KR20100082180A - Electronic apparatus having electro-magnetic interference shielding - Google Patents

Electronic apparatus having electro-magnetic interference shielding Download PDF

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Publication number
KR20100082180A
KR20100082180A KR1020090001542A KR20090001542A KR20100082180A KR 20100082180 A KR20100082180 A KR 20100082180A KR 1020090001542 A KR1020090001542 A KR 1020090001542A KR 20090001542 A KR20090001542 A KR 20090001542A KR 20100082180 A KR20100082180 A KR 20100082180A
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KR
South Korea
Prior art keywords
substrate
ground
electronic device
shield
shielding
Prior art date
Application number
KR1020090001542A
Other languages
Korean (ko)
Other versions
KR101053296B1 (en
Inventor
안계원
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020090001542A priority Critical patent/KR101053296B1/en
Publication of KR20100082180A publication Critical patent/KR20100082180A/en
Application granted granted Critical
Publication of KR101053296B1 publication Critical patent/KR101053296B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having an electromagnetic shielding function capable of blocking electromagnetic interference by shielding electromagnetic waves. A substrate portion having via holes connected to each other, a molding portion for encapsulating the electronic component of the substrate portion, a shielding portion for shielding electromagnetic waves by surrounding the outer surface of the molding portion, and a mounting portion mounted on a mounting area of the substrate portion by the molding portion. An electronic device having an electromagnetic shielding function includes a ground connection part encapsulating at least a portion of the shield part and in contact with an inner surface of the shield part and electrically connected to the via hole to electrically connect the shield part to the ground.

Description

ELECTRONIC APPARATUS HAVING ELECTRO-MAGNETIC INTERFERENCE SHIELDING

The present invention relates to an electronic device, and more particularly, to an electronic device having an electromagnetic shielding function capable of blocking electromagnetic interference by shielding electromagnetic waves.

In recent years, various electronic devices are becoming thin and light in accordance with advantages such as portability or ease of use of space.

The trend of light and small size is also applied to mobile communication terminals such as mobile phones and smart phones, and media players such as portable multimedia players (PMPs), MPEG layer 3 (MP3) players, televisions, and monitors.

Meanwhile, at least one module that implements components such as a high frequency device or an integrated circuit chip into one package may be employed in an electronic device such as a mobile communication terminal or a media player.

Most of these electronic devices generate electromagnetic interference such as Electro-Magnetic Interference (EMI) during inherent electrical operation. For example, the electrical or magnetic energy generated by the electronic device is radiated through a kind of path. ) May cause electromagnetic interference to other electronic devices, or may be subjected to electromagnetic interference by electric or magnetic energy conducted from outside (CE).

The electromagnetic interference may be a serious obstacle that may impair the inherent electrical operation of the electronic device, and conventionally solves the electromagnetic interference by shielding a module employed in the external device or the electronic device with a metal device. Was intended.

However, this method of eliminating electromagnetic interference requires the manufacture of shielding metal appliances separately, requires assembly fixing such as soldering, and increases manufacturing costs, and increases the volume due to the space formed to prevent short between the metal appliances and components. Therefore, there is a problem that can not satisfy the user's demand for light and thin.

In order to solve the above problems, it is an object of the present invention to provide a.

In order to achieve the above object, one technical aspect of the present invention is a substrate portion having a mounting area on which an electronic component is mounted, a ground for grounding the electronic component mounted on the mounting region, and a via hole electrically connected to the ground. A molding part encapsulating the electronic component of the substrate part, a shielding part surrounding an outer surface of the molding part to shield electromagnetic waves, a mounting part mounted in a mounting area of the substrate part, and at least partially sealed by the molding part, And a ground connection part in contact with an inner surface of the shield and electrically connected to the via hole to electrically connect the shield to the ground.

According to one technical aspect of the present invention, the shielding portion may further surround the side surface of the substrate portion.

According to one technical aspect of the present invention, the ground connection part may be mounted on an edge of a mounting area of the substrate part to be in contact with an inner surface of the shielding part surrounding the molding part and the side surface of the substrate part.

According to one technical aspect of the present invention, the molding part may be formed of an insulating resin, and the shielding part may be formed of a metal film.

According to one technical aspect of the present invention, the ground may be formed in the substrate portion.

Another technical aspect of the present invention is a substrate portion having a mounting region on which an electronic component is mounted, a ground for grounding the electronic component mounted on the mounting region, and a via hole electrically connected to the ground, and the electronics of the substrate portion. A molding part encapsulating the component, a shielding part surrounding the outer surface of the molding part to shield electromagnetic waves, and at least a part of which is embedded in a mounting area of the substrate part and in contact with an inner surface of the shielding part and electrically connected to the via hole. To provide an electronic device having an electromagnetic shielding function characterized in that it comprises a ground connection for electrically connecting the shield and the ground.

Another technical aspect of the present invention is a substrate portion having a mounting region on which an electronic component is mounted, a ground for grounding the electronic component mounted on the mounting region, and a via hole electrically connected to the ground, and the substrate portion. A molding part encapsulating an electronic component, a shielding part surrounding an outer surface of the molding part to shield electromagnetic waves, and a mounting part mounted on the mounting area of the substrate to perform a predetermined electrical operation on the mounting area of the substrate. Is formed and connected by a ground pad and a solder (Solder) electrically connected to the via hole, the solder includes a ground connection component for contacting the inner surface of the shield and electrically connects the shield and the ground An electronic device having an electromagnetic shielding function is provided.

According to the present invention, in order to prevent a short between the electronic components mounted on the substrate, the electronic component is encapsulated with a molding part, the outer surface of the molding part is coated with a metal film, and the metal film is electrically connected to the ground of the substrate through a ground connection part mounted on the substrate. By connecting to the device, the electromagnetic wave of the electronic device can be shielded while satisfying the needs of consumers who request light and small reduction.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a transparent perspective view of an electronic device of the present invention.

Referring to FIG. 1, the electronic device 100 of the present invention includes a substrate part 110 having a mounting area set in advance, and at least one electronic component C is mounted in the mounting area of the substrate part 110. . In addition, the ground connection part 140 is formed in the mounting area.

The electronic device 100 of the present invention described above will be described in more detail with reference to a cross-sectional view taken along the AA ′ rectangle.

FIG. 2 is a cross-sectional view illustrating a first embodiment of the electronic device of the present invention in which the electronic device of FIG. 1 is cut in the AA ′ direction.

1 and 2, the first embodiment 100 of the electronic device of the present invention further includes a molding part 120 and a shielding part 130 in addition to the substrate part 110 and the ground connection part 140. do.

As described above, the substrate unit 110 may include a mounting area in which the electronic component is mounted, and may include a ground G for grounding the electronic component and a via hole B electrically connected to the ground G.

The substrate unit 110 may be a ceramic substrate such as a high temperature co-fired ceramic (HTCC) or a low temperature co-fired ceramic (LTCC), and may further include a multilayer ceramic substrate or multiple printing. It may be a printed circuit board (PCB).

The electronic component C mounted in the mounting area of the substrate 110 may be a multi-layer ceramic capacitor (MLCC) or a chip such as a chip inductor or a chip resistor that performs a predetermined electrical operation. Components, and may include integrated circuits, modules or capacitors, circuit elements such as resistors, and the like. In addition, the electronic component C may form one high frequency module.

The molding part 120 is formed of an insulating resin to encapsulate the electronic component C mounted in the mounting region of the substrate part 110 to prevent short between the electronic components C and to prevent the electronic component C. ) From shocks from the outside.

The molding part 120 may be formed of an epoxy resin or a silicone-based insulating resin, and may be formed to a thickness higher than the electronic part C to protect the electronic part C. .

The shielding unit 130 is formed of a metal film to surround the outer surface of the molding unit 120 and is electrically connected to the ground G of the substrate unit 110 to shield electromagnetic waves. In more detail, the shield 130 may be formed of a metal film including at least one metal of a conductive metal such as copper, gold, or nickel, and the upper and side surfaces of the molding part 120 and the substrate part 110. Can surround the side of the.

The thickness of the shield 130 formed of the metal film may be determined in consideration of a skin depth, and in order to shield electromagnetic waves generated by the electronic component C mounted on the substrate 110, the metal Forming thicker than the surface depth of the conductive metal forming the film is advantageous for electromagnetic shielding.

The ground connector 140 electrically connects the shield 130 and the ground of the substrate 110. Therefore, at least a part of the ground connection part 140 should be in contact with the shielding part 130. Accordingly, the ground connection part 140 is mounted in the mounting area of the substrate part 110, and part of the ground connection part 140 is formed by the molding part 120. Can be encapsulated.

In consideration of the efficient utilization of the mounting area of the substrate unit 110 and the short between the electronic components C, the ground connection unit 140 is preferably mounted at the edge of the mounting area of the substrate unit 110. The via 110 may form a via hole B at an edge of the mounting area in which the ground connection 140 is mounted, and electrically connect the ground connection 140 to an internal ground G of the substrate 110. have. In addition, the ground connection part 140 may be partially opened from the molding part 120 to be in contact with the shielding part 130, and the ground part 140 may be grounded to electrically connect the shielding part 130 to the ground G of the substrate part 110. Naturally, the connection part 140 is formed of a conductive material. In addition, in consideration of efficient utilization of the mounting area, the ground connection part 140 may be partially opened from the side surface of the molding part 120 to be in contact with the shielding part 130. In addition, considering that the larger the ground surface contacted, the easier the electromagnetic shielding, the ground connecting portion 140 may be formed in plurality at the edge of the mounting area.

3 is a cross-sectional view showing a second embodiment of an electronic device of the present invention.

Referring to FIG. 3, in the second embodiment 200 of the electronic device of the present invention, the configuration of the ground connector 240 is distinguished from the first embodiment 100 of the electronic device shown in FIG. 2. Accordingly, the substrate portion 110, the molding portion 120, and the shielding portion 130 of the first embodiment 100 shown in FIG. 2 are the substrate portion 210 of the second embodiment 200 shown in FIG. 3. ), The molding part 220 and the shielding part 230 are the same, so a detailed description thereof will be omitted.

Referring to FIG. 3, at least a part of the ground connection 240 of the second embodiment 200 of the electronic device of the present invention is embedded at the edge of the mounting region of the substrate 210 to efficiently use the mounting region. All of the ground connection part 240 may be embedded in the substrate part 210. In addition, a part of the ground connection part 240 may be opened at the side of the substrate part 210 to be electrically connected to the shielding part 230, and the ground connection part 240 may be electrically connected to the via hole B of the substrate part 210. The via hole B is electrically connected to the ground G formed in the connected substrate part 210, so that the ground filter 240 electrically connects the shield 230 and the ground G.

4 is a cross-sectional view showing a third embodiment of an electronic device of the present invention.

Referring to FIG. 4, the third embodiment 300 of the electronic device of the present invention, unlike the first and second embodiments 100 and 200 illustrated in FIGS. 2 and 3, shows a ground connection component 340. With the exception of the ground connection component 340 described above, the configuration of the ground connection unit 240 is distinguished from the first embodiment 100 of the electronic device shown in FIG. 2. Accordingly, the substrate parts 110 and 210, the molding parts 120 and 220, and the shielding parts 130 and 230 of the first and second embodiments 100 and 200 illustrated in FIGS. 2 and 3 are the third embodiment 300 shown in FIG. 4. Since it is the same as the substrate portion 310, the molding portion 320 and the shielding portion 330 of the) will be omitted a detailed description thereof.

Referring to FIG. 4, in order to use the mounting area efficiently, the third embodiment 300 of the electronic device of the present invention is connected to the ground unlike the first and second embodiments 100 and 200 illustrated in FIGS. 2 and 3. The component 340 may be included.

The ground connection component 340 electrically connects the component main body 341 to perform a predetermined electrical operation, and a part of the component main body 341 and the ground pad P provided in the substrate unit 110. It may be composed of a solder (Solder) 342.

Similarly, the ground connection component 340 may be mounted at the edge of the mounting region of the substrate 310, and the component body 341 of the ground connection component 340 may be encapsulated by the molding unit 320. The solder 342, which electrically connects a part of the component body 341 to the ground pad P, and fixes the component body 341, is partially opened from the molding part 320 so that the shield 330 is formed. Is electrically connected to the In addition, the ground pad P is electrically connected to the ground G inside the substrate 310 through the via hole B. FIG.

As described above, the electronic device of the present invention electrically connects the ground between the metal film and the substrate through a ground connection part or a ground connection part mounted at the edge of the mounting area of the substrate, thereby requesting the consumer to request light and small reduction. It is possible to shield the electromagnetic waves of the electronic device while satisfying.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, but is defined by the claims below, and the configuration of the present invention may be modified in various ways without departing from the technical spirit of the present invention. It will be apparent to those skilled in the art that the present invention may be changed and modified.

1 is a transparent perspective view of an electronic device of the present invention.

FIG. 2 is a cross-sectional view illustrating a first embodiment of the electronic device of the present invention with the electronic device of FIG. 1 cut away in the AA ′ direction. FIG.

3 is a cross-sectional view showing a second embodiment of an electronic device of the present invention.

4 is a sectional view showing a third embodiment of an electronic device of the present invention.

<Detailed Description of Major Symbols in Drawing>

100,200,300 ... electronic device

110,210,310

120,220,320 ... molding part

130,230,330 ... shield

140,240 .... ground connection

340 ... Parts for ground connection

341.Parts body

342 Solder

Claims (15)

A substrate portion having a mounting region on which an electronic component is mounted, a ground for grounding the electronic component mounted on the mounting region, and a via hole electrically connected to the ground; A molding part encapsulating the electronic component of the substrate part; A shielding part surrounding an outer surface of the molding part to shield electromagnetic waves; And A ground connection part mounted in a mounting area of the substrate part to be at least partially encapsulated by the molding part and in contact with an inner surface of the shield part and electrically connected to the via hole to electrically connect the shield part and the ground; Electronic device having an electromagnetic shielding function comprising a. The method of claim 1, And the shielding portion further surrounds a side surface of the substrate portion. The method of claim 2, And the ground connection part is mounted at an edge of a mounting area of the substrate part to be in contact with an inner surface of the shield part surrounding the molding part and the side surface of the substrate part. The method of claim 3, The molding part is formed of an insulating resin, The shielding portion is formed of a metal film, the electronic device having an electromagnetic shielding function. The method of claim 4, wherein The ground has an electromagnetic shielding function, characterized in that formed in the substrate portion. A substrate portion having a mounting region on which an electronic component is mounted, a ground for grounding the electronic component mounted on the mounting region, and a via hole electrically connected to the ground; A molding part encapsulating the electronic component of the substrate part; A shielding part surrounding an outer surface of the molding part to shield electromagnetic waves; And At least a portion of the substrate is buried in a mounting area of the substrate and is in contact with an inner surface of the shield and is electrically connected to the via hole to electrically connect the shield to the ground; Electronic device having an electromagnetic shielding function comprising a. The method of claim 6, And the shielding portion further surrounds a side surface of the substrate portion. The method of claim 7, wherein And the ground connection part is mounted at an edge of a mounting area of the substrate part to be in contact with an inner surface of the shield part surrounding the side surface of the substrate part. The method of claim 8, The molding part is formed of an insulating resin, The shielding portion is formed of a metal film, the electronic device having an electromagnetic shielding function. 10. The method of claim 9, The ground has an electromagnetic shielding function, characterized in that formed in the substrate portion. A substrate portion having a mounting region on which an electronic component is mounted, a ground for grounding the electronic component mounted on the mounting region, and a via hole electrically connected to the ground; A molding part encapsulating the electronic component of the substrate part; A shielding part surrounding an outer surface of the molding part to shield electromagnetic waves; And It is mounted on the mounting area of the substrate to perform a predetermined electrical operation, and is formed on the mounting area of the substrate by the ground pad and electrically connected to the via hole, and the solder is shielded. A ground connection component for electrically connecting the shield and the ground in contact with the inner side of the unit. Electronic device having an electromagnetic shielding function comprising a. The method of claim 11, And the shielding portion further surrounds a side surface of the substrate portion. The method of claim 12, The ground connection component is mounted on the edge of the mounting area of the substrate portion is in contact with the inner surface of the shielding portion surrounding the molding portion and the substrate portion, the electronic device having an electromagnetic shielding function. The method of claim 13, The molding part is formed of an insulating resin, The shielding portion is formed of a metal film, the electronic device having an electromagnetic shielding function. The method of claim 14, The ground has an electromagnetic shielding function, characterized in that formed in the substrate portion.
KR1020090001542A 2009-01-08 2009-01-08 Electronic device with electromagnetic shielding KR101053296B1 (en)

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Application Number Priority Date Filing Date Title
KR1020090001542A KR101053296B1 (en) 2009-01-08 2009-01-08 Electronic device with electromagnetic shielding

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101250665B1 (en) * 2011-09-30 2013-04-03 삼성전기주식회사 Semiconductor package and manufacturing method thereof
KR101300503B1 (en) * 2010-10-12 2013-09-10 삼성전기주식회사 Method of manufacturing block module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101075628B1 (en) 2010-07-15 2011-10-21 삼성전기주식회사 Radio frequency module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135972A (en) * 1999-11-09 2001-05-18 Fujitsu I-Network Systems Ltd Noise reducing shielding case
JP2001244688A (en) * 2000-02-28 2001-09-07 Kyocera Corp High-frequency module component and its manufacturing method
JP2008244289A (en) 2007-03-28 2008-10-09 Mitsubishi Electric Corp Electromagnetic shielding structure
JP2008258478A (en) 2007-04-06 2008-10-23 Murata Mfg Co Ltd Electronic component device and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101300503B1 (en) * 2010-10-12 2013-09-10 삼성전기주식회사 Method of manufacturing block module
KR101250665B1 (en) * 2011-09-30 2013-04-03 삼성전기주식회사 Semiconductor package and manufacturing method thereof

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