KR20080063942A - Reticle transfer apparatus - Google Patents
Reticle transfer apparatus Download PDFInfo
- Publication number
- KR20080063942A KR20080063942A KR1020070000574A KR20070000574A KR20080063942A KR 20080063942 A KR20080063942 A KR 20080063942A KR 1020070000574 A KR1020070000574 A KR 1020070000574A KR 20070000574 A KR20070000574 A KR 20070000574A KR 20080063942 A KR20080063942 A KR 20080063942A
- Authority
- KR
- South Korea
- Prior art keywords
- reticle
- air
- unit
- loader arm
- grip
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
1 is a perspective view showing a reticle transfer device according to an embodiment of the present invention.
2 is a cross-sectional view taken along the line A-A 'shown in FIG.
3 is a cross-sectional view taken along the line BB ′ shown in FIG. 1.
Figure 4 is a perspective view showing a reticle transfer device according to another embodiment of the present invention.
FIG. 5 is a cross-sectional view taken along the line C-C 'shown in FIG. 4.
** Description of symbols for the main parts of the drawing **
100, 150: loader arm
151: first loader arm
152: second loader arm
200: robot arm
310: first guide hall
312: tube
320: second guide hall
330: first guide hole
340: second guide hole
410: first air injector
420: second air injector
430: control unit
The present invention relates to a reticle transfer apparatus, and more particularly, to a reticle transfer apparatus capable of stably transferring a reticle by removing particles present in a reticle to be transferred.
In general, a semiconductor device is manufactured by repeatedly or selectively performing unit processes such as a diffusion process, a deposition process, a photolithography process, an etching process, an ion implantation process, and a cleaning process.
Among the above processes, the photolithography process is a process of forming a plurality of predetermined circuit patterns on the upper surface of the wafer. Such a circuit pattern formation technology is a very important technology and serves as a driving force for ultra-high integration of semiconductor devices.
The photolithography process includes coating a photoresist (PR), which is a chemical substance largely exposed to light, on a top surface of a wafer, and an exposure process of projecting a predetermined circuit pattern through light onto the coated PR. And the developing process of developing the exposed circuit pattern using a developing solution.
In the above process, a stepper or a scanner is generally used in the exposure process. Referring to the configuration of the exposure apparatus as described above, the exposure apparatus includes a light source, a reticle stage disposed under the light source, and having a predetermined circuit pattern formed thereon, and having a reticle seated thereon, and a circuit pattern positioned below the reticle stage. And a wafer stage on which the wafer to be formed is seated, and a reduction projection optical system positioned between the reticle stage and the wafer stage to guide the light passing through the reticle to be projected on the upper surface of the wafer.
Here, the reticle is stored in a reticle carriage. The reticle stored in the reticle carriage is carried in or out of the reticle stage by a transfer device. The transfer device is composed of a robot arm which is operated along a predetermined operation path by receiving power from the outside, and a loader arm installed on the robot arm to pick up the reticle.
Here, the loader arm supports the bottom of the reticle and picks up the reticle using a vacuum suction force provided from the outside. Here, the vacuum suction force is provided through a plurality of vacuum holes formed in the loader arm. Accordingly, the reticle is vacuum-adsorbed to the loader arm by a vacuum suction force provided through the vacuum hole, and the reticle is carried in or out of the reticle carriage or the reticle stage in such a state.
However, if particles of a predetermined size are present on the bottom surface of the reticle, in particular, the portion which is in contact with the loader arm and is sucked in vacuum, the particles may be introduced into the vacuum hole provided with the vacuum suction force. In this case, the particles may not be discharged to the outside through the inside of the vacuum hole, but may be caught by the inside of the vacuum hole. In this case, the vacuum suction force provided through the vacuum hole is formed in the normal range or less.
Therefore, in the related art, when the reticle is not normally sucked by the loader arm, and the reticle is transported in this state, the reticle may be shifted from the loader arm, and thus the reticle is shifted from the reticle stage. There is a problem that is settled. Furthermore, there is a problem that the reticle is broken away from the loader arm.
In addition, in the related art, when the exposure process is performed after the seating position is settled on the reticle stage as described above, the circuit pattern substantially formed on the wafer is not normally aligned, which causes product defects.
Of course, in the related art, particles are generated in the reticle as described above, and when the particles are introduced into the vacuum hole, a vacuum error is generated to stop the process and remove the particles. However, in the related art, since the process is stopped and the cleaning process is performed every time the particles are generated as described above, the process time is increased, the product production rate is decreased, and the cost of the equipment is increased.
Accordingly, the present invention has been made to solve the above problems, it is an object of the present invention to provide a reticle transfer device that can remove the particles generated in the reticle.
Another object of the present invention is to provide a reticle conveying apparatus for allowing the vacuum adsorption force of the loader arm for vacuum adsorption of the reticle to be made with a predetermined force.
Still another object of the present invention is to provide a reticle conveying apparatus capable of normally seating the reticle on the reticle stage by preventing the mounting position of the reticle gripped on the loader arm from shifting.
Still another object of the present invention is to provide a reticle transfer device which can prevent the reticle from being separated from the loader arm during reticle transfer.
In order to achieve the above object, the present invention provides a reticle transfer device.
The reticle conveying apparatus of the present invention includes a grip part for moving to a predetermined position to pick up a reticle and a cleaning part for supplying air to an outer surface of the reticle so as to be inclined with respect to the moving direction of the reticle.
Here, the air is preferably provided to be inclined along the moving direction of the reticle.
The cleaning unit includes a first air spray unit provided in the grip unit and spraying air toward the upper surface of the reticle, and a second air spray unit provided in the grip unit and spraying air toward the lower surface of the reticle. Preferably, the air spraying direction of the first air spraying unit and the second air spraying unit is inclined along the moving direction.
In addition, the grip unit includes a loader arm on which the bottom of the reticle is seated, and a robot arm extending from the loader arm, wherein the first air spray unit is formed on the loader arm to guide air to the bottom of the reticle. And a second guide hole provided in the robot arm to guide air to the upper surface of the reticle, wherein the first guide hole and the second guide hole are provided in the robot arm. It is preferably formed along a direction inclined along the moving direction.
Meanwhile, the air may be provided reciprocally between a first reference direction along the moving direction and a second reference direction along the opposite direction to the moving direction.
Here, the cleaning unit is provided in the grip portion and the first 'air injection unit for injecting air toward the upper surface of the reticle, the second' air injection unit provided in the grip portion for injecting air toward the lower surface of the reticle, and It is provided with a grip unit having a rotary unit for reciprocating the first 'air spray unit and the second' air spray unit within a reference range,
The reference range may be a reciprocating range between the first reference direction and the second reference direction.
In addition, the grip part includes a first loader arm on which the bottom of the reticle is seated, a second loader arm extending from the first loader arm to cover an upper portion of the reticle, the first loader arm and the second loader. And a robot arm extending from the arm, wherein the first 'air spraying unit has a first air sprayer positioned in the first guide hole provided in the first loader arm and rotated in the reference range, and the second 'The air spray unit may be provided with a second air sprayer which is located inside the second guide hole provided in the second loader arm and rotates in the reference range.
Here, the first air injector and the second air injector may be swing-operated within the reference range.
In addition, each of the first air injector and the second air injector is driven in connection with a motor, the motor is connected to a control unit for receiving a signal for driving, and the control unit may be preset with the reference range. .
Hereinafter, with reference to the accompanying drawings, it will be described a reticle transfer device according to an embodiment of the present invention.
First, to describe the reticle transfer apparatus according to an embodiment of the present invention.
1 is a perspective view showing a reticle transfer device according to an embodiment of the present invention. 2 is a cross-sectional view taken along the line A-A 'shown in FIG. 3 is a cross-sectional view taken along the line BB ′ shown in FIG. 1.
Referring to FIG. 1, the reticle conveying apparatus provides air to an outer surface of the
The grip part includes a
The
In addition, the
2 and 3, the
Here, the first air spraying unit has a
Referring to FIG. 2, the
The
Referring to FIG. 3, the
Next, to explain the operation and effect of the reticle transfer device according to an embodiment of the present invention configured as described above.
1 to 3, the
Therefore, the air provided from the air provider is injected through the
Meanwhile, the air injected through the
That is, the
Next, to describe the reticle transfer apparatus according to another embodiment of the present invention.
Figure 4 is a perspective view showing a reticle transfer device according to another embodiment of the present invention. FIG. 5 is a cross-sectional view taken along the line C-C 'shown in FIG. 4.
4 and 5, a reticle conveying apparatus according to another embodiment of the present invention is installed in the grip portion and the grip portion to inject air so as to be inclined toward the upper and lower surfaces of the
The grip part includes a
The
The reference range δ is between a
The cleaning unit is installed on the
Here, referring to FIG. 5, the first 'air injection unit is positioned inside the
The second 'air spray unit is provided with a second air sprayer 420 located inside the
The
Next, to explain the operation and effect of the reticle transfer apparatus according to another embodiment of the present invention having the configuration as described above.
4 and 5, the grip part is moved toward the
At this time, the upper and lower surfaces of the
That is, the
Accordingly, the upper and lower surfaces of the
More specifically, the first air injector 410 swings in the reference range δ and injects air having a constant injection pressure to be inclined to the bottom of the
Accordingly, more than half of the
Therefore, the
As described above, the present invention has the effect of removing the particles present on the top and bottom of the reticle.
In addition, the present invention has the effect that the vacuum adsorption force supplied to the loader arm to be supplied with a predetermined force in order to suck the reticle in a vacuum to stably adsorb the reticle.
In addition, the present invention also has the effect that the reticle can be normally seated on the reticle stage by transferring so that the seating position of the reticle gripped on the loader arm is not misaligned.
In addition, the present invention has an effect that can prevent the product loss due to breakage of the reticle by preventing the reticle from being separated from the loader arm during reticle transfer.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070000574A KR20080063942A (en) | 2007-01-03 | 2007-01-03 | Reticle transfer apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070000574A KR20080063942A (en) | 2007-01-03 | 2007-01-03 | Reticle transfer apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20080063942A true KR20080063942A (en) | 2008-07-08 |
Family
ID=39815421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070000574A KR20080063942A (en) | 2007-01-03 | 2007-01-03 | Reticle transfer apparatus |
Country Status (1)
Country | Link |
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KR (1) | KR20080063942A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111324017A (en) * | 2018-12-17 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Mask robot and mask transfer method |
CN112925174A (en) * | 2021-01-28 | 2021-06-08 | 长鑫存储技术有限公司 | Semiconductor lithographic apparatus |
-
2007
- 2007-01-03 KR KR1020070000574A patent/KR20080063942A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111324017A (en) * | 2018-12-17 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Mask robot and mask transfer method |
CN112925174A (en) * | 2021-01-28 | 2021-06-08 | 长鑫存储技术有限公司 | Semiconductor lithographic apparatus |
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