KR20080106499A - 이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트 - Google Patents
이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트 Download PDFInfo
- Publication number
- KR20080106499A KR20080106499A KR1020080114882A KR20080114882A KR20080106499A KR 20080106499 A KR20080106499 A KR 20080106499A KR 1020080114882 A KR1020080114882 A KR 1020080114882A KR 20080114882 A KR20080114882 A KR 20080114882A KR 20080106499 A KR20080106499 A KR 20080106499A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- protection sheet
- sheet
- protective sheet
- bonding
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (2)
- 이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트에 있어서,실리콘 수지와 카본 및 열전도성 필라가 혼재된 보호시트(10)로 구성되되, 표면과 배면에는 엠보싱처리되어, 완충역할과 열전달이 뛰어나며, 실리콘시트를 롤 형태로 권취할 수 있도록 함을 특징으로 하는 이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트.
- 제 1항에 있어서,보호시트(10)는 실리콘 수지 60 내지 80중량%와 카본 18 내지 30중량% 및 열전도성필라 2 내지 10중량%가 혼재된 형태로 구성되며, 전면과 배면에 형성된 엠보싱은 그 크기가 5 내지 40㎛인 것을 특징으로 하는 이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080114882A KR100895792B1 (ko) | 2008-11-18 | 2008-11-18 | 이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080114882A KR100895792B1 (ko) | 2008-11-18 | 2008-11-18 | 이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080106499A true KR20080106499A (ko) | 2008-12-08 |
KR100895792B1 KR100895792B1 (ko) | 2009-05-07 |
Family
ID=40367218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080114882A KR100895792B1 (ko) | 2008-11-18 | 2008-11-18 | 이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100895792B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101319460B1 (ko) | 2011-10-07 | 2013-10-17 | 실리콘밸리(주) | 열확산시트의 제조방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6225779A (ja) | 1985-07-26 | 1987-02-03 | Hokushin Ind Inc | 熱定着ロ−ルの製造方法 |
JP3078155B2 (ja) * | 1993-06-28 | 2000-08-21 | 信越化学工業株式会社 | 耐熱熱伝導性熱圧着シート |
JP4353451B2 (ja) | 2001-11-26 | 2009-10-28 | 信越化学工業株式会社 | 熱圧着用シリコーンゴムシート |
JP4627071B2 (ja) | 2007-07-25 | 2011-02-09 | 信越化学工業株式会社 | 熱圧着用シリコーンゴムシート |
-
2008
- 2008-11-18 KR KR1020080114882A patent/KR100895792B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR100895792B1 (ko) | 2009-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201033000A (en) | Glass laminate and manufacturing method therefor | |
TW201412522A (zh) | 強化之薄片玻璃-聚合物積層板 | |
TWI627058B (zh) | 玻璃結構以及製造與處理玻璃結構之方法 | |
WO2015098888A1 (ja) | ガラス積層体、および電子デバイスの製造方法 | |
WO2012001864A1 (ja) | 表示装置の製造方法 | |
JP2016035832A (ja) | 電子デバイスの製造方法、ガラス積層体の製造方法 | |
TW201500807A (zh) | 製造保護窗之方法及以彼製造之顯示裝置 | |
WO2016190209A1 (ja) | 積層装置および積層方法 | |
KR20090090762A (ko) | 이방성 전도 필름을 이용하는 전기적 회로 본딩장치 및본딩방법 | |
US20060154395A1 (en) | Heat conductive sheet, manufacturing method of the same, and manufacturing method of a liquid crystal display using the same | |
KR102047920B1 (ko) | 표시 장치용 패널 및 그 제조 방법 | |
KR101279257B1 (ko) | 가요성 표시장치용 기판 | |
KR100895792B1 (ko) | 이방성도전필름을 이용한 회로기판과 연성회로기판 접착용 보호시트 | |
JP2014109774A (ja) | 表示パネルの製造方法及び積層構造体 | |
KR200419708Y1 (ko) | 반도체칩 접착용 보호시트 | |
WO2015166880A1 (ja) | ガラス積層体、樹脂層付きガラス基板、樹脂層付き支持基材 | |
KR101924954B1 (ko) | 고수명 내열 완충 시트 | |
KR101074139B1 (ko) | 이방성 도전 필름용 열압착 이형시트 및 이의 제조방법 | |
KR102282067B1 (ko) | 점착 시트 및 그 제조방법 | |
TWI607884B (zh) | Pressing method of thin film display and flexible circuit board and pressing device thereof | |
JP2009036894A (ja) | 表示パネルのフレキシブル基板剥離装置 | |
JP2007187726A (ja) | 液晶表示装置の製造装置及びその製造方法 | |
TW200700230A (en) | Multilayer film, laminate using the same, and method for producing laminate | |
KR200382573Y1 (ko) | Olb 및 tab 공정용 방출 시트 | |
WO2024070281A1 (ja) | 表示装置及び表示装置の製造方法、並びに接続フィルム及び接続フィルムの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
A302 | Request for accelerated examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130424 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20140210 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20150130 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20160217 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20180125 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20190114 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20200224 Year of fee payment: 12 |