KR20070067885A - Led lamp modules for led signs - Google Patents

Led lamp modules for led signs Download PDF

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Publication number
KR20070067885A
KR20070067885A KR1020050129338A KR20050129338A KR20070067885A KR 20070067885 A KR20070067885 A KR 20070067885A KR 1020050129338 A KR1020050129338 A KR 1020050129338A KR 20050129338 A KR20050129338 A KR 20050129338A KR 20070067885 A KR20070067885 A KR 20070067885A
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South Korea
Prior art keywords
led lamp
led
unit
pcb
module
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KR1020050129338A
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Korean (ko)
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KR100745839B1 (en
Inventor
황재성
허한
소민수
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금호전기주식회사
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Priority to KR1020050129338A priority Critical patent/KR100745839B1/en
Publication of KR20070067885A publication Critical patent/KR20070067885A/en
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

A LED(Light Emitting Diode) lamp module for LED signs is provided to improve a radiating characteristic by minimizing electronic errors due to overheat of an LED lamp unit. A plurality of LED lamp units(1) are connected to a connector(60) through a power line(50). Each of the LED lamp units includes an anode contact unit, a cathode contact unit, an LED chip(13) arranged at a center thereof, an LED lamp drive PCB(Printed Circuit Board)(20) electrically connected to the LED chip, a radiating plate(30) attached to a lower part of the PCB, and a unit cover(40) attached to an upper part of the LED lamp drive PCB.

Description

ＬＥＤ 사인용 ＬＥＤ 램프모듈{LED lamp modules for LED signs}LED lamp modules for LED signs

도 1은 종래 LED 램프모듈 구성을 보이기 위한 개략 참조도이며,1 is a schematic reference diagram for showing a conventional LED lamp module configuration,

도 2는 본 발명에 의한 LED 램프 모듈을 구성하는 개별 LED 램프 유닛의 분해사시도이며, 2 is an exploded perspective view of the individual LED lamp unit constituting the LED lamp module according to the present invention,

도 3은 도 2의 A-A' 절취선에서의 단면도를 도시한 것이며, 3 is a cross-sectional view taken along the line AA ′ of FIG. 2;

도 4는 개별 LED 램프 유닛이 커넥터에 의해 인접 유닛과 연결되어 모듈을 구성하는 일부분을 도시한 것이며, 4 shows a part in which individual LED lamp units are connected to adjacent units by connectors to form a module,

도 5는 찬넬(channel)에 내장된 LED 램프모듈 사용예를 도시한 것이다.Figure 5 shows an example of using the LED lamp module built in the channel (channel).

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

1 : LED 램프 유닛 10: LED 램프 모듈1: LED lamp unit 10: LED lamp module

13: LED 칩 14: LED 램프13: LED chip 14: LED lamp

20: LED 램프구동 PCB 30: 방열판20: LED lamp driving PCB 30: heat sink

40: 유닛 커버 41: 중앙홀40: unit cover 41: center hole

42: 반사경 50: 전원라인42: reflector 50: power line

60: 커넥터 70: 찬넬60: connector 70: channel

90: 판넬90: panel

본 발명은 LED 사인용 LED 램프모듈에 관한 것이고, 상세하게는 LED 램프가 내장되어 광고판 또는 상호간판으로 사용되는 LED 사인(sign)에서의 LED 램프모듈에 관한 것이다.The present invention relates to a LED lamp module for LED sign, and more particularly, to a LED lamp module in the LED sign (LED) that is used as a billboard or mutual signboard with a built-in LED lamp.

발광 LED는 가격이 저렴하고, 에너지가 절감이 되며, 사용수명이 길다는 장점이 있으므로, 발광 LED를 이용하여 광고간판 이나 상호간판 등이 제작되고 있으며, 이를 통칭하여 LED 사인이라 정의된다. 이러한 LED 사인 내부에는 LED 램프를 실장하기 위한 LED 모듈이 장착되며, 일반적인 LED 모듈은 LED를 전기회로판 위에 납땜 용접하고, 또는 이 전기회로판을 일정한 고정 박스 내에 넣고, 표면에는 색부착 덮개를 설치하여 사인에 내장한다. 그러나, 이러한 종류의 발광 LED를 사용한 광고간판 또는 상호 간판의 제작은 대단히 번잡하고, 사용자의 디자인 또는 문자요구에 따라 전기회로판 및 발광 LED를 설계하므로, 비용이 상당히 높아지게 될 뿐 아니라 방수기능이 없다는 문제점이 있었다. 또한, LED 램프에서 발생되는 상당한 열량을 해결하지 못하는 한계가 있었다.Since the light emitting LED has the advantages of low price, energy saving, and long service life, advertising signs or signboards are manufactured using the light emitting LED, which is collectively defined as an LED sign. Inside the LED sign, an LED module for mounting an LED lamp is mounted, and a general LED module is soldered and welded to an LED on an electric circuit board, or the electric circuit board is placed in a fixed box, and a colored cover is installed on the surface. Built in. However, the production of advertising signboards or signboards using this kind of light emitting LEDs is very complicated, and electrical circuit boards and light emitting LEDs are designed according to the user's design or character requirements, so that the cost is notably high and there is no waterproof function. There was this. In addition, there is a limit that does not solve the significant amount of heat generated in the LED lamp.

이러한 문제를 해결하기 위하여 한국등록실용 제20-382642호(방수기능을 갖는 LED 발광장치)에 의하면, 다수의 구멍이 개방된 물건과, 방수기능을 가지는 보 호체로 둘러싸인 적어도 1쌍의 LED 램프로 구성되며, 다수의 LED 램프는 1개의 전선에 접속되며, 상기 물건의 하나하나의 구멍에 각각의 한개씩의 발광 LED 램프를 삽입하여 고정하는 LED 발광장치가 개시된다. 그러나, 상기 선행자료는 LED 램프를 사용함으로써 요구되는 고휘도성 및 방열성 해결이 부족하다는 문제점이 여전히 존재하고 있었다.In order to solve this problem, according to Korean Registered Room No. 20-382642 (LED light emitting device having a waterproof function), at least one pair of LED lamps surrounded by an object having a large number of openings and a protection body having a waterproof function is used. A plurality of LED lamps are connected to one wire, and an LED light emitting device for inserting and fixing each one of the light emitting LED lamps into one hole of the object is disclosed. However, the prior art still has a problem that the lack of high brightness and heat dissipation required by using the LED lamp is still present.

한편, 한국등록실용 제20-332840호(LED 조명을 이용한 찬넬 광고장치)에 의하면, 문자나 도형으로 이루어진 찬넬(channel) 광고판에 LED를 적용한 후 LED 발광으로부터 나타나는 조명이 직접 또는 간접적으로 이루어지도록 하기 위하여, 도 1에 도시된 바와 같이 찬넬 내부면에는 체결수단을 통하여 다수개의 고정대를 고정하고, 상기 고정대에는 인쇄회로기판(PCB)를 수직으로 세워 고정하되, PCB 테두리면에는 다수의 LED 고정홀더를 직렬로 배열하며, 상기 LED 고정홀더에는 모듈단위의 회로를 구성하면서 문자나 도형을 표현한 찬넬의 외부 식별이 용이하게 이루어지도록 조명을 제공하는 LED를 결합하고, 찬넬 일면에는 색상이 도포된 덮개판이 피지되어 덮혀지도록 구성된 광고장치가 기술된다. 그러나, 상기 선행기술은 LED 램프의 확장성 또는 연장성이 결여되며, LED 램프 방열의 문제를 해결하지 못하고 있다.On the other hand, according to Korean Registered Room No. 20-332840 (channel advertising device using LED lighting), after applying the LED to the channel (channel) advertising board consisting of letters or figures to ensure that the illumination from the LED light is made directly or indirectly In order to fix the plurality of holders through the fastening means on the inner surface of the channel as shown in FIG. 1, the holders are fixed upright with a printed circuit board (PCB) vertically, and a plurality of LED fixing holders on the edge of the PCB. Arranged in series, the LED fixing holder is combined with the LED to provide a light to facilitate the external identification of the channel expressing letters or figures while forming a module unit circuit, the cover plate coated with color on one side of the channel An advertising device configured to be covered is described. However, the prior art lacks the expandability or extension of the LED lamp, and does not solve the problem of LED lamp heat dissipation.

본 발명은 상기 문제점들을 해결하기 위한 것으로, 본 발명의 목적은 LED 램 프 유닛의 확장성이 가능한 LED 램프모듈을 제공하는 것이다.The present invention is to solve the above problems, it is an object of the present invention to provide an LED lamp module that is expandable of the LED lamp unit.

본 발명의 다른 목적은 LED 램프 유닛이 과열로부터 방지되어 전기적 오류를 최소화할 수 있는 방열성이 개선된 LED 램프모듈을 제공하는 것이며, 본 발명의 또 다른 목적은 고휘도성이 달성되는 LED 램프모듈을 개시하는 것이다.Another object of the present invention is to provide an LED lamp module with improved heat dissipation, which can prevent the LED lamp unit from overheating to minimize electrical error, and another object of the present invention is to disclose an LED lamp module that achieves high brightness It is.

상기 목적을 달성하기 위하여, 본 발명은 다수의 LED 램프 유닛이 탈착가능 커넥터를 매개로 하여 전원라인에 의해 연결되어 구성되는 LED 사인용 LED 램프모듈로 구성된다. 상기 램프모듈은 광고판 등의 변형에 따른 확장성이 보장될 수 있도록 탈착가능한 커넥터를 통하여 각각의 LED 램프유닛이 연장될 수 있다. 본 발명에 있어서, LED 램프모듈을 구성하는 각각의 LED 램프 유닛은, 양단부에 양극 및 음극접촉부가 형성되며 전기적으로 중앙에 배치되는 LED 칩과 도통 배치되는 LED 램프 구동 PCB ; 상기 PCB 하부에 접착된 방열판 ; 및 상기 LED 램프 구동 PCB 상부에 형성되는 유닛 커버 ; 로 구성되어, LED 칩으로부터 발생되어 궁극적으로 모듈 오류를 유발할 수 있는 상당한 열량을 흡수할 수 있도록 방열판이 제공되며, 방수기능을 강화하기 위하여 유닛 커버를 PCB와 결착한다. 상기 LED 칩은 중앙부에 형성된 LED 램프 외주에 상향 돌출부가 형성되어, 유닛 커버와 결착되도록 구성된다. 이를 위하여, 상기 유닛 커버는 중앙부에 LED 램프 외주 돌출부가 삽입될 수 있는 중앙홀이 형성되며, 중앙홀 상부 방사방향으로 반사경이 형성된 것을 특징으로 하여, 휘도성이 개선될 수 있도록 구성된다. 상기 유닛 커버의 형상은 한정되지 아니하지만 바람직하게는 원통형으로 구비된다. 상기 유닛 커버는 LED 램프 구동 PCB 상면을 보호하는 역할을 수행함과 동시에 중앙홀에서 돌출된 LED 램프 휘도를 개선하기 위하여 반사경이 형성된다. 상기 유닛 커버 외면 일측에는 전원라인 삽입홈이 형성되며, 타측에는 판넬고정부가 형성되어, 전원라인 삽입홈을 통하여 전원라인은 LED 램프 구동 PCB 상의 음극 및 양극 접촉부와 연결되며, 상기 판넬고정부는 체결수단(예: 볼트)을 통하여 판넬에 장착되어 찬넬 내부로 실장될 수 있다.In order to achieve the above object, the present invention comprises a plurality of LED lamp unit LED lamp module for LED sign is configured by being connected by a power line via a removable connector. The lamp module may be extended to each LED lamp unit through a removable connector to ensure the expandability according to the deformation of the billboard. In the present invention, each of the LED lamp unit constituting the LED lamp module, LED lamp driving PCB which is formed in both ends and the conductive contact with the LED chip is disposed in the center of the positive and negative electrode; A heat sink bonded to the lower part of the PCB; And a unit cover formed on the LED lamp driving PCB. A heat sink is provided to absorb significant amounts of heat generated from the LED chip and ultimately cause module failure, and the unit cover is bonded to the PCB to enhance waterproofing. The LED chip has an upward protrusion formed on the outer circumference of the LED lamp formed in the center portion, and is configured to be bound to the unit cover. To this end, the unit cover is formed in the central hole in which the LED lamp outer periphery projecting portion can be inserted, the reflector is formed in the radial direction above the central hole, it is configured to improve the brightness. The shape of the unit cover is not limited but is preferably provided in a cylindrical shape. The unit cover serves to protect the upper surface of the LED lamp driving PCB and a reflector is formed to improve the brightness of the LED lamp protruding from the center hole. A power line insertion groove is formed at one side of the outer surface of the unit cover, and a panel fixing part is formed at the other side, and the power line is connected to the negative and positive contact parts on the LED lamp driving PCB through the power line insertion groove, and the panel fixing part is a fastening means. It can be mounted on the panel by using bolts (eg bolts).

이하, 첨부된 도면에 의거하여 본 발명의 바람직한 일 실시예를 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

도 2는 LED 램프 모듈을 구성하는 개별 LED 램프 유닛의 분해사시도이며, 도 3은 도 2의 A-A 절취선에서의 단면도를 도시한 것이며, 도 4는 개별 LED 램프 유닛이 커넥터에 의해 인접 유닛과 연결되어 모듈을 구성하는 일부분을 도시한 것이며, 도 5는 찬넬에 내장된 LED 램프모듈 사용예를 도시한 것이다.Figure 2 is an exploded perspective view of the individual LED lamp unit constituting the LED lamp module, Figure 3 shows a cross-sectional view at the AA cut line of Figure 2, Figure 4 is the individual LED lamp unit is connected to the adjacent unit by a connector A part constituting the module is shown, and FIG. 5 shows an example of using an LED lamp module built in a channel.

도 2 내지 도 3에서 도시된 바와 같이, LED 램프 유닛(1)은 양단부에 양극 및 음극접촉부(11, 12)가 형성되며 전기적으로 중앙에 배치되는 LED 칩(13)과 도통 배치되는 LED 램프 구동 PCB (20) ; 상기 PCB 하부에 접착된 방열판 (30) ; 및 상기 LED 램프 구동 PCB 상부에 형성되는 유닛 커버(40)로 구성된다. 상기 LED 칩(13)은 중앙부에 LED 램프(14)가 형성되며, 상기 LED 램프 외주를 따라 돌출부(15)가 형성되어, 상기 유닛 커버(40) 중앙홀(41)에 결착될 수 있도록 구성된다. 상기 PCB 하면에 도전성 접착재료에 의하여 부착된 방열판(30)은 상기 LED 칩으로부터 발생되어 모듈 전자적 오류를 유발할 수 있는 상당한 열량을 흡수할 수 있도록 구성된다. 상기 양극(11) 및 음극접촉부(12)는 전원라인(50)과 연결되어 LED 칩으로의 전원을 공급하며, 상기 전원라인 일단에는 인접 LED 램프 유닛과 확장될 수 있도록 커넥터(60)가 형성된다. 한편, LED 램프 구동 PCB 방수기능을 강화하기 위하여 유닛 커버(40)가 PCB 상면에 부착된다. 유닛 커버는 중앙부에 LED 램프 외주 돌출부(15)가 삽입될 수 있는 중앙홀(41)이 형성되며, 중앙홀 상부 방사방향으로 반사경(42)이 형성되어, 중앙홀(41)에 돌출된 LED 램프(14)로부터 발광되는 조명 휘도성이 개선될 수 있도록 구성된다. 상기 유닛 커버의 형상은 한정되지 아니하지만 바람직하게는 원통형으로 구비된다. 상기 유닛 커버 외면 일측에는 전원라인 삽입홈(43)이 형성되며, 타측에는 판넬(90)과 고정하기 위한 체결수단이 형성된다. 전원라인 삽입홈(43)을 통하여 전원라인은 LED 램프 구동 PCB 상의 음극 및 양극 접촉부와 연결되며, 상기 체결수단(44)을 통하여 유닛 커버(40) 및 상기 커버 내부에 실장된 LED 램프 유닛(1)은 판넬(90)과 고정되어, 찬넬(70)로 내장될 수 있다. 상기 찬넬(70)은 LED 램프모듈(10)이 내장되면서 문자나 도형을 표현한 내부공간을 구비하는 박스이며, 바람직하게는 찬넬 일면에는 색상이 도포된 덮개판(100)이 파지되어 덮혀지도록 구성된다. As shown in FIGS. 2 to 3, the LED lamp unit 1 has an anode and cathode contact portions 11 and 12 formed at both ends thereof, and drives an LED lamp disposed in electrical communication with an LED chip 13 disposed at an electrically center. PCB 20; A heat sink 30 bonded to the lower part of the PCB; And a unit cover 40 formed on the LED lamp driving PCB. The LED chip 13 has an LED lamp 14 formed at a central portion thereof, and a protrusion 15 is formed along the outer circumference of the LED lamp, so that the LED chip 13 can be attached to the central hole 41 of the unit cover 40. . The heat sink 30 attached to the bottom surface of the PCB by a conductive adhesive material is configured to absorb a significant amount of heat generated from the LED chip and may cause module electronic errors. The positive electrode 11 and the negative electrode contact part 12 are connected to the power line 50 to supply power to the LED chip, and a connector 60 is formed at one end of the power line so as to be extended with an adjacent LED lamp unit. . On the other hand, the unit cover 40 is attached to the upper surface of the PCB to enhance the LED lamp driving PCB waterproof function. The unit cover has a central hole 41 into which the LED lamp outer circumferential protrusion 15 can be inserted, and a reflector 42 is formed in the radial direction above the central hole, and the LED lamp protrudes from the central hole 41. The illumination brightness emitted from 14 is configured to be improved. The shape of the unit cover is not limited but is preferably provided in a cylindrical shape. A power line insertion groove 43 is formed at one side of the outer surface of the unit cover, and a fastening means for fixing with the panel 90 is formed at the other side. The power line is connected to the cathode and anode contacts on the LED lamp driving PCB through the power line insertion groove 43, and the unit lamp 40 and the LED lamp unit 1 mounted inside the cover are provided through the fastening means 44. ) Is fixed to the panel 90, it may be embedded into the channel (70). The channel 70 is a box having an internal space expressing a character or a figure while the LED lamp module 10 is embedded, and preferably, the cover plate 100 coated with color is gripped and covered on one surface of the channel. .

도 4는 각각의 LED 램프 유닛(1)이 전원라인 (50) 일단에 부착된 커넥터 (60)에 의하여 연장된 LED 램프모듈(10) 일부를 도시한 것이여, 도 5는 본 발명에 의한 LED 램프모듈(10)이 볼트(440)에 의해 판넬(90)에 체결되어 찬넬(70) 내부에 삽입되는 사용 참조도를 도시한 것이다.Figure 4 shows a portion of the LED lamp module 10, each LED lamp unit 1 is extended by a connector 60 attached to one end of the power line 50, Figure 5 is an LED according to the present invention The lamp module 10 is fastened to the panel 90 by the bolt 440 and shows a use reference diagram inserted into the panel 70.

이와 같이 구성되는 본 발명의 LED 램프모듈(10)의 조립과정을 설명하면, 일차적으로 다수의 LED 램프유닛(1)을 제작함에 있어서, 방열판 (30) 상면에 도전성 접착제를 도포하고 LED 램프 구동 PCB(20) 및 LED 칩(13)을 배치하여 고정시키고, PCB 양단부에 형성된 양극접촉부 및 음극접촉부(11, 12) 각각에 전원라인(50)을 납땜 용접한다. 상기 전원라인(50) 일단에는 타 LED 램프 유닛과의 연결을 위한 커넥터(60)가 연결되어 구성된다. 상기 LED 칩(13) 중앙부에는 발광 LED 램프(14)가 구비되며, 상기 램프 외주에는 돌출부(15)가 형성되어 유닛 커버(40) 중앙홀(41)과 결착될 수 있다. PCB ; 램프 돌출부를 매개하여 결착된 유닛커버는 볼트(440)을 이용하여 판넬(90)에 고정하여 찬넬(70)에 실장하고, 덮개판(100)을 덮어 각종 문자 또는 도형을 이루는 사인보드를 완성한다.Referring to the assembly process of the LED lamp module 10 of the present invention configured as described above, in the first manufacturing a plurality of LED lamp unit 1, by applying a conductive adhesive on the upper surface of the heat sink 30 and LED lamp driving PCB 20 and the LED chip 13 are disposed and fixed, and the power line 50 is soldered and welded to each of the positive and negative contact portions 11 and 12 formed at both ends of the PCB. One end of the power line 50 is connected to the connector 60 for connection with another LED lamp unit. A light emitting LED lamp 14 may be provided at the center of the LED chip 13, and a protrusion 15 may be formed at the outer circumference of the lamp to be coupled to the central hole 41 of the unit cover 40. PCB; The unit cover fixed through the lamp protrusion is fixed to the panel 90 by using the bolt 440 to be mounted on the panel 70, and covers the cover plate 100 to complete a sign board forming various characters or figures. .

이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위내에서 여러가지 치환, 변형 및 변경이 가능함은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

전술한 바와 같이, 본 발명에 의한 LED 램프모듈을 구성하는 각각의 LED 램 프 유닛의 PCB 및 LED 칩 하부면에는 방열판이 부착되어 과도한 발생 열량에 의한 전자적 오류를 방지할 수 있고, 각각의 LED 램프 유닛은 양단 커넥터로 구성되어 확장성이 용이하며, 특히 LED 램프로부터 발광되는 조명은 유닛 커버에 형성된 반사경에 의하여 고휘도로 유지될 수 있어, 동작 오류를 방지하면서 선명한 사인이 가능한 사인보드를 제공할 수 있다.As described above, the heat sink is attached to the lower surface of the PCB and the LED chip of each LED lamp unit constituting the LED lamp module according to the present invention, it is possible to prevent electronic errors due to excessive heat generation, each LED lamp Since the unit is composed of both ends of the connector, it is easy to expand, and in particular, the light emitted from the LED lamp can be maintained at high brightness by the reflector formed on the unit cover, thereby providing a signboard capable of clear signing while preventing operation errors. have.

Claims (5)

다수의 LED 램프 유닛이 탈착가능 커넥터를 매개로 하여 전원라인에 의해 연결되어 구성되는 LED 사인용 LED 램프모듈LED sign lamp module for LED sign that multiple LED lamp units are connected by power line through removable connector 제1항에 있어서, 상기 LED 램프 유닛은 양단부에 양극 및 음극접촉부가 형성되며, 전기적으로 중앙에 배치되는 LED 칩과 도통 배치되는 LED 램프 구동 PCB ; 상기 PCB 하부에 접착된 방열판 ; 및 상기 LED 램프 구동 PCB 상부에 결착되는 유닛 커버 ; 로 구성된 것을 특징으로 하는 LED 사인용 LED 램프모듈The LED lamp unit of claim 1, wherein the LED lamp unit includes: an LED lamp driving PCB having positive and negative contact portions formed at both ends thereof and electrically connected to an LED chip disposed at an electrical center; A heat sink bonded to the lower part of the PCB; And a unit cover attached to an upper portion of the LED lamp driving PCB. LED lamp module for LED sign, characterized in that consisting of 제1항에 있어서, 상기 LED 칩은 중앙부에 형성된 LED 램프 외주에 돌출부 형성된 것을 특징으로 하는 LED 사인용 LED 램프모듈According to claim 1, wherein the LED chip LED lamp module for LED sign, characterized in that the protrusion formed on the outer periphery of the LED lamp formed in the central portion 제2항에 있어서, 상기 유닛 커버는 중앙부에 LED 램프 외주 돌출부가 삽입될 수 있는 중앙홀이 형성되며, 중앙홀 상부 방사방향으로 반사경이 형성된 것을 특징으로 하는 LED 사인용 LED 램프모듈The LED lamp module of claim 2, wherein the unit cover has a central hole in which a center portion of the LED lamp can be inserted, and a reflector is formed in a radial direction of the upper portion of the central hole. 제2항 또는 제4항에 있어서, 상기 유닛 커버 외면 일측에는 전원라인 삽입홈이 형성되며, 타측에는 체결수단이 형성되는 것을 특징으로 하는 LED 사인용 LED 램프모듈According to claim 2 or 4, LED lamp module for LED sign, characterized in that the power line insertion groove is formed on one side of the outer surface of the unit cover, the fastening means is formed on the other side.
KR1020050129338A 2005-12-26 2005-12-26 LED lamp modules for LED signs KR100745839B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009099311A2 (en) * 2008-02-05 2009-08-13 Egnics Co,. Ltd Sales method for detachable lde module unit and apparatus thereof
KR200455818Y1 (en) * 2009-02-24 2011-09-27 민광기 Reflector of Cup Shape for Advertisement LED
KR101068851B1 (en) * 2010-01-25 2011-09-29 갤럭시아일렉트로닉스(주) Light emitting device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990032749U (en) * 1997-12-31 1999-07-26 윤종용 Alarm display for easy LED replacement
KR200331783Y1 (en) * 2003-07-18 2003-11-01 이동철 Automotive LED bulb

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009099311A2 (en) * 2008-02-05 2009-08-13 Egnics Co,. Ltd Sales method for detachable lde module unit and apparatus thereof
WO2009099311A3 (en) * 2008-02-05 2009-11-26 (주)이지닉스 Sales method for detachable lde module unit and apparatus thereof
KR200455818Y1 (en) * 2009-02-24 2011-09-27 민광기 Reflector of Cup Shape for Advertisement LED
KR101068851B1 (en) * 2010-01-25 2011-09-29 갤럭시아일렉트로닉스(주) Light emitting device

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