KR20080057564A - Outdoor-type signboard using chip led module - Google Patents

Outdoor-type signboard using chip led module Download PDF

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Publication number
KR20080057564A
KR20080057564A KR1020060131011A KR20060131011A KR20080057564A KR 20080057564 A KR20080057564 A KR 20080057564A KR 1020060131011 A KR1020060131011 A KR 1020060131011A KR 20060131011 A KR20060131011 A KR 20060131011A KR 20080057564 A KR20080057564 A KR 20080057564A
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South Korea
Prior art keywords
circuit board
printed circuit
protective film
chip led
chip
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KR1020060131011A
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Korean (ko)
Inventor
김재을
Original Assignee
주식회사 대한전광
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Priority to KR1020060131011A priority Critical patent/KR20080057564A/en
Priority to CNA2007100077709A priority patent/CN101021982A/en
Publication of KR20080057564A publication Critical patent/KR20080057564A/en

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F27/00—Combined visual and audible advertising or displaying, e.g. for public address
    • G09F27/008—Sun shades, shades, hoods or louvres on electronic displays to minimise the effect of direct sun light on the display
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

An outdoor-type signboard using a chip LED module is provided to protect a printed circuit board and a chip LED from ultra-violet rays and moisture by combining the printed circuit board and the chip LED with a protective film. An outdoor-type signboard using a chip LED module comprises a printed circuit board, a protective film(300), a grill(400), and a radiant heat plate. The printed circuit board has a plurality of chip LEDs which are arranged with a grid form and attached on the printed circuit board. The protective film for protecting ultra-violet rays has a plurality of caps(310) corresponding to the position of the plurality of the chip LEDs and is combined with a front side of the printed circuit board. The grill combined with a front side of the protective film has a plurality of grooves(420) for fixing the caps, and a light shielding unit(410) is installed in an upper part of each groove. The radiant heat plate is attached on a rear side of the printed circuit board for radiating heat generated from the printed circuit board.

Description

칩 엘이디 모듈을 이용한 실외용 전광판{outdoor-type signboard using chip LED module}Outdoor electronic signboard using chip LED module

도 1은 본 발명의 실시예에 따른 칩 LED 모듈의 사시도,1 is a perspective view of a chip LED module according to an embodiment of the present invention,

도 2는 본 발명의 실시예에 따른 칩 LED가 부착된 인쇄회로기판의 사시도, 2 is a perspective view of a printed circuit board with a chip LED according to an embodiment of the present invention;

도 3은 본 발명의 실시예에 따른 인쇄회로기판에 결합되는 보호필름의 사시도, 3 is a perspective view of a protective film coupled to a printed circuit board according to an embodiment of the present invention;

도 4는 본 발명의 실시예에 따른 보호필름에 결합되는 그릴의 사시도, 4 is a perspective view of a grill coupled to a protective film according to an embodiment of the present invention;

도 5는 본 발명의 실시예에 따른 인쇄회로기판에 부착되는 방열판 및 방열판에 부착되는 전자소자판의 사시도.5 is a perspective view of a heat sink attached to a printed circuit board and an electronic device plate attached to the heat sink according to an embodiment of the present invention.

<도면의 주요 부분에 대한 설명>Description of the main parts of the drawing

100: 칩 LED 모듈 200: 인쇄회로기판100: chip LED module 200: printed circuit board

210: 칩 LED 300: 보호필름210: chip LED 300: protective film

400: 그릴 410: 차광수단400: grill 410: shading means

500: 방열판 510: 전자소자판 500: heat sink 510: electronic device plate

본 발명은 칩 LED 모듈을 이용한 실외용 전광판에 관한 것으로서, 더욱 상세하게는 칩 LED가 부착되어 있는 인쇄회로기판 전면에 보호필름을 결합시키고, 보호필름에 차광수단이 돌출되어 있는 그릴을 결합시키며, 인쇄회로기판의 후면에는 열을 방출하는 방열판을 부착시키는 칩 LED 모듈을 이용한 실외용 전광판에 관한 것이다. The present invention relates to an outdoor display board using a chip LED module, and more particularly, to combine a protective film on the front of the printed circuit board to which the chip LED is attached, and to combine the grill with the light shielding means protruding from the protective film, printing The back of the circuit board relates to an outdoor electronic board using a chip LED module to attach a heat sink for dissipating heat.

일반적으로 실외에서 사용되는 전광판은 발광다이오드(LED : Light Emitting Diode)를 사용하는 전광판이 널리 사용되고 있다. 이러한 LED를 사용하는 전광판은 LED가 저전력으로 구동되고 그 수명이 길다는 점에서 옥외의 대형전광판이나 실내의 소형 전광판 등 다양한 분야에서 사용되고 있다. In general, an outdoor electronic display board using a light emitting diode (LED) is widely used. The LED board using the LED has been used in various fields such as a large outdoor billboard or a small indoor billboard in that LED is driven at low power and its life is long.

이러한 LED를 사용하는 전광판은 전구형 LED를 사용하여 구현하는 것과 칩 LED를 사용하여 구현하는 것이 있다. 전구형 LED를 사용하여 대형 전광판을 구현하는 경우, LED를 기판에 설치하는 공정과, 제어용 회로 기판을 제조하는 공정이 분리된다. 일반적으로 전구형 LED를 기판에 설치하는 공정은 자동삽입기를 사용하여 수행되며, 인쇄회로기판(PCB : printed circuit board)에 일반적인 전자 소자를 설치하여 제어용 회로 기판을 제조하는 공정은 SMT 장비를 사용하여 수행된다. 상술한 바와 같이 전구형 LED로 구성된 전광판의 경우, 2개의 공정이 필요하므로 제조 비용이 증대될 뿐만 아니라, SMT 장비를 사용하는 공정에 비해, 자동삽입기를 사용 하는 공정이 속도가 현격히 떨어져 제조 속도가 느린 문제점이 있다.Signboards using these LEDs are implemented using bulb LEDs and chip LEDs. When implementing a large display board using a bulb type LED, the process of installing the LED on the substrate and the process of manufacturing the control circuit board is separated. In general, the process of installing the bulb type LED on the board is performed by using an automatic inserter, and the process of manufacturing a control circuit board by installing a general electronic device on a printed circuit board (PCB) using SMT equipment. Is performed. As described above, in the case of a light-emitting board composed of LED bulbs, two processes are required, which increases manufacturing costs, and compared to a process using SMT equipment, a process using an automatic inserter is significantly slower and thus a manufacturing speed is lowered. There is a slow problem.

반면, 칩 LED를 사용하여 대형 전광판을 구현하는 경우, 칩 LED는 회로기판의 제조 공정에 따른 설치가 가능하다. 따라서, 인쇄회로기판의 전광판 동작을 위한 일반적인 전자 소자의 설치 공정에 칩 LED를 설치함으로써, 전광판의 제조 속도 및 제조 비용을 크게 절감할 수 있었다. 그러나, 이러한 칩 LED의 경우 자외선 및 습기에 취약하기 때문에 실외용 전광판으로 사용하기 부적절한 단점이 있다. On the other hand, when implementing a large display board using a chip LED, the chip LED can be installed according to the manufacturing process of the circuit board. Therefore, by installing the chip LED in the general electronic device installation process for the operation of the electronic board of the printed circuit board, it was possible to significantly reduce the manufacturing speed and manufacturing cost of the electronic board. However, such a chip LED is vulnerable to ultraviolet rays and moisture, so there is an inadequate disadvantage to use as an outdoor billboard.

본 발명은 인쇄회로기판 및 칩 LED에 보호필름을 결합시킨 실외용 전광판을 제공함에 목적이 있다. It is an object of the present invention to provide an outdoor electronic display board combining a protective film on a printed circuit board and a chip LED.

또한, 본 발명은 단일 주형으로 제작되는 보호필름을 사용하여 제조시간이 단축되고 제조비용이 절감되는 실외용 전광판을 제공함에 다른 목적이 있다. In addition, another object of the present invention is to provide an outdoor electronic display board which reduces the manufacturing time and reduces the manufacturing cost by using a protective film made of a single mold.

또한, 본 발명은 주간에도 선명한 화면을 제공할 수 있도록 차광수단이 형성된 실외용 전광판을 제공함에 또 다른 목적이 있다. In addition, another object of the present invention is to provide an outdoor display board having a shading means formed so as to provide a clear screen even in the daytime.

본 발명에 따른 칩 LED를 이용한 실외용 전광판은 격자상으로 배열되어 부착된 복수의 칩 LED를 포함하는 인쇄회로기판, 상기 인쇄회로기판의 전면에 결합되어 상기 복수의 칩 LED의 위치에 대응하여 형성되는 복수의 캡을 가지며, 자외선을 차단할 수 있는 보호필름, 상기 보호필름의 전면에 결합되고, 상기 복수의 캡이 끼움 결합되기 위한 복수의 홈이 형성되며, 상기 복수의 홈 각각의 상측에는 차광수단이 형성되는 그릴 및 상기 인쇄회로기판의 후면에 부착되어 상기 인쇄회로기판에서 발생하는 열을 방출하기 위한 방열판을 포함한다. An outdoor display board using a chip LED according to the present invention is a printed circuit board including a plurality of chip LEDs are arranged in a grid, attached to the front surface of the printed circuit board is formed corresponding to the position of the plurality of chip LEDs Has a plurality of caps, a protective film that can block ultraviolet rays, are coupled to the front surface of the protective film, a plurality of grooves are formed to be fitted to the plurality of caps are formed, the light shielding means on each of the plurality of grooves It includes a grill is formed and a heat sink attached to the back of the printed circuit board for dissipating heat generated from the printed circuit board.

이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 안되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in this specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors will appropriately define the concept of terms in order to best explain their invention in the best way possible. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that it can.

따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형 예들이 있을 수 있음을 이해하여야 한다.Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

도 1은 본 발명의 실시예에 따른 실외용 전광판으로 사용되는 칩 LED 모듈을 사시도로 나타낸 것이다. 도 1에 도시된 바와 같이, 본 발명의 실시예 따른 칩 LED 모듈(100)은 인쇄회로기판(200), 인쇄회로기판(200)의 전면에 부착되어 있는 칩 LED(210), 인쇄회로기판(200)의 전면에 결합되어 칩 LED(210) 각각을 둘러싸는 보호필름(300), 보호필름(300)의 전면에 결합되며 햇빛을 차단하기 위한 차광수단(410)이 형성되어 있는 그릴(400), 인쇄회로기판(200)의 후면에 부착되어 인쇄회로기판(200)에서 발생되는 열을 방출하기 위한 방열판(500) 및 방열판(500)의 후면에 부착되어 칩 LED 모듈(100)을 구동하기 위한 전자소자판(510)으로 구성되어 있 다. 1 is a perspective view of a chip LED module used as an outdoor display board according to an embodiment of the present invention. As shown in Figure 1, the chip LED module 100 according to an embodiment of the present invention is a printed circuit board 200, a chip LED 210 attached to the front of the printed circuit board 200, the printed circuit board ( The grill 400, which is coupled to the front surface of the protection film 300 surrounding each of the chip LEDs 210 and coupled to the front surface of the protection film 300, is provided with light shielding means 410 for blocking sunlight. Is attached to the back of the printed circuit board 200, the heat sink 500 for dissipating heat generated from the printed circuit board 200 and the heat sink 500 is attached to the back of the heat sink 500 for driving the chip LED module 100 It is composed of an electronic device plate (510).

도 2는 본 발명의 실시예에 따른 복수의 칩 LED가 부착되어 있는 인쇄회로기판을 사시도로 나타낸 것이다. 도 2에 도시된 바와 같이, 본 발명의 실시예에 따른 인쇄회로기판(200)은 칩 LED(210)가 구동되기 위한 배선이 형성되어 있으며, 각 화소에 해당하는 위치에 복수의 칩 LED(210)가 부착된다. 본 발명의 실시예에 따르면, 칩 LED(210)는 납땜에 의해 인쇄회로기판(200)에 부착됨이 바람직하다. 2 is a perspective view of a printed circuit board to which a plurality of chip LEDs according to an embodiment of the present invention is attached. As shown in FIG. 2, in the printed circuit board 200 according to the embodiment of the present invention, wirings for driving the chip LEDs 210 are formed and a plurality of chip LEDs 210 are positioned at respective pixels. ) Is attached. According to an embodiment of the present invention, the chip LED 210 is preferably attached to the printed circuit board 200 by soldering.

도 3은 본 발명의 실시예에 따른 인쇄회로기판 및 인쇄회로기판에 결합되는 보호필름을 사시도로 나타낸 것이다. 도 3에 도시된 바와 같이, 본 발명의 실시예에 따른 보호필름(300)은 인쇄회로기판(200)의 전면에 결합되되, 인쇄회로기판(200)의 전체 영역을 덮을 수 있는 크기임이 바람직하다. 또한, 보호필름(300)은 인쇄회로기판(200)에 부착되어 있는 복수의 칩 LED(210)와 대응하는 위치마다 복수의 캡(310)을 형성하고 있으며, 보호필름(300)이 인쇄회로기판(200)에 결합될 때, 캡(310)은 칩 LED(210)를 둘러싼다. 이때, 캡(310)은 칩 LED(210) 전체를 둘러쌀 수 있는 크기로 형성되어야 하며, 칩 LED(210)의 발광에 의해 나타나는 이미지가 왜곡되어 보이지 않도록 캡(310)의 광학적 특성에 의한 편차가 충분히 작아야 한다. 이러한 보호필름(300)이 칩 LED(210)가 부착된 인쇄회로기판(200)에 결합됨으로써, 자외선으로부터 칩 LED(210)를 보호하며, 우천 시 빗물로부터 인쇄회로기판(200) 및 칩 LED(210)를 보호한다. 3 is a perspective view of a printed circuit board and a protective film coupled to the printed circuit board according to an embodiment of the present invention. As shown in Figure 3, the protective film 300 according to an embodiment of the present invention is coupled to the front surface of the printed circuit board 200, it is preferable that the size that can cover the entire area of the printed circuit board 200. . In addition, the protective film 300 forms a plurality of caps 310 at positions corresponding to the plurality of chip LEDs 210 attached to the printed circuit board 200, and the protective film 300 is a printed circuit board. When coupled to 200, cap 310 surrounds chip LED 210. At this time, the cap 310 should be formed to a size that can surround the entire chip LED 210, the deviation due to the optical characteristics of the cap 310 so that the image appearing by the light emission of the chip LED 210 is distorted Should be small enough. The protective film 300 is coupled to the printed circuit board 200 to which the chip LED 210 is attached, thereby protecting the chip LED 210 from ultraviolet rays, and the printed circuit board 200 and the chip LED from rainwater during rain. Protect 210).

이때, 본 발명의 실시예에 따른 보호필름(300)은 단일주형으로 제작되기 때문에 제조시간 및 제조비용 측면에서 유리한 장점이 있다.At this time, since the protective film 300 according to the embodiment of the present invention is manufactured in a single mold, there is an advantage in terms of manufacturing time and manufacturing cost.

또한, 본 발명의 실시예에 따른 보호필름(300)은 표면에 자외선차단재료를 코팅하여 제작할 수도 있고, 보호필름(300) 자체를 자외선차단재료로 제작할 수 있다. In addition, the protective film 300 according to the embodiment of the present invention may be manufactured by coating a sunscreen material on the surface, or the protective film 300 itself may be made of a sunscreen material.

도 4는 본 발명의 실시예에 따른 보호필름에 결합되는 그릴을 사시도로 나타낸 것이다. 도 4에 도시된 바와 같이, 본 발명의 실시예에 따른 그릴(400)은 인쇄회로기판(200)에 결합되어 있는 보호필름(300)의 전면에 결합되며, 복수의 캡(310)이 끼워져 결합되기 위한 복수의 홈(420)이 형성되어 있다. 또한, 복수의 홈(420) 각각의 상측에는 차광수단(410)이 형성되어 있어, 칩 LED(210)로 조사되는 햇빛을 차단하여 칩 LED 모듈(100)로 구성된 전광판에 우수한 휘도를 확보한다. 4 is a perspective view of a grill coupled to a protective film according to an embodiment of the present invention. As shown in Figure 4, the grill 400 according to an embodiment of the present invention is coupled to the front surface of the protective film 300 is coupled to the printed circuit board 200, a plurality of caps 310 are fitted A plurality of grooves 420 to be formed are formed. In addition, the light blocking means 410 is formed above each of the plurality of grooves 420 to block the sunlight irradiated by the chip LED 210 to secure excellent luminance on the electronic display plate composed of the chip LED module 100.

도 5는 본 발명의 실시예에 따른 인쇄회로기판에 부착되는 방열판 및 방열판에 부착되는 전자소자판을 사시도로 나타낸 것이다. 도 5에 도시된 바와 같이, 본 발명의 실시예에 따른 방열판(500)은 인쇄회로기판(200)의 후면에 부착되어 인쇄회로기판(200)에서 발생하는 열을 방출하는 역할을 수행한다. 이때, 본 발명의 실시예에 따르면, 방열판(500)의 재질로는 알루미늄 및 알루미늄 합금으로 사용함이 바람직한데, 그 이유는 알루미늄은 열전도도가 우수하여 인쇄회로기판(200)에서 발생되는 열을 효과적으로 분산·방출시키며, 무게가 가벼워 전광판의 경량화에 기여하기 때문이다. 5 is a perspective view of a heat sink attached to a printed circuit board and an electronic device plate attached to the heat sink according to an embodiment of the present invention. As shown in FIG. 5, the heat sink 500 according to the embodiment of the present invention is attached to the rear surface of the printed circuit board 200 and discharges heat generated from the printed circuit board 200. At this time, according to the embodiment of the present invention, it is preferable to use aluminum and aluminum alloy as the material of the heat sink 500, because the aluminum is excellent in thermal conductivity to effectively heat the heat generated from the printed circuit board 200 This is because it disperses and emits, and it is light in weight, contributing to weight reduction of the display board.

한편, 본 발명의 실시예에 따르면, 방열판(500)의 후면에는 전자소자판(510)이 부착될 수 있는데, 이러한 전자소자판(510)은 일측에 전자소자(511)들이 형성되어 칩 LED 모듈(100)을 구동시킨다. On the other hand, according to an embodiment of the present invention, the electronic device plate 510 may be attached to the rear surface of the heat sink 500, the electronic device plate 510 is formed with electronic devices 511 on one side chip LED module Drive (100).

본 발명은 이상에서 살펴본 바와 같이 바람직한 실시예를 들어 도시하고 설명하였으나, 상기한 실시 예에 한정되지 아니하며 본 발명의 정신을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변경과 수정이 가능할 것이다.The present invention has been shown and described with reference to the preferred embodiments as described above, but is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

본 발명의 칩 LED 모듈을 이용한 실외용 전광판은 인쇄회로기판 및 칩 LED에 보호필름이 결합되어 있어, 자외선 및 습기로부터 인쇄회로기판 및 칩 LED를 보호할 수 있는 효과가 있다. The outdoor LED board using the chip LED module of the present invention has a protective film is coupled to the printed circuit board and the chip LED, there is an effect that can protect the printed circuit board and the chip LED from ultraviolet rays and moisture.

또한, 본 발명의 칩 LED 모듈을 이용한 실외용 전광판은 단일 주형으로 보호필름을 제작함으로써, 제조시간을 단축하고 제조비용을 절감할 수 있는 효과가 있다. In addition, the outdoor LED board using the chip LED module of the present invention has the effect of reducing the manufacturing time and manufacturing cost by manufacturing a protective film in a single mold.

또한, 본 발명의 칩 LED 모듈을 이용한 실외용 전광판은 차광수단이 형성되어 있어 주간에도 선명한 화면을 확보할 수 있는 효과가 있다. In addition, the outdoor LED panel using the chip LED module of the present invention has the effect of ensuring a clear screen even in the day because the shading means is formed.

Claims (3)

격자상으로 배열되어 부착된 복수의 칩 LED를 포함하는 인쇄회로기판;A printed circuit board including a plurality of chip LEDs arranged in a grid and attached thereto; 상기 인쇄회로기판의 전면에 결합되어 상기 복수의 칩 LED의 위치에 대응하여 형성되는 복수의 캡을 가지며, 자외선을 차단할 수 있는 보호필름;A protective film coupled to the front surface of the printed circuit board and having a plurality of caps formed corresponding to the positions of the plurality of chip LEDs and blocking ultraviolet rays; 상기 보호필름의 전면에 결합되고, 상기 복수의 캡이 끼움결합되기 위한 복수의 홈이 형성되며, 상기 복수의 홈 각각의 상측에는 차광수단이 형성되는 그릴; 및A grill coupled to the front surface of the protective film and having a plurality of grooves for fitting the plurality of caps together, and having light blocking means formed on each of the plurality of grooves; And 상기 인쇄회로기판의 후면에 부착되어 상기 인쇄회로기판에서 발생하는 열을 방출하기 위한 방열판A heat sink attached to a rear surface of the printed circuit board for dissipating heat generated from the printed circuit board 을 포함하는 칩 LED 모듈을 이용한 실외용 전광판.Outdoor billboard using a chip LED module comprising a. 제 1항에 있어서, The method of claim 1, 상기 보호필름은 표면에 자외선차단재료가 코팅되어 있는 칩 LED 모듈을 이용한 실외용 전광판.The protective film is an outdoor display board using a chip LED module coated with a sunscreen material on the surface. 제 1항에 있어서, The method of claim 1, 상기 보호필름은 자외선차단재료로 이루어지는 칩 LED 모듈을 이용한 실외용 전광판.The protective film is an outdoor billboard using a chip LED module made of a UV blocking material.
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KR100931267B1 (en) * 2008-12-03 2009-12-11 갤럭시아일렉트로닉스(주) Led module and led electric light board with the same
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US8480252B2 (en) 2008-07-07 2013-07-09 Osram Gesellschaft Mit Beschraenkter Haftung Illumination device
KR100931267B1 (en) * 2008-12-03 2009-12-11 갤럭시아일렉트로닉스(주) Led module and led electric light board with the same
KR100923653B1 (en) * 2009-02-24 2009-10-28 주식회사 대한전광 Chip led module with grill for preventing deformation

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