KR20070040550A - Soybean milk cookies and preparing method thereof - Google Patents
Soybean milk cookies and preparing method thereof Download PDFInfo
- Publication number
- KR20070040550A KR20070040550A KR1020050096040A KR20050096040A KR20070040550A KR 20070040550 A KR20070040550 A KR 20070040550A KR 1020050096040 A KR1020050096040 A KR 1020050096040A KR 20050096040 A KR20050096040 A KR 20050096040A KR 20070040550 A KR20070040550 A KR 20070040550A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- soymilk
- dried
- cookies
- powder
- Prior art date
Links
- 235000014510 cooky Nutrition 0.000 title claims abstract description 78
- 235000013336 milk Nutrition 0.000 title claims abstract description 36
- 239000008267 milk Substances 0.000 title claims abstract description 36
- 210000004080 milk Anatomy 0.000 title claims abstract description 36
- 235000010469 Glycine max Nutrition 0.000 title claims abstract description 11
- 244000068988 Glycine max Species 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims abstract description 10
- 235000013322 soy milk Nutrition 0.000 claims abstract description 110
- 239000000843 powder Substances 0.000 claims abstract description 61
- 235000013312 flour Nutrition 0.000 claims abstract description 40
- 241000209140 Triticum Species 0.000 claims abstract description 37
- 235000021307 Triticum Nutrition 0.000 claims abstract description 37
- 235000014121 butter Nutrition 0.000 claims abstract description 36
- 235000013601 eggs Nutrition 0.000 claims abstract description 36
- 229920001542 oligosaccharide Polymers 0.000 claims abstract description 35
- 150000002482 oligosaccharides Chemical class 0.000 claims abstract description 35
- 229920001277 pectin Polymers 0.000 claims abstract description 35
- 235000010987 pectin Nutrition 0.000 claims abstract description 35
- 239000001814 pectin Substances 0.000 claims abstract description 35
- 150000003839 salts Chemical class 0.000 claims abstract description 35
- 229920001353 Dextrin Polymers 0.000 claims abstract description 34
- 239000004375 Dextrin Substances 0.000 claims abstract description 34
- 235000019425 dextrin Nutrition 0.000 claims abstract description 34
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 244000046052 Phaseolus vulgaris Species 0.000 claims abstract description 17
- 235000010627 Phaseolus vulgaris Nutrition 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 238000001035 drying Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 5
- 230000008014 freezing Effects 0.000 claims abstract description 4
- 238000007710 freezing Methods 0.000 claims abstract description 4
- 235000013310 margarine Nutrition 0.000 claims description 19
- 239000003264 margarine Substances 0.000 claims description 19
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 15
- 229910052791 calcium Inorganic materials 0.000 claims description 15
- 239000011575 calcium Substances 0.000 claims description 15
- 235000013343 vitamin Nutrition 0.000 claims description 15
- 229940088594 vitamin Drugs 0.000 claims description 15
- 229930003231 vitamin Natural products 0.000 claims description 15
- 239000011782 vitamin Substances 0.000 claims description 15
- 230000032683 aging Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 235000013305 food Nutrition 0.000 abstract description 11
- 102000004169 proteins and genes Human genes 0.000 abstract description 5
- 108090000623 proteins and genes Proteins 0.000 abstract description 5
- 230000036186 satiety Effects 0.000 abstract description 5
- 235000019627 satiety Nutrition 0.000 abstract description 5
- 235000013527 bean curd Nutrition 0.000 abstract description 4
- 235000016709 nutrition Nutrition 0.000 abstract description 4
- 230000035764 nutrition Effects 0.000 abstract description 4
- 235000005911 diet Nutrition 0.000 abstract description 3
- 230000037213 diet Effects 0.000 abstract description 3
- FYGDTMLNYKFZSV-MRCIVHHJSA-N dextrin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)OC1O[C@@H]1[C@@H](CO)OC(O[C@@H]2[C@H](O[C@H](O)[C@H](O)[C@H]2O)CO)[C@H](O)[C@H]1O FYGDTMLNYKFZSV-MRCIVHHJSA-N 0.000 abstract 1
- 235000012054 meals Nutrition 0.000 abstract 1
- 235000002639 sodium chloride Nutrition 0.000 description 31
- 235000001465 calcium Nutrition 0.000 description 14
- 239000007788 liquid Substances 0.000 description 14
- 238000007598 dipping method Methods 0.000 description 13
- 239000004615 ingredient Substances 0.000 description 5
- 235000019197 fats Nutrition 0.000 description 4
- 235000015895 biscuits Nutrition 0.000 description 3
- 150000001720 carbohydrates Chemical class 0.000 description 3
- 235000014633 carbohydrates Nutrition 0.000 description 3
- 239000002075 main ingredient Substances 0.000 description 3
- 235000015097 nutrients Nutrition 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 235000011888 snacks Nutrition 0.000 description 3
- 150000003722 vitamin derivatives Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 208000008589 Obesity Diseases 0.000 description 2
- 230000037406 food intake Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000008935 nutritious Nutrition 0.000 description 2
- 235000020824 obesity Nutrition 0.000 description 2
- 235000000346 sugar Nutrition 0.000 description 2
- 235000005135 Micromeria juliana Nutrition 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 240000002114 Satureja hortensis Species 0.000 description 1
- 235000007315 Satureja hortensis Nutrition 0.000 description 1
- 244000000231 Sesamum indicum Species 0.000 description 1
- 235000003434 Sesamum indicum Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 241000411851 herbal medicine Species 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A21—BAKING; EDIBLE DOUGHS
- A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
- A21D13/00—Finished or partly finished bakery products
- A21D13/80—Pastry not otherwise provided for elsewhere, e.g. cakes, biscuits or cookies
-
- A—HUMAN NECESSITIES
- A21—BAKING; EDIBLE DOUGHS
- A21D—TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
- A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
- A21D2/08—Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
- A21D2/36—Vegetable material
- A21D2/362—Leguminous plants
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23G—COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF
- A23G3/00—Sweetmeats; Confectionery; Marzipan; Coated or filled products
- A23G3/34—Sweetmeats, confectionery or marzipan; Processes for the preparation thereof
- A23G3/36—Sweetmeats, confectionery or marzipan; Processes for the preparation thereof characterised by the composition containing organic or inorganic compounds
- A23G3/48—Sweetmeats, confectionery or marzipan; Processes for the preparation thereof characterised by the composition containing organic or inorganic compounds containing plants or parts thereof, e.g. fruits, seeds, extracts
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23G—COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF
- A23G2200/00—COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF containing organic compounds, e.g. synthetic flavouring agents
- A23G2200/14—COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF containing organic compounds, e.g. synthetic flavouring agents containing fruits, nuts, e.g. almonds, seeds, plants, plant extracts, essential oils
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
- A23V2250/00—Food ingredients
- A23V2250/20—Natural extracts
- A23V2250/21—Plant extracts
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
- A23V2250/00—Food ingredients
- A23V2250/54—Proteins
- A23V2250/548—Vegetable protein
- A23V2250/5488—Soybean protein
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Botany (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Bakery Products And Manufacturing Methods Therefor (AREA)
Abstract
본 발명은 두유쿠키 및 그 제조방법에 관한 것으로, 본 발명의 두유쿠키는 건조비지 15 내지 30중량%, 소맥분 10 내지 25중량%, 우유버터 10 내지 25중량%, 계란 8 내지 25중량%, 올리고당 5 내지 15중량%, 건조두유 3 내지 10중량%, 베킹파우더 0.5 내지 2중량%, 덱스트린 3 내지 7중량%, 펙틴 1.5 내지 3.5중량% 및 소금 0.1 내지 0.5중량%를 포함하여 이루어지는 것을 특징으로 하며, 그 제조방법은 비지를 마이크로웨이브로 건조시키는 단계; 상기에서 건조된 건조비지 15 내지 30중량%와, 소맥분 10 내지 25중량%, 우유버터 10 내지 25중량%, 계란 8 내지 25중량%, 올리고당 5 내지 15중량%, 건조두유 3 내지 10중량%, 베킹파우더 0.5 내지 2중량%, 덱스트린 3 내지 7중량%, 펙틴 1.5 내지 3.5중량% 및 소금 0.1 내지 0.5중량%를 혼합하는 단계; 상기 혼합물을 냉동숙성시키는 단계; 및 상기에서 숙성된 숙성물을 성형한 후 굽는 단계;를 포함하여 이루어지는 것을 특징으로 한다. The present invention relates to a soy milk cookie and a method for manufacturing the same, soy milk cookie of the present invention is 15 to 30% by weight of dry bean, wheat flour 10 to 25% by weight, milk butter 10 to 25% by weight, eggs 8 to 25% by weight, oligosaccharide 5 to 15% by weight, dried soymilk 3 to 10% by weight, Becking powder 0.5 to 2% by weight, dextrin 3 to 7% by weight, pectin 1.5 to 3.5% by weight and salt comprises 0.1 to 0.5% by weight , The manufacturing method comprises the steps of drying the biji with microwave; 15 to 30% by weight of the dried dry bean, 10 to 25% by weight of wheat flour, 10 to 25% by weight of milk butter, 8 to 25% by weight of eggs, 5 to 15% by weight of oligosaccharides, 3 to 10% by weight of dried soymilk, Mixing 0.5 to 2% by weight of backing powder, 3 to 7% by weight of dextrin, 1.5 to 3.5% by weight of pectin and 0.1 to 0.5% by weight of salt; Freezing the mixture; And forming and baking the aged material matured above.
본 발명의 두유쿠키는 단백질이 풍부하여 영양면에서 우수하고 저칼로리일 뿐만 아니라 소량을 섭취하여도 포만감을 주게 되어 다이어트 식품으로 적합하며 식사대용품으로도 이용될 수 있다. Soymilk cookies of the present invention are rich in protein, excellent in nutrition and low calorie, giving a feeling of satiety even in small amounts, can be used as a diet food and can be used as a meal replacement.
두유, 쿠키, 비지, 콩, 건조비지, 건조두유 Soy milk, cookies, bean curd, soybeans, dried bean curd, dried soymilk
Description
본 발명은 두유쿠키 및 그 제조방법에 관한 것으로, 보다 상세하게는 콩으로부터 생산되는 비지를 주원료로하여 영양면에서 우수하면서도 저칼로리이며 소량을 섭취해도 포만감을 주는 저칼로리 두유쿠키 및 이를 제조하는 방법에 관한 것이다. The present invention relates to a soy milk cookie and a method of manufacturing the same, and more particularly, to a low calorie soy milk cookie which is excellent in nutrition and low calorie and gives a feeling of satiety even when a small amount is consumed by a bean fat produced from soybean. will be.
일반적으로 쿠키는 밀가루, 마가린, 설탕 등을 섞어 반죽하여 만들어지는 것으로 간식용으로 이용된다. 쿠키는 만들어지는 재료상 지방과 탄수화물의 함량이 많아 섭취하게 되면 높은 칼로리를 내게 되어 다량 섭취시 비만해지게 되는 문제점이 있다. In general, cookies are made by mixing flour, margarine, sugar, etc. and used for snacks. Cookies have a problem in that a large amount of fat and carbohydrates in the ingredients are made, ingesting high calories causes obesity when a large amount is ingested.
비만은 만병의 근원으로 건강에 대한 관심이 높아지고 있는 요즈음 저칼로리이면서도 영양가 높은 식품에 대한 관심이 지대해지고 있다. Obesity is a source of all kinds of diseases and the interest in health these days is increasing interest in low-calorie and nutritious food.
쿠키에 있어서도 단순히 맛이 좋은 간식용 과자가 아닌 영양가 있으면서 몸에 이로운 쿠키를 개발하기 위하여 첨가물로서 깨, 콩, 각종 한약재 등을 첨가하여 제조되는 쿠키 등이 개발중에 있다. 그러나 쿠키를 제조하는 재료 자체가 밀가루 중심이고 최근 쌀가루 등이 사용되고 있으나 이 또한 탄수화물이기 때문에 칼로리 를 낮추는데는 한계가 있다. In the case of cookies, cookies are prepared by adding sesame seeds, beans, various herbal medicines, etc. as additives in order to develop nutritious and beneficial cookies, rather than simply snack snacks. However, the material for making cookies is flour-based, and rice flour is used recently, but since it is also a carbohydrate, there is a limit to lowering calories.
이에 본 발명자는 심혈을 기울여 연구한 결과, 단백질 식품인 비지 및 두유를 주원료로 하여 영양가 높으면서 칼로리가 낮고 소량을 섭취하여도 포만감을 느낄 수 있는 쿠키를 제조 완성하였다. Accordingly, the present inventors devote a lot of research to produce a cookie that can be felt with satiety and low in calories and ingesting a small amount of protein foods, such as soy milk and soy milk as the main ingredients.
본 발명의 목적은 건조비지를 주원료로 하여 영양면에서 우수하면서도 저칼로리이며 소량을 섭취해도 포만감을 주는 두유쿠키를 제공하는 것이다. It is an object of the present invention to provide soymilk cookies which are excellent in nutrition and have low calorie content and provide satiety even when a small amount is consumed by using a dry bean as a main ingredient.
본 발명의 다른 목적은 저칼로리 두유쿠키를 제조하는 방법을 제공하는 것이다. Another object of the present invention is to provide a method for producing a low calorie soymilk cookie.
상기한 목적을 달성하기 위하여, 본 발명의 두유쿠키는 건조비지 15 내지 30중량%, 소맥분 10 내지 25중량%, 우유버터 10 내지 25중량%, 계란 8 내지 25중량%, 올리고당 5 내지 15중량%, 건조두유 3 내지 10중량%, 베킹파우더 0.5 내지 2중량%, 덱스트린 3 내지 7중량% 펙틴 1.5 내지 3.5중량% 및 소금 0.1 내지 0.5중량%를 포함하여 이루어지는 것을 특징으로 한다. In order to achieve the above object, the soymilk cookie of the present invention is 15 to 30% by weight of dry bean, 10 to 25% by weight of wheat flour, 10 to 25% by weight of milk butter, 8 to 25% by weight of eggs, 5 to 15% by weight of oligosaccharides 3 to 10% by weight of dried soymilk, 0.5 to 2% by weight of Becking powder, 3 to 7% by weight of dextrin, 1.5 to 3.5% by weight of pectin and 0.1 to 0.5% by weight of salt.
본 발명에서는 중량% 기준으로 구성 성분들이 혼합되어 이루어진다. In the present invention, the components are mixed by weight.
본 발명에서 주원료로 사용되는 비지는 통상적으로 콩으로부터 생산되는 것을 사용하는 데, 건조된 건조비지를 사용한다. In the present invention, the busy paper used as a main raw material is usually produced from soybeans, and dried dry busy paper is used.
건조비지는 물에 불게 되면 부피가 2배, 중량은 3배 정도로 증가하게 되는 데, 따라서 건조비지를 다량함유하는 식품은 소량을 섭취하여도 만복감을 느끼게 된다. When the dry fat is blown in water, the volume is increased by 2 times and the weight is about 3 times. Therefore, foods containing a large amount of dry fat feel full even when a small amount is consumed.
본 발명의 두유쿠키는 건조비지를 주원료로 함으로써 소량을 섭취하여도 포만감을 느끼게 되고 또한 칼로리가 낮아 다이어트 식품으로 적당하다. Soymilk cookies according to the present invention is a dry raw material as a main ingredient, even if a small amount of ingestion to feel full and also low calorie is suitable as a diet food.
이 외, 본 발명의 두유쿠키를 만드는 데 사용되는 소맥분, 우유버터, 계란, 올리고당, 건조두유, 베킹파우더, 덱스트린, 펙틴 및 소금은 통상적으로 식품에 사용되는 것이 사용된다. In addition, the wheat flour, milk butter, eggs, oligosaccharides, dried soy milk, Becking powder, dextrin, pectin and salt used to make the soymilk cookie of the present invention is used that is commonly used in food.
본 발명의 두유쿠키에 있어서 건조비지의 함량이 15중량% 미만이면 저칼로리 식품으로서의 효능이 떨어지고 30중량%를 넘게 되면 소맥분, 계란 등의 쿠키 제조에 필수불가결한 성분의 함량이 떨어짐으로써 쿠키 성형에 어려움이 있다. In the soymilk cookie of the present invention, if the content of the dry bean is less than 15% by weight, the efficacy as a low-calorie food is lowered, and if it exceeds 30% by weight, it is difficult to form a cookie by reducing the content of ingredients essential for the manufacture of cookies such as wheat flour and eggs. There is this.
본 발명의 두유쿠키에 있어서 건조두유의 함량이 3중량% 미만이면 고소한 맛이 감소하고 저칼로리 식품으로서의 효능이 떨어지고 10중량%를 넘게 되면 쿠키를 구을때 잘 타는 문제점이 있다. In the soymilk cookie of the present invention, if the content of the dry soy milk is less than 3% by weight, the savory taste is reduced and the efficacy as a low-calorie food is lowered and exceeds 10% by weight.
본 발명의 두유쿠키는 마가린을 5 내지 20중량% 더 포함하여 이루어질 수 있다. 이들을 포함함으로써 본 발명 쿠키를 보다 부드럽게 할 수 있다. Soymilk cookies of the present invention may be made by further comprising 5 to 20% by weight of margarine. By including these, the cookie of the present invention can be made softer.
본 발명의 두유쿠키는 두유를 10 내지 20중량% 더 포함하여 이루어질 수 있다. 액상의 두유가 더 혼합됨으로써 본 발명 쿠키의 질감을 보다 부드럽게 할 수 있다. Soymilk cookies of the present invention may be made by further comprising 10 to 20% by weight of soy milk. By further mixing the liquid soy milk it is possible to soften the texture of the cookies of the present invention.
본 발명의 두유쿠키는 비타민을 0.01 내지 1중량% 더 포함하여 이루어질 수 있다. 본 발명에서 사용되는 비타민은 통상적으로 식품에 사용되는 것이 이용되며 어느 것에 한정되는 것은 아니다. 비타민이 함유됨으로써 본 발명의 쿠키는 쿠키에 부족하기 쉬운 영양소를 보충할 수 있다. Soymilk cookies of the present invention may be made by further comprising 0.01 to 1% by weight of vitamins. Vitamins used in the present invention are usually used in foods are not limited to any. By containing vitamins, the cookies of the present invention can be supplemented with nutrients that cookies are likely to lack.
또한, 본 발명의 두유쿠키는 칼슘을 0.01 내지 1중량% 더 포함하여 이루어질 수 있다. 본 발명에서 사용되는 칼슘은 통상적으로 식품에 사용되는 것이 이용되며 어느 것에 한정되는 것은 아니다. 칼슘이 함유됨으로써 본 발명의 쿠키는 쿠키에 부족하기 쉬운 영양소를 보충할 수 있다. In addition, the soymilk cookies of the present invention may be made by further containing 0.01 to 1% by weight of calcium. Calcium used in the present invention is conventionally used for food is not limited to any one. By containing calcium, the cookie of the present invention can replenish nutrients that are likely to be lacking in cookies.
본 발명의 두유쿠키에는 혼합되는 성분들의 반죽 질에 따라 물이 더 포함될 수 있다. 배합되는 물은 혼합되는 성분 총중량에 대하여 5 내지 15중량% 더 포함될 수 있다. Soymilk cookies of the present invention may further include water depending on the dough quality of the ingredients to be mixed. Water to be blended may further comprise 5 to 15% by weight based on the total weight of the components to be mixed.
본 발명의 두유쿠키는 상기한 성분들을 상기한 범위 내에서 혼합시킬때 쿠키 믹싱이 잘 이루어진다. Soymilk cookies of the present invention is well mixed cookies when the above ingredients are mixed within the above range.
이하, 본 발명의 저칼로리 두유쿠키를 제조하는 방법을 설명한다. Hereinafter, the method of manufacturing the low calorie soymilk cookie of this invention is demonstrated.
본 발명의 두유쿠키 제조방법은, 콩으로부터 생산된 비지를 마이크로웨이브로 건조시키는 단계; 상기에서 건조된 건조비지 15 내지 30중량%, 소맥분 10 내지 25중량%, 우유버터 10 내지 25중량%, 계란 8 내지 25중량%, 올리고당 5 내지 15중량%, 건조두유 3 내지 10중량%, 베킹파우더 0.5 내지 2중량%, 덱스트린 3 내지 7중량%, 펙틴 1.5 내지 3.5중량% 및 소금 0.1 내지 0.5중량%를 혼합하는 단계; 상기 혼합물을 냉동숙성시키는 단계; 및 상기에서 숙성된 숙성물을 성형한 후 굽는 단계;를 포함하여 이루어지는 것을 특징으로 한다. Soymilk cookies manufacturing method of the present invention comprises the steps of drying the soybeans produced from soybeans with microwave; 15 to 30% by weight of the dried dry bean, 10 to 25% by weight of wheat flour, 10 to 25% by weight of milk butter, 8 to 25% by weight of eggs, 5 to 15% by weight of oligosaccharides, 3 to 10% by weight of dried soymilk, and baking Mixing 0.5 to 2% by weight of powder, 3 to 7% by weight of dextrin, 1.5 to 3.5% by weight of pectin and 0.1 to 0.5% by weight of salt; Freezing the mixture; And forming and baking the aged material matured above.
본 발명의 두유쿠키 제조 방법을 보다 상세하게 설명한다. The soymilk cookie manufacturing method of this invention is demonstrated in detail.
먼저, 비지를 만들기 위한 콩을 준비하고, 소맥분, 우유버터, 계란, 올리고 당, 건조두유, 베킹파우더, 덱스트린, 펙틴 및 소금을 준비한다. First, prepare soybeans for making a bean, and prepare wheat flour, milk butter, eggs, oligosaccharides, dried soy milk, Becking powder, dextrin, pectin and salt.
통상의 방법으로 콩으로부터 비지를 만든다. 이어, 만들어진 비지를 마이크로웨이브로 건조시킨다. 이때 건조온도는 45 내지 55℃가 바람직하다. 건조온도가 45℃ 이하이면 건조가 잘 이루어지지 않으면서 건조시간이 길어지는 문제점이 있고, 55℃ 이상이면 영양소가 파괴는 문제점이 있다. The bean is made from beans in the usual way. Subsequently, the made busy paper is dried with microwaves. At this time, the drying temperature is preferably 45 to 55 ℃. If the drying temperature is 45 ° C or less, there is a problem that the drying time is long while the drying is not performed well, and if the drying temperature is 55 ° C or more, the nutrients are destroyed.
비지를 건조시킬때 냉동동결을 통하여 건조시키는 기존의 방법은 24시간 이상의 시간이 소요되나 본 발명에서는 마이크로웨이브를 이용함으로써 60분 내지 120분으로 비지를 건조시킬 수 있다. Conventional methods for drying the freeze through drying freezing takes 24 hours or more, but in the present invention can be dried in 60 to 120 minutes by using a microwave.
이어, 앞서 제조된 건조비지 15 내지 30중량%과, 소맥분 10 내지 25중량%, 우유버터 10 내지 25중량%, 계란 8 내지 25중량%, 올리고당 5 내지 15중량%, 건조두유 3 내지 10중량%, 베킹파우더 0.5 내지 2중량%, 덱스트린 3 내지 7중량%, 펙틴 1.5 내지 3.5중량% 및 소금 0.1 내지 0.5중량%를 혼합한다. Then, 15 to 30% by weight of the previously prepared dry bean, wheat flour 10 to 25% by weight, milk butter 10 to 25% by weight, eggs 8 to 25% by weight, oligosaccharides 5 to 15% by weight, dried soymilk 3 to 10% by weight , 0.5 to 2% by weight of Becking Powder, 3 to 7% by weight of dextrin, 1.5 to 3.5% by weight of pectin and 0.1 to 0.5% by weight of salt.
이어, 상기 혼합물을 냉동숙성시킨다. 이때 숙성시간은 혼합물 양에 따라 다를 것이나 40 내지 48시간이 바람직하다. The mixture is then freeze aged. At this time, the aging time will vary depending on the amount of the mixture, but 40 to 48 hours is preferable.
이어, 숙성된 숙성물을 일정 형상으로 성형하고, 성형물을 굽는다. 이때, 통상적으로 본 기술 분야에서 사용되는 오븐이 사용될 수 있으나 본 발명에서는 컨벡션 오븐이 바람직하게 사용된다. 또한 135 내지 155℃의 온도에서 10 내지 20분 동안 굽는 것이 바람직하다. Subsequently, the aged mature material is molded into a predetermined shape and the molded product is baked. In this case, an oven generally used in the art may be used, but in the present invention, a convection oven is preferably used. It is also preferable to bake for 10 to 20 minutes at a temperature of 135 to 155 ℃.
상기와 같이 구워짐으로써 본 발명의 두유쿠키는 제조되고, 제조된 쿠키는 통상의 절차인 검사 과정을 거치고 포장된 후 출하된다. By baking as described above, the soymilk cookie of the present invention is manufactured, and the manufactured cookie is shipped after being packaged through an inspection procedure which is a normal procedure.
본 발명의 두유쿠키 제조방법에 있어서, 상기 성분들을 혼합하는 단계에서 마가린을 5 내지 20중량% 더 혼합하여 제조할 수 있다. In the soymilk cookies manufacturing method of the present invention, in the step of mixing the components may be prepared by further mixing 5 to 20% by weight margarine.
또한, 본 발명의 두유쿠키 제조방법에 있어서, 상기 성분들을 혼합하는 단계에서 두유를 10 내지 20중량% 더 혼합하여 제조할 수 있다. In addition, in the soymilk cookies manufacturing method of the present invention, in the step of mixing the components can be prepared by further mixing 10 to 20% by weight soy milk.
나아가, 본 발명의 두유쿠키 제조방법에 있어서, 상기 성분들을 혼합하는 단계에서 칼슘 및/또는 비타민을 0.01 내지 1중량% 더 혼합하여 제조할 수 있다. Furthermore, in the soymilk cookies manufacturing method of the present invention, in the step of mixing the components can be prepared by mixing calcium and / or vitamins 0.01 to 1% by weight further.
본 발명의 두유쿠키는 단백질을 다량 함유함으로써 100g 당 420 칼로리 정도의 열량을 낸다. 이는, 소맥분 30 내지 40중량%, 마가린 25 내지 30중량% 및 설탕 25 내지 30중량%로 이루어지는 일반 쿠키가 100g 당 550칼로리의 열량을 내는 것에 비하면 훨씬 낮은 열량치이다. The soymilk cookie of the present invention contains about 420 calories per 100 g by containing a large amount of protein. This is a much lower calorie value compared to a typical cookie consisting of 30-40 wt% wheat flour, 25-30 wt% margarine and 25-30 wt% sugar, yielding 550 calories per 100 g.
하기 실시예에서 본 발명의 두유쿠키 제조방법을 구체적으로 살펴본다. In the following examples look at the soymilk cookies manufacturing method of the present invention in detail.
<실시예 1> <Example 1>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말 및 소금을 준비하였다. 비지를 마이크로웨이브에 넣고 45℃에서 110분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 275g과, 건조두유 80g, 소맥분 200g, 우유버터 150g, 계란 80g, 올리고당 120g, 베킹파우더 13g, 덱스트린 50g, 펙틴 30g 및 소금 2g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 44시간 숙성시켰다. 숙성된 반죽을 지름 3.5cm, 두께 0.5cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 155℃의 온도에서 10분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder and salt were prepared. The busy papers were placed in a microwave and dried at 45 ° C. for 110 minutes to prepare dry papers. 275 g of the dried bean curd prepared above, 80 g of dried soy milk, 200 g of wheat flour, 150 g of milk butter, 80 g of eggs, 120 g of oligosaccharide, 13 g of Becking powder, 50 g of dextrin, 30 g of pectin, and 2 g of salt were mixed in a dough container. The mixture was placed in a freezer and aged for 44 hours. The mature dough was formed by dipping into a cookie mold of 3.5 cm in diameter and 0.5 cm in thickness, and baking for 10 minutes at a temperature of 155 ° C. in a convection oven to prepare soymilk cookies.
<실시예 2> <Example 2>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금 및 마가린을 준비하였다. 비지를 마이크로웨이브에 넣고 55℃에서 80분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 250g과, 건조두유 80g, 소맥분 130g, 우유버터 100g, 계란 120g, 올리고당 110g, 베킹파우더 7g, 덱스트린 50g, 펙틴 20g, 소금 3g 및 마가린 130g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 46시간 숙성시켰다. 숙성된 반죽을 지름 3.5cm, 두께 0.5cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 135℃의 온도에서 20분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt and margarine were prepared. The busy papers were placed in a microwave and dried at 55 ° C. for 80 minutes to prepare dry papers. 250 g of dried soybean prepared above, dried soymilk 80g, wheat flour 130g, milk butter 100g, eggs 120g, oligosaccharides 110g, Becking powder 7g, dextrin 50g, pectin 20g, salt 3g and margarine 130g were mixed in a dough container. The mixture was placed in a freezer and aged for 46 hours. Mature dough was formed by dipping into 3.5cm diameter and 0.5cm thick cookie molds, and baking for 20 minutes at a temperature of 135 ° C. in a convection oven to prepare soymilk cookies.
<실시예 3> <Example 3>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금 및 두유를 준비하였다. 비지를 마이크로웨이브에 넣고 45℃에서 100분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 190g과, 건조두유 80g, 소맥분 150g, 우유버터 150g, 계란 80g, 올리고당 110g, 베킹파우더 5g, 덱스트린 50g, 펙틴 23g, 소금 2g 및 두유 160g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 45시간 숙성시켰다. 숙성된 반죽을 지름 3.5cm, 두께 0.5cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 155℃의 온도에서 10분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt and soy milk were prepared. The busy papers were put in a microwave and dried at 45 ° C. for 100 minutes to prepare dry papers. Drying bean 190g prepared above, dried soymilk 80g, wheat flour 150g, milk butter 150g, eggs 80g, oligosaccharides 110g, Becking powder 5g, dextrin 50g, pectin 23g, salt 2g and 160g soy milk was mixed in a dough container. The mixture was placed in a freezer and aged for 45 hours. The mature dough was formed by dipping into a cookie mold of 3.5 cm in diameter and 0.5 cm in thickness, and baking for 10 minutes at a temperature of 155 ° C. in a convection oven to prepare soymilk cookies.
<실시예 4> <Example 4>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우 더, 덱스트린 분말, 펙틴 분말, 소금, 마가린 및 두유를 준비하였다. 비지를 마이크로웨이브에 넣고 50℃에서 95분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 200g과, 건조두유 70g, 소맥분 150g, 우유버터 120g, 계란 125g, 올리고당 100g, 베킹파우더 10g, 덱스트린 40g, 펙틴 22g, 소금 3g 및 마가린 50g, 두유 110g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 48시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.5cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 135℃의 온도에서 20분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt, margarine and soy milk were prepared. The busy papers were placed in a microwave and dried at 50 ° C. for 95 minutes to prepare dry papers. 200 g of dried biscuits prepared above, dried soymilk 70g, wheat flour 150g, milk butter 120g, eggs 125g, oligosaccharides 100g, Becking powder 10g, dextrin 40g, pectin 22g, salt 3g and margarine 50g, soy milk 110g mixed in a dough container It was. The mixture was placed in a freezer and aged for 48 hours. Mature dough was formed by dipping into a 5.0 cm diameter, 0.5 cm thick cookie mold and baking for 20 minutes at a temperature of 135 ° C. in a convection oven to prepare soymilk.
<실시예 5> Example 5
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금 및 비타민을 준비하였다. 비지를 마이크로웨이브에 넣고 45℃에서 110분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 185g과, 건조두유 80g, 소맥분 220g, 우유버터 160g, 계란 110g, 올리고당 160g, 베킹파우더 10g, 덱스트린 43g, 펙틴 20g, 소금 2g 및 비타민 10g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 44시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.5cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 140℃의 온도에서 17분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt and vitamins were prepared. The busy papers were placed in a microwave and dried at 45 ° C. for 110 minutes to prepare dry papers. 185 g of the dried bean oil prepared above, dried soymilk 80g, wheat flour 220g, milk butter 160g, eggs 110g, oligosaccharides 160g, Becking powder 10g, dextrin 43g, pectin 20g, salt 2g and vitamin 10g was mixed in the dough container. The mixture was placed in a freezer and aged for 44 hours. The mature dough was formed by dipping into a cookie mold of 5.0 cm in diameter and 0.5 cm in thickness and baking for 17 minutes at a temperature of 140 ° C. in a convection oven to prepare soymilk.
<실시예 6> <Example 6>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금 및 칼슘을 준비하였다. 비지를 마이크로웨이브에 넣고 55℃에서 80분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건 조비지 185g과, 건조두유 80g, 소맥분 220g, 우유버터 160g, 계란 110g, 올리고당 160g, 베킹파우더 10g, 덱스트린 42g, 펙틴 20g, 소금 3g 및 칼슘 10g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 45시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.5cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 140℃의 온도에서 17분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt and calcium were prepared. The busy papers were placed in a microwave and dried at 55 ° C. for 80 minutes to prepare dry papers. 185 g of the dried biscuits prepared above, dried soymilk 80g, wheat flour 220g, milk butter 160g, eggs 110g, oligosaccharides 160g, Becking powder 10g, dextrin 42g, pectin 20g, salt 3g and calcium 10g were mixed in a dough container. The mixture was placed in a freezer and aged for 45 hours. The mature dough was formed by dipping into a cookie mold of 5.0 cm in diameter and 0.5 cm in thickness and baking for 17 minutes at a temperature of 140 ° C. in a convection oven to prepare soymilk.
<실시예 7> <Example 7>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금, 마가린 및 비타민을 준비하였다. 비지를 마이크로웨이브에 넣고 45℃에서 100분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 245g과, 건조두유 80g, 소맥분 130g, 우유버터 100g, 계란 120g, 올리고당 110g, 베킹파우더 8g, 덱스트린 50g, 펙틴 20g, 소금 2g, 마가린 130g 및 비타민 5g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 40시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.7cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 155℃의 온도에서 10분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt, margarine and vitamins were prepared. The busy papers were put in a microwave and dried at 45 ° C. for 100 minutes to prepare dry papers. 245 g of the dried bean curd prepared above, 80 g of dried soy milk, 130 g of wheat flour, 100 g of milk butter, 120 g of eggs, oligosaccharide 110 g, Becking powder 8 g, dextrin 50 g, pectin 20 g, salt 2 g, margarine 130 g and vitamins 5 g mixed in a dough container It was. The mixture was placed in a freezer and aged for 40 hours. Mature dough was formed by dipping into a 5.0 cm diameter, 0.7 cm thick cookie mold and baking for 10 minutes at a temperature of 155 ° C. in a convection oven to prepare soymilk.
<실시예 8> <Example 8>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금, 마가린 및 칼슘을 준비하였다. 비지를 마이크로웨이브에 넣고 50℃에서 95분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 250g과, 건조두유 80g, 소맥분 125g, 우유버터 100g, 계란 120g, 올리고당 110g, 베킹파우더 5g, 덱스트린 50g, 펙틴 22g, 소금 3g, 마가린 130g 및 칼슘 5g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 45시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.7cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 135℃의 온도에서 20분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt, margarine and calcium were prepared. The busy papers were placed in a microwave and dried at 50 ° C. for 95 minutes to prepare dry papers. 250g of dried biji prepared above, dried soymilk 80g, wheat flour 125g, milk butter 100g, eggs 120g, oligosaccharide 110g, Becking powder 5g, dextrin 50g, pectin 22g, salt 3g, margarine 130g and calcium 5g mixed in a dough container It was. The mixture was placed in a freezer and aged for 45 hours. Mature dough was formed by dipping into a cookie mold of 5.0 cm in diameter and 0.7 cm thick, and then baked for 20 minutes at a temperature of 135 ° C. in a convection oven to prepare soymilk cookies.
<실시예 9> Example 9
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금, 두유 및 비타민을 준비하였다. 비지를 마이크로웨이브에 넣고 45℃에서 110분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 185g과, 건조두유 80g, 소맥분 150g, 우유버터 150g, 계란 80g, 올리고당 110g, 베킹파우더 5g, 덱스트린 53g, 펙틴 20g, 소금 2g, 두유 160g 및 비타민 5g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 44시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.7cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 155℃의 온도에서 10분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt, soy milk and vitamins were prepared. The busy papers were placed in a microwave and dried at 45 ° C. for 110 minutes to prepare dry papers. 185 g of the dried bean oil prepared above, dried soymilk 80g, wheat flour 150g, milk butter 150g, eggs 80g, oligosaccharides 110g, Becking powder 5g, dextrin 53g, pectin 20g, salt 2g, soymilk 160g and vitamins 5g mixed in a dough container It was. The mixture was placed in a freezer and aged for 44 hours. Mature dough was formed by dipping into a 5.0 cm diameter, 0.7 cm thick cookie mold and baking for 10 minutes at a temperature of 155 ° C. in a convection oven to prepare soymilk.
<실시예 10> <Example 10>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금, 두유 및 칼슘을 준비하였다. 비지를 마이크로웨이브에 넣고 55℃에서 80분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 190g과, 건조두유 80g, 소맥분 147g, 우유버터 150g, 계란 80g, 올리고당 110g, 베킹파우더 5g, 덱스트린 50g, 펙틴 20g, 소금 3g, 두유 160g 및 칼슘 5g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 46시간 숙성시켰다. 숙성된 반죽을 지름 3.5cm, 두께 0.5cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐 에서 140℃의 온도에서 17분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt, soy milk and calcium were prepared. The busy papers were placed in a microwave and dried at 55 ° C. for 80 minutes to prepare dry papers. Drying 190 g prepared above, dried soymilk 80g, wheat flour 147g, milk butter 150g, eggs 80g, oligosaccharides 110g, Becking powder 5g, dextrin 50g, pectin 20g, salt 3g, soymilk 160g and calcium 5g mixed in a dough container It was. The mixture was placed in a freezer and aged for 46 hours. Mature dough was formed by dipping into a cookie mold of 3.5cm in diameter and 0.5cm in thickness, and baking it for 17 minutes at a temperature of 140 ° C. in a convection oven to prepare soymilk.
<실시예 11> <Example 11>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금, 마가린, 두유 및 비타민을 준비하였다. 비지를 마이크로웨이브에 넣고 45℃에서 105분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 185g과, 건조두유 60g, 소맥분 150g, 우유버터 120g, 계란 160,올리고당 73g, 베킹파우더 5g, 덱스트린 40g, 펙틴 20g, 소금 2g 및 마가린 80g, 두유 100g, 및 비타민 5g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 47시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.5cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 155℃의 온도에서 10분 동안 구워 두유쿠키를 제조하였다. Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt, margarine, soy milk and vitamins were prepared. The busy papers were placed in a microwave and dried at 45 ° C. for 105 minutes to prepare dry papers. Knead 185 g of the dried bisque prepared above, dried soymilk 60g, wheat flour 150g, milk butter 120g, egg 160, oligosaccharide 73g, Becking powder 5g, dextrin 40g, pectin 20g, salt 2g and margarine 80g, soymilk 100g, and vitamin 5g Placed in a container and mixed. The mixture was placed in a freezer and aged for 47 hours. Mature dough was formed by dipping into a cookie mold of 5.0 cm in diameter and 0.5 cm in thickness, and then baking for 10 minutes at a temperature of 155 ° C. in a convection oven to prepare soymilk cookies.
<실시예 12> <Example 12>
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금, 마가린, 두유 및 칼슘을 준비하였다. 비지를 마이크로웨이브에 넣고 50℃에서 95분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 160g과, 건조두유 70g, 소맥분 165g, 우유버터 100g, 계란 150, 올리고당 82g, 베킹파우더 5g, 덱스트린 40g, 펙틴 20g, 소금 3g 및 마가린 100g, 두유 100g, 및 칼슘 5g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 45시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.7cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 135℃의 온도에서 20분 동안 구워 두유쿠키를 제조 하였다.Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt, margarine, soy milk and calcium were prepared. The busy papers were placed in a microwave and dried at 50 ° C. for 95 minutes to prepare dry papers. Kneading 160g of dried biscuits, dried soymilk 70g, wheat flour 165g, milk butter 100g, egg 150, oligosaccharide 82g, Becking powder 5g, dextrin 40g, pectin 20g, salt 3g and margarine 100g, soymilk 100g, and calcium 5g Placed in a container and mixed. The mixture was placed in a freezer and aged for 45 hours. Mature dough was formed by dipping into a 5.0 cm diameter, 0.7 cm thick cookie mold and baking for 20 minutes at a temperature of 135 ° C. in a convection oven to prepare soymilk.
<실시예 13> Example 13
비지, 건조두유, 소맥분, 우유버터, 계란 푼 것, 액상 올리고당, 베킹파우더, 덱스트린 분말, 펙틴 분말, 소금, 마가린, 두유, 비타민 및 칼슘을 준비하였다. 비지를 마이크로웨이브에 넣고 45℃에서 110분간 건조시켜 건조비지를 제조하였다. 상기에서 제조된 건조비지 190g과, 건조두유 70g, 소맥분 150g, 우유버터 120g, 계란 128, 올리고당 100g, 베킹파우더 10g, 덱스트린 40g, 펙틴 20g, 소금 2g 및 마가린 50g, 두유 110g, 비타민 5g 및 칼슘 5g을 반죽용기에 넣고 혼합하였다. 상기 혼합물을 냉동고에 넣고 48시간 숙성시켰다. 숙성된 반죽을 지름 5.0cm, 두께 0.7cm 쿠키틀에 찍어 성형한 후 컨벡션 오븐에서 140℃의 온도에서 17분 동안 구워 두유쿠키를 제조하였다.Busy, dried soy milk, wheat flour, milk butter, egg loose, liquid oligosaccharide, Becking powder, dextrin powder, pectin powder, salt, margarine, soy milk, vitamins and calcium were prepared. The busy papers were placed in a microwave and dried at 45 ° C. for 110 minutes to prepare dry papers. 190 g dried soybean, dry soy milk 70 g, wheat flour 150 g, milk butter 120 g, egg 128, oligosaccharide 100 g, Becking powder 10 g, dextrin 40 g, pectin 20 g, salt 2 g and margarine 50 g, soy milk 110 g, vitamin 5 g and calcium 5 g Was put into the dough container and mixed. The mixture was placed in a freezer and aged for 48 hours. Mature dough was formed by dipping into a 5.0 cm diameter, 0.7 cm thick cookie mold and baking for 17 minutes at a temperature of 140 ° C. in a convection oven to prepare soymilk cookies.
상기 실시예 1 내지 13에서 제조된 두유쿠키는 이루어지는 성분들의 단백질, 탄수화물, 지방 함량을 기준으로 계산하면 100g 당 395.5 내지 445.5 칼로리의 열량을 낸다. Soymilk cookies prepared in Examples 1 to 13 calculates 395.5 to 445.5 calories per 100 g of calories based on the protein, carbohydrate and fat content of the ingredients.
이상에서 본 발명의 구체예가 제시되어 있지만 본 발명이 상기에 한정되는 것은 아니며 본 발명의 기술 사상 범위 내에서 다양하게 변형 가능하고 이러한 변형은 하기한 본 발명의 청구범위에 속한다 할 것이다. Specific embodiments of the present invention have been presented above, but the present invention is not limited to the above, and various modifications can be made within the technical spirit of the present invention, and such modifications will belong to the following claims.
본 발명의 두유쿠키는 두유 및 비지를 주원료로 함으로써 단백질이 풍부하여 기존의 탄수화물 중심의 쿠키에 비하여 영양면에서 우수하고 저칼로리일 뿐만 아니 라 소량을 섭취하여도 포만감을 주게 되어 다이어트 식품으로 적합하며 식사대용품으로도 이용될 수 있다. Soymilk cookies of the present invention is rich in protein by the soy milk and soybeans as a main raw material is excellent in nutrition compared to conventional carbohydrate-oriented cookies, low calorie, giving a feeling of satiety even in small amounts ingestion is suitable as a diet food It can also be used as an article.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050096040A KR20070040550A (en) | 2005-10-12 | 2005-10-12 | Soybean milk cookies and preparing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050096040A KR20070040550A (en) | 2005-10-12 | 2005-10-12 | Soybean milk cookies and preparing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20070040550A true KR20070040550A (en) | 2007-04-17 |
Family
ID=38176242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050096040A KR20070040550A (en) | 2005-10-12 | 2005-10-12 | Soybean milk cookies and preparing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20070040550A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100870538B1 (en) * | 2007-07-06 | 2008-12-01 | 호서대학교 산학협력단 | Producing method for cookie of bean-curd dregs |
| CN103461868A (en) * | 2013-09-30 | 2013-12-25 | 陕西师范大学 | Spiced bean dreg sasanqua mixing powder |
| CN112385779A (en) * | 2019-11-19 | 2021-02-23 | 张海龙 | Egg bean curd and preparation method thereof |
-
2005
- 2005-10-12 KR KR1020050096040A patent/KR20070040550A/en active IP Right Grant
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100870538B1 (en) * | 2007-07-06 | 2008-12-01 | 호서대학교 산학협력단 | Producing method for cookie of bean-curd dregs |
| CN103461868A (en) * | 2013-09-30 | 2013-12-25 | 陕西师范大学 | Spiced bean dreg sasanqua mixing powder |
| CN112385779A (en) * | 2019-11-19 | 2021-02-23 | 张海龙 | Egg bean curd and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101698330B1 (en) | Method for producing rice steamed bread comprising edible insect | |
| KR101245303B1 (en) | Composition for Manufacturing Gluten-free Rice Cookie and Manufacturing Method Thereof | |
| KR101300547B1 (en) | Manufacturing method of crunchable doughnut | |
| KR102079784B1 (en) | Manufacturing method of cookie containing of cream cheese | |
| KR101724664B1 (en) | Bread containing mashed sweet potato and method for manufacturing the same | |
| KR100947347B1 (en) | Method for manufacturing walnut cake using barley and walnut cake thereby | |
| CN114586816A (en) | Gel jelly filled crisp biscuit | |
| KR20200026238A (en) | Flavor and nutritional improvement walnut pie and a method of manufacturing the same | |
| KR20170065056A (en) | Macaron crunch and manufacture mathod thereof | |
| KR20070040550A (en) | Soybean milk cookies and preparing method thereof | |
| KR101589894B1 (en) | Processing for making baked snack containing cheese and sweet potato | |
| KR20150128249A (en) | Manufacture method of rice noodles with the crust of overcooked rice | |
| KR20170119086A (en) | Manufacturing method of ice moon cake | |
| KR100451057B1 (en) | Glutinous barley bread, and the processing method | |
| KR100560176B1 (en) | A manufacturing method of cereal bar and cereal bar threrby | |
| KR20150060542A (en) | Method for production of rice snack with high content of sweet potato | |
| KR20160035832A (en) | Bread composition comprising stevia leaf powder and bread prepared by the same | |
| KR20150066674A (en) | Woo Sang Yong rice cookies | |
| KR101744396B1 (en) | A process for the preparation of pizza dough and pizza dough prepared therefrom | |
| KR20190040405A (en) | Soft Bean Curd bread manufacture method | |
| KR19990062657A (en) | Process for preparing flour-containing food for microwave heating | |
| KR20180019265A (en) | Blueberry hodduk of manufaure | |
| KR20160113946A (en) | A process for the preparation of pizza dough and pizza dough prepared therefrom | |
| KR101852977B1 (en) | The method for manufacturing train shape walnut cake containing mulberry leaves, lentils, almond and blueberry | |
| KR102384686B1 (en) | Yakgwa cookies and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| NORF | Unpaid initial registration fee |