KR20080050176A - Image sensor pakage of optical pointing device - Google Patents

Image sensor pakage of optical pointing device Download PDF

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KR20080050176A
KR20080050176A KR1020060121073A KR20060121073A KR20080050176A KR 20080050176 A KR20080050176 A KR 20080050176A KR 1020060121073 A KR1020060121073 A KR 1020060121073A KR 20060121073 A KR20060121073 A KR 20060121073A KR 20080050176 A KR20080050176 A KR 20080050176A
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image sensor
pointing device
optical pointing
package
sensor package
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KR100899859B1 (en
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안건준
배재훈
김재동
홍성덕
고희곤
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크루셜텍 (주)
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

An image sensor package of an optical pointing device is provided to prevent pollution of an image sensor chip by arranging a sealing mold on the image sensor chip and filling a transparent sealant into the sealing mold and hardening the transparent sealant, and stand against external shocks due to vertical load generated by a dome switch. An image sensor package is manufactured by the steps of preparing a printed circuit board(211) having lead terminal groups printed at intervals, wherein the lead terminal groups consist of a center securing part and circumferential lead terminals(207,213); connecting bonding pads(205) of an image sensor chip(201) with the lead terminals by bonding wires(203); molding a transparent sealant(209) integratedly with the printed circuit board to cover the bonding pads of the image sensor chip and the lead terminal groups for packaging; and separating each image sensor package.

Description

광포인팅 장치의 이미지센서 패키지{Image Sensor Pakage of Optical Pointing Device}Image sensor package of optical pointing device {Image Sensor Pakage of Optical Pointing Device}

도1은 종래의 이미지 센서 패키지를 나타내는 측단면도Figure 1 is a side cross-sectional view showing a conventional image sensor package

도2는 본 발명에 따른 광포인팅 장치의 이미지 센서 패키지가 설치된 휴대단말기의 사시도2 is a perspective view of a portable terminal in which the image sensor package of the optical pointing device according to the present invention is installed;

도2a는 본 발명에 따른 이미지 센서 패키지가 실장된 광포인팅 장치 단면도.Figure 2a is a cross-sectional view of the optical pointing device mounted with an image sensor package according to the present invention.

도3a 내지 도3f는 본 발명의 이미지 센서 패키지의 패키징 방법에 따른 단계 모습을 나타내는 단면도들이다.3A to 3F are cross-sectional views illustrating steps of the packaging method of the image sensor package according to the present invention.

본 발명은 광포인팅 장치의 이미지 센서 패키지에 관한 것으로,좀더 상세하게 설명하면, 본 발명의 광포인팅 장치는 휴대단말기와 같은 휴대기기에 장착되어 상기 광포인팅 장치의 커버플레이트상에 손가락을 접촉시켜 움직임으로써 이미지 센서에서 손가락의 움직임을 감지하여 휴대기기의 엘씨디(LCD) 화면의 포인터(커서)를 동작시킨다. The present invention relates to an image sensor package of an optical pointing device. In more detail, the optical pointing device of the present invention is mounted on a portable device such as a portable terminal and moves by touching a finger on a cover plate of the optical pointing device. As a result, the image sensor detects the movement of a finger to operate the pointer (cursor) on the LCD screen of the mobile device.

또한 본 발명의 광포인팅 장치에서 이미지 센서는 피사체 정보를 검지하여 전기적인 영상신호로 변환하는 장치로써 손가락 움직임 센싱뿐만 아니라 본 발명의 광포인팅 장치의 높이를 좌우한다.In addition, in the optical pointing device of the present invention, the image sensor detects subject information and converts it into an electric video signal. The image sensor not only senses finger movement but also determines the height of the optical pointing device of the present invention.

종래기술인 대한민국 등록특허 제 0636412호는 기존의 광의 이동경로를 수직구조에서 수평구조로 변환함으로써 초슬림형의 광포인팅 장치를 구성 한다.Korean Patent No. 0636412, which is a prior art, constitutes an ultra-slim optical pointing device by converting a conventional light path from a vertical structure to a horizontal structure.

상기의 초슬림형 광포인팅 장치와 같이 초슬림형의 구조를 가지기 위해선 이미지센서가 광포인팅 장치의 동작회로와 함께 칩온보드(Chip On Board) 형태의 인쇄회로기판에 경박단소하게 구성되어야 한다. In order to have an ultra-slim structure like the ultra-slim optical pointing device, the image sensor should be lightly and simply configured on a printed circuit board in the form of a chip on board together with the operation circuit of the optical pointing device.

그러나 상기와 같은 칩온보드(Chip On Board)는 반도체 칩을 직접 인쇄 회로 기판위에 금선 연결하고 성형하는 방식 표면 실장 기술의 하나로 금선 연결 실장과 플립 칩 (Flip Chip) 실장으로 구분된다.However, the chip on board as described above is one of the surface mount technologies in which a semiconductor chip is directly connected to and molded on a printed circuit board, and is classified into a gold wire connection mount and a flip chip mount.

상기와 같은 패키지 방법은 이미지 센서의 실장 높이를 줄일수 있지만 외부의 오염 및 충격에 약하다는 문제점이 있다.Such a packaging method can reduce the mounting height of the image sensor, but has a problem in that it is weak to external contamination and impact.

특히 종래기술인 대한민국 공개특허 제 2005-0091343호와 같은 광포인팅 장치에 스위칭 기능이 추가된다면 수직구조의 광학계를 가지는 광포인팅 장치는 인쇄회로기판에 계속적인 스위칭으로 이미지 센서회로 기판에 충격을 줌으로써 단선이 발생하는 문제점이 있다. In particular, if a switching function is added to an optical pointing device such as Korean Patent Laid-Open Publication No. 2005-0091343, an optical pointing device having an optical system having a vertical structure has a short circuit by impacting the image sensor circuit board by continuously switching to a printed circuit board. There is a problem that occurs.

상기 문제점을 해결하기 위하여 종래에는 세라믹 또는 플라스틱 패키지를 사용하고 있다. In order to solve the problem, a conventional ceramic or plastic package is used.

도1을 살펴보면, 세라믹과 같은 측벽부(109)를 가지는 인쇄회로기판(107) 위에 이미지 센서칩(101)이 안착되고, 이미지 센서칩의 광수광부 보호 및 광의 투명 도와 굴절율을 개선하기 위하여 이미세 센서 칩 상면에 글라스와 같은 투명부재(111)를 올려놓는 방식을 따른다. Referring to FIG. 1, an image sensor chip 101 is mounted on a printed circuit board 107 having a sidewall portion 109 such as ceramic, and is used to protect the light-receiving portion of the image sensor chip and to improve light transparency and refractive index. Follow the method of placing a transparent member 111 such as glass on the sensor chip upper surface.

상기와 같은 종래의 세라믹 패키지는 그 구조적으로 복잡하기 때문에 경박 단소화를 구현하는 데 한계가 있으며,세라믹 패키지의 가격이 고가이며, 단품 단위의 생산으로 제조비용이 높다는 한계가 있다.The conventional ceramic package as described above has a limitation in realizing light and thin shortening because of its structural complexity, the price of the ceramic package is expensive, there is a limitation that the manufacturing cost is high due to the production of a single unit.

그리고, 상기와 같은 종래의 이미지 센서용 플라스틱 패키지도 그 구조적으로 복잡하기 때문에 경박 단소화를 구현하는 데 한계가 있다.In addition, since the plastic package for the conventional image sensor is also structurally complicated, there is a limit in implementing light and thin reduction.

상기와 같은 이미지 패키지는 각각의 투명부재 및 측벽부를 가짐으로써 대량 생산 및 제조 공정이 복잡해진다. Such image packages have respective transparent members and sidewalls, which complicates the mass production and manufacturing process.

상기의 문제점을 해결하기 위하여 본 발명은 광포인팅 장치의 이미지 센서와 동작회로가 칩온 보드(Chip On Board) 상태에서 상면에 봉합 금형을 배치시켜 투명 봉지재를 밀봉하여 외부의 기계적/전기적/화학적 충격이나 오염을 방지 할 수 있다. 그리고 공정을 단순화 시켜 생산 효율을 향상 시킬수 있는 광포인팅 장치의 이미지 센서 패키지를 제공하는데 있다.In order to solve the above problems, the present invention places the sealing mold on the upper surface of the image sensor and the operation circuit of the optical pointing device in the state of a chip on board (Chip On Board) to seal the transparent sealing material to the external mechanical / electrical / chemical impact Or pollution can be prevented. In addition, to provide an image sensor package of the optical pointing device that can simplify the process and improve the production efficiency.

상세하게는 봉합금형을 칩온 보드(Chip On Board) 상태의 여러개의 이미지 센서 상면 전체에 봉합하여 투명봉지재로 충진하고, 충진된 투명봉지재가 경화된후 봉합금형을 제거하고, 봉합된 이미지 센서 칩을 낱개로 컷팅 분리함으로써, 글라스와 같은 투명부재와 측벽부를 없앤다. Specifically, the sealing mold is sealed on the entire upper surface of the image sensor in a chip on board (Chip On Board) state and filled with a transparent encapsulant, and after the filled transparent encapsulant is cured, the encapsulation mold is removed, and the sealed image sensor chip By cutting and separating each, the transparent member such as glass and the side wall part are eliminated.

상기의 방법으로 제조된 이미지 센서 패키지는 작업시간 단축으로 생산성을 향상시킬 수 있다.The image sensor package manufactured by the above method can improve productivity by reducing work time.

본 발명은 광포인팅 장치의 이미지 센서 패키지에 관한 것으로,The present invention relates to an image sensor package of the optical pointing device,

좀더 상세하게 설명하게는, 본 발명의 광포인팅 장치는 휴대단말기와 같은 휴대기기에 장착되어 상기 광포인팅 장치의 커버플레이트상에 손가락을 접촉시켜 움직임으로써 이미지 센서에서 손가락의 움직임을 감지하여 휴대기기의 엘씨디(LCD) 화면의 포인터(커서)를 동작시킨다. In more detail, the optical pointing device of the present invention is mounted on a mobile device such as a mobile terminal, and touches a finger on a cover plate of the optical pointing device to detect a finger movement in an image sensor. Activates the pointer (cursor) on the LCD screen.

또한 본 발명의 광포인팅 장치에서 이미지 센서는 피사체 정보를 검지하여 전기적인 영상신호로 변환하는 장치로써 손가락 움직임 센싱뿐만 아니라 본 발명의 광포인팅 장치의 높이를 좌우한다.In addition, in the optical pointing device of the present invention, the image sensor detects subject information and converts it into an electric video signal. The image sensor not only senses finger movement but also determines the height of the optical pointing device of the present invention.

종래기술인 대한민국 등록특허 제 0636412호는 기존의 광의 이동경로를 수직구조에서 수평구조로 변환함으로써 초슬림형의 광포인팅 장치를 구성 한다.Korean Patent No. 0636412, which is a prior art, constitutes an ultra-slim optical pointing device by converting a conventional light path from a vertical structure to a horizontal structure.

상기의 초슬림형 광포인팅 장치와 같이 초슬림형의 구조를 가지기 위해선 이미지센서가 광포인팅 장치의 동작회로와 함께 칩온보드(Chip On Board) 형태의 인쇄회로기판에 경박단소하게 구성되어야 한다. In order to have an ultra-slim structure like the ultra-slim optical pointing device, the image sensor should be lightly and simply configured on a printed circuit board in the form of a chip on board together with the operation circuit of the optical pointing device.

그러나 상기와 같은 칩온보드(Chip On Board)는 반도체 칩을 직접 인쇄 회로 기판위에 금선 연결하고 성형하는 방식 표면 실장 기술의 하나로 금선 연결 실장과 플립 칩 (Flip Chip) 실장으로 구분된다.However, the chip on board as described above is one of the surface mount technologies in which a semiconductor chip is directly connected to and molded on a printed circuit board, and is classified into a gold wire connection mount and a flip chip mount.

상기와 같은 패키지 방법은 이미지 센서의 실장 높이를 줄일수 있지만 외부의 오염 및 충격에 약하다는 문제점이 있다.Such a packaging method can reduce the mounting height of the image sensor, but has a problem in that it is weak to external contamination and impact.

특히 종래기술인 대한민국 공개특허 제 2005-0091343호와 같은 광포인팅 장치에 스위칭 기능이 추가된다면 수직구조의 광학계를 가지는 광포인팅 장치는 인쇄회로기판에 계속적인 스위칭으로 이미지 센서회로 기판에 충격을 줌으로써 단선이 발생하는 문제점이 있다. In particular, if a switching function is added to an optical pointing device such as Korean Patent Laid-Open Publication No. 2005-0091343, an optical pointing device having an optical system having a vertical structure has a short circuit by impacting the image sensor circuit board by continuously switching to a printed circuit board. There is a problem that occurs.

상기 문제점을 해결하기 위하여 종래에는 세라믹 또는 플라스틱 패키지를 사용하고 있다. In order to solve the problem, a conventional ceramic or plastic package is used.

도1을 살펴보면, 세라믹과 같은 측벽부(109)를 가지는 인쇄회로기판(107) 위에 이미지 센서칩(101)이 안착되고, 이미지 센서칩의 광수광부 보호 및 광의 투명도와 굴절율을 개선하기 위하여 이미세 센서 칩 상면에 글라스와 같은 투명부재(111)를 올려놓는 방식을 따른다. Referring to FIG. 1, an image sensor chip 101 is mounted on a printed circuit board 107 having a sidewall portion 109 such as a ceramic, and in order to protect the light-receiving portion of the image sensor chip and to improve light transparency and refractive index. Follow the method of placing a transparent member 111 such as glass on the sensor chip upper surface.

상기와 같은 종래의 세라믹 패키지는 그 구조적으로 복잡하기 때문에 경박 단소화를 구현하는 데 한계가 있으며,세라믹 패키지의 가격이 고가이며, 단품 단위의 생산으로 제조비용이 높다는 한계가 있다.The conventional ceramic package as described above has a limitation in realizing light and thin shortening because of its structural complexity, the price of the ceramic package is expensive, there is a limitation that the manufacturing cost is high due to the production of a single unit.

그리고, 상기와 같은 종래의 이미지 센서용 플라스틱 패키지도 그 구조적으로 복잡하기 때문에 경박 단소화를 구현하는 데 한계가 있다.In addition, since the plastic package for the conventional image sensor is also structurally complicated, there is a limit in implementing light and thin reduction.

상기와 같은 이미지 패키지는 각각의 투명부재 및 측벽부를 가짐으로써 대량 생산 및 제조 공정이 복잡해진다. Such image packages have respective transparent members and sidewalls, which complicates the mass production and manufacturing process.

상기의 문제점을 해결하기 위해 본 발명의 광포인팅 장치의 이미지 센서패키지는 중앙의 안착부와, 둘레의 리드단자들로 이루어진 리드단자 군이 간격을 두고 다수개 인쇄된 인쇄회로기판을 준비하는 단계와; 상기 이미지 센서의 본딩 패드와 상기 리드단자 군의 리드 단자들을 본딩 와이어로 연결하는 단계와; 상기 이미지 센서의 본딩 패드와 상기 리드단자 군의 리드단자 군을 덮어서 패키징 할 수 있도록 상기 인쇄 회로기판에 투명봉지재를 일체로 사출 봉합 성형하는 단계와 ; 상기 패키징된 각 이미지 센서 패키지를 낱개로 분리하는 단계를 포함하는 것을 특징으로 한다.In order to solve the above problems, the image sensor package of the optical pointing device of the present invention comprises the steps of preparing a plurality of printed circuit boards are spaced apart from the lead terminal group consisting of the center seating portion, the lead terminals of the circumference; ; Connecting a bonding pad of the image sensor and lead terminals of the lead terminal group with a bonding wire; Injection sealing molding the transparent sealing material integrally on the printed circuit board so as to cover the bonding pad of the image sensor and the lead terminal group of the lead terminal group; And separating each of the packaged image sensor packages individually.

도2a 에서 본 발명의 광포인팅 장치는 휴대단말기(21)에 장착되어 장치의 커버플레이트(23) 상의 피사체(손가락)(25)의 움직임을 통해 휴대단말기 엘씨디(LCD)의 커서(27)를 움직이게 하는 장치로써, 상기 광포인팅 장치는 피사체의 움직임을 감지하는 이미지 센서 패키지를 구비한다.In FIG. 2A, the optical pointing device of the present invention is mounted on the portable terminal 21 to move the cursor 27 of the portable terminal LCD through the movement of the subject (finger) 25 on the cover plate 23 of the apparatus. In one embodiment, the optical pointing device includes an image sensor package for detecting a movement of a subject.

도2b는 본 발명의 광포인팅 장치(20)의 실시예를 나타낸 도면으로써, 광포인팅 장치(20)가 휴대단말기에 실장되어 손가락(25)에 의해 광포인팅 장치에 부착된 돔스위치(33)가 클릭이 되면서, 전기적으로 인쇄회로 기판의 리드와 이미지센서 칩의 패드를 연결하는 와이어에 충격을 준다. 2B is a view showing an embodiment of the optical pointing device 20 of the present invention, in which the dome switch 33 in which the optical pointing device 20 is mounted on a portable terminal and attached to the optical pointing device by a finger 25 is shown. As it clicks, it electrically impacts the wires that connect the leads of the printed circuit board to the pads of the image sensor chip.

또한 본 발명의 이미지 센서칩은 피사체(손가락) 정보를 검지하여 전기적인 영상신호로 변환하는 이미지 센서와 이와 같은 이미지 센서를 동작시키는 구동회로가 하나의 칩으로 구성한다.In addition, the image sensor chip of the present invention comprises an image sensor that detects subject (finger) information and converts it into an electric video signal, and a driving circuit for operating such an image sensor.

본발명의 구성 및 제조방법에 대해 도3a 내지 도3f를 참조하여 상세하게 살펴보면, 상기 이미지 센서칩(201)의 본딩패드(205)와 인쇄회로기판(211)의 리드단자(207)(213)는 본딩와이어(203)로 연결되고, 본딩와이어(203)는 금 재질의 세선으로 구성되며, 이미지 센서칩(201)의 본딩패드(205)와 인쇄회로기판(211)의 리드단 자(207)(213)를 전기적으로 연결한다. 3A through 3F, the bonding pads 205 of the image sensor chip 201 and the lead terminals 207 and 213 of the printed circuit board 211 will be described in detail. Is connected to the bonding wire 203, the bonding wire 203 is composed of a thin wire made of gold, the bonding pad 205 of the image sensor chip 201 and the lead terminal 207 of the printed circuit board 211. 213 is electrically connected.

상기의 방법으로 실장된 이미지 센서칩(201)의 상면에 봉합금형(300)을 배치시켜 봉합금형(300)에 투명재질의 에폭시 몰딩 컴파운드(EMC)(209)를 충진 및 경화시킴으로써, 이미지 센서칩(201)과 본딩 와이어(203) 및 리드단자(207)(213)를 덮어서 봉합하는 것을 특징으로 한다. 봉합 금형(300)을 제거하고, 봉합된 이미지 센서 패키지군을 쏘잉기(301)로 컷팅하여 릴(Reel)형태로 이미지 센서 패키지를 작업이 가능하게 한다. By placing the sealing mold 300 on the upper surface of the image sensor chip 201 mounted by the above method, filling and curing the epoxy molding compound (EMC) 209 of a transparent material in the sealing mold 300, 201, the bonding wire 203, and the lead terminals 207 and 213 are covered and sealed. The sealing mold 300 is removed, and the sealed image sensor package group is cut by the sawing machine 301 to enable the image sensor package to work in the form of a reel.

상기 투명 재질의 에폭시 몰딩 컴파운드(EMC)는 절연체이면서 빛의 투과성이 좋은 재질로 구성되어 있다. The transparent epoxy molding compound (EMC) is an insulator and is made of a material having good light permeability.

상기 방법으로 구성된 이미지 센서 패키지는 투명봉지재가 인쇄회로기판과 일체로 성형된다.In the image sensor package constructed by the above method, the transparent encapsulant is molded integrally with the printed circuit board.

이상에서 설명한 바와 같이, 본 발명의 이미지 센서 패키지는 이미지 센서칩의 본딩패드와 인쇄회로기판의 리드단자가 전기적으로 연결하는 칩온보드(Chip On Board)에서 이미지 센서칩 상에 봉합금형을 만들어 봉합금형에 투명봉지재를 충진 및 경화하여 이미지 센서칩의 외부에 의한 오염을 원천적으로 방지 할수 있고, 본발명에 클릭을 위한 돔 스위치가 부가됨으로써 발생되는 상하 하중에 따른 외부충격에 견딜 수 있음으로써 이미지센서칩의 성능저하와 수명단축을 미연에 방지할수 있는 효과가 있다.As described above, in the image sensor package of the present invention, a sealing mold is formed on the image sensor chip by a chip on board (Chip On Board) electrically connected between the bonding pad of the image sensor chip and the lead terminal of the printed circuit board. By filling and hardening the transparent encapsulant on the inside, it is possible to prevent contamination by the outside of the image sensor chip and to withstand the external shock caused by the up and down load caused by the addition of a dome switch for clicking on the present invention. It can prevent the chip's performance degradation and shorten the life cycle.

Claims (5)

휴대단말기에 장착되어 장치의 커버플레이트 상의 피사체(손가락)의 움직임을 통해 휴대단말기 엘씨디(LCD)의 커서를 움직이게 하는 광포인팅 장치에 있어서,In the optical pointing device mounted on the portable terminal to move the cursor of the portable terminal LCD (LCD) through the movement of the subject (finger) on the cover plate of the device, 상기 광포인팅 장치의 파사체의 움직임을 감지하는 이미지 센서 패키지Image sensor package for detecting the movement of the projectile body of the optical pointing device 제 1항에 있어서,The method of claim 1, 여러개의 인쇄회로기판의 리드단자군과 이미지 센서의 본딩패드를 본딩 와이어로 연결하는 칩온보드(Chip On Board) 형태로 실장되는것을 특징으로 하는 이미지 센서 패키지 Image sensor package, characterized in that it is mounted in the form of a chip on board connecting the lead terminal group of a plurality of printed circuit board and the bonding pad of the image sensor by a bonding wire. 제2항에 있어서,The method of claim 2, 상기 칩온보드(Chip On Board)로 실장된 여러개의 이미지 센서의 상면에 봉합금형을 배치시키고 봉합금형에 봉지재를 충전하여 경화된 이미지 센서 군을 패키지 형태로 컷팅하여 낱개로 분리하는 이미지 센서 패키지An image sensor package that separates the cured image sensor group into a package form by placing a sealing mold on the top surface of the plurality of image sensors mounted with the chip on board and filling the sealing material with the sealing mold into a package. 제3항에 있어서,The method of claim 3, 상기 컷팅된 이미지 센서 패키지를 릴(Reel) 작업이 가능하도록 하는 이미지 센서 패키지Image sensor package for reeling the cut image sensor package 제3항에 있어서,The method of claim 3, 봉지재의 재질은 투명 에폭시몰딩컴파운드(Epoxy Molding Compound)로 사용하는 것을 특징으로 하는 이미지 센서 패키지 Image sensor package, characterized in that the material of the encapsulation material is used as a transparent epoxy molding compound (Epoxy Molding Compound)
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101346652B1 (en) * 2013-08-20 2014-01-07 (주)드림텍 Method of manufacturing fingerprint recognition home key and fingerprint recognition home key
KR101380340B1 (en) * 2012-08-31 2014-04-02 크루셜텍 (주) Fingerprint sensor package and portable electronic device having the same
KR20170000961A (en) * 2015-06-25 2017-01-04 크루셜텍 (주) Sensor package and method of manufacturing same
CN109890188A (en) * 2019-02-15 2019-06-14 华为技术有限公司 Package assembling and electronic equipment

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KR100494025B1 (en) * 2003-02-27 2005-06-10 김영선 Method manufacturing for image sensor
KR100465969B1 (en) * 2003-04-11 2005-01-13 (주)모비솔 Pointing device using the surface of a finger

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KR101380340B1 (en) * 2012-08-31 2014-04-02 크루셜텍 (주) Fingerprint sensor package and portable electronic device having the same
KR101346652B1 (en) * 2013-08-20 2014-01-07 (주)드림텍 Method of manufacturing fingerprint recognition home key and fingerprint recognition home key
KR20170000961A (en) * 2015-06-25 2017-01-04 크루셜텍 (주) Sensor package and method of manufacturing same
CN109890188A (en) * 2019-02-15 2019-06-14 华为技术有限公司 Package assembling and electronic equipment
CN109890188B (en) * 2019-02-15 2021-03-23 华为技术有限公司 Packaging assembly and electronic equipment

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