KR20100052629A - Light emitted diode light - Google Patents

Light emitted diode light Download PDF

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Publication number
KR20100052629A
KR20100052629A KR1020080111431A KR20080111431A KR20100052629A KR 20100052629 A KR20100052629 A KR 20100052629A KR 1020080111431 A KR1020080111431 A KR 1020080111431A KR 20080111431 A KR20080111431 A KR 20080111431A KR 20100052629 A KR20100052629 A KR 20100052629A
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KR
South Korea
Prior art keywords
led
lighting module
led lighting
pcb
heat sink
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KR1020080111431A
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Korean (ko)
Inventor
양상훈
오수남
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에프씨반도체 주식회사
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Application filed by 에프씨반도체 주식회사 filed Critical 에프씨반도체 주식회사
Priority to KR1020080111431A priority Critical patent/KR20100052629A/en
Priority to PCT/KR2009/003070 priority patent/WO2010055983A1/en
Publication of KR20100052629A publication Critical patent/KR20100052629A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/08—Lighting devices intended for fixed installation with a standard
    • F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • F21S8/086—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

PURPOSE: A light emitted diode light is provided to minimize resource waste by using a movable bracket combined with an LED lighting module and using a conventional frame. CONSTITUTION: An LED package(11) is mounted a PCB(Printed Circuit Board)(12). The one-side of the base heat radiation plate(14) is touched with the bottom of the PCB. The base heat radiation plate transfers the heat from the LED package to the outside. A second radiation plate(16) is touched with the other side of the base heat radiation plate. The second radiation plate comprises a plurality of heat plates(15) which releases the heat through convection. The LED lighting module comprises the bracket(13). The bracket is combined with the frame of an LED lamp and base heat radiation plate through a combination member.

Description

ＬＥＤ 조명등{LIGHT EMITTED DIODE LIGHT}LED light {LIGHT EMITTED DIODE LIGHT}

본 발명은 조명등에 관한 것으로, 더욱 상세하게는 소비전력 및 열발생을 최소화하고, 기존 프레임을 그대로 유지하면서 LED 점등모듈만을 교체할 수 있도록 한 LED 조명등에 관한 것이다.The present invention relates to a lamp, and more particularly, to minimize the power consumption and heat generation, and to an LED lamp to replace only the LED lighting module while maintaining the existing frame.

조명등은 백열등 또는 형광등과 같은 일반적인 조명등을 비롯하여 사용 용도 및 장소에 따라 다양한 조명등이 있다.Illumination lamps include general lighting such as incandescent or fluorescent lamps, and various lightings depending on the use purpose and location.

그 중 일례로 가로등은 나트륨 램프 및 수은 램프 등의 여러 가지 램프를 이용하여 광범위한 영역을 조명하게 되는데, 이 나트륨 램프 및 수은 램프는 고역률인 관계로 일출 및 일몰 시간의 통계에 따라 점소등이 이루어지게 되며, 점차적으로 해당 조도의 밝기에 이르러 넓은 영역을 조명하게 된다.For example, street lamps use a variety of lamps, such as sodium lamps and mercury lamps, to illuminate a wide range of areas. These sodium lamps and mercury lamps have a high power factor. It gradually illuminates a large area by reaching the brightness of the corresponding illuminance.

그런데, 이와 같은 가로등은 해당 조도에 이르게 되면, 소비전력이 과다해지고 이와 함께 온도가 상승하여 열로 인한 램프 및 주변부품의 열화가 발생하는 문제점이 있다.By the way, when the street lamp reaches the illuminance, the power consumption is excessive and the temperature rises together with deterioration of the lamp and the peripheral parts due to heat.

이에 소비전력 및 열발생 최소화를 위해 LED 조명등이 제안되고 있으며, 최근 많이 보급되고 있다.In order to minimize power consumption and heat generation, LED lamps have been proposed, and recently, they have been widely used.

그러나, 이 LED 조명등 역시 열발생으로 인한 LED 패키지 및 주변부품의 열화문제를 해결해야 하는 과제를 안고 있으며, 또한 기존 조명등을 LED 조명등으로 교체함에 따른 비용이 많이 소요되는 문제점이 있다. 즉, LED 조명등으로의 교체는 실질적으로 점등모듈과 이를 지지하는 프레임 모두를 포함하는 조명등 전체의 교체를 의미하므로 자원 낭비로 이어지는 문제점이 있다. 이에 기존 장비를 그대로 이용하면서 LED 점등모듈만 교체할 수 있는 방안이 필요하다할 것이다.However, this LED lamp also has a problem to solve the problem of deterioration of the LED package and peripheral components due to heat generation, there is also a problem that the cost of replacing the existing lamp with an LED lamp is expensive. That is, the replacement of the LED lamp means a replacement of the entire lamp including both the lighting module and the frame supporting it, which leads to a waste of resources. Therefore, it would be necessary to replace the LED lighting module with existing equipment.

한편, 가로등과 같이 밝은 조도가 필요한 조명등의 경우에는 비교적 높은 전압 및 전류가 필요함에 따라 안정적인 전력공급이 함께 수반되어야 한다. 그러므로 LED 조명등으로의 교체에 있어, 비교적 많은 수로 실장되는 LED 패키지의 그룹으로 이루어진 LED 조명등은 더 더욱 안정적인 전력공급이 선행되어야 하는 문제점이 있다.On the other hand, in the case of a lamp having a bright illuminance, such as a street lamp, a relatively high voltage and current need to be accompanied with a stable power supply. Therefore, in the replacement of the LED lamp, the LED lamp made of a group of relatively large number of LED package has a problem that more stable power supply must be preceded.

따라서, 본 발명은 상기한 종래 기술의 문제점을 해결하기 위해 이루어진 것으로서, 본 발명의 목적은 열발생을 효율적으로 감소시키기 위해 2중으로 방열판을 형성시키고, 비교적 많은 수로 실장되는 LED 패키지로 안정적인 전력을 공급하기 위해 승압부 및 정전류 공급부를 포함하는 제어회로를 마련함과 아울러, 기존 프레임을 최대한 이용하기 위해 LED 점등모듈에 체결된 브래킷을 기존 프레임에 대응하여 이동고정할 수 있도록 한 LED 조명등을 제공하는데 있다.Accordingly, the present invention has been made to solve the above problems of the prior art, an object of the present invention is to form a heat sink in a double to efficiently reduce heat generation, supplying a stable power to a relatively large number of LED package mounted In order to provide a control circuit including a boosting unit and a constant current supply unit, and in order to maximize the use of the existing frame to provide an LED lamp that can be fixed to move the bracket fastened to the LED lighting module corresponding to the existing frame.

상기와 같은 목적을 달성하기 위한 본 발명의 LED 조명등은, LED 패키지가 실장되며, 회로가 인쇄된 PCB; 상기 PCB 저면에 일면이 접촉되어 상기 LED 패키지로부터 발생된 열을 전도시키는 베이스 방열판; 상기 베이스 방열판의 타면에 접촉되어 전도된 열을 대류시켜 방출시키는 다수의 방열 플레이트를 형성시킨 2차 방열판; 상기 PCB 상면에 배치되는 투명커버; 및 결합부재에 의해 LED 조명등의 프레임 및 상기 베이스 방열판에 결합되는 브래킷을 포함하는 LED 점등모듈을 포함하여 이루어진 것을 특징으로 한다.LED lamp of the present invention for achieving the above object, the LED package is mounted, the circuit printed circuit board; A base heat dissipation plate having one surface in contact with the bottom surface of the PCB to conduct heat generated from the LED package; A secondary heat sink configured to form a plurality of heat dissipation plates contacting the other surface of the base heat sink to condense and radiate the conducted heat; A transparent cover disposed on the upper surface of the PCB; And an LED lighting module including a bracket coupled to the frame and the base heat sink of the LED lamp by the coupling member.

이때, 상기 LED 점등모듈은, 상기 LED 패키지로부터 발산된 광을 설정 각도로 지향시키며, 상기 PCB와 투명커버 사이에 설치된 반사경을 더 포함하는 것이 바람직하며, 상기 투명커버는 반사경에 대응하는 영역에 렌즈를 형성시킨 것이 더욱 바람직할 것이다.At this time, the LED lighting module, directing the light emitted from the LED package at a set angle, preferably further comprises a reflector provided between the PCB and the transparent cover, the transparent cover is a lens in the area corresponding to the reflector More preferably.

또한, 상기 브래킷은 결합부재가 상기 프레임 및 베이스 방열판의 임의의 위치에 이동고정될 수 있도록 하는 장공을 형성시킨 것이 바람직하다.In addition, the bracket is preferably formed to form a long hole so that the coupling member can be moved to any position of the frame and the base heat sink.

그리고, 상기 LED 점등모듈은 전원공급부로부터 공급된 전원을 하네스를 통해 다수개 접속되어 해당 밝기에 대응하며, 상기 LED 점등모듈 각각의 PCB에는, 전원공급부로부터 전달된 전압을 승압시키는 전해콘덴서; 상기 LED 패키지에서 필요로 하는 전류값을 조절하는 제1저항 내지 제3저항; 상기 제1저항 내지 제3저항에 대응하는 PWM(PULSE WIDTH MODULATION) 제어를 통해 출력 전류량을 조절하는 IC칩; 및 상기 IC칩 출력단과 LED 패키지에 접속된 코일을 형성시킨다.In addition, the LED lighting module is connected to a plurality of power supplied from the power supply through the harness to correspond to the corresponding brightness, each of the LED lighting module PCB, an electrolytic capacitor for boosting the voltage transmitted from the power supply; First to third resistors for adjusting a current value required by the LED package; An IC chip configured to adjust an output current amount through PWM control corresponding to the first to third resistors; And a coil connected to the IC chip output terminal and the LED package.

상술한 바와 같이, 본 발명에 의한 LED 조명등은 다음과 같은 효과가 있다.As described above, the LED lamp according to the present invention has the following effects.

첫째, 2중 방열판의 구조(직접방열과 간접방열)를 통해 효과적으로 발생된 열을 방출시킴으로써 LED 점등모듈 및 주변부품의 수명을 연장시킬 수 있다.First, by effectively dissipating heat generated through the structure of the double heat sink (direct heat and indirect heat) can extend the life of the LED lighting module and peripheral components.

둘째, LED 점등모듈에 체결된 이동 가능한 브래킷을 이용함으로써 다양한 구조를 갖는 프레임에 적용할 수 있을 뿐만 아니라, 기존 프레임을 최대한 활용할 수 있으므로 자원낭비를 최소화할 수 있다.Second, by using the movable bracket fastened to the LED lighting module can be applied to a frame having a variety of structures, it can minimize the waste of resources because it can make the most of the existing frame.

셋째, LED 패키지에 안정적인 전력이 공급됨에 따라 사용 용도에 따른 서로 다른 밝기의 LED 조명등에 용이하게 대응할 수 있다.Third, as the stable power is supplied to the LED package, it is possible to easily cope with the LED lamps of different brightness according to the intended use.

이하, 본 발명의 LED 조명등에 대하여 첨부된 도면을 참조하여 상세히 설명하기로 한다.Hereinafter, with reference to the accompanying drawings for the LED lamp of the present invention will be described in detail.

도 1은 본 발명의 제1실시예에 의한 LED 점등모듈의 사시도이고, 도 2는 본 발명의 제1실시예에 의한 LED 점등모듈의 분해사시도이며, 도 3은 본 발명의 제1실시예에 의한 LED 점등모듈의 측면도이다.1 is a perspective view of the LED lighting module according to the first embodiment of the present invention, Figure 2 is an exploded perspective view of the LED lighting module according to the first embodiment of the present invention, Figure 3 is a first embodiment of the present invention Side view of LED lighting module.

도 1 내지 도 3에 도시된 바와 같이, 본 발명의 LED 점등모듈(1)은, LED 패키지(11)가 실장되며, 회로가 인쇄된 PCB(Printed Circuit Board)(12)와, LED 조명등의 프레임에 고정되는 브래킷(13)이 고정결합되며, PCB(12) 저면에 일면이 접촉되어 LED 패키지(11)로부터 발생된 열을 전도시키는 베이스 방열판(14)과, 이 베이스 방열판(14)의 타면에 접촉되어 전도된 열을 대류시켜 방출시키는 다수의 방열 플레이트(15)를 형성시킨 2차 방열판(16)과, LED 패키지(11)가 실장된 PCB(12) 상면에 설치되어 LED 패키지(11)로부터 발산된 광을 설정 각도로 지향시키는 반사경(17)과, 반사경 상면에 부착된 투명커버(18)로 구성되어 있다.As shown in Figures 1 to 3, the LED lighting module 1 of the present invention, the LED package 11 is mounted, a printed circuit board (PCB) 12, the circuit is printed, and a frame such as LED lighting A bracket 13 fixed to the base is fixedly coupled to one side of the bottom surface of the PCB 12 and the base heat sink 14 conducts heat generated from the LED package 11 and the other surface of the base heat sink 14. The secondary heat sink 16 formed with a plurality of heat dissipation plates 15 for convectively dissipating and conducting heat, which is in contact with the LED package 11, is installed on the upper surface of the PCB 12 on which the LED package 11 is mounted, A reflector 17 for directing the emitted light at a set angle and a transparent cover 18 attached to the upper surface of the reflector.

이때, 2차 방열판(16)의 방열 플레이트(15)는 천공되어 있는 것이 바람직하다.At this time, the heat dissipation plate 15 of the secondary heat dissipation plate 16 is preferably perforated.

또한, 반사경(17)과 투명커버(18)는 기둥나사(19)를 개재하여 베이스 방열판(14)에 결합되며, 기둥나사(19)의 길이는 반사경(17)의 높이와 동일하게 하는 것이 바람직하다. 투명커버(18)에는 광의 직진성을 향상시키기 위해 렌즈를 형성시키는 것도 바람직하다.In addition, the reflector 17 and the transparent cover 18 are coupled to the base heat sink 14 via the column screw 19, the length of the column screw 19 is preferably equal to the height of the reflector 17. Do. It is also preferable to form a lens in the transparent cover 18 to improve the straightness of the light.

그리고, LED 점등모듈(1)을 기존 프레임에 고정시키기 위한 브래킷(13)이 베이스 방열판(16)에 체결되어 있으며, 이 브래킷(13)은 기존 프레임의 구조를 고려하여 위치 조절이 가능한 홈을 형성시키고 있다. 즉, 브래킷(13)에 형성된 홈(장공)은 나사가 기존 프레임 또는 베이스 방열판(14)에 결합될 때 상하좌우로 조절하여 결합될 수 있도록 형성되어 있다.In addition, a bracket 13 for fixing the LED lighting module 1 to the existing frame is fastened to the base heat sink 16, and the bracket 13 forms a groove which can be adjusted in position in consideration of the structure of the existing frame. I'm making it. That is, the groove (hole) formed in the bracket 13 is formed so that the screw can be adjusted by adjusting up, down, left and right when coupled to the existing frame or base heat sink (14).

이와 같이, 베이스 방열판(14)을 통한 직접방열 방식과 베이스 방열판(14)에 접촉된 2차 방열판(16)을 통한 간접방열 방식에 의해 방열효율을 높일 수 있다.As such, the heat dissipation efficiency can be increased by the direct heat dissipation method through the base heat sink 14 and the indirect heat dissipation method through the secondary heat sink 16 in contact with the base heat sink 14.

도 4는 본 발명의 제2실시예에 의한 LED 점등모듈의 사시도이고, 도 5는 본 발명의 제2실시예에 의한 LED 점등모듈의 분해사시도이며, 도 6은 본 발명의 제2실시예에 의한 LED 점등모듈의 측면도이다.Figure 4 is a perspective view of the LED lighting module according to a second embodiment of the present invention, Figure 5 is an exploded perspective view of the LED lighting module according to a second embodiment of the present invention, Figure 6 is a second embodiment of the present invention Side view of LED lighting module.

제2실시예의 도면에 있어 제1실시예와 동일한 구성요소에 대해서는 동일 참조번호를 부여하기로 한다.In the drawings of the second embodiment, the same components as those of the first embodiment will be given the same reference numerals.

도 4 내지 도 6에 도시된 바와 같이, 본 발명의 LED 점등모듈(2)은, LED 패키지(11)가 실장되며, 회로가 인쇄된 PCB(12)와, LED 조명등의 프레임에 고정되는 브래킷(13)이 고정결합되며, PCB(12) 저면에 일면이 접촉되어 LED 패키지(11)로부터 발생된 열을 전도시키는 베이스 방열판(14)과, 이 베이스 방열판(14)의 타면에 접촉되어 전도된 열을 대류시켜 방출시키는 다수의 방열 플레이트(15)를 형성시킨 2차 방열판(16)과, 기둥나사(19)를 개재하여 LED 패키지(11)와 일정 간격을 갖고 LED 패키지(11)가 실장된 PCB(12) 상면에 설치되는 투명커버(18)로 구성되어 있다.As shown in Figures 4 to 6, the LED lighting module 2 of the present invention, the LED package 11 is mounted, the circuit board printed circuit board 12 and the bracket is fixed to the frame of the LED lamp ( 13) is fixedly coupled, the base heat sink 14 which is in contact with the bottom surface of the PCB 12 to conduct heat generated from the LED package 11, and the heat is brought into contact with the other surface of the base heat sink 14 PCB in which the LED package 11 is mounted at a predetermined distance from the LED package 11 through the secondary heat sink 16 having a plurality of heat dissipation plates 15 for convexing and discharging the same. (12) It is comprised by the transparent cover 18 provided in the upper surface.

즉, 제1실시예와 대비하여 반사경을 포함하지 않는 경우이다.In other words, it does not include the reflector as compared with the first embodiment.

이때, 2차 방열판(16)의 방열 플레이트(15)는 천공되어 있는 것이 바람직하다.At this time, the heat dissipation plate 15 of the secondary heat dissipation plate 16 is preferably perforated.

또한, 투명커버(18)에는 광의 직진성을 향상시키기 위해 렌즈를 형성시키는 것도 바람직하다.In addition, it is also preferable to form a lens in the transparent cover 18 to improve the straightness of the light.

그리고, LED 점등모듈(2)을 기존 프레임에 고정시키기 위한 브래킷(13)이 베이스 방열판(14)에 체결되어 있으며, 이 브래킷(13)은 기존 프레임의 구조를 고려하여 위치 조절이 가능한 홈을 형성시키고 있다. 즉, 브래킷(13)에 형성된 홈(장공)은 나사가 기존 프레임 또는 베이스 방열판(14)에 결합될 때 상하좌우로 조절하여 결합될 수 있도록 형성되어 있다.In addition, a bracket 13 for fixing the LED lighting module 2 to the existing frame is fastened to the base heat sink 14, and the bracket 13 forms a groove which can be adjusted in position in consideration of the structure of the existing frame. I'm making it. That is, the groove (hole) formed in the bracket 13 is formed so that the screw can be adjusted by adjusting up, down, left and right when coupled to the existing frame or base heat sink (14).

도 7은 본 발명의 제3실시예에 의한 LED 점등모듈의 사시도이고, 도 8은 본 발명의 제4실시예에 의한 LED 점등모듈의 사시도이다.7 is a perspective view of the LED lighting module according to the third embodiment of the present invention, Figure 8 is a perspective view of the LED lighting module according to the fourth embodiment of the present invention.

도 7에 도시된 바와 같이, 제1실시예 및 제2실시예에서 제시한 투명커버에 형성된 렌즈를 제거하고 판형의 투명부재를 투명커버로 이용할 수 있으며, 도 8에 도시된 바와 같이, 투명커버를 제거한 상태의 LED 점등모듈을 구성할 수도 있다.As shown in FIG. 7, the lens formed on the transparent covers shown in the first and second embodiments may be removed, and a plate-shaped transparent member may be used as the transparent cover. As shown in FIG. 8, the transparent cover You can also configure the LED lighting module with the state removed.

도 9는 본 발명의 제1실시예에 의한 LED 점등모듈이 다수개 적용된 경우를 나타낸 사시도이다.9 is a perspective view showing a case where a plurality of LED lighting module according to the first embodiment of the present invention is applied.

도 9에 도시된 바와 같이, 다수개의 LED 점등모듈(1)이 하나의 모듈을 이룰 경우에는 베이스 방열판(14) 또는 2차 방열판(16)이 일체로 형성된 것을 이용하는 것이 바람직할 것이다. 본 실시예에서는 2차 방열판(16)을 일체로 형성한 일례를 제시하고 있다.As illustrated in FIG. 9, when the plurality of LED lighting modules 1 form one module, it may be preferable to use the base heat sink 14 or the secondary heat sink 16 integrally formed. In this embodiment, an example in which the secondary heat sink 16 is integrally formed is shown.

미도시되었으나, 베이스 방열판을 일체로 형성할 경우에, 기존 가로등 프레임 내부의 형태에 대응하여 용이하게 제작할 수 있으므로 LED 패키지가 실장된 PCB의 개수를 임의로 조절하여 밝기(용량)를 용이하게 조절할 수 있다. 즉, 베이스 방열판에 결합되는 브래킷이 기존 가로등 프레임 내부에 용이하게 결합됨으로써 기존 가로등 프레임에 대한 호환성을 높일 수 있다.Although not shown, when the base heat sink is integrally formed, it can be easily manufactured to correspond to the shape of the existing street light frame so that the brightness (capacity) can be easily adjusted by arbitrarily adjusting the number of PCBs on which the LED package is mounted. . That is, the bracket coupled to the base heat sink can be easily coupled to the inside of the existing streetlight frame to increase the compatibility with the existing streetlight frame.

한편, 본 실시예에서는 제1실시예에서 제시한 LED 점등모듈이 적용된 경우만 제시하였으나, 제2실시예 내지 제4실시예에서 제시한 LED 점등모듈도 다수개 적용될 수 있을 것이다.Meanwhile, in the present embodiment, only the LED lighting module presented in the first embodiment is applied, but a plurality of the LED lighting modules shown in the second to fourth embodiments may also be applied.

도 10은 본 발명의 제1실시예에 의한 LED 점등모듈이 가로등 프레임에 적용된 경우의 사시도이다.10 is a perspective view when the LED lighting module according to the first embodiment of the present invention is applied to a street lamp frame.

도 10에 도시된 바와 같이, 기존 가로등 프레임에 형성된 홀에 브래킷(13)을 조절하여 결합함으로써 기존 램프를 LED 점등모듈(1)로 용이하게 교체할 수 있다.As shown in FIG. 10, by adjusting and coupling the bracket 13 to the hole formed in the existing street light frame, the existing lamp may be easily replaced with the LED lighting module 1.

도 11은 본 발명의 일실시예에 의한 LED 점등모듈의 회로도이다.11 is a circuit diagram of the LED lighting module according to an embodiment of the present invention.

도 11에 도시된 바와 같이, 본 발명의 LED 점등모듈의 회로는, 외부 교류전원을 공급받아 직류전원으로 변환하여 출력시키는 전원공급부(4)와, 전원공급부(4) 로부터 출력된 직류전원을 공급받아 전압을 상승시킴과 아울러 LED 패키지(11)에서 필요로 하는 전류의 정밀한 제어를 수행하는 제어부(5)와, 제어부(5)에서 공급되는 전류에 의해 점등이 이루어지는 점등부(6)로 이루어져 있다.As shown in FIG. 11, the circuit of the LED lighting module of the present invention, the power supply unit 4 for receiving the external AC power is converted to a DC power supply and outputs the DC power output from the power supply unit 4 It is composed of a control unit 5 for increasing the voltage and precisely controlling the current required by the LED package 11, and a lighting unit 6 that lights up by the current supplied from the control unit 5. .

전원공급부(4)는 SMPS(SWITCHING-MODE POWER SUPPLY)를 이용한다.The power supply unit 4 uses a switch-mode power supply (SMPS).

제어부(5)는, 도 2 및 도 4에 도시된 바와 같이 5개의 LED 패키지(11)를 하나의 그룹으로 하여 3개의 그룹이 하나의 모듈을 형성할 경우에, 이들 각 그룹에 공급되는 전류를 제어하는 컨트롤러(51, 52, 53)를 각각 마련하고 있다.As shown in FIGS. 2 and 4, the control unit 5 uses the five LED packages 11 as one group, and when three groups form one module, the control unit 5 supplies the current supplied to each group. The controllers 51, 52, and 53 which control are provided, respectively.

이 컨트롤러(51, 52, 53) 각각은, 전원공급부(4)로부터 전달된 전압을 승압시키는 전해콘덴서(C1)와, LED 패키지(11)에서 필요로 하는 전류값을 조절하는 3개의 저항(R1, R2, R3)과, 쇼트키 다이오드(D)와, 세라믹 콘덴서(C2)와, PWM(PULSE WIDTH MODULATION) 제어를 통해 출력 전류량을 조절하는 IC칩(IC)과, 코일(L)로 구성되어 있다. 즉, 기존에는 1개의 저항을 이용하여 전류값을 조절하였으나, 본 발명에서는 3개의 저항(R1, R2, R3)과 이들 저항값에 대응하여 PWM 제어를 수행하는 IC칩(IC)을 결합시킴으로써 LED 패키지(11)에 안정된 전류값을 공급할 수 있다.Each of the controllers 51, 52, and 53 includes an electrolytic capacitor C1 for boosting the voltage transmitted from the power supply unit 4, and three resistors R1 for adjusting the current value required by the LED package 11. , R2, R3), Schottky diode (D), ceramic capacitor (C2), IC chip (IC) for adjusting output current amount through PWM (PULSE WIDTH MODULATION) control, and coil (L) have. That is, in the past, the current value was adjusted by using one resistor, but in the present invention, the LED is connected by combining three resistors (R1, R2, R3) and an IC chip (IC) that performs PWM control in response to these resistance values. A stable current value can be supplied to the package 11.

점등부(6)는 LED 패키지(11)의 그룹을 의미한다.The lighting unit 6 means a group of the LED package 11.

도 12는 2개의 LED 점등모듈이 하네스를 이용하여 연결된 경우의 회로개념도이다. 도 12는 2개의 LED 점등모듈이 연결된 경우의 회로만 제시하고 있으나, 전원공급부(4)의 출력단에 접속되는 하네스(7)를 통해 다수의 LED 점등모듈이 연결될 수 있다.12 is a circuit diagram in which two LED lighting modules are connected using a harness. FIG. 12 shows only a circuit when two LED lighting modules are connected, but a plurality of LED lighting modules may be connected through a harness 7 connected to an output terminal of the power supply unit 4.

이상에서 몇 가지 실시예를 들어 본 발명을 더욱 상세하게 설명하였으나, 본 발명은 반드시 이러한 실시예로 국한되는 것이 아니고 본 발명의 기술사상을 벗어나지 않는 범위 내에서 다양하게 변형실시될 수 있다.Although the present invention has been described in more detail with reference to some embodiments, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention.

도 1은 본 발명의 제1실시예에 의한 LED 점등모듈의 사시도이다.1 is a perspective view of an LED lighting module according to a first embodiment of the present invention.

도 2는 본 발명의 제1실시예에 의한 LED 점등모듈의 분해사시도이다.2 is an exploded perspective view of the LED lighting module according to the first embodiment of the present invention.

도 3은 본 발명의 제1실시예에 의한 LED 점등모듈의 측면도이다.3 is a side view of the LED lighting module according to the first embodiment of the present invention.

도 4는 본 발명의 제2실시예에 의한 LED 점등모듈의 사시도이다.4 is a perspective view of the LED lighting module according to a second embodiment of the present invention.

도 5는 본 발명의 제2실시예에 의한 LED 점등모듈의 분해사시도이다.5 is an exploded perspective view of the LED lighting module according to the second embodiment of the present invention.

도 6은 본 발명의 제2실시예에 의한 LED 점등모듈의 측면도이다.6 is a side view of the LED lighting module according to the second embodiment of the present invention.

도 7은 본 발명의 제3실시예에 의한 LED 점등모듈의 사시도이다.(추가)7 is a perspective view of an LED lighting module according to a third embodiment of the present invention.

도 8은 본 발명의 제4실시예에 의한 LED 점등모듈의 사시도이다.(추가)8 is a perspective view of an LED lighting module according to a fourth embodiment of the present invention.

도 9는 본 발명의 제1실시예에 의한 LED 점등모듈이 다수개 적용된 경우를 나타낸 사시도이다.9 is a perspective view showing a case where a plurality of LED lighting module according to the first embodiment of the present invention is applied.

도 10은 본 발명의 제1실시예에 의한 LED 점등모듈이 가로등 프레임에 적용된 경우의 사시도이다.10 is a perspective view when the LED lighting module according to the first embodiment of the present invention is applied to a street lamp frame.

도 11은 본 발명의 일실시예에 의한 LED 점등모듈의 회로도이다.11 is a circuit diagram of the LED lighting module according to an embodiment of the present invention.

도 12는 2개의 LED 점등모듈이 하네스를 이용하여 연결된 경우의 회로도이다.12 is a circuit diagram when two LED lighting modules are connected by using a harness.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

1, 2 : LED 점등모듈 11 : LED 패키지1, 2: LED lighting module 11: LED package

12 : PCB 13 : 브래킷12: PCB 13: Bracket

14 : 베이스 방열판 15 : 방열 플레이트14 base heat sink 15 heat sink plate

16 : 2차 방열판 17 : 반사경16: secondary heat sink 17: reflector

18 : 투명커버 19 : 결합나사18: transparent cover 19: coupling screw

4 : 전원공급부 5 : 제어부4: power supply unit 5: control unit

51, 52, 53 : 컨트롤러 6 : 점등부51, 52, 53: controller 6: lighting unit

7 : 하네스7: harness

Claims (7)

LED 패키지가 실장되며, 회로가 인쇄된 PCB;A PCB with an LED package mounted thereon and a circuit printed thereon; 상기 PCB 저면에 일면이 접촉되어 상기 LED 패키지로부터 발생된 열을 전도시키는 베이스 방열판;A base heat dissipation plate having one surface in contact with the bottom surface of the PCB to conduct heat generated from the LED package; 상기 베이스 방열판의 타면에 접촉되어 전도된 열을 대류시켜 방출시키는 다수의 방열 플레이트를 형성시킨 2차 방열판; 및A secondary heat sink configured to form a plurality of heat dissipation plates contacting the other surface of the base heat sink to condense and radiate the conducted heat; And 결합부재에 의해 LED 조명등의 프레임 및 상기 베이스 방열판에 결합되는 브래킷을 포함하는 LED 점등모듈을 포함하는 것을 특징으로 하는 LED 조명등.LED lighting module comprising a LED lighting module comprising a frame coupled to the base heat sink and the frame of the LED lamp by the coupling member. 제1항에 있어서, 상기 PCB 상면에 배치되는 투명커버를 더 포함하는 것을 특징으로 하는 LED 조명등.The LED lamp of claim 1, further comprising a transparent cover disposed on the upper surface of the PCB. 제2항에 있어서, 상기 LED 점등모듈은, 상기 LED 패키지로부터 발산된 광을 설정 각도로 지향시키며, 상기 PCB와 투명커버 사이에 설치된 반사경을 더 포함하는 것을 특징으로 하는 LED 조명등.The LED lamp of claim 2, wherein the LED lighting module further comprises a reflector disposed between the PCB and the transparent cover to direct light emitted from the LED package at a predetermined angle. 제2항 또는 제3항에 있어서, 상기 투명커버는 LED 패키지에 대응하는 영역에 렌즈를 형성시킨 것을 특징으로 하는 LED 조명등.The LED lamp of claim 2 or 3, wherein the transparent cover has a lens formed in an area corresponding to the LED package. 제1항에 있어서, 상기 브래킷은 결합부재가 상기 프레임 및 베이스 방열판의 임의의 위치에 이동고정될 수 있도록 하는 장공을 형성시킨 것을 특징으로 하는 LED 조명등.The LED lamp of claim 1, wherein the bracket forms a long hole for allowing the coupling member to be fixed to an arbitrary position of the frame and the base heat sink. 제1항에 있어서, 상기 LED 점등모듈은 전원공급부로부터 공급된 전원을 하네스를 통해 다수개 접속되어 해당 밝기에 대응하는 것을 특징으로 하는 LED 조명등.The LED lamp of claim 1, wherein the LED lighting module is connected to a plurality of powers supplied from a power supply unit through a harness to correspond to the corresponding brightness. 제6항에 있어서, 상기 LED 점등모듈 각각의 PCB에는,According to claim 6, Each of the LED lighting module PCB, 전원공급부로부터 전달된 전압을 승압시키는 전해콘덴서;An electrolytic capacitor for boosting the voltage transmitted from the power supply unit; 상기 LED 패키지에서 필요로 하는 전류값을 조절하는 제1저항 내지 제3저항;First to third resistors for adjusting a current value required by the LED package; 상기 제1저항 내지 제3저항에 대응하는 PWM(PULSE WIDTH MODULATION) 제어를 통해 출력 전류량을 조절하는 IC칩; 및An IC chip configured to adjust an output current amount through PWM control corresponding to the first to third resistors; And 상기 IC칩 출력단과 LED 패키지에 접속된 코일을 형성시킨 것을 특징으로 하 는 LED 조명등.An LED lamp, characterized in that to form a coil connected to the IC chip output terminal and the LED package.
KR1020080111431A 2008-11-11 2008-11-11 Light emitted diode light KR20100052629A (en)

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Cited By (3)

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CN102783251A (en) * 2011-02-25 2012-11-14 宇理照明(株) Lighting apparatus having PN junction semiconductor light-emitting element and method for illuminating same
US8492981B2 (en) 2011-02-25 2013-07-23 Wooree Lighting Co., Ltd. Lighting apparatus using PN junction light-emitting element
US8531117B2 (en) 2011-02-25 2013-09-10 Wooree Lighting Co., Ltd. Lighting apparatus using PN junction light-emitting element

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CN102537697A (en) * 2010-12-21 2012-07-04 格拉维顿莱特有限公司 Illuminating device and assembling method
CN108488642A (en) * 2018-05-25 2018-09-04 深圳市明微电子股份有限公司 A kind of light emitting diode illuminating apparatus and light emitting diode

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JP4527024B2 (en) * 2005-07-28 2010-08-18 株式会社小糸製作所 Vehicle lighting
KR20080010904A (en) * 2006-07-28 2008-01-31 주식회사 씨쎄븐 Illuminating device with a built in light emitting device, bracket and assembly
KR100903305B1 (en) * 2007-04-17 2009-06-16 주식회사 대진디엠피 Led lighting apparatus
KR101019624B1 (en) * 2007-04-27 2011-03-07 김태완 Lighting Apparatus Using LED

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CN102783251A (en) * 2011-02-25 2012-11-14 宇理照明(株) Lighting apparatus having PN junction semiconductor light-emitting element and method for illuminating same
US8471481B2 (en) 2011-02-25 2013-06-25 Wooree Lighting Co., Ltd. Lighting apparatus using PN junction light-emitting element and dimming method thereof
US8492981B2 (en) 2011-02-25 2013-07-23 Wooree Lighting Co., Ltd. Lighting apparatus using PN junction light-emitting element
US8531117B2 (en) 2011-02-25 2013-09-10 Wooree Lighting Co., Ltd. Lighting apparatus using PN junction light-emitting element
CN102783251B (en) * 2011-02-25 2016-03-02 宇理照明(株) The light-dimming method of PN junction semiconductor light-emitting elements lighting device

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