KR20070069562A - System for suppling chemical for cleaning wafer - Google Patents

System for suppling chemical for cleaning wafer Download PDF

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Publication number
KR20070069562A
KR20070069562A KR1020050131840A KR20050131840A KR20070069562A KR 20070069562 A KR20070069562 A KR 20070069562A KR 1020050131840 A KR1020050131840 A KR 1020050131840A KR 20050131840 A KR20050131840 A KR 20050131840A KR 20070069562 A KR20070069562 A KR 20070069562A
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South Korea
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chemical
cleaning
tank
wafer
reservoir
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KR1020050131840A
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Korean (ko)
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오세열
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주식회사 실트론
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Priority to KR1020050131840A priority Critical patent/KR20070069562A/en
Publication of KR20070069562A publication Critical patent/KR20070069562A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A chemical supply system for cleaning a wafer is provided to prevent particles from being generated due to pollution of a chemical by supplying the chemical into an outer reservoir. A cleaning reservoir has an inner reservoir(11) receiving a wafer(10) to be cleaned and an outer reservoir(12) installed on an edge of the inner reservoir. A circulation piping(14) circulates a chemical solution which is supplied to the outer reservoir in the inner reservoir. A pump(21) and a filter(22) are provided in the circulation piping. A chemical supply line(13) supplies the chemical to the outer reservoir. One end of the circulation piping is installed in the outer reservoir, and the other end is installed in the inner reservoir.

Description

웨이퍼 세정용 약액 공급 시스템{SYSTEM FOR SUPPLING CHEMICAL FOR CLEANING WAFER}Chemical Supply System for Wafer Cleaning {SYSTEM FOR SUPPLING CHEMICAL FOR CLEANING WAFER}

도 1은 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템의 구성을 개략적으로 나타내 보인 도면.1 is a view schematically showing the configuration of a chemical cleaning system for wafer cleaning according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10. 웨이퍼10. Wafer

11. 내조11. House

12. 외조12. The Bird

13. 약액공급라인13. Chemical supply line

14. 순환배관14. Circulation piping

21. 펌프21. Pump

22. 필터22. Filter

본 발명은 웨이퍼 세정용 약액 공급 시스템에 관한 것으로서, 보다 상세하게는 약액 오염에 의한 파티클(Particle)의 발생을 원천적으로 방지하기 위한 웨이퍼 세정용 약액 공급 시스템에 관한 것이다.The present invention relates to a chemical cleaning system for wafer cleaning, and more particularly, to a chemical cleaning system for wafer cleaning to prevent generation of particles due to chemical contamination.

웨이퍼 제조 및 반도체 공정에서의 세정은 약액(Chemical) 사용을 통한 화학적 반응이 필수적으로 요구가 되고 있다. Cleaning of wafers and semiconductor processes requires chemical reactions through the use of chemicals.

그러나, 매 작업(Run) 마다 약액을 드레인(Drain)하고 공급할 경우 약액 소모량 및 폐수 처리비용 증가와 같은 문제로 인해 일정 작업 진행 후, 드레인 및 신액(新液)을 공급받는 방식을 택하고 있다. However, in the case of draining and supplying the chemical solution at every run, problems such as an increase in the consumption of the chemical solution and the cost of wastewater treatment are selected, so that the drain and the new liquid are supplied after a certain operation.

이때 약액이 순환 및 여과(Filtering) 되지 않을 경우, 세정 효과가 급격히 저하되는 바, 이러한 문제점을 보완하기 위해 순환 시스템이 구성되어 있으며, 순환 시스템의 주요 부품은 순환을 시켜주는 펌프(Pump)와 약액 내 불순물을 제거해 주는 필터(Filter)가 구비되어 있다.At this time, when the chemical liquid is not circulated and filtered, the cleaning effect is sharply reduced, and a circulation system is configured to compensate for this problem. The main components of the circulation system are a pump and a chemical liquid that circulate. Filter is provided to remove impurities.

그리고 약액 드레인 이후 신액이 공급받는 방식은, 일정량의 초순수(DIW)가 공급되고 난 후, 약액이 세정조(Bath)의 내조로 유입된다. 그런 후, 약액이 정량만큼 공급되고, 다시 초순수를 공급받는다. In addition, the new liquid is supplied after the drainage of the chemical liquid. After a certain amount of ultrapure water (DIW) is supplied, the chemical liquid flows into the inner tank of the cleaning bath. Then, the chemical liquid is supplied in a quantitative manner, and ultrapure water is supplied again.

즉, 초순수의 경우 메인 장비에서 초순수 필터(DIW Filter)를 통해 여과된 상태로 세정조에 공급이 되나, 약액의 경우 약액 바틀(Bottle) 자체의 오염, 장비까지의 배관 오염 등으로 인해 불순물 측면에서 불리하나, 내조로 약액이 직접 공급됨에 따라 약액 공급 초기에 파티클 수준(Particle Level) 상승이 발생하다가, 어느 정도 순환 시스템을 통해야만 여과되고 난 후 안정화되는 경향을 나타낸다.In other words, ultrapure water is supplied to the washing tank as filtered through the ultra pure water filter (DIW Filter) from the main equipment, but in the case of chemical liquids, it is disadvantageous in terms of impurities due to contamination of the chemical bottle itself and pipe contamination to the equipment. However, as the chemical solution is directly supplied to the inner tank, the particle level rises at the initial stage of the chemical solution supply, and is stabilized after being filtered through a circulating system to some extent.

상기한 바와 같이 종래의 세정조의 구조는 약액이 모두 내조로 직접 공급되어 약액 교환 이후 초기 불안정한 품질을 나타내었다. As described above, in the structure of the conventional cleaning tank, all of the chemical liquids are directly supplied to the inner tank, thereby showing an initial unstable quality after chemical liquid exchange.

본 발명은 상기와 같은 문제점을 해결하기 위하여 창출된 것으로서, 약액 공급이 세정조의 외조로 직접 공급을 하여, 약액 오염에 의한 파티클 발생을 원천적으로 방지하도록 한 웨이퍼 세정용 약액 공급 시스템을 제공하는데 그 목적이 있다.The present invention was created to solve the above problems, the chemical liquid supply is supplied directly to the outer tank of the cleaning tank, to provide a chemical cleaning system for wafer cleaning to prevent the generation of particles due to chemical contamination. There is this.

상기와 같은 목적을 달성하기 위한 본 발명의 웨이퍼 세정용 약액 공급 시스템은, 세정되는 웨이퍼가 수납된 내조와, 상기 내조의 가장자리에 설치된 외조를 구비하여 된 세정조와; 상기 외조에 약액이 공급되면 이를 상기 내조로 순환되도록 연결 설치된 순환배관과; 상기 순환배관에 순차적으로 설치된 펌프와, 필터;를 포함하는 것을 그 특징으로 한다. A chemical cleaning system for wafer cleaning according to the present invention for achieving the above object comprises: a cleaning tank including an inner tank in which a wafer to be cleaned is stored and an outer tank provided at an edge of the inner tank; A circulation pipe connected to the outer tank so as to be circulated to the inner tank when the chemical liquid is supplied to the outer tank; It characterized in that it comprises a pump and a filter, which are sequentially installed in the circulation pipe.

이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1에는 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템의 구성을 개략적으로 나타낸 구성도가 도시되어 있다.1 is a block diagram schematically showing the configuration of a chemical cleaning system for wafer cleaning according to the present invention.

설명에 앞서, 일반적인 웨이퍼 세정 시스템의 구성 설명은 생략하기로 하고, 여기에서는 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템의 특징적인 구성만을 설명하기로 한다.Prior to the description, a description of the configuration of the general wafer cleaning system will be omitted, and only the characteristic configuration of the chemical cleaning system for wafer cleaning according to the present invention will be described.

도면을 참조하면, 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템은, 세정되는 웨이퍼(10)가 수납된 내조(11)와, 이 내조(11)의 가장자리에 설치된 외조(12) 를 구비하여 된 세정조와, 이 세정조의 외조(12)에 약액이 공급되면 이를 내조(11)로 순환되도록 연결 설치된 순환배관(14)과, 이 순환배관(14)에 순차적으로 설치된 펌프(21)와, 필터(22)를 포함하여 구성된다.Referring to the drawings, the chemical cleaning system for wafer cleaning according to the present invention includes a cleaning tank including an inner tank 11 containing a wafer 10 to be cleaned and an outer tank 12 provided at an edge of the inner tank 11. When the chemical liquid is supplied to the outer tank 12 of the washing tank, the circulation pipe 14 connected to the inner tank 11 is circulated, the pump 21 sequentially installed on the circulation pipe 14, and the filter 22. It is configured to include.

그리고 상기 외조(12)에는 약액이 직접 외조(12)에 공급되도록 하는 약액공급라인(13)이 설치된다. 또한 상기 순환배관(14)의 일단은 외조(12)에 설치되고, 타단은 상기 내조(11)에 설치된다.The outer tank 12 is provided with a chemical liquid supply line 13 to directly supply the chemical liquid to the outer tank 12. In addition, one end of the circulation pipe 14 is installed in the outer tank 12, the other end is installed in the inner tank (11).

상기한 바와 같은 구성을 갖는 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템의 작용을 설명하면 다음과 같다.Referring to the operation of the chemical cleaning system for wafer cleaning according to the present invention having the configuration as described above are as follows.

설명에 앞서, 일반적인 웨이퍼 세정 시스템의 작용 설명은 생략하기로 하고, 여기에서는 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템의 특징적인 작용만을 설명하기로 한다.Prior to the description, description of the operation of the general wafer cleaning system will be omitted, and only the characteristic operation of the chemical cleaning system for wafer cleaning according to the present invention will be described.

설명에 앞서, 전술한 바와 같이 종래에는 내조(11)로 약액이 직접 공급됨에 따라 약액 공급 초기에 파티클 수준 상승이 발생하다가, 어느 정도 순환 시스템을 통해야만 여과되고 난 후 안정화되는 경향을 나타내었다.Prior to the description, as described above, as the chemical liquid is directly supplied to the inner tank 11, particle level rise occurs at the initial stage of the chemical liquid supply, and it shows a tendency to stabilize after being filtered through a circulating system to some extent.

따라서 약액이 모두 내조(11)로 직접 공급되어 약액 교환 이후 초기 불안정한 품질을 나타내었다. Therefore, the chemicals were all supplied directly to the inner tank 11, which showed initial unstable quality after chemical exchange.

그러나, 상기한 종래의 문제점을 근본적으로 해결한 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템은, 도 1에 도시된 바와 같이, 약액을 세정조의 외조(12)로 직접 공급하는 방식을 적용하였다.However, in the wafer cleaning chemical supply system according to the present invention, which fundamentally solves the conventional problems described above, as shown in FIG. 1, a method of directly supplying the chemical solution to the outer tank 12 of the cleaning tank is applied.

이러한 방식을 통해 외조(12)로 약액을 상기 약액공급라인(13)을 통하여 직 접 공급하고, 웨이퍼(10)가 들어있는 내조(11)에 약액이 공급되도록 순환배관(14)의 펌프(21) 및 필터(22)를 통하여 여과된 상태의 깨끗한 약액만을 공급하게 한다.In this manner, the chemical liquid is directly supplied to the outer tank 12 through the chemical liquid supply line 13, and the pump 21 of the circulation pipe 14 is supplied with the chemical liquid to the inner tank 11 containing the wafer 10. And only the clean chemical liquid in the filtered state through the filter 22.

상기한 바와 같이, 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템은, 웨이퍼(10) 제조 및 반도체 공정 중 약액을 사용하는 세정조에 약액 공급을 외조(12)로 직접 공급을 하고, 필터(22)를 통하여 여과된 약액만을 내조(11)로 투입하여 약액 오염에 의한 파티클 발생을 원천적으로 방지한다.As described above, in the wafer cleaning chemical liquid supply system according to the present invention, the chemical liquid supply is directly supplied to the outer tank 12 to the cleaning tank using the chemical liquid during the wafer 10 manufacturing and semiconductor processes, and the filter 22 is supplied. Only the chemical liquid filtered through the inner tank 11 is introduced to prevent particles generated by the chemical liquid contamination.

상술한 바와 같이 본 발명에 따른 웨이퍼 세정용 약액 공급 시스템은 다음과 같은 효과를 갖는다.As described above, the chemical cleaning system for wafer cleaning according to the present invention has the following effects.

종래와 같이 약액 공급을 세정조의 내조로 공급되는 것을, 본 발명과 같이 외조로 공급하여, 약액 오염에 의한 파티클 발생을 원천적으로 방지할 수 있게 되었다. 특히, 약액 교체 이후 탁월한 효과를 가진다.As in the prior art, the supply of the chemical liquid supply to the inner tank of the washing tank can be supplied to the outer tank as in the present invention, thereby preventing the generation of particles due to the chemical liquid contamination. In particular, it has an excellent effect after chemical replacement.

본 발명은 도면에 도시된 일 실시예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 당해 기술 분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 실시예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 보호 범위는 첨부된 특허청구범위에 의해서만 정해져야 할 것이다.Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (3)

세정되는 웨이퍼가 수납된 내조와, 상기 내조의 가장자리에 설치된 외조를 구비하여 된 세정조와;A cleaning tank including an inner tank in which the wafer to be cleaned is stored and an outer tank provided at an edge of the inner tank; 상기 외조에 약액이 공급되면 이를 상기 내조로 순환되도록 연결 설치된 순환배관과;A circulation pipe connected to the outer tank so as to be circulated to the inner tank when the chemical liquid is supplied to the outer tank; 상기 순환배관에 순차적으로 설치된 펌프와, 필터;를 포함하는 것을 특징으로 하는 웨이퍼 세정용 약액 공급 시스템.And a pump and a filter sequentially installed in the circulation pipe. 제1항에 있어서,The method of claim 1, 상기 외조에는 약액이 직접 상기 외조에 공급되도록 하는 약액공급라인이 설치된 것을 특징으로 하는 웨이퍼 세정용 약액 공급 시스템.The chemical solution supply system for a wafer cleaning, characterized in that the chemical solution supply line is installed in the outer tank to supply the chemical liquid directly to the outer tank. 제1항에 있어서,The method of claim 1, 상기 순환배관의 일단은 상기 외조에 설치되고, 타단은 상기 내조에 설치된 것을 특징으로 하는 웨이퍼 세정용 약액 공급 시스템.One end of the circulation pipe is installed in the outer tank, the other end is a wafer cleaning chemical supply system, characterized in that installed in the inner tank.
KR1020050131840A 2005-12-28 2005-12-28 System for suppling chemical for cleaning wafer KR20070069562A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100898045B1 (en) * 2007-09-27 2009-05-19 세메스 주식회사 Substrate treatment apparatus and method for supplying chemical of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100898045B1 (en) * 2007-09-27 2009-05-19 세메스 주식회사 Substrate treatment apparatus and method for supplying chemical of the same

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