KR20050073816A - Hybrid module - Google Patents
Hybrid module Download PDFInfo
- Publication number
- KR20050073816A KR20050073816A KR1020040001912A KR20040001912A KR20050073816A KR 20050073816 A KR20050073816 A KR 20050073816A KR 1020040001912 A KR1020040001912 A KR 1020040001912A KR 20040001912 A KR20040001912 A KR 20040001912A KR 20050073816 A KR20050073816 A KR 20050073816A
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- South Korea
- Prior art keywords
- terminal
- substrate
- hybrid module
- connecting portion
- straight line
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
회로가 인쇄된 기판에 각종 전자부품이 실장된 하이브리드 모듈이 개시된다. 상기 하이브리드 모듈은 회로가 인쇄된 기판, 상기 기판에 설치된 다수의 전자부품, 상기 기판에 접속되는 제 1 접속부와 상기 제 1 접속부의 단부에서 직선으로 연장형성된 연결부와 상기 연결부의 단부에서 구불구불하게 연장형성된 부 및 상기 부의 단부에서 직선으로 연장형성되어 다른 부품에 접속되는 제 2 접속부를 가지는 다수의 단자를 구비한다. 상기 하이브리드 모듈은 단자에 부가 형성되므로, 단자를 펴서 그 길이를 연장할 수 있다.Disclosed is a hybrid module in which various electronic components are mounted on a printed circuit board. The hybrid module includes a substrate on which a circuit is printed, a plurality of electronic components installed on the substrate, a first connecting portion connected to the substrate and a connecting portion extending in a straight line from an end portion of the first connecting portion and a winding portion extending from an end portion of the connecting portion. And a plurality of terminals having a formed portion and a second connecting portion extending in a straight line at an end of the portion and connected to another component. Since the hybrid module is additionally formed in the terminal, the terminal can be extended to extend its length.
Description
본 발명은 회로가 인쇄된 기판에 각종 전자부품이 실장된 하이브리드 모듈에 관한 것이다.The present invention relates to a hybrid module in which various electronic components are mounted on a printed circuit board.
도 1은 종래의 하이브리드 모듈의 사시도로써, 이를 설명한다.1 is a perspective view of a conventional hybrid module, which will be described.
도시된 바와 같이, 회로가 인쇄된 기판(11) 상에 각종 전자부품(13)이 설치되고, 기판(11)의 회로에는 다수의 단자(15)가 접속된다. 이때, 단자(15)는 직선형으로 마련되어 일단부측은 기판(11)의 회로에 납땜되어 접속되고, 타단부측은 기판(11)의 외측으로 돌출되어 다른 부품에 납땜되어 접속된다. As shown, various electronic components 13 are provided on the substrate 11 on which the circuit is printed, and a plurality of terminals 15 are connected to the circuit of the substrate 11. At this time, the terminal 15 is provided in a straight shape, and one end side is soldered and connected to the circuit of the substrate 11, and the other end side is protruded out of the substrate 11 and soldered and connected to other components.
그러나, 상기와 같은 종래의 하이브리드 모듈은 단자(15)가 직선형으로 마련되므로 단자(15)의 길이를 연장할 수 없는 단점이 있다. 상세히 설명하면, 단자(15)들 중, 어느 하나의 단자(15a)의 길이가 길어야만 할 경우에는 그 길이를 연장할 수 없으므로, 별도의 전선을 연결하여 단자(15a)와 상기 다른 부품을 접속시켜야 하는 불편함이 있다.However, the conventional hybrid module as described above has a disadvantage in that the terminal 15 may not be extended because the terminal 15 is provided in a straight line. In detail, if the length of any one of the terminals 15 should be long, the length cannot be extended, so connecting a separate electric wire to connect the terminal 15a and the other component There is discomfort that should be done.
그리고, 단자(15)가 접속되는 상기 다른 부품과 단자(15)의 높이가 다를 경우, 단자(15)를 시켜 상기 다른 부품에 납땜하여 접속하여야 한다. 그런데, 단자(15)를 덮는 크림솔더(Cream Solder)(19)의 두께 보다 단자(15)가 더 많이 되므로 인하여 접촉불량이 발생하는 단점이 있다.When the height of the terminal 15 is different from that of the other component to which the terminal 15 is connected, the terminal 15 should be soldered and connected to the other component. However, since the terminal 15 is larger than the thickness of the cream solder 19 covering the terminal 15, there is a disadvantage in that contact failure occurs.
본 발명은 상기와 같은 종래 기술의 문제점을 해소하기 위하여 안출된 것으로, 본 발명의 목적은 단자를 구불구불하게 벤딩형성하여 그 길이를 연장할 수 있는 하이브리드 모듈을 제공함에 있다.The present invention has been made to solve the problems of the prior art as described above, an object of the present invention is to provide a hybrid module capable of extending the length by bending the terminal twisted.
상기 목적을 달성하기 위한 본 발명에 따른 하이브리드 모듈은 회로가 인쇄된 기판; 상기 기판에 설치된 다수의 전자부품; 상기 기판에 접속되는 제 1 접속부, 상기 제 1 접속부의 단부에서 직선으로 연장형성된 연결부, 상기 연결부의 단부에서 구불구불하게 연장형성된 벤딩부 및 상기 벤딩부의 단부에서 직선으로 연장형성되어 다른 부품에 접속되는 제 2 접속부를 가지는 다수의 단자를 구비한다.Hybrid module according to the present invention for achieving the above object is a circuit printed circuit board; A plurality of electronic components installed on the substrate; A first connecting portion connected to the substrate, a connecting portion extending in a straight line at an end of the first connecting portion, a bending portion extending in a serpentine form at an end of the connecting portion, and extending in a straight line at an end of the bending portion and connected to another component A plurality of terminals having a second connecting portion is provided.
이하, 첨부한 도면을 참조하여 본 발명의 일 실시예에 따른 하이브리드 모듈을 상세히 설명한다.Hereinafter, a hybrid module according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 일 실시예에 따른 하이브리드 모듈의 사시도이고, 도 3은 도 2에 도시된 단자의 정면도이다.2 is a perspective view of a hybrid module according to an embodiment of the present invention, and FIG. 3 is a front view of the terminal illustrated in FIG. 2.
도시된 바와 같이, 하이브리드 모듈(100)은 회로가 인쇄된 기판(110)을 가진다. 기판(110)의 상면에는 콘덴서 또는 인덕터 등과 같은 칩 부품과 반도체 등과 같은 회로부품인 다수의 전자부품(120)이 설치된다. 그리고, 기판(110)에는 기판(110)과 다른 부품을 접속시키는 다수의 단자(130)가 접속된다.As shown, the hybrid module 100 has a substrate 110 on which circuits are printed. On the upper surface of the substrate 110, a plurality of electronic components 120, which are chip components such as capacitors or inductors, and circuit components such as semiconductors, are installed. And the board | substrate 110 is connected with the several terminal 130 which connects the board 110 and another component.
본 실시예에 따른 하이브리드 모듈(100)의 단자(130)는 길이를 연장할 수 있도록 구성된다. 상세히 설명하면, 도 3에 도시된 바와 같이, 단자(130)는 제 1, 2 접속부(131,133), 연결부(135) 및 벤딩부(137)를 가진다. 제 1 접속부(131)는 ㄷ 또는 역ㄷ 형상으로 마련되어 기판(110)의 회로에 납땜된다. 제 1 접속부(131)를 ㄷ 또는 역ㄷ 형상으로 마련한 이유는 단자(130)를 기판(110)에 삽입하여 접속하기 위함으로, 이로인해 단자(130)가 기판(110)에 견고하게 접속된다. 연결부(135)는 제 1 접속부(131)에서 연장형성되어 직선으로 마련되고, 벤딩부(137)는 연결부(135)의 단부에서 구불구불하게 벤딩형성된다. 그리고, 제 2 접속부(133)는 벤딩부(137)의 단부에서 직선으로 연장형성되어 상기 다른 부품에 납땜된다.Terminal 130 of the hybrid module 100 according to the present embodiment is configured to extend the length. In detail, as shown in FIG. 3, the terminal 130 has first and second connectors 131 and 133, a connector 135, and a bending part 137. The first connector 131 is provided in a c or inverted shape and soldered to a circuit of the substrate 110. The reason why the first connection part 131 is provided in the c or inverted shape is to insert the terminal 130 into the substrate 110 so that the terminal 130 is firmly connected to the substrate 110. The connection part 135 extends from the first connection part 131 and is provided in a straight line, and the bending part 137 is bent to bend at the end of the connection part 135. The second connecting portion 133 extends in a straight line at the end of the bending portion 137 and is soldered to the other component.
그리하여, 기판(110)에 단자(130)의 제 1 접속부(131)를 접속한 후 제 2 접속부(133)를 상기 다른 부품에 접속하면 된다. 이때, 다수의 단자(130) 중 어느 하나의 단자(130a)(도 2참조)의 길이를 길게하여야 할 경우에는, 단자(130a)의 벤딩부(137)를 펴서 단자(130a)를 상기 다른 부품에 납땜하면 된다. Therefore, what is necessary is just to connect the 1st connection part 131 of the terminal 130 to the board | substrate 110, and to connect the 2nd connection part 133 to the said other component. At this time, when it is necessary to lengthen the length of one terminal 130a (see FIG. 2) of the plurality of terminals 130, the bending part 137 of the terminal 130a is extended to connect the terminal 130a to the other components. Solder to
그리고, 단자(130)가 접속되는 상기 다른 부품과 단자(130)의 높이가 다른 경우, 단자(130)를 벤딩하여 상기 다른 부품에 납땜하면 된다. 그런데, 본 실시예에 따른 단자(130)는 벤딩부(137)를 가지고 있으므로 단자(130)의 양단부측을 덮는 크림솔더(Cream Solder)(140)의 두께 보다 단자(130)를 더 작게 벤딩시켜 단자(130)를 기판(110) 및 상기 전자부품에 납땜할 수 있다.When the height of the terminal 130 is different from that of the other component to which the terminal 130 is connected, the terminal 130 may be bent and soldered to the other component. However, since the terminal 130 according to the present exemplary embodiment has the bending part 137, the terminal 130 is bent smaller than the thickness of the cream solder 140 covering both end portions of the terminal 130. The terminal 130 may be soldered to the substrate 110 and the electronic component.
이상에서 설명한 바와 같이, 본 발명에 따른 하이브리드 모듈은 단자에 벤딩부가 형성되므로, 단자를 펴서 그 길이를 연장할 수 있다.As described above, since the bending part is formed in the terminal of the hybrid module according to the present invention, the terminal can be extended to extend its length.
이상에서는, 본 발명의 일 실시예에 따라 본 발명을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 변경 및 변형한 것도 본 발명에 속함은 당연하다.In the above, the present invention has been described in accordance with one embodiment of the present invention, but those skilled in the art to which the present invention pertains have been changed and modified without departing from the spirit of the present invention. Of course.
도 1은 종래의 하이브리드 모듈의 사시도.1 is a perspective view of a conventional hybrid module.
도 2는 본 발명의 일 실시예에 따른 하이브리드 모듈의 사시도.2 is a perspective view of a hybrid module according to an embodiment of the present invention.
도 3은 도 2에 도시된 단자의 정면도.3 is a front view of the terminal shown in FIG. 2;
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on main parts of drawing
110 : 기판 120 : 전자부품110: substrate 120: electronic components
130 : 단자 140 : 솔더크림(Solder Cream)130: terminal 140: solder cream
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040001912A KR20050073816A (en) | 2004-01-12 | 2004-01-12 | Hybrid module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040001912A KR20050073816A (en) | 2004-01-12 | 2004-01-12 | Hybrid module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20050073816A true KR20050073816A (en) | 2005-07-18 |
Family
ID=37262719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040001912A KR20050073816A (en) | 2004-01-12 | 2004-01-12 | Hybrid module |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20050073816A (en) |
-
2004
- 2004-01-12 KR KR1020040001912A patent/KR20050073816A/en not_active Application Discontinuation
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