KR20100000568A - Preheating apparatus for resin molding system - Google Patents

Preheating apparatus for resin molding system Download PDF

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Publication number
KR20100000568A
KR20100000568A KR1020080060118A KR20080060118A KR20100000568A KR 20100000568 A KR20100000568 A KR 20100000568A KR 1020080060118 A KR1020080060118 A KR 1020080060118A KR 20080060118 A KR20080060118 A KR 20080060118A KR 20100000568 A KR20100000568 A KR 20100000568A
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KR
South Korea
Prior art keywords
vacuum
preheating
semiconductor element
resin molding
molding system
Prior art date
Application number
KR1020080060118A
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Korean (ko)
Inventor
최일락
Original Assignee
세크론 주식회사
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Publication date
Application filed by 세크론 주식회사 filed Critical 세크론 주식회사
Priority to KR1020080060118A priority Critical patent/KR20100000568A/en
Publication of KR20100000568A publication Critical patent/KR20100000568A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: A pre-heating device for a semiconductor device resin molding system is provided to improve production yield by preventing damage to the semiconductor device. CONSTITUTION: A pre-heating device for a semiconductor device resin molding system comprises a pre-heating plate(320), a detecting sensor, and a control part. A semiconductor device is settled on the pre-heating plate, and then preheated. The detecting sensor detects whether existence of the semiconductor device loaded on the pre-heating plate or not. The control part stops the pre-heating device according to the detected result of the detecting sensor, and then reactivates.

Description

Preheating device for semiconductor element resin molding system {PREHEATING APPARATUS FOR RESIN MOLDING SYSTEM}

The present invention relates to a preheating apparatus for a semiconductor element resin molding system, and more particularly, to correct the warpage of a semiconductor element so as to be in close contact with a preheating plate and to uniformly preheat it, and to provide a reliable operation. A preheating device for a semiconductor element resin molding system.

In general, a post-process for manufacturing a semiconductor is mounted by attaching a semiconductor chip separated from a wafer onto a package substrate such as a lead frame or a printed circuit board (PCB). A die bonding process, a wire bonding process for electrically connecting the semiconductor chip and the package substrate using a metal wire, and a resin molding for sealing the semiconductor package using a resin. (resin molding) process and the like.

Among these, the resin molding process protects the semiconductor chip and the metal wires from physical or chemical external environments such as impact, heat, moisture, and the like, and maintains the connection of the metal wires with an epoxy molding compound (EMC). It is a process of wrapping a semiconductor package with a sealing resin such as).

Hereinafter, for convenience of description, a semiconductor semi-finished product including a package substrate, a semiconductor chip, and a metal wire after completing the wire bonding process will be referred to as a semiconductor device.

As shown in FIG. 1, the resin molding system 100 performing the resin molding process includes a loading apparatus 200, a preheating apparatus 300, a mold apparatus 400, an unloading apparatus 500, and the like.

The loading device 200 sequentially transfers and supplies a semiconductor element to be molded.

The preheating device 300 preheats the supplied semiconductor element to a predetermined temperature before molding.

The mold apparatus 400 molds the semiconductor element supplied through the preheater 300 using a resin, that is, heats the resin to melt and injects and hardens the molten resin into the mold to mold the semiconductor element.

The unloading apparatus 500 transfers and discharges the molded semiconductor device.

2 schematically shows a conventional preheating device.

The preheating device 300 preheats the semiconductor element to a predetermined temperature before molding, thereby correcting warpage present in the semiconductor element, improving resin bonding force during molding, and rapidly deforming the semiconductor element due to the high temperature applied during molding. It is possible to improve the molding quality and to reduce the heating time during molding, thereby improving productivity.

The preheating temperature is determined between the room temperature and the molding temperature, usually about 150 ~ 160 ℃.

The preheating device 300 has a preheating plate 320 provided in a horizontal direction on the upper space so as to be supported by the support 310 on the lower side, and the heating means for heating in the preheating plate 320. Not shown) is appropriately provided.

On the upper surface of the preheating plate 320, a plurality of seating area portions 322 may be formed in which semiconductor elements are respectively seated.

Therefore, the semiconductor element is loaded on the preheating plate 320 maintained in the heated state by the operation of the heating means, preheated by being kept for a predetermined time, and then transferred to the mold apparatus 400 side.

However, the conventional preheating device 300 as described above has the following problems.

First, a problem arises in that the semiconductor device is double loaded onto the preheating plate 320.

Specifically, whether the semiconductor device is loaded on the preheating plate 320 is managed by the program memory in the controller. When the operator does not check the memory contents or forcibly deletes the memory contents at the time of restarting after stopping, As the new semiconductor device is loaded onto the preheating plate 320, a situation in which a double loading is eventually generated frequently.

In other words, when the loading device 200 loads the semiconductor element on the preheating plate 320, the controller recognizes that the semiconductor element is loaded on the preheating plate 320 according to the detection of the sensor installed in the loading device 200. If the memory information in the controller is lost due to various reasons at the time of restarting after the equipment is stopped once due to an error or the like during the preheating operation of the semiconductor device, the loading device 200 is replaced with a new semiconductor device. By loading onto the preheating plate 320, the semiconductor element is loaded on the preheating plate 320 in duplicate.

As such, when the double loading of the semiconductor device occurs, the semiconductor device must be damaged and discarded, so that the production yield is greatly reduced, and productivity is reduced due to the occurrence of work interruption.

Secondly, there is a problem in that the semiconductor element in a bent state cannot be preheated uniformly.

That is, in recent years, as the package substrate becomes very thin, the warpage exists mostly in the thin package substrate. Thus, the semiconductor device s in which the warpage exists is shown in the cross-sectional view of FIG. 3. Likewise, the upper surface of the preheating plate 320 may not be uniformly adhered and thus cannot be preheated uniformly.

Typically, the semiconductor element s has a warp in the form in which the center portion floats upward in comparison with both outer portions.

Therefore, when the semiconductor element s is preheated nonuniformly, molding failure occurs for the semiconductor element s.

In this regard, since the warpage of the semiconductor element s with excessive warpage is not completely corrected even through preheating, a transfer fail that cannot be smoothly transferred in the process of being transferred to the mold apparatus 400 after preheating. Occurs, thus causing process interruption.

Third, when the loading apparatus loads the semiconductor element s onto the preheating plate 320, there is a problem in that the loaded semiconductor element s is separated from the correct position on the preheating plate 320.

This is because there is no means for fixing the semiconductor element s on the preheating plate 320 at all.

Therefore, when the detachment phenomenon of the semiconductor element s occurs, the semiconductor element s is damaged and preheating is performed incorrectly.

The present invention was devised to solve the above-mentioned problems, and it is possible to completely prevent the double loading of the semiconductor device upon restarting after stopping, thereby preventing the loss of the semiconductor device, and taking the follow-up measures of the double loading. It is an object of the present invention to provide a preheating device of a semiconductor device resin molding system capable of preventing work interruption.

In addition, the present invention, even if the semiconductor element is present in the warp is loaded, it is possible to completely correct and warp the warp, thereby preventing the occurrence of a transfer failure during the transfer to the molding apparatus after preheating, improve the molding quality It is an object of the present invention to provide a preheating device for a semiconductor device resin molding system that can be made.

Furthermore, an object of the present invention is to provide a preheating apparatus of a semiconductor device resin molding system capable of accurately positioning a semiconductor device to be loaded, thereby preventing a phenomenon of damage to the semiconductor device by preventing a separation phenomenon during loading. have.

The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention by those skilled in the art.

The preheating apparatus of the semiconductor element resin molding system of the present invention for achieving the above object is a preheating apparatus of a semiconductor element resin molding system having a preheating plate for seating and preheating a semiconductor element, wherein the preheating apparatus is loaded on the preheating plate. A detection sensor for detecting the presence or absence of the semiconductor element; And a control unit controlling the progress of restarting after stopping according to the detection result of the detection sensor. It includes.

Preferably, when the semiconductor device is present on the preheating plate as a result of the detection of the detection sensor, the controller may stop the restart.

Also preferably, the detection sensor may include a light emitting unit provided at one side to irradiate detection light toward the semiconductor element loaded on the preheating plate; And a light receiving unit provided on the other side of the light emitting unit to receive the detection light. It may be made of.

Also preferably, a plurality of vacuum holes formed on the preheating plate to apply a vacuum suction pressure; A vacuum flow passage connected to the plurality of vacuum holes in common; A vacuum line connected in communication with the vacuum flow path; And vacuum pressure forming means connected to the vacuum line to form a vacuum suction pressure. It may further include.

Also preferably, the vacuum pressure forming means may include a venturi tube having a narrow portion whose inner diameter is reduced in the inner flow path through which the high pressure air passes and the vacuum line is connected to the narrow portion; It may be provided.

Also preferably, the vacuum pressure forming means may be a vacuum pump or a vacuum motor.

Also preferably, the vacuum holes may be arranged to be denser than the outer portions on the preheating plate in the center portion.

Also preferably, the vacuum pressure forming means may be connected to one end of the venturi tube and supply a high pressure air line; And an air discharge line connected to the other end of the venturi tube to discharge high pressure air. It may be further provided.

Also preferably, the vacuum pressure forming means, main air line or high pressure air generating means for supplying a high pressure air to the high pressure air line; It may be further provided.

According to the present invention, when the semiconductor device on the preheating plate is detected after restarting after stopping, when the semiconductor device is detected, the double-loading of the semiconductor device can be prevented by re-activation, thereby preventing damage to the semiconductor device due to the double loading. Thus, the effect of improving the production yield and preventing the interruption of work for the follow-up of the double loading can be achieved to improve the productivity.

In addition, since the bending state of the semiconductor device may be completely corrected by using the vacuum suction pressure, the semiconductor device may be completely in close contact with the preheating plate and uniformly preheated. Thus, a transfer fail may be generated during the transfer to the molding apparatus after preheating. It is possible to achieve the effect of improving the productivity by improving the productivity and molding quality.

Furthermore, since the semiconductor device loaded on the preheating plate can be accurately fixed by using the vacuum suction pressure, an effect of preventing the occurrence of departure phenomenon and improving the production yield and productivity of the semiconductor device can be achieved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 is a block diagram showing the configuration of a preheating apparatus of a semiconductor element resin molding system according to a preferred embodiment of the present invention, and FIG. 5 is a schematic perspective view of the preheating apparatus.

Prior to the description, it will be omitted that the detailed description of the same components as in the prior art.

According to the present invention, a detection sensor 330 is provided for detecting the presence or absence of the semiconductor element s loaded for each seating area portion 322 on the preheating plate 320.

The detection sensor 330 includes a light emitting unit 332 for irradiating detection light and a light receiving unit 334 provided opposite the light emitting unit 332 to receive the detection light irradiated from the light emitting unit 332 on the opposite side. Consists of a pair.

Preferably, a light emitting portion 332 is provided at one outer side of each seating area portion 322, and a light receiving portion 334 is provided at an opposite outer side of the seating area portion 322.

The mounting height of the detection sensor 330 is determined to correspond to the height of the semiconductor device s seated on the preheating plate 320.

Therefore, when the semiconductor element s loaded on the preheating plate 320 exists, the detection light irradiated from the light emitting unit 332 is blocked by the semiconductor element s so that the operation does not proceed. As a result, it is detected that the semiconductor element s is in a loaded state by not being received by the light receiving unit 334.

On the other hand, when the semiconductor element s loaded on the preheating plate 320 does not exist, the detection light irradiated from the light emitting unit 332 goes straight and received by the light receiving unit 334, whereby the semiconductor element s is It is detected that it is not loaded.

The detection sensor 330 is communicatively connected to the control unit 600 provided for the resin molding system 100 or provided for the preheating device 300.

The control unit 600 first sends an operation command to the detection sensor 330 at the time of restarting after the preheating device 300 is stopped, and the detection sensor 330 is provided with the semiconductor element s on the preheating plate 320. It is detected whether it exists and the detection result is sent to the control unit 600.

In addition, when detecting that the semiconductor element s is present, the controller 600 immediately stops the process of restarting, thereby preventing double loading of the new semiconductor element s onto the preheating plate 320 according to the restarting. do.

Of course, if it is detected that the semiconductor element s does not exist on the preheating plate 320, the control unit 600 allows the operation of restarting.

As a result, since the double loading of the semiconductor device s can be completely prevented, the semiconductor device s can be prevented from being damaged due to the double loading, and the work interruption for the follow-up of the double loading can be prevented.

Furthermore, according to the present invention, as shown in FIGS. 5 to 7, a plurality of minute vacuum holes 332a are provided on each seating area portion 322 of the preheating plate 320.

The vacuum hole 332a is open at the upper surface of the preheating plate 320 and is formed to penetrate in the vertical direction therein.

Preferably, the plurality of vacuum holes 332a in the preheating plate 320 may be connected to one vacuum passage 332b in common, and the vacuum passage 332b may have an external vacuum pressure forming means 350. And a vacuum line 340 may be connected.

Therefore, the vacuum suction pressure formed by operating the vacuum pressure forming means 350 provided at the outside and forcibly discharging the internal air to the outside discharges the vacuum line 340, the vacuum flow passage 332b, and the vacuum hole 332a. By sequentially passing), a vacuum suction pressure is finally applied to the vacuum hole 332a.

Preferably, as shown in Figure 8, the vacuum pressure forming means 350 is connected to the high-pressure air line 360, the vacuum line 340 to which the high-pressure air is continuously supplied, the high-pressure air line 360 A venturi tube 352 for applying a vacuum suction pressure to the vacuum line 340 by suctioning and discharging the air in the connected vacuum line 340 while passing through the high-pressure air at a high speed. Equipped.

In detail, the venturi tube 352 has a narrow portion 352a in which an internal flow path is reduced, and one end of the venturi tube 352 has a high-pressure air line 360 and an air discharge line 370 at the other end thereof. The vacuum line 340 is connected to the narrow part 352a.

Therefore, the high pressure air is supplied through the high pressure air line 360 to pass through the venturi tube 352 as it is and is discharged to the air discharge line 370, and the high pressure air is narrowed to the venturi tube 352 ( When exiting the 352a, the air in the vacuum line 340 connected to the narrow portion 352a is sucked out and discharged together while exiting at an increased flow rate, thereby allowing the vacuum line 340 and the vacuum flow path connected thereto ( A strong vacuum suction pressure is applied to the 332b and the vacuum hole 332a.

Of course, the vacuum pressure forming means 350 may be implemented by a conventional vacuum motor or a vacuum pump in place of the venturi tube 352.

Then, in order to continuously supply the high pressure air to the high pressure air line 360 connected to one end of the venturi tube 352, the main air which is a factory utility installed basically in the factory and continuously supplying the high pressure air Lines (not shown) may be connected to the high pressure air line 360.

Alternatively, high pressure air generating means (not shown), such as an air compressor, may be provided at one end of the high pressure air line 360 so as to generate and supply air of the high pressure state to the high pressure air line 360. have.

As a result, since the vacuum suction pressure may be applied through the vacuum holes 332a provided on the preheating plate 320, even if the semiconductor element s having warpage is loaded on the preheating plate 320, the corresponding semiconductor device is loaded. (s) may be pulled by the vacuum suction pressure applied, and the bending state thereof may be corrected, and the overall contact with the upper surface of the preheating plate 320 may be performed.

Therefore, the semiconductor device s that is generally in close contact with the upper surface of the preheating plate 320 may be uniformly preheated afterwards.

In addition, when the semiconductor element s to be preheated is transferred to be loaded on the preheating plate 320 by the loading device, the loaded semiconductor element s may be absorbed and fixed by vacuum suction pressure. The separation phenomenon of the loaded semiconductor device s may be prevented.

In relation to this, a plurality of vacuum holes 332a are generally disposed in each seating area portion 322 on the preheating plate 320, and as shown in FIG. As a result, the center portion can be vacuum-adsorbed more strongly with respect to the semiconductor element s that is bent so that the center portion is upward, so that the warpage can be completely corrected.

In the foregoing description, it should be understood that those skilled in the art can make modifications and changes to the present invention without changing the gist of the present invention as merely illustrative of a preferred embodiment of the present invention.

1 is a block diagram showing the configuration of a conventional conventional semiconductor device resin molding system;

2 is a perspective view schematically showing a preheating apparatus of a conventional semiconductor element resin molding system;

3 is a cross-sectional view showing a situation in which a semiconductor element in a bent state is seated on a preheating plate of a preheating apparatus of a conventional semiconductor element resin molding system;

4 is a block diagram showing a configuration of a preheating apparatus of a semiconductor device resin molding system according to a preferred embodiment of the present invention;

5 is a perspective view schematically showing a preheating apparatus of a semiconductor device resin molding system according to a preferred embodiment of the present invention;

6 is a plan view illustrating a preheating plate of a preheating apparatus of a semiconductor device resin molding system according to a preferred embodiment of the present invention;

7 is a cross-sectional view showing a preheating plate of a preheating apparatus of a semiconductor device resin molding system according to a preferred embodiment of the present invention;

8 is a cross-sectional view showing vacuum pressure forming means included in the preheating apparatus of the semiconductor element resin molding system according to the preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

300: preheating device 320: preheating plate

322: seating area portion 322a: vacuum hole

322b: vacuum flow path 330: detection sensor

332: light emitting unit 334: light receiving unit

340: vacuum line 350: vacuum pressure forming means

352 Venturi tube 352a Narrow part

360: high pressure air line 370: air discharge line

600: control unit s: semiconductor element

Claims (11)

In the preheating apparatus of the semiconductor element resin molding system provided with the preheating plate which mounts and preheats a semiconductor element, A detection sensor for detecting the presence or absence of the semiconductor element loaded on the preheating plate; And A control unit controlling the progress of restarting after stopping according to a detection result of the detection sensor; Preheating device of a semiconductor device resin molding system comprising a. The method of claim 1, The control unit, When the semiconductor element is present on the preheating plate as a result of the detection of the detection sensor, restarting is stopped. The method according to claim 1 or 2, The detection sensor, A light emitting unit provided at one side to irradiate detection light toward the semiconductor element loaded on the preheating plate; And A light receiving unit provided on the other side of the light emitting unit to receive the detection light; The preheating apparatus of the semiconductor element resin molding system characterized by consisting of. The method according to claim 1 or 2, A plurality of vacuum holes formed on the preheating plate to apply a vacuum suction pressure; A vacuum flow passage connected to the plurality of vacuum holes in common; A vacuum line connected in communication with the vacuum flow path; And Vacuum pressure forming means connected to the vacuum line to form a vacuum suction pressure; Preheating device of a semiconductor device resin molding system, characterized in that it further comprises. The method of claim 4, wherein The vacuum pressure forming means, A venturi tube having a narrow portion whose inner diameter is reduced in the inner flow path through which the high pressure air passes and the vacuum line is connected to the narrow portion; The preheating apparatus of the semiconductor element resin molding system characterized by including. The method of claim 4, wherein The vacuum pressure forming means, A preheating device for a semiconductor element resin molding system, which is a vacuum pump or a vacuum motor. The method of claim 4, wherein The vacuum hole, A preheating device of a semiconductor device resin molding system, characterized in that it is arranged to be denser than a central portion of the outer side on the preheating plate. The method of claim 5, wherein The vacuum pressure forming means, A high pressure air line connected to one end of the venturi tube to supply high pressure air; And An air discharge line connected to the other end of the venturi tube to discharge high pressure air; The preheating apparatus of the semiconductor element resin molding system characterized by further equipped. The method of claim 8, The vacuum pressure forming means, A main air line or high pressure air generating means for supplying air in a high pressure state to the high pressure air line; The preheating apparatus of the semiconductor element resin molding system characterized by further equipped. In the preheating apparatus of the semiconductor element resin molding system provided with the preheating plate which mounts and preheats a semiconductor element, A plurality of vacuum holes formed on the preheating plate to apply a vacuum suction pressure; A vacuum flow passage connected to the plurality of vacuum holes in common; A vacuum line connected in communication with the vacuum flow path; And Vacuum pressure forming means connected to the vacuum line to form a vacuum suction pressure; Preheating device of a semiconductor device resin molding system further comprising. A semiconductor device resin molding system comprising: molding a semiconductor device with a resin; and having a preheating device for preheating the semiconductor device before molding; A detection sensor for detecting the presence or absence of the semiconductor element loaded on a preheating plate of the preheater; A controller for controlling whether to restart according to a detection result of the detection sensor; And A plurality of vacuum holes formed on the preheating plate to apply a vacuum suction pressure; Semiconductor device resin molding system comprising a.
KR1020080060118A 2008-06-25 2008-06-25 Preheating apparatus for resin molding system KR20100000568A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110273407A1 (en) * 2010-05-07 2011-11-10 Bo-Yong Chung Scan driver, method of driving the scan driver, and organic light-emitting display including the scan driver
CN109801859A (en) * 2018-12-19 2019-05-24 华进半导体封装先导技术研发中心有限公司 It is a kind of for correcting the semiconductor device and antidote of plastic packaging sheet warpage

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110273407A1 (en) * 2010-05-07 2011-11-10 Bo-Yong Chung Scan driver, method of driving the scan driver, and organic light-emitting display including the scan driver
US8704807B2 (en) * 2010-05-07 2014-04-22 Samsung Display Co., Ltd. Scan driver, method of driving the scan driver, and organic light-emitting display including the scan driver
CN109801859A (en) * 2018-12-19 2019-05-24 华进半导体封装先导技术研发中心有限公司 It is a kind of for correcting the semiconductor device and antidote of plastic packaging sheet warpage

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