KR20040052549A - A assembly type of ondol heat system which insided heat pipe - Google Patents

A assembly type of ondol heat system which insided heat pipe Download PDF

Info

Publication number
KR20040052549A
KR20040052549A KR1020040019845A KR20040019845A KR20040052549A KR 20040052549 A KR20040052549 A KR 20040052549A KR 1020040019845 A KR1020040019845 A KR 1020040019845A KR 20040019845 A KR20040019845 A KR 20040019845A KR 20040052549 A KR20040052549 A KR 20040052549A
Authority
KR
South Korea
Prior art keywords
heat
heat pipe
plate member
heating device
solid filler
Prior art date
Application number
KR1020040019845A
Other languages
Korean (ko)
Inventor
박명숙
Original Assignee
피앤비월드주식회사
박명숙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 피앤비월드주식회사, 박명숙 filed Critical 피앤비월드주식회사
Priority to KR1020040019845A priority Critical patent/KR20040052549A/en
Publication of KR20040052549A publication Critical patent/KR20040052549A/en

Links

Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/18Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • E04F15/181Insulating layers integrally formed with the flooring or the flooring elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00Hot-water central heating systems
    • F24D3/12Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/141Tube mountings specially adapted therefor
    • F24D3/142Tube mountings specially adapted therefor integrated in prefab construction elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2220/00Components of central heating installations excluding heat sources
    • F24D2220/07Heat pipes

Abstract

PURPOSE: A set heating device incorporating a heat pipe is provided to form a heat pipe in the set-up state for simplifying the mounting work of heat pipes while keeping the thermal response of the heat pipes, thereby minimizing the heat loss. CONSTITUTION: A set heating device incorporating a heat pipe includes a plurality of supporting blocks(200) to be mounted on a floor with a predetermined interval, and plate elements secured between the supporting blocks to be coupled together. Solid fillers are filled in the plate elements, wherein heat pipe(101) are provided in the center. A heat diffusion plate closely contacts and is coupled with top ends of the fillers. The heat diffusion plate and the plate elements are simultaneously coupled with the supporting blocks by screws(203).

Description

히트파이프를 내장한 조립식 난방장치{ A assembly type of ondol heat system which insided heat pipe}Prefabricated heating device with heat pipe {A assembly type of ondol heat system which insided heat pipe}

본 발명은 히트파이프를 내장한 조립식 난방장치에 관한 것으로, 특히 우수한 열적응답성을 지니면서도 설치가 용이한 히트파이프를 내장한 조립식 난방장치에 관한 것이다.The present invention relates to a prefabricated heating device with a built-in heat pipe, and more particularly, to a prefabricated heating device with a built-in heat pipe with excellent heat response.

종래의 바닥 난방에는 엑셀관이나 히트파이프를 매설하고, 모르타르나 시멘트로 마감을 하거나, 전기패널을 설치하는 방법이 있었다. 그중에서도 히트파이프를 이용하여 난방을 하는 방법은 히트파이프의 열적응답성이 뛰어나 관수량과 난방비를 절감하는 효과가 있어 1990년대초 부터 바닥난방에 적용해보려는 시도가 진행되었다. 히트파이프는 충전되는 작동유체의 증발과 응축을 통해 발생하는 잠열의 형태로 열을 수송하는 전열 장치이다.In conventional floor heating, there was a method of embedding an Excel tube or a heat pipe, finishing with mortar or cement, or installing an electric panel. Among them, the heating method using the heat pipe is excellent in thermal response of the heat pipe, which reduces the irrigation amount and the heating cost. Therefore, an attempt has been made to apply it to floor heating since the early 1990s. Heat pipes are heat transfer devices that transfer heat in the form of latent heat generated through evaporation and condensation of the working fluid being charged.

히트파이프를 이용한 바닥난방에 대한 연구는 아직도 부족하며, 대개 써머사이폰식 히트파이프를 이용하여 바닥에 경사를 주어 설치가 어려운 단점이 있다.Research on floor heating using heat pipes is still insufficient, and it is difficult to install due to the slope of the floor using a thermosiphon type heat pipe.

또한 종래의 바닥난방의 설치시 시멘트등의 양성기간으로 시공기간이 길고, 바닥전체의 중량이 무거워지며, 불필요한 곳에 열에너지가 방출되어 난방비가 상승하는 결점이 있다.In addition, there is a drawback that the construction period is long due to the positive period of cement, etc. in the installation of conventional floor heating, the weight of the entire floor is heavy, and heat energy is released where it is unnecessary, thereby increasing the heating cost.

본 발명은 상기와 같은 종래의 히트파이프를 이용한 바닥난방시스템이 갖는 단점을 해결하기 위해 안출된 것으로, 히트파이프를 조립형으로 형성하여 설치를 용이하게 하되 히트파이프의 우수한 열적응답성을 그대로 살릴 수 있으면서도 바닥난방에 있어서 필연적을 발생할 수 밖에 없는 열손실을 최소화할 수 있는 히트파이프를 내장한 조립식 난방장치를 제공하기 위한 것이다.The present invention was devised to solve the disadvantages of the conventional floor heating system using a heat pipe as described above, it is possible to facilitate the installation by forming the heat pipe as an assembly type, but can maintain the excellent thermal response of the heat pipe as it is It is to provide a prefabricated heating device with a heat pipe which can minimize heat loss which is inevitable in floor heating.

제 1 도 - 본 발명의 바람직한 응용을 나타내는 사시도1 is a perspective view showing a preferred application of the present invention

제 2 도 - 본 발명의 주요 특징인 손쉬운 분해조립을 나타내는 사시도2 is a perspective view showing easy disassembly and assembly as the main features of the present invention.

제 3 도 - 본 발명의 판부재의 분해사시도3 is an exploded perspective view of the plate member of the present invention

제 4 도 - 본 발명의 구조용 블럭의 구조를 나타내는 분해사시도4 is an exploded perspective view showing the structure of the structural block of the present invention.

제 5 도 - 본 발명의 구조를 나타내는 A-A' 단면도5-A-A 'cross-sectional view showing the structure of the present invention

제 6 도 - 본 발명의 특징인 판부재과 지지블럭의 연속적인 배치를 나타내는 단면도6 is a cross-sectional view showing the continuous arrangement of the plate member and the supporting block which is a feature of the present invention.

* 도면의 주요한 부분에 대한 설명* Description of the main parts of the drawing

100 : 난방 블럭(block) 101 : 히트파이프(heat pipe)100: heating block 101: heat pipe

102 : 고체충전재 103 : 구조재102: solid filler 103: structural material

104 : 판부재 105 :상판104: plate member 105: top plate

106 : 열확산판 107 : 다공층106: thermal diffusion plate 107: porous layer

108 : 나사구멍 109 : 단열재108: screw hole 109: heat insulating material

200 : 지지블럭 201 : 다공층200: support block 201: porous layer

202 : 경사면 203 : 나사202: inclined surface 203: screw

204 : 나사구멍 205 : 캡204: screw hole 205: cap

이하, 본 발명을 첨부한 도면에 의해 상세히 설명하면 다음과 같다.Hereinafter, described in detail by the accompanying drawings of the present invention.

도 2는 본 발명 히트파이프를 내장한 조립식 난방장치는 바닥에 얹히도록 일정간격 이격되도록 설치되어지는 다수개의 지지블럭(200)과, 상기 지지블럭(200)의 사이사이에 얹혀져 결합되는 판부재(104)와, 상기 판부재(104) 안에 충진되어지며 히트파이프(101)를 중간부에 구비하는 고체충진재(102)와, 상기 고체충진재(102)의 상단에 밀착되도록 결합되는 열확산판(106)과, 상기 열확산판(106)과 판부재(104)가 나사(203)에 의해 지지블럭(200)에 동시에 결합되도록 구성되어진다.Figure 2 is a prefabricated heating device incorporating the heat pipe of the present invention is a plurality of support blocks 200 are installed so as to be spaced apart from each other so as to be placed on the floor, the plate member is mounted between the support blocks 200 ( 104, a solid filler 102 filled in the plate member 104 and having a heat pipe 101 in an intermediate portion thereof, and a thermal diffusion plate 106 coupled to be in close contact with an upper end of the solid filler 102. And, the thermal diffusion plate 106 and the plate member 104 is configured to be coupled to the support block 200 by the screw 203 at the same time.

상기 판부재(104)와 고체충진재(102) 사이에는 단열재(109)가 개재(介在)되어질 수 있으며, 상기 단열재는 고체충진재(102)의 중간부에 길이방향으로 내삽되어 보일러나 전기히터로 부터 온수나 증기, 전열과 같은 열에너지를 공급받아 고체충진재(102)를 가열하게 되는 히트파이프(101)의 열이 고체충진재(102)의 아랫방향으로는 손실되지 않고, 최대한 윗쪽으로 발산될 수 있도록 하기 위해 필요한 구성이다.An insulating material 109 may be interposed between the plate member 104 and the solid filler 102, and the insulating material is interpolated in the middle of the solid filler 102 in a longitudinal direction from a boiler or an electric heater. The heat of the heat pipe 101 which heats the solid filler 102 by receiving thermal energy such as hot water, steam, or heat transfer is not lost in the downward direction of the solid filler 102 and is diverted upward as much as possible. This is necessary configuration.

이때 열을 보다 효율적으로 윗쪽으로만 발산할 수 있도록 하고, 조립을 용이하게 하기 위하여 상기 판부재(104)와 고체충진재(102)의 단면형상이 역삼각형, 즉 "V"자 형상을 이루도록 하였으며, 상기 상기 판부재(104)를 지지하는 지지블럭(200)의 재질 또한 단열성이 좋은 플라스틱재질을 사용하였다. 물론 상기 맞닿는 지지블럭(200)의 양측면도 상기 판부재(104)의 경사와 동일한 경사를 유지하도록 하였으며, 상기 판부재(104)의 하단에는 판부재(104)의 지지력을 보강하기 위한 아랫방향으로 돌출된 받침부재를 형성할 수도 있으며, 상기 받침부재에는 단열성과 소음방지, 재료의 절약을 위해서 다수의 다공층(107)이 형성되도록 하였다. 물론 상기 지지블럭(200)에도 단열성과 소음방지, 재료의 절약을 위해서 다수의 다공층(201)이 형성되도록 구성할 수도 있다.At this time, the cross-sectional shape of the plate member 104 and the solid filler 102 is formed in an inverted triangle, that is, a "V" shape in order to more efficiently dissipate heat upward and to facilitate assembly. The material of the support block 200 supporting the plate member 104 is also made of a plastic material having good thermal insulation. Of course, both sides of the abutting support block 200 are also maintained to be inclined with the inclination of the plate member 104, the lower end of the plate member 104 in the downward direction for reinforcing the support force of the plate member 104 A protruding support member may be formed, and the support member has a plurality of porous layers 107 formed for thermal insulation, noise prevention, and material saving. Of course, the support block 200 may also be configured such that a plurality of porous layers 201 are formed for thermal insulation, noise prevention, and material saving.

상기 판부재(104)의 측면에는 고체충진재(102)의 충진시 흘러내리는 것을 방지하기 위한 차단판이 형성되어지며, 상기 차단판의 구멍을 뚫어 히트파이프(101)의 끝 부분을 밖으로 돌출시키게 된다.A blocking plate is formed on the side of the plate member 104 to prevent the solid filler 102 from flowing down when the solid filler 102 is filled, and protrudes the end of the heat pipe 101 by drilling a hole in the blocking plate.

또한 상기 지지블럭(200)의 양측단부는 캡(205)을 씌워 열의 손실 방지와 보다 좋은 미관을 유지하도록 하였다.In addition, both ends of the support block 200 is covered with a cap 205 to prevent heat loss and maintain a better aesthetics.

상기 열확산판(106)은 고체충진재(102)에 전달되는 히트파이프(101)의 열을 보다 신속하게 바닥에 고루 전달될 수 있도록 하기 위한 구성으로, 열전도성이 좋은 구리판이나 알루미늄판을 사용함이 바람직하고, 고체충진재(102)의 재질로는 열보존력이 좋고 원적외선을 발산할 수 있는 황토나 맥반석, 자갈, 모래 등을 사용함이 바람직하다.The thermal diffusion plate 106 is configured to allow the heat of the heat pipe 101 transferred to the solid filler 102 to be more evenly transferred to the bottom more preferably, using a copper plate or an aluminum plate having good thermal conductivity. In addition, as the material of the solid filler 102, it is preferable to use ocher or elvan, gravel, sand, etc., which have good heat preservation and emit far infrared rays.

이처럼 판부재(104)는 열확산판(106)과 함께 지지블럭(200)의 양측단부에 끼워져 결합되어지며, 나사(203)에 의해 지지블럭(200)에 고정되어진다.In this way, the plate member 104 is coupled to both ends of the support block 200 together with the thermal diffusion plate 106, and is fixed to the support block 200 by a screw 203.

이때 도 1은 본 발명을 연속으로 바닥에 설치하여 난방장치를 형성한 상태를 도시한 것이며, 도 2는 조립상태를 보이기 위한 것이다.At this time, Figure 1 shows a state in which the heating device is formed by continuously installing the present invention on the floor, Figure 2 is for showing the assembled state.

즉 도 2 에 도시한 바와 같이 판부재(104)와 지지블럭(200)의 단면형상은 서로 대응하도록 형성되어진 역삼각형 형상이므로 지지블럭(200)을 먼저 바닥에 설치하고, 이후 판부재(104)를 그 위에 올려놓기만 하면 중력에 의해 스스로 경사면을 따라 자동으로 맞추어지는 구조를 갖게되는 것이다.That is, as shown in FIG. 2, since the cross-sectional shapes of the plate member 104 and the support block 200 are inverted triangular shapes formed to correspond to each other, the support block 200 is first installed on the floor, and then the plate member 104 is formed. Just put it on it and you will have a structure that automatically adjusts itself along the slope by gravity.

이후 판부재(100)과 지지블럭(200)을 나사(203)로 고정만하면 단단한 바닥난방장치가 완성되는 것으로 매우 조립이 용이하게 되는 것이다.After the plate member 100 and the support block 200 is simply fixed by the screw 203, the solid floor heating device is completed, which is very easy to assemble.

본 발명의 효과로서 바닥난방장치의 시공이 간편하고 용이해지며, 아파트 등의 대형건축물을 시공할 때도 바닥난방설치후 콘크리트 양생기간등을 현저하게 줄일 수 있는 것이다. 또한 바닥난방장치의 중량을 현저히 감소시킬 수 있어 전체적으로 구조재 등의 절감효과를 가져올 수 있으며, 무엇보다 열의 전도성이 우수한히트파이프로 판부재 내부에 충진된 고체충진재만을 가열하고, 판부재 아래로 낭비되는 열을 사전에 차단할 수 있어 종래의 난방공법보다 훨씬 더 적은 양의 에너지로도 난방이 가능하게 되는 것이다.As an effect of the present invention, the construction of the floor heating device becomes simple and easy, and when the large buildings such as apartments are installed, the concrete curing period after the floor heating installation can be significantly reduced. In addition, the weight of the floor heating device can be significantly reduced, resulting in a reduction effect of the structural material as a whole. Above all, only the solid filler filled inside the plate member is heated with heat pipe having excellent thermal conductivity, and is wasted below the plate member. Heat can be blocked in advance, allowing heating with much less energy than conventional heating methods.

또한 역삼각형 구조의 판부재과 이와 대응되는 형태의 지지블럭에 의해 손쉽게 조립이 가능하므로 빠른 시간안에 바닥난방장치를 형성할 수 있으며, 기존의 시멘트 모르타르 대신 인체에 유익한 황토, 맥반석, 자갈, 모래 등과 같은 천연 성분으로 바닥재를 대신하므로 인체에 유익하게 된다.In addition, it can be easily assembled by the plate member of the inverted triangular structure and the support block of the corresponding type, so that it is possible to form the floor heating device in a short time. Natural ingredients replace flooring, which is beneficial to the human body.

또 판부재과 지지블럭의 내부에 형성된 다공층은 상면으로부터 오는 소음을 줄이는 차음재의 기능을 할 수도 있는 효과를 갖는다.In addition, the porous layer formed inside the plate member and the support block has an effect that may function as a sound insulating material to reduce the noise coming from the upper surface.

Claims (7)

조립식으로 바닥 난방을 형성하기 위한 장치에 있어서,In a device for prefabricated floor heating, 바닥에 얹히도록 일정간격 이격되도록 설치되어지는 다수개의 지지블럭(200)과, 상기 지지블럭(200)의 사이사이에 얹혀져 결합되는 판부재(104)와, 상기 판부재(104) 안에 충진되어지며 히트파이프(101)를 중간부에 구비하는 고체충진재(102)와, 상기 고체충진재(102)의 상단에 밀착되도록 결합되는 열확산판(106)과, 상기 열확산판(106)과 판부재(104)가 나사(203)에 의해 지지블럭(200)에 동시에 결합되도록 구성되어짐을 특징으로 하는 히트파이프를 내장한 조립식 난방장치.Filled in the plate member 104 and the plate member 104, which is mounted between the plurality of support blocks 200 are installed to be spaced apart from the predetermined intervals so as to be placed on the floor, and coupled between the support blocks 200; A solid filler 102 having a heat pipe 101 in an intermediate portion thereof, a thermal diffusion plate 106 coupled to closely contact an upper end of the solid filler 102, the thermal diffusion plate 106 and the plate member 104. Prefabricated heating device with a built-in heat pipe, characterized in that is configured to be coupled to the support block 200 by a screw (203) at the same time. 제 1항에 있어서 상기 판부재(104)와 고체충진재(102) 사이에는 단열재(109)가 개재되도록 구성되어짐을 특징으로 하는 히트파이프를 내장한 조립식 난방장치.The prefabricated heating device with a built-in heat pipe according to claim 1, wherein a heat insulating material (109) is interposed between the plate member (104) and the solid filler material (102). 제 1항에 있어서 상기 판부재(104)의 하단에는 판부재(104)의 지지력을 보강하기 위한 아랫방향으로 돌출된 받침부재를 형성되도록 하고, 단면형상이 역삼각형 형상을 가지도록 구성되어짐을 특징으로 하는 히트파이프를 내장한 조립식 난방장치.According to claim 1, wherein the lower end of the plate member 104 to form a support member protruding downward to reinforce the holding force of the plate member 104, characterized in that the cross-sectional shape is configured to have an inverted triangle shape Prefabricated heating device with built-in heat pipe. 제 1항에 있어서 상기 판부재(104)와 지지블럭(200)의 재질은 플라스틱으로 이루어짐을 특징으로 하는 히트파이프를 내장한 조립식 난방장치.2. The prefabricated heating apparatus with heat pipes according to claim 1, wherein the plate member (104) and the support block (200) are made of plastic. 제 1항에 있어서 상기 지지블럭(200)에는 다수의 다공층(107)이 형성되도록 구성되어짐을 특징으로 하는 히트파이프를 내장한 조립식 난방장치.The prefabricated heating apparatus with heat pipes according to claim 1, wherein the support block (200) is configured such that a plurality of porous layers (107) are formed. 제 1항에 있어서 상기 지지블럭(200)의 양단부는 캡(205)이 씌워지도록 구성되어짐을 특징으로 하는 히트파이프를 내장한 조립식 난방장치.2. The prefabricated heating apparatus with heat pipes according to claim 1, wherein both ends of the support block (200) are configured to cover the cap (205). 제 1항에 있어서 상기 고체충진재(102)의 재질로는 황토, 맥반석, 자갈, 모래 중 어느 하나를 선택하여서 구성되어짐을 특징으로 하는 히트파이프를 내장한 조립식 난방장치.The method of claim 1, wherein the solid filler material 102 is a prefabricated heating device with a built-in heat pipe, characterized in that configured by selecting any one of ocher, elvan, gravel, sand.
KR1020040019845A 2004-03-24 2004-03-24 A assembly type of ondol heat system which insided heat pipe KR20040052549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020040019845A KR20040052549A (en) 2004-03-24 2004-03-24 A assembly type of ondol heat system which insided heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040019845A KR20040052549A (en) 2004-03-24 2004-03-24 A assembly type of ondol heat system which insided heat pipe

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR20-2004-0008080U Division KR200353343Y1 (en) 2004-03-24 2004-03-24 A assembly type of ondol heat system which insided heat pipe

Publications (1)

Publication Number Publication Date
KR20040052549A true KR20040052549A (en) 2004-06-23

Family

ID=37346136

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040019845A KR20040052549A (en) 2004-03-24 2004-03-24 A assembly type of ondol heat system which insided heat pipe

Country Status (1)

Country Link
KR (1) KR20040052549A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100615899B1 (en) * 2004-10-22 2006-08-29 피앤비월드주식회사 A assembly type of ondol heat system which insided heating means
KR100725819B1 (en) * 2006-01-19 2007-06-08 박명숙 A heating hinoki bed with heatpipes and infra materials
KR100835231B1 (en) * 2005-09-12 2008-06-05 주식회사 엘지화학 Heat insulator and floor heating system using the same
KR20190050084A (en) * 2017-11-02 2019-05-10 이현구 A buffer floor structure including heat tubes and the construction method using the device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100615899B1 (en) * 2004-10-22 2006-08-29 피앤비월드주식회사 A assembly type of ondol heat system which insided heating means
KR100835231B1 (en) * 2005-09-12 2008-06-05 주식회사 엘지화학 Heat insulator and floor heating system using the same
KR100725819B1 (en) * 2006-01-19 2007-06-08 박명숙 A heating hinoki bed with heatpipes and infra materials
KR20190050084A (en) * 2017-11-02 2019-05-10 이현구 A buffer floor structure including heat tubes and the construction method using the device

Similar Documents

Publication Publication Date Title
US20100198414A1 (en) Systems and methods for controlling interior climates
KR100632177B1 (en) Dry floor heating construction method using heat radiation member with heat pipe
AU2008269938A1 (en) Structural wall panels and methods and systems for controlling interior climates
US4607791A (en) Hydronic room heating device
WO2011033324A1 (en) Thermo-frame element, and heat-radiating, radiant heat absorbing, air-heating and air-recooling bordering surfaces formed with this thermo-frame element
KR20040052549A (en) A assembly type of ondol heat system which insided heat pipe
KR101858332B1 (en) Assembled Hot-Water Panel Apparatus
KR100727321B1 (en) Prefabrication type floor heating system and the construction method thereof
KR200353343Y1 (en) A assembly type of ondol heat system which insided heat pipe
KR101708442B1 (en) Hot water heating panel
JP2007163116A (en) Hot water mat for hot water floor heating system and construction method of hot water floor heating system using the hot water mat
CN205560931U (en) Warm up floor
KR20210012106A (en) Floor heating board for heating purposes
KR20050061434A (en) The unit of heat pipe with two line system
KR200394430Y1 (en) A panel assembly for heating
KR100615899B1 (en) A assembly type of ondol heat system which insided heating means
CN207363200U (en) A kind of novel rapid-installation formula floor heater template
KR200317943Y1 (en) regenerative heating system using hot water
CN213015153U (en) Modularized heat-preservation toilet chassis
CN104964330A (en) Novel dry type ground heating system
KR100916083B1 (en) Triple ondol heating structure
CN217759772U (en) Floor heating system
RU2191328C1 (en) Solar heating panel for buildings
KR200165359Y1 (en) A panel for the under-floor heating system
KR200284807Y1 (en) Adiabatic Board for Arrangement of Heating Pipe

Legal Events

Date Code Title Description
A108 Dual application of patent
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application