KR20090055268A - Apparatus of processing wafers - Google Patents
Apparatus of processing wafers Download PDFInfo
- Publication number
- KR20090055268A KR20090055268A KR1020070122102A KR20070122102A KR20090055268A KR 20090055268 A KR20090055268 A KR 20090055268A KR 1020070122102 A KR1020070122102 A KR 1020070122102A KR 20070122102 A KR20070122102 A KR 20070122102A KR 20090055268 A KR20090055268 A KR 20090055268A
- Authority
- KR
- South Korea
- Prior art keywords
- chuck
- substrate processing
- wafer
- substrate
- protrusion
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus having a chuck pin capable of improving productivity.
Generally, wafer processing processes in the semiconductor manufacturing process include photoresist coating, developing & developing, etching, chemical vapor deposition and ashing. In order to remove various contaminants attached to the substrate in the process of performing each of the various steps, there is a cleaning process using chemical or pure water (Wet Cleaning Process). Various kinds of substrate processing apparatuses are used to perform such various processes.
This substrate processing process mainly proceeds in the process chamber, and the substrate is seated on the chuck formed inside the process chamber. At this time, a plurality of chuck pins formed on the chuck support the side of the substrate.
However, the chuck pin may be damaged when the chemical liquid process or the plasma process is performed. If the chuck pin is damaged, impurities caused by the corroded or damaged chuck pin may be generated, which may cause a defect, and the chuck pin may be deformed to prevent smooth operation of the process, thereby lowering productivity.
An object of the present invention is to provide a substrate processing apparatus having a chuck pin capable of improving productivity.
Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.
One aspect of the substrate processing apparatus of the present invention for achieving the above object is a chuck on which the wafer is seated and a plurality of chuck pins are formed on the upper surface of the chuck to support the wafer, the body portion is in contact with the chuck And a chuck pin protruding from an upper surface of the body part to support a side surface of the wafer, and a chuck pin including a protective material surrounding the protrusion, wherein the body part and the protrusion are formed of ceramic.
Other specific details of the invention are included in the detailed description and drawings.
According to the substrate processing apparatus of the present invention as described above has the following effects. That is, the substrate processing apparatus as described above can improve the productivity by reducing the defective rate caused by the deformation or damage of the chuck pin and proceeding the process more efficiently.
Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.
Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.
Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.
Hereinafter, a substrate processing apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3B. 1 is a block diagram illustrating a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is an enlarged view of A of FIG. 1. 3A is a cross-sectional view of the chuck pin of the substrate processing apparatus of FIG. 1. 3B is a perspective view of the chuck pin of the substrate processing apparatus of FIG. 1.
1 to 3B, the substrate processing apparatus according to the first embodiment of the present invention includes a
The
In addition, a plurality of
Protruding
In this case, the
On the other hand, the
The
The substrate processing
The
The
The
Hereinafter, a substrate processing apparatus according to a second embodiment of the present invention will be described with reference to FIGS. 4A and 4B. 4A is a cross-sectional view of the chuck pin of the substrate processing apparatus according to the second embodiment of the present invention. 4B is a perspective view of a chuck pin of the substrate processing apparatus according to the second embodiment of the present invention.
4A and 4B, the substrate processing apparatus according to the second embodiment of the present invention differs from the first embodiment in that the
Hereinafter, a substrate processing apparatus according to a second embodiment of the present invention will be described with reference to FIGS. 5 to 7B. 5 is a block diagram illustrating a substrate processing apparatus according to a third embodiment of the present invention. FIG. 6 is an enlarged view of B of FIG. 5. 7A is a cross-sectional view of the chuck pin of the substrate processing apparatus of FIG. 5. 7B is a perspective view of the chuck pin of the substrate processing apparatus of FIG. 5.
5 to 7B, the substrate processing apparatus according to the third embodiment of the present invention differs from the first embodiment in that it does not include the support pin (120 of FIG. 1) and the protrusion of the
That is, the
That is, the
Hereinafter, a substrate processing apparatus according to a fourth embodiment of the present invention will be described with reference to FIGS. 8A and 8B. 8A is a cross-sectional view of the chuck pin of the substrate processing apparatus according to the fourth embodiment of the present invention. 8B is a perspective view of a chuck pin of the substrate processing apparatus according to the fourth embodiment of the present invention.
8A and 8B, the substrate processing apparatus according to the fourth embodiment of the present invention differs from the third embodiment of the present invention in that the
As described in the first to fourth embodiments of the present invention, the protective material may be formed in a cap shape or a ring shape, or may be formed to cover the upper surface of the body portion as in the third embodiment. That is, the present invention may include all of the structures of the various protective materials that can be applied, as long as it does not impair the idea of the present invention while covering the side surface of the protrusion.
Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.
1 is a block diagram illustrating a substrate processing apparatus according to a first embodiment of the present invention.
FIG. 2 is an enlarged view of A of FIG. 1.
3A is a cross-sectional view of the chuck pin of the substrate processing apparatus of FIG. 1.
3B is a perspective view of the chuck pin of the substrate processing apparatus of FIG. 1.
4A is a cross-sectional view of the chuck pin of the substrate processing apparatus according to the second embodiment of the present invention.
4B is a perspective view of a chuck pin of the substrate processing apparatus according to the second embodiment of the present invention.
5 is a block diagram illustrating a substrate processing apparatus according to a third embodiment of the present invention.
FIG. 6 is an enlarged view of B of FIG. 5.
7A is a cross-sectional view of the chuck pin of the substrate processing apparatus of FIG. 5.
7B is a perspective view of the chuck pin of the substrate processing apparatus of FIG. 5.
8A is a cross-sectional view of the chuck pin of the substrate processing apparatus according to the fourth embodiment of the present invention.
8B is a perspective view of a chuck pin of the substrate processing apparatus according to the fourth embodiment of the present invention.
(Explanation of symbols for the main parts of the drawing)
100:
112, 132, 152, 172:
116, 136, 156, 176: Protective material 120: Support pin
150: rotation axis 180: first drive unit
200: substrate processing liquid supply unit 300: bowl
400: recovery part 500: fluid supply part
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070122102A KR20090055268A (en) | 2007-11-28 | 2007-11-28 | Apparatus of processing wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070122102A KR20090055268A (en) | 2007-11-28 | 2007-11-28 | Apparatus of processing wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090055268A true KR20090055268A (en) | 2009-06-02 |
Family
ID=40986964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070122102A KR20090055268A (en) | 2007-11-28 | 2007-11-28 | Apparatus of processing wafers |
Country Status (1)
Country | Link |
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KR (1) | KR20090055268A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190060741A (en) * | 2019-05-24 | 2019-06-03 | 세메스 주식회사 | Substrate treating apparatus |
US20200391259A1 (en) * | 2019-06-14 | 2020-12-17 | Kctech Co., Ltd. | Substrate holder and substrate support device including the substrate holder |
-
2007
- 2007-11-28 KR KR1020070122102A patent/KR20090055268A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190060741A (en) * | 2019-05-24 | 2019-06-03 | 세메스 주식회사 | Substrate treating apparatus |
US20200391259A1 (en) * | 2019-06-14 | 2020-12-17 | Kctech Co., Ltd. | Substrate holder and substrate support device including the substrate holder |
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