of the light emitting diode PCB 14 with the bolt 15 are coupled by fastening with bolts. Through (12) to cool by heat radiation by heat transfer.

상기 본체(10)의 결합부위(20)에 투명체(17)를 위치하면서 저면의 고정보스(16)에 형성한 볼트공에 다수의 통기공(19)이 형성된 커버(18)를 볼트로 결합하도록 함으로써 투명체(17)를 통해 발광 다이오드(15)의 빛이 투광되는 동시에 통기공(19)을 통한 공기에 의한 냉각이 이루어져 발광 다이오드(15)를 점등하는 중에 발생하는 열을 효율적으로 냉각할 수 있다.Positioning the transparent body 17 in the coupling portion 20 of the main body 10 to bolt the cover 18 formed with a plurality of vent holes 19 in the bolt hole formed in the high information 16 on the bottom with a bolt As a result, light of the light emitting diode 15 is transmitted through the transparent body 17, and cooling by air through the air vent 19 is performed to efficiently cool the heat generated while the light emitting diode 15 is turned on. .

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 또한 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시 가능한 것은 물론이고, 그와 같은 변경은 기재된 청구범위 내에 있게 된다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but many variations and modifications may be made without departing from the scope of the invention. It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.

도 1은 종래 발광 다이오드 램프의 구성을 도시한 단면도.1 is a cross-sectional view showing the configuration of a conventional light emitting diode lamp.

도 2는 본 발명의 전체 구성을 도시한 분리 사시도.Figure 2 is an exploded perspective view showing the overall configuration of the present invention.

도 3은 본 발명의 결합상태의 구성을 도시한 단면도Figure 3 is a cross-sectional view showing the configuration of the bonded state of the present invention

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1 : 금속 소켓 3 : 베이스1: metal socket 3: base

5 : 전원용 PCB 10 : 본체5: power supply PCB 10: main body

12 : 방열용 리브 13 : 열전달용 리브12: rib for heat dissipation 13: rib for heat transfer

14 : 발광 다이오드용 PCB 17 : 투명체14 PCB for light emitting diode 17 transparent body

18 : 커버 19 : 통기공18: cover 19: ventilator

Claims (2)

금속 소켓(1)의 나사부(2)가 베이스(3)의 나사부(4)에 나사조임으로 체결되도록 하고,The screw part 2 of the metal socket 1 is fastened to the screw part 4 of the base 3 by screwing, 상기 베이스(3)의 저면에는 전원용 PCB(5)를 볼트로 부착하면서 볼트공을 형성한 고정보스(6)를 통하여 본체(10)의 상면 고정보스(11)의 볼트공에 볼트로 결합하고,The bottom surface of the base 3 is attached to the bolt hole of the upper high intelligence 11 of the upper surface of the main body 10 through the high information 6 to form a bolt hole while attaching the power supply PCB (5) with a bolt, 외면에 다수의 방열용 리브(12)를 형성하면서 내면에 열전달용 리브(13)를 다수 형성한 알루미늄 재질의 본체(10)의 저면 결합부위(20)에는 다수의 발광 다이오드(15)를 부착한 발광 다이오드용 PCB(14)를 볼트로 체결하면서 결합하고,A plurality of light emitting diodes 15 are attached to the bottom coupling portion 20 of the main body 10 made of aluminum, in which a plurality of heat dissipation ribs 12 are formed on the outer surface, and a plurality of heat transfer ribs 13 are formed on the inner surface. The light emitting diode PCB 14 is fastened with bolts, 상기 본체(10)의 결합부위(20)에 투명체(17)를 위치하면서 저면의 고정보스(16)에 형성한 볼트공에 다수의 통기공(19)이 형성된 커버(18)를 볼트로 결합하여 구성한 것을 특징으로 하는 발광다이오드 램프.The cover 18 formed with a plurality of vent holes 19 is bolted to the bolt holes formed in the high information 16 on the bottom while the transparent body 17 is positioned at the coupling portion 20 of the main body 10. A light emitting diode lamp comprising: 청구항 1에 있어서,The method according to claim 1, 상기 본체(1)의 외면에 다수의 방열용 리브(12)를 영문 "S"형으로 형성하여 열을 방출하는 면적이 최대가 되도록 구성한 것을 특징으로 하는 발광다이오드 램프.A light emitting diode lamp comprising a plurality of heat dissipation ribs 12 formed on an outer surface of the main body 1 in an English " S " shape to maximize the area for dissipating heat.
KR1020090039696A 2009-05-07 2009-05-07 LED lamp KR101055293B1 (en)

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WO2013022179A1 (en) * 2011-08-08 2013-02-14 아이스파이프 주식회사 Led lighting device
CN103185229A (en) * 2011-12-29 2013-07-03 邱庆彬 LED (light emitting diode) bread lamp
KR101407687B1 (en) * 2013-07-02 2014-06-13 주식회사 이디엠아이 Large LED lamp with excellent heat dissipation effect
US8757841B2 (en) 2010-11-08 2014-06-24 Lg Innotek Co., Ltd. Lighting device
US8770806B2 (en) 2011-10-04 2014-07-08 Samsung Electronics Co., Ltd. Light emitting diode lighting module
CN104948938A (en) * 2014-03-27 2015-09-30 四川新力光源股份有限公司 LED lamp, optical engine and optical engine manufacturing method thereof

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US8757841B2 (en) 2010-11-08 2014-06-24 Lg Innotek Co., Ltd. Lighting device
US9039242B2 (en) 2010-11-08 2015-05-26 Lg Innotek Co., Ltd. Lighting device
WO2013022179A1 (en) * 2011-08-08 2013-02-14 아이스파이프 주식회사 Led lighting device
US8770806B2 (en) 2011-10-04 2014-07-08 Samsung Electronics Co., Ltd. Light emitting diode lighting module
CN103185229A (en) * 2011-12-29 2013-07-03 邱庆彬 LED (light emitting diode) bread lamp
KR101407687B1 (en) * 2013-07-02 2014-06-13 주식회사 이디엠아이 Large LED lamp with excellent heat dissipation effect
CN104948938A (en) * 2014-03-27 2015-09-30 四川新力光源股份有限公司 LED lamp, optical engine and optical engine manufacturing method thereof
CN104948938B (en) * 2014-03-27 2017-05-03 四川新力光源股份有限公司 LED lamp, optical engine and optical engine manufacturing method thereof

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