KR20060071914A - The combination method of multi flex printed board - Google Patents

The combination method of multi flex printed board Download PDF

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Publication number
KR20060071914A
KR20060071914A KR1020040110396A KR20040110396A KR20060071914A KR 20060071914 A KR20060071914 A KR 20060071914A KR 1020040110396 A KR1020040110396 A KR 1020040110396A KR 20040110396 A KR20040110396 A KR 20040110396A KR 20060071914 A KR20060071914 A KR 20060071914A
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South Korea
Prior art keywords
wiring pattern
circuit board
anisotropic conductive
conductive adhesive
printed circuit
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KR1020040110396A
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Korean (ko)
Inventor
박동순
김현수
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주식회사 엠. 씨. 텍
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Priority to KR1020040110396A priority Critical patent/KR20060071914A/en
Publication of KR20060071914A publication Critical patent/KR20060071914A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed

Abstract

본 발명은 Multi FPCB를 제조하는 방법에 관한 것으로서 특히 Multi FPCB를 이루는 각 층간의 접합에 관한 것이다. The present invention relates to a method for producing a Multi FPCB, and more particularly to the bonding between the layers forming the Multi FPCB.

양면에 동박막이 적층된 동박적층판 (CCL)상에 통상의 사진식각을 통해 인쇄회로패턴을 형성하는 단계; 패턴이 형성된 CCL에 절연수지를 도포한 다음, 건조된 절연수지층상에 합지시키는 단계; 이어서 상기 비어홀이 형성된 기판을 무전해 Cu도금에 이어 전해 Cu도금을 행하여 다시 인쇄회로패턴을 형성하는 단계; 및 상기 절연층과 인쇄회로패턴을 필요한 만큼 반복적으로 형성하는 단계; 를 포함하여 구성되는 다층 인쇄회로기판의 제조방법에 있어서, 상기 합지의 형성단계에서, 인쇄회로패턴이 형성된 CCL상에 열경화성 절연수지를 도포한 다음, 건조한 절연수지층을 열간 압축(hot press)을 행하여 DELAMINATION 형성을 제어하는 다층 인쇄회로기판의 제조방법에 관한 것을 그 기술적 요지로 한다. Forming a printed circuit pattern on a copper clad laminate (CCL) having copper foil films laminated on both sides through ordinary photolithography; Applying an insulating resin to the patterned CCL and then laminating it on the dried insulating resin layer; Subsequently electroless Cu plating on the substrate on which the via hole is formed, followed by electrolytic Cu plating to form a printed circuit pattern again; And repeatedly forming the insulating layer and the printed circuit pattern as necessary. In the method of manufacturing a multilayer printed circuit board comprising a, wherein in the forming step of the paper, by applying a thermosetting insulating resin on the CCL on which the printed circuit pattern is formed, and then hot pressing the dry insulating resin layer (hot press) The technical gist of the present invention relates to a method for manufacturing a multilayer printed circuit board which controls the formation of the membrane.

다층, 합지기술Multilayer, Lamination Technology

Description

다층 연성회로기판의 합지기술 개발{The combination method of Multi flex printed board} Development of lamination technology for multilayer flexible printed circuit boards {The combination method of Multi flex printed board}

도 1은 본 발명에 관한 다층회로기판의 실시형태의 일례를 나타낸 단면도. 1 is a cross-sectional view showing an example of an embodiment of a multilayer circuit board according to the present invention.

도 2는 본 발명의 제조방법을 설명하는 플로챠트. 2 is a flow chart illustrating a manufacturing method of the present invention.

도 3은 본 발명의 제조방법에 의해 적층한 다층 연성 회로기판의 평면도. 3 is a plan view of a multilayer flexible circuit board laminated by the manufacturing method of the present invention.

도 4는 본 발명에 관한 다층회로기판의 접착제의 도전성을 이용하여 층간의 배선패턴의 전기적 접속에따른 실시예를 나타낸 단면도. 4 is a cross-sectional view showing an embodiment in accordance with the electrical connection of the wiring pattern between the layers using the conductivity of the adhesive of the multilayer circuit board according to the present invention.

도 5는 배경기술의 다층 연성 회로기판을 나타낸 단면도. 5 is a cross-sectional view illustrating a multilayer flexible circuit board of the background art.

본 발명은 다층회로기판 및 그 제조방법에 관한 것이다.BT 수지등으로 된 수지기판등을 사용하여 배선패턴을 다층 형성할 경우에, 층간의 배선패턴을 접합하는 방법으로서는 다층으로 적층한 기판을 드릴가공하여 스루 홀(through hole)을 형성하고, 스루 홀내를 도금하여 층간의 배선패턴을 전기적으로 접속하는 방법이 일반적으로 행해지고 있다. 도 3은 수지기판(60)을 적층한 회로기판을 나타낸다. 62는 수지기판(60)에 형성한 스루 홀이며, 스루 홀(62)의 내벽에 스루 홀 도금(예컨대 동도금)(64)을 하여 층간의 배선패턴(66)을 전기적으로 접속하고 있다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer circuit board and a method of manufacturing the same. In the case where a wiring pattern is formed in a multilayer using a resin substrate made of BT resin or the like, as a method of joining the wiring patterns between layers, a multilayer board is drilled. BACKGROUND OF THE INVENTION In general, a method of forming a through hole by forming a through hole, plating the inside of the through hole, and electrically connecting the wiring pattern between layers is generally performed. 3 shows a circuit board on which the resin substrate 60 is laminated. 62 is a through hole formed in the resin substrate 60, and through-hole plating (for example, copper plating) 64 is performed on the inner wall of the through hole 62 to electrically connect the wiring pattern 66 between the layers.

이와 같이 다층회로기판을 제조할 경우에는 수지기판(60)을 적층하여 접착하는 공정 후에 스루 홀(62)의 형성공정, 및 스루 홀(62)내의 도금공정이 필요하므로 생산효율이 낮은 과제가 있었다. 또 상기와 같이 스루 홀 도금(64)을 하여 각 층의 배선패턴(66)과 전기적으로 접속하는 방법의 경우에는, 배선패턴(66)간의 전기적 접속을 확실히 하기 위해 스루 홀(62)의 내벽에 대한 도금액의 접착성을 좋게 할 필요가 있으므로, 스루 홀의 구멍지름을 어느 정도 이상 작게 할 수가 없다. 통상 이 스루 홀의 구멍지름은 0.3mm 정도가 한도이며, 이 때문에 배선패턴(66)의 고집적화가 제한되는 과제가 있었다. In the case of manufacturing the multilayer circuit board as described above, a step of forming the through hole 62 and a plating process in the through hole 62 are required after the step of laminating and bonding the resin substrate 60. . In the case of the method of electrically connecting the wiring pattern 66 of each layer by through-hole plating 64 as described above, the inner wall of the through hole 62 is provided in order to ensure electrical connection between the wiring patterns 66. Since it is necessary to improve the adhesiveness of the plating liquid to, the through hole hole diameter cannot be made smaller than a certain degree. Normally, the hole diameter of this through hole is about 0.3 mm, which is a problem, and therefore, there is a problem that high integration of the wiring pattern 66 is limited.

이에 대해 이방도전성 접착제의 도전성을 이용하여 층간의 배선패턴을 전기적으로 접속한 다층회로기판이 일본국 특개평7-94868호 공보에 개시되어 있다. 그 다층회로기판을 도 4에 나타낸다. 다층회로기판을 구성하는 제1의 기판(70)의 한쪽 면에 배선패턴(72)을 형성하고, 다른 쪽 면에 접속용의 랜드(74)를 형성하고 있다. 접속용의 랜드(74)는 이방도전성 접착제(80)를 사용하여 제1의 기판(70)과 동일 구성의 제2의 기판(70a)과 접합할 때에, 제2의 기판(70a)에 형성한 배선패턴(72)과 이방도전성 접착제(80)로 분산된 도전입자(80a)를 통해서 전기적으로 접속되며, 이에 따라 층간의 배선패턴(72,72)이 전기적으로 접속된다. 또한 각 기판(70,70a)의 양면간의 전기적 접속, 즉 배선패턴(72)과 접속용의 랜드(74) 사이는 각 기판(70,70a)의 두께방향으로 스루 홀(76)을 형성하고, 스루 홀(76)내에 도전성 페이스트(78)를 충전함으로써 이루어진다. On the other hand, Japanese Patent Laid-Open No. 7-94868 discloses a multilayer circuit board which electrically connects wiring patterns between layers using the conductivity of an anisotropic conductive adhesive. The multilayer circuit board is shown in FIG. The wiring pattern 72 is formed on one side of the first substrate 70 constituting the multilayer circuit board, and the lands 74 for connection are formed on the other side. The lands 74 for the connection are formed on the second substrate 70a when bonding with the second substrate 70a having the same configuration as the first substrate 70 using the anisotropic conductive adhesive 80. The wiring patterns 72 and the conductive particles 80a dispersed by the anisotropic conductive adhesive 80 are electrically connected to each other, so that the wiring patterns 72 and 72 between the layers are electrically connected. Further, through-holes 76 are formed in the thickness direction of each of the substrates 70 and 70a between the electrical connection between both surfaces of each substrate 70 and 70a, that is, between the wiring pattern 72 and the lands 74 for the connection. This is done by filling the conductive paste 78 into the through hole 76.

기판(2)끼리를 접합하는 접착제로 사용하고 있는 이방도전성 접착제(80)는 전기적 절연성을 갖는 열가소성계 접착제 등의 기재에 땜납 입자등의 도전 입자(80a)를 함유시킨 것으로서, 양측으로부터 강하게 가압된 부분에서 절연물질이 배제되어 도전입자(80a)에 의해 도통되고, 기타의 부분에서는 전기적 절연성을 유지하는 특성을 갖는다  The anisotropically conductive adhesive 80 used as an adhesive for bonding the substrates 2 together contains conductive particles 80a such as solder particles in a substrate such as a thermoplastic adhesive having electrical insulation properties, and is strongly pressed from both sides. The insulating material is excluded from the portion and is conducted by the conductive particles 80a, and the other portion has a property of maintaining electrical insulation.

원재료의 유수명(Life Time)이 초과된 원재료 사용에 의해 발생되거나, 원재료 보관조건이 미흡하여 원재료 흡습에 의해 발생되는 경우 원재료(PREPREG , INNER LAYER) 자체에 이물 및 유기물이 잔존하는 경우 LAY UP 작업 시 이물(머리카락,종이 Particle , 기타)이 유입되는 경우, 적층 작업 조건 미준수 (적층 성형성 부족 , 작업 중 장비 Error 진공,압력,온도) 등이 H/P 공정에서 내층간 또는 외층과 내층간에 완전히 접착되지 못하고 들뜨는 DELAMINATION 발생을 제어 하여 보다 나은 Multi flex 회로기판의 생산성을 확보하는데 있다. It is caused by the use of raw materials that have exceeded the life time of the raw materials, or due to the absorption of raw materials due to insufficient storage conditions of the raw materials. If foreign matter (hair, paper particles, etc.) is introduced, the lamination work conditions are not met (lack of formability, equipment error during operation, vacuum, pressure, temperature), etc. in the H / P process. It is to secure the productivity of the multi flex circuit board by controlling the occurrence of the floatation that cannot be bonded.

본 발명은 상기 목적을 달성하기 위해 다음과 같은 구성을 갖춘다. The present invention has the following configuration to achieve the above object.

본 발명은 제1의 배선패턴이 형성된 회로기판상에 열경화성 수지재 또는 열가소성 수지재등으로 된 접착제에 도전입자가 분산된 이방도전성 접착제층이 형성되고, 상기 이방도전성 접착제층상에 제2의 배선패턴이 형성됨과 동시에, 상기 제2의 배선패턴의 단부가 상기 이방도전성 접착제층의 내측으로 만곡되어 상기 도전입자를 통해서 제2의 배선패턴이 전기적으로 접속되는 것을 특징으로 한다. According to the present invention, an anisotropic conductive adhesive layer in which conductive particles are dispersed in an adhesive made of a thermosetting resin material or a thermoplastic resin material is formed on a circuit board on which a first wiring pattern is formed, and a second wiring pattern is formed on the anisotropic conductive adhesive layer. At the same time, an end portion of the second wiring pattern is curved inside the anisotropic conductive adhesive layer to electrically connect the second wiring pattern through the conductive particles.

또 상기 회로기판의 제1의 배선패턴의 단부가 형성된 부위에 상기 제1의 배선패턴의 단부를 노출하는 관통구멍이 형성됨으로써, 외부 접속단자를 적절히 접속할 수 있다. In addition, a through hole for exposing the end portion of the first wiring pattern is formed in a portion where the end portion of the first wiring pattern of the circuit board is formed, whereby the external connection terminal can be properly connected.

또 상기 관통구멍에는 땜납이 충전되며 외부 접속단자가 형성되고, 또한 그 외부 접속단자가 상기 관통구멍에 충전된 땜납과 일체로 형성된 땜납 볼이므로 적절하게 장착할 수가 있다. The through hole is filled with solder to form an external connection terminal, and the external connection terminal is a solder ball formed integrally with the solder filled in the through hole.

또 본 발명은 제1의 배선패턴이 형성된 회로기판상에 열경화성 수지재 또는 열가소성 수지재등으로 된 접착제에 도전입자가 분산된 이방도전성 접착제층을 형성하고, 상기 이반도전성 접착제층상에 도체층을 형성함과 동시에, 상기 도전체층을 제2의 배선패턴에 형성한 후, 상기 이방도전성 접착제층을 가열하여 연화시켜서 상기 제2의 배선패턴의 단부를 이방도전성 접착제의 내측으로 만곡시킴과 동시에, 상기 도전입자를 통해서 제2의 배선패턴과 제1의 배선패턴을 전기적으로 접속하는 것을 특징으로 하는 다층회로기판의 제조방법이기도 하다. According to the present invention, an anisotropic conductive adhesive layer in which conductive particles are dispersed in an adhesive made of a thermosetting resin material or a thermoplastic resin material is formed on a circuit board on which a first wiring pattern is formed, and a conductor layer is formed on the semiconductive adhesive layer. At the same time, after the conductor layer is formed on the second wiring pattern, the anisotropic conductive adhesive layer is heated and softened, thereby bending the end of the second wiring pattern to the inside of the anisotropic conductive adhesive, and simultaneously It is also a method of manufacturing a multilayer circuit board, wherein the second wiring pattern and the first wiring pattern are electrically connected through the particles.

또 상기 이방도전성 접착제층을 시트형으로 형성된 이방도전성 접착제막을 사용하고, 상기 이방도전성 접착제막상에 도체층을 형성한 후, 상기 이방도전성 접착제막을 상기 회로기판에 적층하여 형성하고, 상기 이방도전성 접착제막에 형성한 도체층을 상기 제2의 배선패턴에 형성한 후, 상기 이방도전성 접착제막을 상기 회로기판에 적층함으로써 더욱 좋은 효율로 다층회로기판을 제조할 수 있다. Further, using an anisotropic conductive adhesive film having the anisotropic conductive adhesive layer formed into a sheet, forming a conductor layer on the anisotropic conductive adhesive film, laminating the anisotropic conductive adhesive film on the circuit board, and forming the anisotropic conductive adhesive film on the anisotropic conductive adhesive film. After the formed conductor layer is formed on the second wiring pattern, the multilayer anisotropic conductive adhesive film is laminated on the circuit board, whereby a multilayer circuit board can be manufactured with better efficiency.

또 상기 다층회로기판의 제조방법을 반복해서 배선패턴을 3층 이상의 다층으로 용이하게 형성할 수가 있다. In addition, the wiring pattern can be easily formed into a multilayer of three or more layers by repeating the manufacturing method of the multilayer circuit board.

또 이와같이 배선패턴을 3층 이상의 다층으로 형성할 경우에, 상기 이방도전성 접착제층이 금속입자가 분산된 에폭시계의 열경화성 수지로 됨으로써, 일단 경화한 접착제가 다음 층을 형성할 때의 가열에 의해 재차 연화하는 것을 염려할 필요가 없어서, 확실한 전기적 접속을 얻을 수가 있다. When the wiring pattern is formed in a multilayer of three or more layers in this manner, the anisotropic conductive adhesive layer becomes an epoxy-based thermosetting resin in which metal particles are dispersed, so that the adhesive once cured is heated again when forming the next layer. There is no need to worry about softening, and a reliable electrical connection can be obtained.

또한 상기 금속입자가 땜납 입자, 니켈 입자 또는 금 입자로 됨으로써, 사용 조건에 따라서 적합한 전기적 접속을 얻을 수가 있다. Moreover, since the said metal particle becomes a solder particle, nickel particle, or gold particle, suitable electrical connection can be obtained according to a use condition.

본 발명에 의하면 제2의 배선패턴의 단부가 이방도전성 접착제층의 내측으로 만곡되어 상기 도전입자를 통해서 제1의 배선패턴과 접속된다.According to the present invention, the end portion of the second wiring pattern is curved inside the anisotropic conductive adhesive layer and connected to the first wiring pattern through the conductive particles.

따라서 종래와 같은 스루 홀의 형성이 불필요하게 됨과 동시에, 기존 열간 압접시 발생하게 되는 DELAMINATION, 도금 또는 도전성 페이스트의 충전 등의 공정을 요하지 않으므로, 다층회로기판의 생산공정을 간략화할 수가 있다. 이에 따라 생산효율을 향상시킬 수 있고, 제조원가도 절감할 수가 있다. 또 스루 홀의 형성이 불필요하므로 미세배선화도 가능해지는 효과를 발휘한다. Therefore, the conventional through-hole formation is not necessary, and the process of eliminating DELAMINATION, plating, or filling of the conductive paste, which is generated during conventional hot welding, does not require a process, thereby simplifying the production process of the multilayer circuit board. As a result, production efficiency can be improved and manufacturing costs can be reduced. In addition, since the formation of the through holes is unnecessary, it is possible to achieve fine wiring.

Claims (6)

제1의 배선패턴이 형성된 회로기판상에 열경화성 수지재 또는 열가소성 수지재등으로 된 접착제에 도전입자가 분산된 이방도전성 접착제층이 형성되고, 상기 이방도전성 접착제층상에 제2의 배선패턴이 형성됨과 동시에, 상기 제2의 배선패턴의 단부가 상기 이방도전성 접착제층의 내측으로 만곡되어 상기 도전입자를 통해서 제2의 배선패턴이 전기적으로 접속된 것을 특징으로 하는 다층회로기판. An anisotropic conductive adhesive layer in which conductive particles are dispersed in an adhesive made of a thermosetting resin material or a thermoplastic resin material is formed on a circuit board on which the first wiring pattern is formed, and a second wiring pattern is formed on the anisotropic conductive adhesive layer. And at the same time, an end portion of the second wiring pattern is curved inside the anisotropic conductive adhesive layer so that the second wiring pattern is electrically connected through the conductive particles. 제1항에 있어서, 상기 회로기판의 제1의 배선패턴의 단부가 형성된 부위에 상기 제1의 배선패턴의 단부를 노출하는 관통구멍이 형성된 것을 특징으로 하는 다층회로기판. The multilayer circuit board of claim 1, wherein a through hole exposing an end portion of the first wiring pattern is formed at a portion where the end portion of the first wiring pattern is formed. 제2항에 있어서, 상기 관통구멍에는 땜납이 충전되며, 외부 접속단자가 형성된 것을 특징으로 하는 다층회로기판. 3. The multilayer circuit board of claim 2, wherein the through hole is filled with solder, and an external connection terminal is formed. 제3항에 있어서, 상기 외부 접속단자가 상기 관통구멍에 충전된 땜납과 일체로 형성된 땜납 볼인 것을 특징으로 하는 다층회로기판. 4. The multilayer circuit board of claim 3, wherein the external connection terminal is a solder ball formed integrally with solder filled in the through hole. 제1의 배선패턴이 형성된 회로기판상에 열경화성 수지재 또는 열가소성 수지재등으로 된 이방도전성 접착제층을 형성하고, 상기 이방도전성 접착제층상에 도체층을 형성함과 동시에, 상기 도체층을 제2의 배선패턴에 형성한 후, 상기 이방도전성 접착제층을 가열하여 연화시켜서 상기 제2의 배선패턴의 단부를 이방도전성 접착제의 내측으로 만곡시킴과 동시에 , 상기 도전입자를 통해서 제2의 배선패턴과 제1의 배선패턴을 전기적으로 접속하는 것을 특징으로 하는 다층회로기판의 제조방법. An anisotropic conductive adhesive layer made of a thermosetting resin material, a thermoplastic resin material, or the like is formed on the circuit board on which the first wiring pattern is formed, and a conductor layer is formed on the anisotropic conductive adhesive layer. After forming on the wiring pattern, the anisotropic conductive adhesive layer is heated and softened to bend the ends of the second wiring pattern to the inside of the anisotropic conductive adhesive, and at the same time, the second wiring pattern and the first wiring pattern are formed through the conductive particles. A method for manufacturing a multilayer circuit board, comprising electrically connecting wiring patterns. 제5항에 있어서, 상기 이방도전성 접착제층으로 시트형으로 형성된 이방도전성 접착제막을 사용하고, 상기 이방도전성 접착제막상에 도체층을 형성한 후, 상기 이방도전성 접착제막을 상기 회로기판에 적층하여 형성하는 것을 특징으로 하는 다층회로기판의 제조방법. 6. The method of claim 5, wherein an anisotropic conductive adhesive film formed in a sheet form is used as the anisotropic conductive adhesive layer, and after forming a conductor layer on the anisotropic conductive adhesive film, the anisotropic conductive adhesive film is laminated on the circuit board. A method of manufacturing a multilayer circuit board.
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