KR20050017905A - Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Circuit Board manufactured by the method thereof - Google Patents
Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Circuit Board manufactured by the method thereofInfo
- Publication number
- KR20050017905A KR20050017905A KR1020030055427A KR20030055427A KR20050017905A KR 20050017905 A KR20050017905 A KR 20050017905A KR 1020030055427 A KR1020030055427 A KR 1020030055427A KR 20030055427 A KR20030055427 A KR 20030055427A KR 20050017905 A KR20050017905 A KR 20050017905A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- flexible printed
- printed circuit
- laminate
- forming
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
본 발명은 연성회로기판 제조방법 및 그에 의해 제조된 연성회로기판에 관한 것으로, 보다 상세하게는 도금층이 필요없는 굴곡부에 대응한 부분에칭공정을 통해 도금층을 구성시키지 않음으로써 원자재 그대로의 굴곡성과 유연성을 유지시킴과 동시에, 정밀한 회로패턴을 가능하도록 한 연성회로기판 제조방법 및 그에 의해 제조된 연성회로기판을 제공하는데 그 목적이 있다.The present invention relates to a flexible printed circuit board manufacturing method and a flexible printed circuit board manufactured by the present invention, and more particularly, the flexibility and flexibility of raw materials can be achieved by not forming a plating layer through a partial etching process corresponding to a bent portion requiring no plating layer. It is an object of the present invention to provide a flexible circuit board manufacturing method and a flexible circuit board manufactured thereby, which are capable of maintaining and at the same time enabling a precise circuit pattern.
일반적으로 여러 전자기기에서 굴곡이 많은 부위에 전기적으로 두 구간을 연결시키는 위하여 연성회로기판(FPCB: Flexible Printed Cirucit Board)이 이용된다. 이러한 연성회로기판의 주요 특징부는 굴곡성에 관련된다.In general, a flexible printed circuit board (FPCB) is used to electrically connect two sections to a bent portion of various electronic devices. The main feature of such flexible circuit boards relates to flexibility.
종래 기술에 따른 연성인쇄회로기판의 제조방법을 도1을 참조하여 설명하면 다음과 같다. 도1은 종래 기술에 따른 연성인쇄회로기판의 제조방법에 의하여 구성된 연성인쇄회로기판을 도시한 구성도이다.A method of manufacturing a flexible printed circuit board according to the prior art will now be described with reference to FIG. 1. 1 is a block diagram showing a flexible printed circuit board constructed by a method of manufacturing a flexible printed circuit board according to the prior art.
종래 기술에 따른 연성인쇄회로기판의 제조과정은, 폴리이미드(polymide) 재질의 베이스 필름(1)과 동박(2) 사이를 접착제(3)로 접착하여 적층체를 형성하는 단계와; 상기 동박(2)에 에칭 및 드라이필름(dry film) 박리를 통하여 회로를 형성하는 단계와; 상기 적층체에 비아홀(4)을 형성하는 단계와; 상기 적층체의 상면, 즉 상기 동박(2)의 상면 및 비아홀(4)에 무전해 동도금(5)하는 단계와; 상기 무전해 동도금 상면 및 비아홀(5)에 전해 도금(6)하는 단계; 및 상기 전해도금(6) 상면에 접착제(7)로 접착하여 폴리이미드 재질의 상부 필름(8)을 접착하는 단계로 이루어진다. 이와 같은 제조공정을 통해 완성된 연성회로기판은 도1에 도시한 바와 같은 구조를 갖는다.The manufacturing process of the flexible printed circuit board according to the prior art includes the steps of: forming a laminate by adhering a polyimide base film (1) and a copper foil (2) with an adhesive (3); Forming a circuit through the etching and dry film peeling on the copper foil; Forming via holes (4) in the laminate; Electroless copper plating (5) on the upper surface of the laminate, that is, the upper surface of the copper foil (2) and the via hole (4); Electroplating (6) the electroless copper plating upper surface and the via hole (5); And adhering the upper film 8 made of polyimide by adhering to the upper surface of the electroplating 6 with an adhesive 7. The flexible circuit board completed through such a manufacturing process has a structure as shown in FIG.
여기에서, 상기 연성인쇄회로기판은 상기 비아홀(4)을 통해 각 층 간을 도통시키고 비아홀(4) 내부를 두 가지 도금, 즉 무전해 동도금 및 전해 도금을 통해 도통된다. Herein, the flexible printed circuit board is electrically connected between the layers through the via holes 4 and the inside of the via holes 4 through two plating processes, namely, electroless copper plating and electrolytic plating.
또한, 상기 베이스 필름(1)은 부도체임으로 전해도금을 할 수 없기 때문에 촉매를 바른 후 무전해 동도금을 하게 된다. 이 때, 무전해 동도금(5)은 시간이 오래걸리며 공정이 까다로워 신뢰성을 얻을 만큼의 도금층을 적층할 수 없기 때문에, 이미 무전해 동도금(5)으로 도금된 비아홀(4) 내부를 전해도금(6)을 통해 한번 더 두껍게 도금해준다.In addition, since the base film 1 cannot be electroplated because it is a non-conductor, electroless copper plating is performed after applying a catalyst. At this time, since the electroless copper plating 5 takes a long time and the process is difficult, it is impossible to laminate the plating layer to obtain reliability, and thus electroplating the inside of the via hole 4 already plated with the electroless copper plating 5. ) To thicken once more.
상기 동박(2)에 회로를 형성한 후 회로보호를 위해 경질 인쇄회로기판의 경우 솔더 레지스트 잉크를 도포해 주지만, 연성인쇄회로기판의 경우 굴곡부에 사용되기 때문에 솔더 레지스트 잉크를 사용할 수 없어, 연성회로기판의 경우에는 회로보호를 위하여 접착제(70)를 매개로 상기 상부 필름(8)을 형성시킨다.After forming the circuit on the copper foil (2), the solder resist ink is applied to the hard printed circuit board to protect the circuit, but in the case of the flexible printed circuit board, the solder resist ink cannot be used because the flexible printed circuit board is used in the bent portion. In the case of the substrate, the upper film 8 is formed through the adhesive 70 to protect the circuit.
그러나, 상기와 같은 종래 기술에 따른 연성인쇄회로기판의 제조방법은, 비아홀의 전기적 도통을 위한 도금시 비아홀의 내벽뿐만 아니라 자재 전반에 걸쳐 도금이 이루어진다. 따라서, 도금이 필요없는 부분까지 도금되기 때문에 연성회로기판의 장점인 굴곡성을 저해시키는 문제점이 있다.However, in the method of manufacturing a flexible printed circuit board according to the related art as described above, plating is performed not only on the inner wall of the via hole but also on the entire material during plating for electrical conduction of the via hole. Therefore, there is a problem of inhibiting the flexibility, which is an advantage of the flexible printed circuit board, because the plating is performed to a portion where plating is not required.
이러한 문제점을 극복하기 위하여 다른 변형된 공법들이 사용될 수 있으나, 이러한 공법에 맞는 설비 및 공정형태를 갖춰야 하기 때문에 새로운 설비 및 공정형태에 대한 투자부담이 발생하는 문제점이 있다.In order to overcome this problem, other modified methods may be used, but there is a problem in that an investment burden for new equipment and process types is generated because it is necessary to have equipment and process types suitable for these methods.
따라서, 본 발명은 상기의 제반 문제점을 해결하기 위하여 제안된 것으로서, 비아홀이 형성되는 도금층 이외의 부분에 대응하여 부분에칭공정을 통해 도금층을 형성시키지 않음으로써 원자재 그대로의 굴곡성 및 유연성을 향상시킬 수 있는 연성인쇄회로기판의 제조방법 및 이에 의해 제조된 연성회로기판을 제공하는데 그 목적이 있다.Accordingly, the present invention has been proposed to solve the above problems, and can improve the flexibility and flexibility of raw materials as it is by not forming a plating layer through a partial etching process corresponding to portions other than the plating layer in which via holes are formed. An object of the present invention is to provide a method of manufacturing a flexible printed circuit board and a flexible circuit board manufactured thereby.
또한, 본 발명은 불필요한 부분에 도금층을 형성하지 않아 굴곡성을 향상시킬 수 있어, 값비싼 자재를 사용할 필요가 없어 자재 비용을 절감시킬 수 있는 연성인쇄회로기판 및 그에 의해 제조된 연성인쇄회로기판을 제공하는데 다른 목적이 있다.In addition, the present invention provides a flexible printed circuit board and a flexible printed circuit board manufactured thereby, which can improve the flexibility by not forming a plating layer on the unnecessary portion, thereby eliminating the need for expensive materials. Has a different purpose.
또한, 본 발명은 별도의 특정설비 및 공정형태를 필요로 하지 않고, 기존 장비를 이용하므로써 동일 성능의 제품을 저비용으로 제조할 수 있는 연성인쇄회로기판의 제조방법 및 이에 의해 제조된 연성인쇄회로기판을 제공하는데 또 다른 목적이 있다.In addition, the present invention does not require a separate specific equipment and process form, and the method of manufacturing a flexible printed circuit board that can produce a product of the same performance at a low cost by using the existing equipment and the flexible printed circuit board manufactured thereby There is another purpose to provide.
또한, 본 발명은 연성인쇄회로기판의 제조공정에서 부분에칭공정이 부가됨으로써 비교적 협소한 공간에서도 정밀한 패턴을 구현할 수 있는 연성인쇄회로기판 제조방법 및 그에 의해 제조된 연성회로기판을 제공하는데 또 다른 목적이 있다.In addition, the present invention is to provide a flexible printed circuit board manufacturing method and a flexible printed circuit board manufactured thereby that can realize a precise pattern in a relatively narrow space by adding a partial etching process in the manufacturing process of the flexible printed circuit board. There is this.
상기 목적을 달성하기 위하여 본 발명은, 베이스 필름 상면에 동박을 적층 고정시켜 제1적층체를 형성하는 제1단계; 상기 제1적층체에 회로 및 비아홀을 형성시켜 제2적층체를 형성하는 제2단계; 상기 제2적층체의 상면에 무전해 동도금을 도금하여 제3적층체를 형성하는 제3단계; 상기 제3적층체의 상면에 전해 도금을 도금하여 제4적층체를 형성하는 제4단계; 상기 제4적층체의 상면 일측에 에칭마스크부재를 적층시켜 제5적층체를 형성하는 제5단계; 상기 제5적층체의 상면을 에칭시켜 제6적층체를 형성하는 제6단계; 상기 제6적층체로부터 에칭마스크부재를 제거하는 제7단계; 및 상기 에칭마스크부재가 제거된 제6적층체 상면에 상부필름을 적층 고정시켜 제8적층체를 형성하는 제8단계를 포함하는 연성인쇄회로기판의 제조방법을 제공한다.The present invention to achieve the above object, the first step of forming a first laminated body by laminating and fixing the copper foil on the upper surface of the base film; A second step of forming a second laminate by forming circuits and via holes in the first laminate; A third step of forming a third laminate by plating electroless copper plating on the upper surface of the second laminate; A fourth step of forming a fourth laminated body by plating electrolytic plating on the upper surface of the third laminated body; A fifth step of forming a fifth stacked body by stacking an etching mask member on one side of an upper surface of the fourth stacked body; A sixth step of forming a sixth stacked body by etching the upper surface of the fifth stacked body; A seventh step of removing the etching mask member from the sixth laminate; And an eighth step of forming an eighth laminated body by stacking and fixing the upper film on the upper surface of the sixth laminated body from which the etching mask member is removed.
상기 제5단계에서는 상기 비아홀이 형성되는 부분에 대응하는 제5적층체 상면에 에칭마스크부재가 위치되거나, 설계시 연성회로기판이 굴곡되지 않는 비굴곡부에 대응하는 위치에 위치된다.In the fifth step, the etching mask member is positioned on the upper surface of the fifth stacked body corresponding to the portion where the via hole is formed, or at the position corresponding to the non-bending portion where the flexible circuit board is not bent in design.
상기 제6단계에서는 상기 에칭마스크부재가 형성되지 않은 제5적층체 상면의 무전해 도금과 전해 도금를 제거한다.In the sixth step, the electroless plating and the electrolytic plating are removed on the upper surface of the fifth laminate in which the etching mask member is not formed.
상술한 목적, 특징들 및 장점은 첨부된 도면과 관련한 다음의 상세한 설명을 통하여 보다 분명해질 것이다. 이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 일실시예를 상세히 설명한다. The above objects, features and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도2는 본 발명에 따른 연성인쇄회로기판의 제조방법에 따른 공정을 순서대로 도시한 공정도이고, 도3은 본 발명에 따른 연성인쇄회로기판의 제조방법에 의하여 제조된 연성인쇄회로기판을 도시한 구성도이다.FIG. 2 is a process diagram sequentially showing a process according to a method of manufacturing a flexible printed circuit board according to the present invention, and FIG. 3 is a diagram of a flexible printed circuit board manufactured by a method of manufacturing a flexible printed circuit board according to the present invention. It is a block diagram.
본 발명에 따른 연성인쇄회로기판의 제조방법은 도2에 도시된 바와 같이, 부도체의 베이스 필름(10)상면에 접착제(11)를 매개로 동박(12)를 접착시켜 제1적층체(20)를 형성하는 제1단계와; 상기 동박(12)에 에칭 및 드라이필름(dry film) 박리를 통하여 회로 및 비아홀(13)을 구비한 제2적층체(21)를 형성하는 제2단계와; 상기 제2적층체(21)의 상면, 즉 동박(12) 상면 및 비아홀(13) 내벽에 무전해 동도금(14)을 도금하여 제3적층체(22)를 형성하는 제3단계와; 상기 제3적층체(22)의 상면, 즉 상기 무전해 동도금(14)의 상면 및 비아홀(13) 내측에 전해 도금(15)을 도금하여 제4적층체(23)를 형성하는 제4단계와; 상기 제4적층체(23)의 상면 일측에 에칭마스크부재(30)를 적층시켜 제5적층체(24)를 형성하는 제5단계와; 상기 제5적층체(24)의 상면을 에칭시켜 에칭마스크부재(30)가 형성되지 않은 제5적층체(24)의 무전해 도금(14)과 전해 도금(15)를 제거하여 제6적층체(25)를 형성하는 제6단계와; 상기 제6적층체(25)로부터 에칭마스크부재(30)를 제거하는 제7단계; 및 상기 에칭마스크부재(30)가 제거된 제6적층체(25) 상면에 접착제(16)를 매개로 부도체의 상부필름(17)을 접착시켜 제8적층체(26)을 형성하는 제8단계를 포함한다. In the method of manufacturing a flexible printed circuit board according to the present invention, as shown in FIG. 2, the first laminated body 20 is formed by adhering the copper foil 12 to the upper surface of the base film 10 of the insulator through the adhesive 11. Forming a first step; A second step of forming a second laminate 21 having a circuit and via holes 13 through etching and dry film peeling on the copper foil 12; A third step of plating the electroless copper plating 14 on the upper surface of the second laminated body 21, that is, the upper surface of the copper foil 12 and the inner wall of the via hole 13 to form a third laminated body 22; A fourth step of forming the fourth laminated body 23 by plating the electrolytic plating 15 on the upper surface of the third laminated body 22, that is, the upper surface of the electroless copper plating 14 and the inside of the via hole 13; ; A fifth step of forming a fifth laminated body (24) by laminating an etching mask member (30) on one side of an upper surface of the fourth laminated body (23); The upper surface of the fifth laminate 24 is etched to remove the electroless plating 14 and the electrolytic plating 15 of the fifth laminate 24 on which the etching mask member 30 is not formed. A sixth step of forming (25); A seventh step of removing the etching mask member 30 from the sixth laminate 25; And an eighth step of forming the eighth laminated body 26 by adhering the upper film 17 of the insulator to the upper surface of the sixth laminated body 25 from which the etching mask member 30 is removed by the adhesive 16. It includes.
상기 제8단계에서 형성된 제8적층체는 도3에 도시한 바와 같은 완성된 연성인쇄회로기판 구성을 갖는다.The eighth laminate formed in the eighth step has a completed flexible printed circuit board configuration as shown in FIG.
상기 베이스 필름(10) 및 상부 필름(17)은 부도체인 폴리이미드(polymide) 재질로 이루어진다.The base film 10 and the upper film 17 are made of a polyimide material which is a nonconductor.
상기 제5단계에서는 상기 에칭마스크부재(30)가 비아홀(13)이 형성되는 부분에 대응하는 제5적층체(24) 상면에 적층되는 것이다. In the fifth step, the etching mask member 30 is laminated on the upper surface of the fifth stacked structure 24 corresponding to the portion where the via hole 13 is formed.
다시 말해서, 연성회로기판은 고정된 비굴곡부와 굴곡성와 유연성을 갖는 굴곡부로 나뉘어질 수 있는데, 상기 비굴곡부(A)는 비아홀(13)이 형성되며, 고정되어 움직이지 않는 부분으로, 상기 제5단계에서의 에칭마스크부재(30)는 설계시 연성회로기판이 굴곡되지 않는 비굴곡부(A)에 대응하는 위치에 적층되는 것이 바람직하다.In other words, the flexible circuit board may be divided into a fixed non-flexion portion and a bending portion having flexibility and flexibility. The non-flexion portion A is a portion in which a via hole 13 is formed and is fixed and does not move. The etching mask member 30 is preferably laminated at a position corresponding to the non-bending portion A in which the flexible circuit board is not bent in design.
이와 같이 형성된 연성회로기판의 비굴곡부(B)은 고정되어 움직이지 않는 부분으로, 비아홀(13)이 형성되어 무전해 동도금(14) 및 전해 도금(15)이 필요한 부분이다. 다시말해서, 상기 비아홀(13)은 비굴곡부(A) 부분에만 형성되는 것이며, 상기 비굴곡부(A) 이외의 부분, 즉 굴곡부에는 무전해 동도금(15) 및 전해 도금(15)의 도금층이 형성되지 않는다.The non-bending portion B of the flexible printed circuit board formed as described above is a fixed and non-moving portion, and a via hole 13 is formed to be a portion requiring electroless copper plating 14 and electroplating 15. In other words, the via hole 13 is formed only in the non-bending portion A, and the plating layer of the electroless copper plating 15 and the electrolytic plating 15 is not formed in a portion other than the non-bending portion A, that is, the bending portion. Do not.
따라서, 상기 비아홀(13)에는 그의 도통을 위하여 무전해 동도금(14) 및 전해 도금(15)이 반드시 필요하기 때문에 필요한 부분만 도금층이 형성되도록 하고, 필요하지 않은 부분은 부분 에칭하여 도금층을 제거시킴으로써 원자재가 갖는 굴곡성과 유연성을 갖게 된다.Therefore, since the electroless copper plating 14 and the electrolytic plating 15 are absolutely necessary for the conduction of the via hole 13, only a necessary portion is formed, and the unnecessary portion is partially etched to remove the plating layer. It has flexibility and flexibility of raw materials.
이와 같은 연성회로기판 제조방법은 층 수가 많아질수록 현격한 효과를 구현할 수 있으며. 도금층을 구비하면서도 굴곡성을 좋게 하는 값비싼 자재를 필요로 하지 않는다.Such a flexible circuit board manufacturing method can realize a dramatic effect as the number of layers increases. There is no need for an expensive material having a plated layer and good flexibility.
또한, 도금층을 필요로 하지 않는 부분들에 대한 부분에칭공정이 부가됨으로써 비교적 협소한 공간에서도 정밀한 회로형성을 구현할 수 있게 된다.In addition, by adding a partial etching process to the portions that do not require a plating layer, it is possible to realize precise circuit formation even in a relatively narrow space.
이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하다는 것이 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible in the art without departing from the technical spirit of the present invention. It will be clear to those of ordinary knowledge.
상기한 바와 같은 본 발명에 따르면, 비아홀이 형성되는 도금층 이외의 부분에 대응하여 부분에칭공정을 통해 도금층을 형성시키지 않음으로써 원자재 그대로의 굴곡성 및 유연성을 향상시키는 효과가 있다.According to the present invention as described above, there is an effect of improving the flexibility and flexibility of the raw material as it does not form the plated layer through the partial etching process corresponding to the portion other than the plated layer in which the via hole is formed.
또한, 본 발명은 불필요한 부분에 도금층을 형성하지 않아 굴곡성을 향상시킬 수 있어, 기존의 도금층을 형성하면서 굴곡성을 유지시킬 수 있는 값비싼 자재를 사용할 필요가 없어 자재 비용을 절감시키는 효과가 있다.In addition, the present invention can improve the flexibility by not forming a plating layer on the unnecessary portion, there is no need to use expensive materials that can maintain the flexibility while forming the existing plating layer has the effect of reducing the material cost.
또한, 본 발명은 별도의 특정설비 및 공정형태를 필요로 하지 않기 때문에 동일 성능의 제품을 저비용으로 제조할 수 있는 효과가 있다.In addition, the present invention does not require a separate specific equipment and process form, there is an effect that can be produced at low cost of the same performance products.
또한, 본 발명은 연성인쇄회로기판의 제조공정에서 부분에칭공정이 부가됨으로써 비교적 협소한 공간에서도 정밀한 패턴을 구현할 수 있는 효과가 있다.In addition, the present invention has the effect of implementing a precise pattern even in a relatively narrow space by adding a partial etching process in the manufacturing process of the flexible printed circuit board.
도1은 종래 기술에 따른 연성인쇄회로기판의 제조방법에 의하여 구성된 연성인쇄회로기판을 도시한 구성도. 1 is a block diagram showing a flexible printed circuit board constructed by a method of manufacturing a flexible printed circuit board according to the prior art.
도2는 본 발명에 따른 연성인쇄회로기판의 제조방법에 따른 공정을 순서대로 도시한 공정도.2 is a process diagram sequentially showing a process according to a method of manufacturing a flexible printed circuit board according to the present invention.
도3은 본 발명에 따른 연성인쇄회로기판의 제조방법에 의하여 제조된 연성인쇄회로기판을 도시한 구성도.Figure 3 is a block diagram showing a flexible printed circuit board manufactured by a method for manufacturing a flexible printed circuit board according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10: 베이스 필름 11, 16: 접착제10: base film 11, 16: adhesive
12: 동박 13: 비아홀12: copper foil 13: via hole
14: 무전해 동도금 15: 전해 도금14: electroless copper plating 15: electrolytic plating
17: 상부 필름 20: 제1적층체17: upper film 20: first laminate
21: 제2적층체 23: 제3적층체21: second laminate 23: third laminate
24: 제3적층체 25: 제4적층체24: third stacked body 25: fourth stacked body
26: 제5적층체 30: 에칭마스크부재26: fifth laminated body 30: etching mask member
A: 비굴곡부A: non-bending portion
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030055427A KR20050017905A (en) | 2003-08-11 | 2003-08-11 | Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Circuit Board manufactured by the method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030055427A KR20050017905A (en) | 2003-08-11 | 2003-08-11 | Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Circuit Board manufactured by the method thereof |
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| Publication Number | Publication Date |
|---|---|
| KR20050017905A true KR20050017905A (en) | 2005-02-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030055427A KR20050017905A (en) | 2003-08-11 | 2003-08-11 | Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Circuit Board manufactured by the method thereof |
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| KR (1) | KR20050017905A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101018554B1 (en) * | 2009-05-15 | 2011-03-03 | (주)디지털초음파 | Method for manufacturing spiral coil and spiral coil thereof and EMAT thereof |
| KR20140123433A (en) | 2013-04-12 | 2014-10-22 | 주식회사 아모그린텍 | Method for manufacturing flexible printed circuit board, and flexible printed circuit board manufactured by the method |
| KR20140130368A (en) | 2013-04-30 | 2014-11-10 | 주식회사 아모그린텍 | Flexible printed circuit board and Manufacturing method Thereof |
| KR20160046774A (en) | 2013-11-14 | 2016-04-29 | 주식회사 아모그린텍 | Flexible circuit board and manufacturing method thereof |
| US9648753B2 (en) | 2012-12-31 | 2017-05-09 | Amogreentech Co., Ltd. | Flexible printed circuit board and method for manufacturing same |
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2003
- 2003-08-11 KR KR1020030055427A patent/KR20050017905A/en not_active Application Discontinuation
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101018554B1 (en) * | 2009-05-15 | 2011-03-03 | (주)디지털초음파 | Method for manufacturing spiral coil and spiral coil thereof and EMAT thereof |
| US9648753B2 (en) | 2012-12-31 | 2017-05-09 | Amogreentech Co., Ltd. | Flexible printed circuit board and method for manufacturing same |
| KR20140123433A (en) | 2013-04-12 | 2014-10-22 | 주식회사 아모그린텍 | Method for manufacturing flexible printed circuit board, and flexible printed circuit board manufactured by the method |
| KR20160011682A (en) | 2013-04-12 | 2016-02-01 | 주식회사 아모그린텍 | Method for manufacturing flexible printed circuit board, and flexible printed circuit board manufactured by the method |
| US10512175B2 (en) | 2013-04-12 | 2019-12-17 | Amogreentech Co., Ltd. | Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured thereby |
| KR20140130368A (en) | 2013-04-30 | 2014-11-10 | 주식회사 아모그린텍 | Flexible printed circuit board and Manufacturing method Thereof |
| KR20140130369A (en) | 2013-04-30 | 2014-11-10 | 주식회사 아모그린텍 | Flexible printed circuit board and Manufacturing method Thereof |
| KR20160119730A (en) | 2013-04-30 | 2016-10-14 | 주식회사 아모그린텍 | Flexible printed circuit board and Manufacturing method Thereof |
| KR20160119731A (en) | 2013-04-30 | 2016-10-14 | 주식회사 아모그린텍 | Flexible printed circuit board and Manufacturing method Thereof |
| US9949379B2 (en) | 2013-04-30 | 2018-04-17 | Amogreentech Co., Ltd. | Flexible printed circuit board and method for manufacturing same |
| KR20160046774A (en) | 2013-11-14 | 2016-04-29 | 주식회사 아모그린텍 | Flexible circuit board and manufacturing method thereof |
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