KR20090005712A - Shape structure for plate of reinforce on fpcb - Google Patents

Shape structure for plate of reinforce on fpcb Download PDF

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Publication number
KR20090005712A
KR20090005712A KR1020070068973A KR20070068973A KR20090005712A KR 20090005712 A KR20090005712 A KR 20090005712A KR 1020070068973 A KR1020070068973 A KR 1020070068973A KR 20070068973 A KR20070068973 A KR 20070068973A KR 20090005712 A KR20090005712 A KR 20090005712A
Authority
KR
South Korea
Prior art keywords
fpcb
flexible circuit
circuit board
reinforcement plate
groove
Prior art date
Application number
KR1020070068973A
Other languages
Korean (ko)
Inventor
배성호
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020070068973A priority Critical patent/KR20090005712A/en
Publication of KR20090005712A publication Critical patent/KR20090005712A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Abstract

The present invention relates to the shape of the reinforcing plate is changed to prevent cracking of the flexible circuit board at the boundary between the flexible circuit board and the reinforcing plate, the present invention relates to a flexible circuit board, a connector mounted on the flexible circuit board, the flexible circuit Provided is a reinforcement plate shape structure of a flexible circuit board, which is provided on an opposite side of a connector mounting surface of a board, and includes a reinforcement plate having a groove formed at an outer end contacting the interruption of the flexible circuit board.

Description

Shape structure for plate of reinforce on FPCB}

1 is a plan view and a side view showing a conventional flexible circuit board and a reinforcement plate.

FIG. 2 is a perspective view illustrating one groove of a reinforcing plate formed over the entire flexible circuit board according to one embodiment of the present invention.

3 is a perspective view showing that the shape of the groove formed in the reinforcement plate is changed in another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: gusset 12: boundary

14: groove 20: flexible printed circuit board (FPCB)

30: Connector

The present invention relates to the shape of the reinforcement plate is changed to prevent cracking of the flexible circuit board at the boundary between the flexible circuit board and the reinforcement plate.

In general, flexible printed circuit boards (FPCBs) are electronic components capable of miniaturization of components and weight reduction of products to cope with high speed and integration of technology in accordance with the trend of lighter and shorter and higher density of electronics industry. to be. In addition, since the product can be designed by utilizing the ductile properties of the material of the FPCB itself, the FPCB is a product that is expected to be in high demand in the future.

FPCB is a circuit board on which a complicated circuit is formed on a flexible insulating film. The material of the FPCB is a flexible material such as PET (Polyester) or PI (Polyimide). The FPCB is not only used in video cameras, car stereos, computers and prints, but also in liquid crystal displays because of its flexibility in bending, overlapping, folding, curling, twisting, etc., which enables effective use of space and three-dimensional wiring. It is also widely used in thin electronic components such as devices (LCDs).

1 is a plan view and a side view showing a reinforcing plate of a conventional FPCB.

A connector 30 is mounted on the FPCB 20 to connect the device with the FPCB 20. In order to prevent the connector 30 from being damaged, a connector 30 is mounted on an opposite side of the surface on which the connector 30 is mounted. The reinforcement plate 10 is installed and the part except the connector mounting part is designed and manufactured with the minimum width in order to secure the maximum flexibility of the FPCB.

However, the reinforcement plate 10 and the FPCB 20 based on the reinforcement plate 10 during the hot-press process, in which the reinforcement plate 10 is installed on the FPCB 20. ), There is a problem in that the damage occurs in the FPCB 20 at the boundary portion 12 of the FPCB 20 and the reinforcing plate 10, which is the interruption of the outer end.

The deformation is because the compressive force generated by the hot-press process when the reinforcement plate 10 is installed on the FPCB 20 is concentrated on the boundary portion 12 of the FPCB 20 and the reinforcement plate 10 This is because a phenomenon in which the load is concentrated and pressed on the boundary portion 12 of the FPCB 20 and the reinforcing plate 10 due to the partial thickness variation occurs.

The part in which the deformation occurs in the FPCB 20 is physically weak compared to other parts of the FPCB 20, and is externally applied by the process of assembling, producing, and using the product using the FPCB 20. The stress generated when the mounting portion of the connector 30 of the FPCB 20 is bent is concentrated, which causes a problem in that wires (not shown) formed in the FPCB 20 are disconnected.

The present invention provides a shape structure of the reinforcement plate to distribute the stress concentrated on the boundary between the FPCB and the reinforcement plate to prevent the cracks in the FPCB at the boundary of the FPCB and the reinforcement plate.

The present invention relates to a flexible circuit board, a connector mounted on the flexible circuit board, and a reinforcement plate provided on an opposite surface of the connector mounting surface of the flexible circuit board and having a groove formed at an outer end contacting the interruption of the flexible circuit board. It provides a reinforcement plate shape structure of a flexible circuit board comprising.

The width of the groove is greater than the width of the flexible circuit board and provides a reinforcement plate shape structure of the flexible circuit board formed smaller than the width of the reinforcement plate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

Hot-press is a process for producing a product or a sample by applying high temperature and high pressure to raw materials such as synthetic resin, rubber, plastic sheet, and pellets. to be.

Figure 2 is a perspective view showing that the groove of the reinforcing plate is formed as one throughout the FPCB in one embodiment of the present invention.

A connector 30 is mounted on one surface of the FPCB 20 in which a circuit is formed on the flexible insulating film, and a reinforcement for preventing damage to the connector 30 on the opposite side on which the connector 30 is mounted. The plate 10 is installed. In this case, the reinforcing plate 10 is formed with a groove 14 in a position in contact with the FPCB 20, the groove 14 is formed in a direction toward the boundary portion 12.

The portion of the FPCB 20 that is not in contact with the reinforcement plate 10 is formed to have a smaller width than the reinforcement plate 10, but the FPCB 20 of the portion where the reinforcement plate 10 is installed is the reinforcement. It is formed equal to the width of the plate 10. Therefore, the width of the groove 14 may be formed to be wider than the width of the FPCB 20 not in contact with the reinforcing plate 10, and the groove 14 is formed as described above to concentrate on the boundary portion 12 The stressed portion is increased so that the stress is dispersed.

In more detail, when an external force is applied to the connector mounting portion of the FPCB 20, the connector mounting portion is not deformed by the reinforcing plate 10 attached to the connector back, the reinforcement plate 100 and the FPCB The deformation starts from the boundary of 20. When the deformation starts to become the boundary between the FPCB 20 and the reinforcing plate 10, the stress in the portion already damaged in the hot-pressing process is applied. The defects are concentrated and the wiring on the FPCB 20 is easily disconnected.

However, when the width of the groove 14 is formed larger than the width of the FPCB 20 that does not contact the reinforcement plate 10 and narrower than the width of the reinforcement plate 10, the area where deformation occurs due to external force and hot -The part damaged by the pressing process can prevent the damage to the spaced door FPCB (20).

In addition, since the FPCB 20 and the reinforcing plate 10 are subjected to heat and pressure at the same time during the hot-pressing process, significant stress is concentrated on the boundary 12. Therefore, the grooves 14 are formed in the reinforcing plate 10 to prevent cracks in the FPCB 20 at the boundary portion 12 due to the stresses in order to distribute the stresses. Therefore, the groove 14 serves to increase the portion where the reinforcing plate 10 and the FPCB 20 is in contact with the boundary portion 12, and thus the stress is distributed to the reinforcing plate 10.

3 is a perspective view showing that the shape of the groove formed in the reinforcement plate is changed in another embodiment of the present invention.

The grooves 14 are formed in the reinforcement plate 10 to disperse the stress, and the grooves 14 are formed at the boundary portion at which the middle portion of the FPCB 20 contacts the reinforcement plate 10. This is to see the effect of dispersing the stress by increasing the length of the boundary line of (12). Therefore, it is important that the groove 14 is formed so that the length of the boundary line is extended rather than the shape of the groove 14 formed in the reinforcing plate 10.

That is, as illustrated in FIG. 3, three grooves 14 are formed in the reinforcement plate 10, but two grooves 14 are formed in the reinforcement plate 10 to form the FPCB ( It may be installed in 20). Or more grooves 14 may be formed.

In addition, when the groove 14 is formed in the reinforcing plate 10, the shape of the edge of the groove 14 is preferably formed to be curved. This is because the curved edges of the grooves 14 are curved so that the stresses are not concentrated in one place but are dispersed rather than angled.

Therefore, even if a plurality of grooves 14 are formed in the reinforcing plate 10, it is preferable that the edges of the boundary between the adjacent grooves 14 and the grooves 14 are formed in a curved shape without an angle.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

According to the present invention, the groove formed in the reinforcement plate is stressed by increasing the length of the interface between the reinforcement plate and the FPCB and separating the deformation region generated during the use of the FPCB by the hot-pressing process during fabrication of the FPCB. Concentration on this specific site can be dispersed, thereby reducing the frequency of cracks that can occur in the FPCB.

In addition, if a plurality of grooves are formed over the entire FPCB, the length of the interface between the reinforcing plate and the FPCB is further increased, thereby dispersing stress.

On the other hand, the curved edge of the groove is more effective in dispersing the stress than the edge of the groove is formed to be angled.

Claims (5)

Flexible circuit boards; A connector mounted on the flexible circuit board; A reinforcement plate installed on an opposite surface of the connector mounting surface of the flexible circuit board and having a groove formed at an outer end thereof in contact with a break of the flexible circuit board; Reinforcement plate shape structure of the flexible circuit board comprising a. The method of claim 1, The width of the groove is greater than the width of the flexible circuit board and the reinforcement plate shape structure of the flexible circuit board is formed smaller than the width of the reinforcement plate. The method of claim 2, The groove is a reinforcement plate shape structure of the flexible circuit board is formed as one throughout the flexible circuit board. The method of claim 2, The groove is a reinforcement plate shape structure of the flexible circuit board is formed in two or more over the entire flexible circuit board. The method of claim 2, Reinforcement plate shape structure of the flexible circuit board is formed in the curved edge of the groove formed in the reinforcement plate.
KR1020070068973A 2007-07-10 2007-07-10 Shape structure for plate of reinforce on fpcb KR20090005712A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070068973A KR20090005712A (en) 2007-07-10 2007-07-10 Shape structure for plate of reinforce on fpcb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070068973A KR20090005712A (en) 2007-07-10 2007-07-10 Shape structure for plate of reinforce on fpcb

Publications (1)

Publication Number Publication Date
KR20090005712A true KR20090005712A (en) 2009-01-14

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ID=40487259

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070068973A KR20090005712A (en) 2007-07-10 2007-07-10 Shape structure for plate of reinforce on fpcb

Country Status (1)

Country Link
KR (1) KR20090005712A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101365994B1 (en) * 2013-07-10 2014-02-24 (주)드림텍 Pcb structure for usim module
CN113038695A (en) * 2021-03-02 2021-06-25 广德新三联电子有限公司 Carbon paste through hole circuit board and preparation method thereof
KR20220002831A (en) * 2021-02-26 2022-01-07 삼성디스플레이 주식회사 Flexible circuit film and display apparatus having the same
US11653449B2 (en) 2014-06-03 2023-05-16 Samsung Display Co., Ltd. Flexible circuit film and display apparatus having the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101365994B1 (en) * 2013-07-10 2014-02-24 (주)드림텍 Pcb structure for usim module
US11653449B2 (en) 2014-06-03 2023-05-16 Samsung Display Co., Ltd. Flexible circuit film and display apparatus having the same
KR20220002831A (en) * 2021-02-26 2022-01-07 삼성디스플레이 주식회사 Flexible circuit film and display apparatus having the same
CN113038695A (en) * 2021-03-02 2021-06-25 广德新三联电子有限公司 Carbon paste through hole circuit board and preparation method thereof

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