KR20100093892A - Seed production method for ingot growing by wire saw - Google Patents
Seed production method for ingot growing by wire saw Download PDFInfo
- Publication number
- KR20100093892A KR20100093892A KR1020090013025A KR20090013025A KR20100093892A KR 20100093892 A KR20100093892 A KR 20100093892A KR 1020090013025 A KR1020090013025 A KR 1020090013025A KR 20090013025 A KR20090013025 A KR 20090013025A KR 20100093892 A KR20100093892 A KR 20100093892A
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- KR
- South Korea
- Prior art keywords
- seed
- wire saw
- wire
- saw
- ingot growing
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Wire Saw를 이용하여 제작하는 방법으로 Main Roller의 Groove Pitch 간격이 클수록 Wire의 단선 가능성이 발생한다. Wire의 Tension을 안정적으로 유지 할 수 있도록 Main Roller를 제작하는 방법이다.The wire saw is manufactured by using wire saw. As the groove pitch of the main roller increases, the possibility of wire breakage occurs. This is how to manufacture the main roller to keep the wire tension stable.
Wire Saw를 이용한 Seed 제작과 이에 사용되는 Wire Saw의 Main Roller를 Seed 제작용으로 개선 시 Groove Pitch를 도 1의 방법으로 제작한다.Groove Pitch is produced by the method of FIG. 1 when the Seed is manufactured using the wire saw and the main roller of the wire saw is used for the seed production.
Ingot 성장용 Seed 제작 시 I.D Saw(Inner Diamond blade Saw)를 사용하여 제작한다. I.D Saw 사용 시 사람의 인력 및 시간 소요가 많으며 재료(Seed 제작용 재료 : 실리콘) Cutting시 Kerf loss가 Wire Saw를 이용한 제작방법 보다 많다. When manufacturing Seed for Ingot Growth, I.D Saw (Inner Diamond Blade Saw) is used. When I.D saw is used, man's manpower and time are much needed. Kerf loss is higher than cutting method using wire saw when cutting material (Seed material: silicon).
또한 I.D Saw를 사용 시에는 재료 결정면(100),(011)을 X-Ray Goniometer로 측정하며 재료의 6면을 Rotation하여 Cutting 한다. Wire Saw를 이용하는 방법에서는 위와 같은 방법을 간소화하여 2면을 측정하고 제작할 수 있다.In addition, when using I.D saw, the material crystal planes (100) and (011) are measured by X-ray goniometer, and the six sides of the material are rotated and cut. In the method using the wire saw, the above method can be simplified to measure and manufacture two sides.
본 발명에서는 기존의 방식인 I.D Saw를 이용하여 Seed 제작하는 방법에 비하여 같은 재료의 양으로 Kerf loss를 줄여 많은 양의 Seed 제품을 안정적으로 생산하며 또한 공정의 간소화로 생산 시간을 단축하여 생산량을 증가 할 수 있다. In the present invention, compared to the method of manufacturing Seed using the ID Saw, which is the conventional method, it reduces the Kerf loss with the same amount of material and stably produces a large amount of Seed products, and also increases production by shortening the production time by simplifying the process. can do.
Wire Saw의 Main Roller를 사용하여 Seed를 제작하고자 할 때 장비의 특성상 Wire를 사용한다. Wire 사용 시 Groove의 간격이 넓을수록 Wire가 단선 될 가능성이 증가한다. 이와 같은 문제를 해결하여 Seed의 생산량을 증가하는데 목적이 있다. When manufacturing Seed using Wire Saw Main Roller, Wire is used due to the characteristics of equipment. The wider the gap between wires, the greater the chance of wire breakage. The aim is to increase the yield of Seed by solving these problems.
상기한 바와 같은 목적을 달성하기 위하여, 본 발명에서는 Wire Saw의 Main Roller의 Groove Pitch를 Wire의 공급 부분과 회수 부분의 Pitch를 Seed의 규격보다 작게 제작하여 Wire의 Tension을 안정적으로 유지하여 Wire 단선을 최소화 하였다.In order to achieve the above object, in the present invention, the groove pitch of the main roller of the wire saw is made smaller than that of the seed of the feed part and the recovery part of the wire to keep the wire tension stable. Minimized.
본 발명에서는 기존의 방식인 I.D Saw를 이용하여 Seed 제작하는 방법에 비하여 같은 재료의 양으로 Kerf loss를 줄여 많은 양의 Seed 제품을 안정적으로 생산하며 또한 공정의 간소화로 생산 시간을 단축하여 생산량을 증가 할 수 있다. In the present invention, compared to the method of manufacturing Seed using the ID Saw, which is the conventional method, it reduces the Kerf loss with the same amount of material and stably produces a large amount of Seed products, and also increases production by shortening the production time by simplifying the process. can do.
도 1 Wire Saw Main Roller를 Seed 규격에 맞게 Groove Pitch를 제작한다. 도 2 제작된 Main Roller에 Wire를 Winding하고 Seed용 재료를 준비 한다. 도 3 준비한 재료(Ingot)를 Wire Saw 장비를 이용하여 Cutting한다. 도 4는 Slicing이 완료된 Seed의 형태. Figure 1 Wire Saw Main Roller to manufacture Groove Pitch according to Seed standard. Winding the wire on the manufactured Main Roller and prepare a material for Seed. 3 The prepared material (Ingot) is cut using a wire saw equipment. Figure 4 is a form of Seed is completed Slicing.
반도체 산업에서 사용되는 Silicon Ingot의 생산이 필요로 하는 곳에는 Seed가 반드시 필요하다 위에서 언급한 내용을 적용하면 다량의 Seed를 공급할 수 있다.Seed is essential where the production of silicon ingots used in the semiconductor industry is necessary. By applying the above-mentioned information, a large amount of seed can be supplied.
<도면에서 기호 표현><Symbol Representation in Drawing>
1 : Wire Tension유지 Groove 2 : Main Roller Resin 부분 1: Maintain wire tension Groove 2: Main Roller Resin part
3 : Seed 규격에 맞게 제작된 Groove pitch3: Groove pitch made to Seed standard
4 : Wire 5 : Seed 재료(실리콘)4: Wire 5: Seed Material (Silicone)
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090013025A KR20100093892A (en) | 2009-02-17 | 2009-02-17 | Seed production method for ingot growing by wire saw |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090013025A KR20100093892A (en) | 2009-02-17 | 2009-02-17 | Seed production method for ingot growing by wire saw |
Publications (1)
Publication Number | Publication Date |
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KR20100093892A true KR20100093892A (en) | 2010-08-26 |
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Family Applications (1)
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KR1020090013025A KR20100093892A (en) | 2009-02-17 | 2009-02-17 | Seed production method for ingot growing by wire saw |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8900972B2 (en) | 2012-11-19 | 2014-12-02 | Memc Singapore Pte. Ltd. | Systems and methods for producing seed bricks |
US9111745B2 (en) | 2012-12-31 | 2015-08-18 | MEMC Singapore Pte., Ltd. (UEN200614794D) | Methods for producing rectangular seeds for ingot growth |
KR20160065449A (en) | 2014-12-01 | 2016-06-09 | 백무윤 | Durable Work Roller of Wire Saw |
-
2009
- 2009-02-17 KR KR1020090013025A patent/KR20100093892A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8900972B2 (en) | 2012-11-19 | 2014-12-02 | Memc Singapore Pte. Ltd. | Systems and methods for producing seed bricks |
US9111745B2 (en) | 2012-12-31 | 2015-08-18 | MEMC Singapore Pte., Ltd. (UEN200614794D) | Methods for producing rectangular seeds for ingot growth |
US9499920B2 (en) | 2012-12-31 | 2016-11-22 | Memc Singapore Pte. Ltd. (Uen200614794D) | Methods for producing rectangular seeds for ingot growth |
KR20160065449A (en) | 2014-12-01 | 2016-06-09 | 백무윤 | Durable Work Roller of Wire Saw |
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