KR20100008733A - Heat sink with compound material having covalent bond carbon nanotube - Google Patents
Heat sink with compound material having covalent bond carbon nanotube Download PDFInfo
- Publication number
- KR20100008733A KR20100008733A KR1020080069346A KR20080069346A KR20100008733A KR 20100008733 A KR20100008733 A KR 20100008733A KR 1020080069346 A KR1020080069346 A KR 1020080069346A KR 20080069346 A KR20080069346 A KR 20080069346A KR 20100008733 A KR20100008733 A KR 20100008733A
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- KR
- South Korea
- Prior art keywords
- metal
- heat sink
- carbon nanotubes
- composite material
- heat
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
Abstract
The heat sink of the present invention is composed of a thermally conductive composite material in which carbon nanotubes and one or more metal-based elements are covalently bonded to each other to have a stable structure that is not easily damaged or deformed even in an operating environment to which excessive thermal stress is applied. . Metal-based elements to which the carbon nanotubes are covalently bonded include, for example, a pure metal of aluminum, copper, silver, iron, or an alloy based on one or more selected thereof, or a composite composed of them. The composite material may be manufactured by a method of covalently bonding carbon nanotubes and metal-based elements through a pretreatment process of carbon nanotubes and metal-based elements, and further dissolving the carbon nanotubes and metal-based elements in a corresponding metal. Such a thermally conductive composite material has a large mechanical strength, such as steel, while reducing the weight by 20% or more, thereby reducing the weight of the mounted product. Heat sinks made of a thermally conductive composite material having these characteristics are mounted on various devices to enable stable operation of the corresponding devices. Such a heat sink may be composed of, for example, a heat sink, a radiator, a heat radiation pipe, and the like, as described in the following embodiments.
Description
The present invention relates to a heat sink for heat dissipation or heat absorption, and more particularly, to a heat sink made of a thermally conductive composite material in which carbon nanotubes and one or more metal-based elements are covalently bonded.
Various types of heat sinks are used from home to industrial use. For example, a CPU (Central Processing Unit) mounted in a computer system must be equipped with a cooling plate or a heat sink because high heat is generated by a high speed operation. Depending on the type of refrigerant, there are air cooling methods and water cooling methods. Heat sinks are used as devices for heat generation or heat absorption in heating and cooling systems. For example, in the case of a radiator, heat is radiated from a surface heated by hot water, or a special oil is heated to radiate heat from the surface. In the case of a domestic boiler system, a heat radiating pipe is embedded inside an ondol floor, and hot water flows through the buried radiant pipe to heat the floor.
Such various types of heat sinks are used. Since the heat sinks are directly exposed to the surrounding environment, the heat sinks should be highly robust and not easily deformed or damaged by thermal stress. In addition, the weight is not heavy, so it is better not to weigh the final product. There is a need for a new heat sink that meets these conditions.
SUMMARY OF THE INVENTION An object of the present invention is to provide a heat sink composed of a thermally conductive composite material in which carbon nanotubes and one or more metal-based elements are covalently bonded to carbon nanotubes, which are not easily deformed or damaged by thermal stress, and which are durable and lightweight. It is.
One aspect of the present invention for achieving the above technical problem relates to a heat sink. The heat sink of the present invention has a heat dissipation surface for dissipating or absorbing heat, and the heat dissipation surface is composed of a composite material in which carbon nanotubes and one or more metal-based elements are covalently bonded.
In one embodiment, the metal-based element includes a pure metal of aluminum, copper, silver, iron, or an alloy based on one or more selected thereof, or a composite composed thereof.
According to the heat sink composed of a composite material having a covalently bonded carbon nanotube of the present invention, a heat sink composed of a thermally conductive composite material has a large mechanical strength, such as steel, while reducing the weight by 20% or more. The weight can be reduced. Heat sinks made of a thermally conductive composite material having these characteristics are mounted on various devices to enable stable operation of the corresponding devices.
In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiment of the present invention may be modified in various forms, the scope of the invention should not be construed as limited to the embodiments described in detail below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings and the like may be exaggerated to emphasize a more clear description. It should be noted that the same members in each drawing are sometimes shown with the same reference numerals. Detailed descriptions of well-known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention are omitted.
The heat sink of the present invention is composed of a thermally conductive composite material in which carbon nanotubes and one or more metal-based elements are covalently bonded to each other to have a stable structure that is not easily damaged or deformed even in an operating environment to which excessive thermal stress is applied. . Metal-based elements to which the carbon nanotubes are covalently bonded include, for example, a pure metal of aluminum, copper, silver, iron, or an alloy based on one or more selected thereof, or a composite composed of them. The composite material may be manufactured by a method of covalently bonding carbon nanotubes and metal-based elements through a pretreatment process of carbon nanotubes and metal-based elements, and further dissolving the carbon nanotubes and metal-based elements in a corresponding metal. Such a thermally conductive composite material has a large mechanical strength, such as steel, while reducing the weight by 20% or more, thereby reducing the weight of the mounted product. Heat sinks made of a thermally conductive composite material having these characteristics are mounted on various devices to enable stable operation of the corresponding devices. Such a heat sink may be composed of, for example, a heat sink, a radiator, a heat radiation pipe, and the like, as described in the following embodiments.
1 is a view showing a heat sink according to a first embodiment of the present invention.
Referring to FIG. 1, the
2 is a view showing a radiator according to a second embodiment of the present invention.
Referring to FIG. 2, the
3 is a view showing a heat dissipation pipe according to a third embodiment of the present invention.
3, the
Embodiment of the heat sink composed of a composite material having a covalently bonded carbon nanotube of the present invention described above is merely illustrative, and those skilled in the art to which the present invention pertains various modifications and It will be appreciated that other equivalent embodiments are possible. Therefore, it will be understood that the present invention is not limited only to the form mentioned in the above detailed description. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims. It is also to be understood that the present invention includes all modifications, equivalents, and substitutes within the spirit and scope of the invention as defined by the appended claims.
The heat sink made of a composite material having a covalently bonded carbon nanotube of the present invention can be used in various types of heat sinks to improve the operation performance of the corresponding product even in an operating environment in which excessive thermal stress is applied.
1 is a view showing a heat sink according to a first embodiment of the present invention.
2 is a view showing a radiator according to a second embodiment of the present invention.
3 is a view showing a heat dissipation pipe according to a third embodiment of the present invention.
* Description of the symbols for the main parts of the drawings *
10: heat sink 20: heating element
30: radiator 40: heat dissipation pipe
50: ondol floor
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020080069346A KR101497412B1 (en) | 2008-07-16 | 2008-07-16 | Heat sink with compound material having covalent bond carbon nanotube |
Applications Claiming Priority (1)
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KR1020080069346A KR101497412B1 (en) | 2008-07-16 | 2008-07-16 | Heat sink with compound material having covalent bond carbon nanotube |
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Publication Number | Publication Date |
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KR20100008733A true KR20100008733A (en) | 2010-01-26 |
KR101497412B1 KR101497412B1 (en) | 2015-03-02 |
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KR1020080069346A KR101497412B1 (en) | 2008-07-16 | 2008-07-16 | Heat sink with compound material having covalent bond carbon nanotube |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102593081A (en) * | 2011-01-12 | 2012-07-18 | 英飞凌科技股份有限公司 | Semiconductor device including a heat spreader |
US9700939B2 (en) | 2012-06-15 | 2017-07-11 | Korea Institute Of Industrial Technology | Apparatus for producing a composite material |
KR20200073009A (en) | 2018-12-13 | 2020-06-23 | 문규식 | Heat Dissipating Printed Circuit Board and The Manufacturing Method thereof |
KR20200073353A (en) | 2018-12-13 | 2020-06-24 | 주식회사 태광뉴텍 | Method for Manufacturing Carbon-based Material for Heat-radiating Structure and The Heat-radiating Structure |
US10815124B2 (en) | 2012-07-12 | 2020-10-27 | Seerstone Llc | Solid carbon products comprising carbon nanotubes and methods of forming same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7273095B2 (en) * | 2003-03-11 | 2007-09-25 | United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Nanoengineered thermal materials based on carbon nanotube array composites |
KR100816412B1 (en) * | 2003-12-18 | 2008-03-25 | 시마네켄 | Metal-based carbon fiber composite material and method for producing the same |
JP2007162080A (en) * | 2005-12-14 | 2007-06-28 | Nissan Motor Co Ltd | Thermally conductive member, automotive parts and manufacturing method therefor |
-
2008
- 2008-07-16 KR KR1020080069346A patent/KR101497412B1/en active IP Right Grant
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102593081A (en) * | 2011-01-12 | 2012-07-18 | 英飞凌科技股份有限公司 | Semiconductor device including a heat spreader |
US9700939B2 (en) | 2012-06-15 | 2017-07-11 | Korea Institute Of Industrial Technology | Apparatus for producing a composite material |
US10815124B2 (en) | 2012-07-12 | 2020-10-27 | Seerstone Llc | Solid carbon products comprising carbon nanotubes and methods of forming same |
KR20200073009A (en) | 2018-12-13 | 2020-06-23 | 문규식 | Heat Dissipating Printed Circuit Board and The Manufacturing Method thereof |
KR20200073353A (en) | 2018-12-13 | 2020-06-24 | 주식회사 태광뉴텍 | Method for Manufacturing Carbon-based Material for Heat-radiating Structure and The Heat-radiating Structure |
Also Published As
Publication number | Publication date |
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KR101497412B1 (en) | 2015-03-02 |
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