KR20100096469A - A led lamp having piled protection against heat panel - Google Patents

A led lamp having piled protection against heat panel Download PDF

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Publication number
KR20100096469A
KR20100096469A KR1020090015362A KR20090015362A KR20100096469A KR 20100096469 A KR20100096469 A KR 20100096469A KR 1020090015362 A KR1020090015362 A KR 1020090015362A KR 20090015362 A KR20090015362 A KR 20090015362A KR 20100096469 A KR20100096469 A KR 20100096469A
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South Korea
Prior art keywords
led
heat
frame
projection
heat sink
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KR1020090015362A
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Korean (ko)
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김경식
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(주)유스텍
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Priority to KR1020090015362A priority Critical patent/KR20100096469A/en
Publication of KR20100096469A publication Critical patent/KR20100096469A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PURPOSE: A light emitting diode lamp including a heat emitting plate is provided to effectively emit heat generated from a light emitting diode by arranging the heat emitting plate on the external periphery of a frame. CONSTITUTION: A light emitting diode lamp includes a frame(100), a light emitting diode(200), a heat emitting plate(300), and a conductive connector(400). The frame is composed of a metal material. The light emitting diode is inserted into the one side of the frame. The heat emitting plate is arranged on the external periphery of the frame. The heat emitting plate is composed of a plurality of disks. Protrusions and a plurality of pores are arranged in each disk. The conductive connector is arranged on one side of the frame to be electrically connected with the light emitting diode.

Description

적층형 방열판을 갖는 엘이디 램프{A LED Lamp Having Piled Protection Against Heat Panel}LED Lamp Having Stacked Heat Sink {A LED Lamp Having Piled Protection Against Heat Panel}

본 발명은 적층형 방열판을 갖는 엘이디 램프에 관한 것으로, 특히 엘이디 램프 하우징의 측면에 원판으로 이루어진 다수개의 디스크형 원판을 순차 적층시켜 엘이디 램프의 방열이 효과적으로 이루어지도록 한 것을 특징으로 하는 적층형 방열판을 갖는 엘이디 램프에 관한 것이다.The present invention relates to an LED lamp having a laminated heat sink, and in particular, a plurality of disk-shaped disks made of disks are sequentially stacked on the side of the LED lamp housing, the LED having a laminated heat sink, characterized in that the effective heat radiation of the LED lamp Relates to the lamp.

각양 각색의 전등 중에서 투사등은 오랜 시간 동안 상당히 고정적인 비율을 차지하고 있는데, 특히 각종 전자 절전형 전구는 전통적인 백열등을 대체하는 동시에 투사등이 제공하는 특수한 조명효과로 인해 조명 시장에서 중요한 부분을 차지하고 있으며 가정집, 전시장 또는 식당 등 인테리어 설계에서 필수적이다. Of all the different types of lamps, projection lamps have a fairly constant proportion over a long period of time. In particular, various electronic energy-saving bulbs replace the traditional incandescent lamps and are an important part of the lighting market due to the special lighting effects provided by the projection lamps. Essential for interior design, such as exhibition halls or restaurants.

또한, 투사등은 특유의 분위기를 통해 전시하려는 제품이나 장식을 더욱 돋보이게 한다. 투사등의 시장은 매우 방대하고 현재 시장에는 그 크기가 규격화되어 있다. In addition, the projection lamp further enhances the product or decoration to be exhibited through a unique atmosphere. The market of projection lamps is very large and the size is standardized in the current market.

종래의 투사등으로서, 도 1에 도시된 바와 같이, 11볼트의 할로겐 투사전구(A)가 사용되고 있다. 할로겐 투사전구는 전기 소모량이 높고, 쉽게 고온 으로 발열하기 때문에, 내구성이 짧다. As a conventional projection lamp, as shown in Fig. 1, an 11 volt halogen projection bulb A is used. Halogen projection bulbs have high electricity consumption and are easy to heat to high temperatures, and therefore have low durability.

할로겐 투사전구는 평균수명이 수 개월에 지나지 않는다. 따라서 할로겐 투사전구는 경제성이 낮고, 환경에도 악영향을 미친다. 또한, 할로겐 투사전구의 발광시 고온의 열이 발생하기 때문에 전선이 과열되어 화재 사고가 발생할 수 있다. 또한, 종래의 할로겐 투사전구는 발광시 과도한 자외선이 방출된다는 단점이 있다.Halogen projection bulbs have a life expectancy of only a few months. Therefore, halogen projection bulbs have low economical efficiency and adversely affect the environment. In addition, since high temperature heat is generated when the halogen projection bulb emits light, the wire may be overheated and a fire accident may occur. In addition, the conventional halogen projection bulb has the disadvantage that excessive ultraviolet light is emitted during light emission.

즉, 할로겐 투사전구에 눈이나 피부가 장기간 노출되는 경우 손상을 입기 쉽다. 따라서, 할로겐 투사전구의 문제점을 개선할 수 있는 대안을 제시할 필요가 있다.That is, it is easy to be damaged when eyes or skin are exposed to halogen projection bulbs for a long time. Therefore, there is a need to propose an alternative that can improve the problem of halogen projection bulbs.

따라서, 이를 감안하여 현재 LED를 광원으로 하는 투사등이 개발되었다. 이는 LED의 절전 특성을 이용해 전통적인 할로겐 투사등의 결점을 개선한 것이다. 도 2에 도시된 바와 같이, 종래의 LED 투사전구(B)는 투사등 케이스(C), 전압변환부(D) 및 LED부(E)로 구성되며, LED부(E)와 전압변환부(D)는 금속으로 제작된 투사등 케이스(C)내에 설치된다. Therefore, in view of this, a projection lamp using LED as a light source has been developed. This improves on the drawbacks of traditional halogen projection lamps using the power-saving characteristics of LEDs. As shown in Figure 2, the conventional LED projection bulb (B) is composed of a projection lamp case (C), voltage conversion unit (D) and LED unit (E), LED unit (E) and voltage conversion unit ( D) is installed in the projection lamp case C made of metal.

전압변환부(D)를 통해 11볼트인 교류전류가 LED부(E)에 사용되는 직류전류로 전환되어 제공되며, LED부(E)가 발광하며 빛이 투사된다. 전술한 종래의 LED투사전구(B)의 구조는 통상적인 할로겐 투사전구(A)에 비해 절전과 환경보호의 측면에서 개선된 기능을 가지지만, LED부(E) 역시 발열 문제가 존재한다.The 11-volt AC current is converted into the DC current used in the LED unit E through the voltage conversion unit D, and the LED unit E emits light and projects light. The structure of the above-described conventional LED projection light bulb (B) has an improved function in terms of power saving and environmental protection compared to the conventional halogen projection light bulb (A), but the LED unit (E) also has a heat problem.

즉, 일점 투사의 효과에 도달하려면 LED부(E)에서 방출되는 빛이 일정치 이상의 밝기에 도달해야하는데, 현재 당해 관련 분야의 과학기술의 발전과 함께 LED부(E)의 밝기가 향상되고 있지만, 밝기를 높이기 위해서는 LED부(E)가 전력을 많이 소모하기 때문에 LED부(E)에서도 고온의 열이 방출된다는 문제점이 있다. In other words, in order to achieve the effect of single-point projection, the light emitted from the LED unit E must reach a certain level or more of brightness. At present, the brightness of the LED unit E is improving with the development of science and technology in the relevant field. In order to increase the brightness, since the LED unit E consumes a lot of power, there is a problem in that high temperature heat is emitted from the LED unit E.

또한, 발열 정도가 그 허용치를 초과하는 경우 LED부(E)에서 방출되는 빛의 밝기가 감퇴하기 때문에 의도하는 조명 효과를 이루기 어렵다. In addition, when the degree of heat generation exceeds the allowable value, the brightness of the light emitted from the LED portion E is reduced, so that it is difficult to achieve the intended lighting effect.

또한, LED부(E)는 통상적인 할로겐 투사전구(A)와 비교할 때 내열성이 더 낮기 때문에, 할로겐 투사전구에서 방출되는 빛에 가까운 밝기로 빛을 방출하는 경우 고열에 의해 LED부(E)의 사용수명이 단축되는 문제점이 있다.In addition, since the LED portion E has lower heat resistance compared to the conventional halogen projection bulb A, when the light is emitted at a brightness close to that emitted from the halogen projection bulb A, the LED portion E is exposed to high heat. There is a problem that the service life is shortened.

한편, 상기와 같은 종래기술에 따른 LED투사전구(B)는 LED부(E)가 작동할 때 발생하는 열을 금속으로 제작된 투사등 케이스(C)를 통해 천천히 공기 중에 방열하는 방식으로 방열구조를 개선할 수 있다. On the other hand, the LED projection bulb (B) according to the prior art as described above, the heat dissipation structure in such a way that the heat generated when the LED unit (E) operates in a slow heat radiation in the air through the projection lamp case (C) made of metal Can be improved.

그러나 이러한 방열구조에 따른 방열효과는 한계가 있다. 예를 들면, 상기와 같이 LED부에서 발생하는 열을 방열하는 경우 LED투사전구(B)는 LED부의 방열 능력을 고려할 때 최대 1와트의 LED부(E)를 사용할 수 있으나, 그 이상의 전력을 소모하는 LED부를 사용할 수 없다. 따라서, LED투사전구는 더 높은 밝기로 발광하는 통상적인 할로겐 투사전구(A)를 완전히 대체할 수가 없다. 따라서, 통상적인 할로겐 투사전구(A)가 전기 소모량이 높고 발열이 높은 단점이 있지만 여전히 일정한 시장점유율을 확보하고 있어서, 자원의 낭비가 초래되는 문제점이 있다.However, the heat radiation effect of this heat radiation structure is limited. For example, in the case of dissipating heat generated from the LED unit as described above, the LED projection bulb (B) can use the LED unit (E) of up to 1 Watt in consideration of the heat dissipation ability of the LED unit, but consumes more power than that LED part to use cannot be used. Therefore, the LED projection light bulb cannot completely replace the conventional halogen projection light bulb A which emits light with higher brightness. Therefore, although the conventional halogen projection light bulb A has a disadvantage of high electricity consumption and high heat generation, it still has a certain market share, resulting in a waste of resources.

본 고안은 상기와 같은 문제를 해결코자 하는 것으로,The present invention is to solve the above problems,

엘이디 램프의 몸체 외주연에 수평한 형태의 방열편을 다수개 적층 설치하여 엘이디 램프에서 발생하는 열을 효과적으로 방열할 수 있도록 하는데 그 목적이 있다.The purpose of the present invention is to effectively radiate the heat generated from the LED lamp by installing a plurality of horizontally arranged heat dissipating pieces on the outer circumference of the LED lamp.

또한, 할로겐 투사 전구를 대처할 수 있는 엘이디 램프를 제공하는데 그 목적이 있다.It is also an object of the present invention to provide an LED lamp that can cope with halogen projection bulbs.

상기 목적을 달성하기 위한 수단으로,As a means for achieving the above object,

본 발명은 엘이디 램프 모듈을 지지하기 위한 금속재질의 프레임과, 상기 프레임의 일측에 삽입되어 빛을 발산시키는 엘이디와, 상기 프레임의 외주연에 삽입 설치되며 다수개가 적층되어 끼움 결합되는 디스크형 원판 형태의 방열판과, 상기 프레임의 일측에 설치되며 엘이디와 전기적으로 결합되는 도전 커넥터로 이루어짐이 특징이다.The present invention provides a frame of a metal material for supporting the LED lamp module, the LED is inserted into one side of the frame to emit light, and the disk-shaped disc is inserted and installed in the outer periphery of the frame and a plurality of laminated The heat sink and is installed on one side of the frame is characterized by consisting of a conductive connector electrically coupled with the LED.

또한, 상기 방열판을 구성하는 원판들은 일측 끝단에 일체형으로 수직하게 돌기편을 절곡시켜 연장 설치된 것이 특징이다.In addition, the original plate constituting the heat sink is characterized in that the extension is installed by bending the projection piece vertically integrally at one end.

또한, 상기 방열판을 구성하는 원판에는 다수개의 홀을 형성하여 이루어진 것이 특징이다.In addition, the original plate constituting the heat sink is characterized in that a plurality of holes formed.

또한, 상기 방열판을 구성하는 원판과 원판 사이에는 직선형 파이프를 관통 결합하여 이루어진 것이 특징이다.In addition, between the disk and the disk constituting the heat sink is characterized in that the through-pipe coupled through.

상술한 바와 같이 본 발명의 적층형 방열편을 갖는 엘이디 램프는 램프에서 발생하는 열을 효과적으로 외부로 방출시키기 때문에 사용상의 안전성을 확보할 수 있다.As described above, the LED lamp having the laminated heat dissipation member of the present invention effectively discharges heat generated from the lamp to the outside, thereby ensuring safety in use.

또한, 본 발명은 엘이디 램프 밝기의 대폭적 증가를 통해 통상적인 할로겐 투사전구를 완전히 대체하며, 에너지를 절약하고 환경보호의 효과를 달성할 수 있다.In addition, the present invention can completely replace the conventional halogen projection bulb through a significant increase in the brightness of the LED lamp, it is possible to save energy and achieve the effect of environmental protection.

이하, 본 발명의 바람직한 실시예를 첨부된 도면들을 참조하여 상세히 설명한다. 우선 각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한한 동일한 부호를 가지도록 하고 있음에 유의하여야 한다. 또한, 하기에서 본 발명을 설명함에 있어, 관련된 공지기능 또는 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

도 3은 본 발명에 따른 LED 모듈 사시도.Figure 3 is a perspective view of the LED module according to the present invention.

도 4는 본 발명에 따른 LED 모듈 단면도.4 is a cross-sectional view of the LED module according to the present invention.

도 5는 본 발명에 따른 LED 모듈 제 1 실시예도.Figure 5 is a first embodiment of the LED module according to the present invention.

도 6은 본 발명에 따른 LED 모듈 제 2 실시예도로서,Figure 6 is a second embodiment of the LED module according to the present invention,

본 발명의 적층형 방열판을 갖는 엘이디 램프 모듈은, 상기 엘이디 램프 모 듈을 지지하기 위한 금속재질의 프레임(100)과, 상기 프레임의 일측에 삽입되어 빛을 발산시키는 엘이디(200)와, 상기 프레임의 외주연에 삽입 설치되며 다수개가 적층되어 끼움 결합되는 디스크형 원판 형태의 방열판(300)과, 상기 프레임의 일측에 설치되며 엘이디와 전기적으로 결합되는 도전 커넥터(400)로 이루어진다.LED lamp module having a laminated heat sink of the present invention, the metal frame for supporting the LED lamp module 100, the LED 200 is inserted into one side of the frame to emit light, and the The heat sink 300 is inserted into the outer periphery of the disk-shaped disk plate is inserted into a plurality of laminated and coupled, and the conductive connector 400 is installed on one side of the frame and electrically coupled to the LED.

상기 프레임(100)은 열전도율이 비교적 우수한 구리나 알루미늄과 같은 금속재질로 제작된다. The frame 100 is made of a metal material such as copper or aluminum having excellent thermal conductivity.

이러한 본 발명의 엘이디 모듈의 특징은 방열판(300)이 프레임(100)의 외부둘레에 설치되어, 엘이디(200)에서 열이 방출되면, 프레임을 통해 방열부로 열이 전도되고 방열판에서 빠른 속도로 방열된다는 것이다.The feature of the LED module of the present invention is that the heat sink 300 is installed on the outer periphery of the frame 100, when the heat is discharged from the LED 200, the heat is conducted to the heat radiating portion through the frame and the heat radiating from the heat sink at a high speed It is.

즉, 상기 프레임(100)의 외부둘레에 설치되는 방열판(300)은 다수의 디스크형 원판(310)으로 구성되는바, 디스크 형태의 원판(310)이 순차적으로 차례로 적층되어 이루어진다.That is, the heat dissipation plate 300 installed on the outer circumference of the frame 100 is composed of a plurality of disc-shaped discs 310, and disc-shaped discs 310 are sequentially stacked in this order.

이때, 방열판(300)을 구성하는 각 디스크형 원판(310)은 중앙에 홀이 형성되어 있어 프레임(100)에 끼움 결합되면서 상기 프레임(100)과 방열판(300)이 접촉되며, 이에 따라 방열판(300)의 테두리는 프레임(100) 기준으로 외측으로 향하도록 배치된다.At this time, each of the disk-shaped disk 310 constituting the heat sink 300 has a hole formed in the center thereof is fitted to the frame 100, the frame 100 and the heat sink 300 is in contact, accordingly the heat sink ( The border of 300 is disposed to face outward with respect to the frame 100.

그리고, 상기 방열판(300)을 구성하는 디스크형 원판(310)은 프레임(310)에 밀착되는 부분에 돌기편(311)을 형성토록 하며, 상기 돌기편(311)이 겹치도록 설치하기 때문에 돌기편(311)에 의해서 자동으로 일정간격으로 배치되며, 아울러 상기 돌기편들(311)은 프레임(310)에 밀착 결합되는 형태이기 때문에 프레임(310)으로부 터 발생되는 열은 상기 돌기편(311)을 경유하여 디스크형 원판(310)을 통해 외부로 배출된다.In addition, the disc-shaped disc 310 constituting the heat dissipation plate 300 is to form a projection piece 311 in close contact with the frame 310, because the projection piece 311 is installed so as to overlap the projection piece Automatically arranged at a predetermined interval by the (311), and also because the projection pieces 311 is in close contact with the frame 310, the heat generated from the frame 310 is the projection piece 311 Via the disc-shaped disc 310 is discharged to the outside.

즉, 상기 돌기편(311)이 프레임(310)이 밀착되기 때문에 프레임(310)으로부터 발생하는 열이 프레임에 밀착 설치되는 돌기편(311)으로 전도된 다음 돌기편(311)과 일체로 형성되는 디스크형 원판(310)을 통해 외부로 원할하게 배출되는 것이다.That is, since the projection piece 311 is in close contact with the frame 310, heat generated from the frame 310 is conducted to the projection piece 311 closely installed to the frame, and then integrally formed with the projection piece 311. The disk-shaped disk 310 is to be discharged to the outside smoothly.

또한, 본 발명에 적용되는 방열판(300)이 열전도성이 우수한 구리 또는 알루미늄 등의 금속재료로 제작되기 때문에 돌기편을 통해 외부로 빠른속도로 열을 방출한다.In addition, since the heat dissipation plate 300 applied to the present invention is made of a metal material such as copper or aluminum having excellent thermal conductivity, heat is radiated to the outside through the projection pieces at a high speed.

또한, 본 발명은 엘이디(200)와 도전 커넥터(400)가 직접 전기적으로 연결될 수 있고, 아니면 엘이디와 도전 커넥터 사이에 전압 변환부가 설치되면서 전기적으로 연결될 수 있는바, 외부에서 직류신호가 곧바로 입력되면 도전 커넥터와 엘이디를 곧바로 연결하면 되고, 외부에서 교류신호가 입력되면 전압 변환부에서 직류로 변환시킨 다음 엘이디로 전기를 중계할 수 있다. 본 발명에서는 엘이디의 방열구조에 기술적 촛점이 있는 것이고, 엘이디와 도전 커넥터와의 관계가 주요한 발명의 요지가 아니기 때문에 더이상의 설명은 생략토록 하며, 엘이디와 도전 커넥터의 연결구성은 통상의 기술을 적용한다.In addition, the present invention can be electrically connected to the LED 200 and the conductive connector 400 directly, or can be electrically connected while the voltage conversion unit is installed between the LED and the conductive connector, if a direct current signal is directly input from the outside The conductive connector and the LED may be directly connected, and when an AC signal is input from the outside, the voltage converter may convert the DC into a DC and then relay the electricity to the LED. In the present invention, there is a technical focus on the heat dissipation structure of the LED, and since the relationship between the LED and the conductive connector is not the main point of the invention, further descriptions will be omitted, and the connection configuration of the LED and the conductive connector applies conventional techniques. do.

도 5는 본 발명의 제 1 실시예로서, 본 발명의 방열판(300)을 구성하는 디스크형 원판(310)에 다수개의 홀(320)을 형성하여 상기 홀(320)을 경유하여 방열이 효과적으로 이루어지도록 하였다. 상기와 같이 디스크형 원판(310)에 홀(320)을 형 성하게 되면 원판(310)을 통해 열이 외부로 방출될 때 상기 홀(320)을 통하여서도 외부 공기가 접촉되면서 열이 방출되므로 보다 효율적으로 열방출이 이루어진다.5 is a first embodiment of the present invention, by forming a plurality of holes 320 in the disk-shaped disk 310 constituting the heat dissipation plate 300 of the present invention to effectively radiate heat via the holes 320 To lose. When the hole 320 is formed in the disc-shaped disc 310 as described above, when heat is discharged to the outside through the disc 310, the outside air is also contacted through the hole 320 so that heat is released. Efficient heat dissipation is achieved.

도 6은 본 발명의 제 2 실시예로서, 본 발명의 디스크형 원판(310) 사이로 직선형 파이프(330)를 관통 결합 하였다. 6 is a second embodiment of the present invention, through which the straight pipe 330 is coupled through the disc-shaped disk 310 of the present invention.

상기와 같이 직선형 파이프(330)로 디스크형 원판(310)을 관통 결합하게 되면 디스크형 원판(310)으로부터 열이 방출될때 상기 직선형 파이프(330)가 동시에 열을 외부로 방출시키는 역할을 하기 때문에 한층더 열의 외부 방사가 쉽게 이루어지도록 한다.When the disk-shaped disk 310 is coupled through the straight pipe 330 as described above, when the heat is discharged from the disk-shaped disk 310, the straight pipe 330 simultaneously releases heat to the outside. Makes it easier for external radiation of heat.

즉, 디스크형 원판(310)으로만 열을 외부로 방출하였을때보다 직선형 파이프(330)를 연결하여 상기 직선형 파이프를 통하여 열을 외부로 방출하였을때 보다 더 효과적으로 엘이디(200)의 열을 외부로 방출할 수 있게되는 것이다.That is, the heat of the LED 200 to the outside is more effective than when the heat is discharged to the outside through the straight pipe 330 by connecting the straight pipe 330 than when the heat to the disk 310 alone. It will be able to release.

본 발명에 따르면 발열에 의한 문제를 해결할 수 있어서, 종래기술에 비해 상대적으로 큰 전력을 소비하는 엘이디를 채택하여 적용할 수 있다. 따라서, 높은 밝기의 빛을 방출하는 엘이디 모듈을 구현할 수 있다. According to the present invention can solve the problem caused by heat, it can be applied by adopting the LED that consumes a relatively large power compared to the prior art. Therefore, it is possible to implement an LED module for emitting high brightness light.

MR-16 규격의 예를 들어 말하면, 현재까지 상용화된 엘이디 모듈은 방열효과가 좋지 않기 때문에, 1와트를 초과하는 전력을 소모하는 엘이디를 사용할 수 없었지만, 본 고안에 따른 엘이디 모듈은 방열부의 방열효과로 인해 소모전력이 적어도 5와트에 달하는 엘이디를 사용할 수 있어서, LED투사광원모듈의 밝기를 현저히 높일 수 있다.As an example of the MR-16 specification, since the LED module commercially available has not a good heat dissipation effect, an LED that consumes more than 1 watt of power cannot be used. However, the LED module according to the present invention has a heat dissipation effect. Due to the use of LEDs with power consumption of at least 5 watts, it is possible to significantly increase the brightness of the LED projection light source module.

즉, 종래의 할로겐 투사전구의 밝기에 가까운 밝기의 빛을 발생시킬 수 있어 서, 할로겐 투사전구를 완전히 대체할 수 있다. 또한, LED부의 수명이 평균 십만 시간 이상이므로, 본 발명은 통상적인 할로겐 투사전구와 비교할 때, 절전, 환경보호 및 사용수명의 연장의 측면에서 많은 장점이 있다. That is, it is possible to generate light having a brightness close to that of the conventional halogen projection light bulb, thereby completely replacing the halogen projection light bulb. In addition, since the LED part has an average lifetime of 100,000 hours or more, the present invention has many advantages in terms of power saving, environmental protection, and extension of service life when compared to a conventional halogen projection light bulb.

이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의하여 한정되는 것은 아니고, 본 발명의 기술적사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하다는 것이 본 발명이 속하는 분야에서 통상의 지식을 가진 자에게 있어서 명백할 것이다.The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the field of the present invention that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

도 1은 종래기술에 따른 할로겐 투사전구를 나타낸 사시도.1 is a perspective view showing a halogen projection bulb according to the prior art.

도 2는 종래기술에 따른 LED 투사광원모듈을 조립하는 것을 나타낸 사시도.Figure 2 is a perspective view showing assembling the LED projection light source module according to the prior art.

도 3은 본 발명에 따른 LED 모듈 사시도.Figure 3 is a perspective view of the LED module according to the present invention.

도 4는 본 발명에 따른 LED 모듈 단면도.4 is a cross-sectional view of the LED module according to the present invention.

도 5는 본 발명에 따른 LED 모듈 제 1 실시예도.Figure 5 is a first embodiment of the LED module according to the present invention.

도 6은 본 발명에 따른 LED 모듈 제 2 실시예도.Figure 6 is a second embodiment of the LED module according to the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

100: 프레임100: frame

200: 엘이디200: LED

300: 방열판300: heat sink

310: 디스크형 원판310: disc-shaped disc

311: 돌기편311: protrusion

320: 홀320: hall

330: 직선형 파이프330: straight pipe

400: 도전 커넥터400: conductive connector

Claims (4)

엘이디 램프 모듈을 지지하기 위한 금속재질의 프레임(100)과, Metal frame 100 for supporting the LED lamp module, 상기 프레임의 일측에 삽입되어 빛을 발산시키는 엘이디(200)와, An LED 200 inserted into one side of the frame to emit light; 상기 프레임의 외주연에 삽입 설치되며 다수개가 적층되어 끼움 결합되는 디스크형 원판 형태의 방열판(300)과, Heat-dissipating plate 300 of the disc-shaped disk is inserted and installed in the outer periphery of the frame is stacked and coupled to a plurality of, 상기 프레임의 일측에 설치되며 엘이디와 전기적으로 결합되는 도전 커넥터(400)로 이루어짐을 특징으로 하는 적층형 방열판을 갖는 엘이디 램프.LED lamp having a laminated heat sink, characterized in that consisting of a conductive connector 400 is installed on one side of the frame and electrically coupled to the LED. 제 1 항에 있어서,The method of claim 1, 상기 방열판(300)을 구성하는 원판(310)들은 일측 끝단에 일체형으로 수직하게 돌기편(311)을 절곡시켜 연장 설치된 것을 특징으로 하는 적층형 방열판을 갖는 엘이디 램프.The disk 310 constituting the heat sink 300 is an LED lamp having a laminated heat sink, characterized in that the extension is installed by bending the projection piece 311 vertically integrally at one end. 제 1 항에 있어서,The method of claim 1, 상기 방열판(300)을 구성하는 원판(310)에는 다수개의 홀(320)을 형성하여 이루어진 것을 특징으로 하는 적층형 방열판을 갖는 엘이디 램프.LED lamp having a laminated heat sink, characterized in that formed in the plate 310 constituting the heat sink 300 a plurality of holes (320). 제 1 항에 있어서,The method of claim 1, 상기 방열판(300)을 구성하는 원판(310)과 원판 사이에는 직선형 파이프(330)를 관통 결합하여 이루어진 것을 특징으로 하는 적층형 방열판을 갖는 엘이디 램프.LED lamp having a laminated heat sink, characterized in that formed through the straight pipe 330 between the disc 310 and the disc constituting the heat sink 300 through.
KR1020090015362A 2009-02-24 2009-02-24 A led lamp having piled protection against heat panel KR20100096469A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016163702A1 (en) * 2015-04-06 2016-10-13 유태승 Stack type heat sink and led lamp module with same applied thereto
EP3795894A1 (en) * 2018-09-21 2021-03-24 Fischer Lighting Holding ApS Light fixture for absorbing sound energy

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016163702A1 (en) * 2015-04-06 2016-10-13 유태승 Stack type heat sink and led lamp module with same applied thereto
EP3795894A1 (en) * 2018-09-21 2021-03-24 Fischer Lighting Holding ApS Light fixture for absorbing sound energy

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