KR20040009164A - Method and apparatus for connection of electric element - Google Patents

Method and apparatus for connection of electric element Download PDF

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Publication number
KR20040009164A
KR20040009164A KR1020020043007A KR20020043007A KR20040009164A KR 20040009164 A KR20040009164 A KR 20040009164A KR 1020020043007 A KR1020020043007 A KR 1020020043007A KR 20020043007 A KR20020043007 A KR 20020043007A KR 20040009164 A KR20040009164 A KR 20040009164A
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South Korea
Prior art keywords
lead wires
sleeve
connection
sleeve member
lead wire
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KR1020020043007A
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Korean (ko)
Inventor
김완호
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(주) 청송상공
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Priority to KR1020020043007A priority Critical patent/KR20040009164A/en
Publication of KR20040009164A publication Critical patent/KR20040009164A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: A method and an apparatus are provided to achieve improved soldering strength and reduce defects by mounting a sleeve on the connection portion between the lead wire of PCB and resistant lead wire and soldering the lead wires and sleeve. CONSTITUTION: A method comprises a step of superimposing lead wires(12,31) of electrical devices; a step of permitting the superimposed lead wires to be surrounded with a sleeve member(100); a step of connecting electrical devices and lead wires in the sleeve member and filling the sleeve member with the connection material for fixing the electrical devices and lead wires; and a step of melting the connection material filled in the sleeve member and connecting the lead wires and the sleeve.

Description

전기 소자의 접속 방법 및 장치 {METHOD AND APPARATUS FOR CONNECTION OF ELECTRIC ELEMENT}METHOD AND APPARATUS FOR CONNECTION OF ELECTRIC ELEMENT}

본 발명은 전기소자의 납땜 방법에 관한 것으로, 특히 PCB기판의 리드와 저항 리드간의 연결부분에 슬리브(sleeve)를 장착하고, 그 내부를 납땜을 함으로써 납땜 강도를 향상시키고 납땜의 품질을 양호하게 하는 전기소자 접속방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method of an electric element, and more particularly, by installing a sleeve at a connection portion between a lead and a resistance lead of a PCB substrate and soldering the inside thereof to improve soldering strength and improve soldering quality. It relates to a method of connecting electrical devices.

일반적으로, 두 전기소자를 연결하기 위한 방법으로 각 소자에서 돌출된 리드선을 서로 납땜하여 접속한다.In general, the lead wires protruding from each device are soldered together to connect the two electric devices.

도1은 LED 칩을 사용하는 발광전구를 도시한 것으로서, 표면에 LED 칩(11)을 구비하고, 하부에 제1 및 제2리드선(12, 13)을 구비하는 인쇄회로기판(10); 상기 인쇄회로기판(10)을 수용하며, 상기 인쇄회로기판(10)의 전기적 연결이 이루어지는 케이스(20); 상기 제1리드선(12)과 연결되는 저항(30); 및 상기 케이스(20)의 하부에 연결되어 상기 저항을 수용하며, 외부와 전기적 연결을 이루는 베이스(40)로 이루어진다.1 shows a light emitting bulb using an LED chip, comprising a printed circuit board 10 having an LED chip 11 on its surface and first and second lead wires 12 and 13 below; A case 20 accommodating the printed circuit board 10 and configured to electrically connect the printed circuit board 10; A resistor 30 connected to the first lead wire 12; And a base 40 connected to the lower part of the case 20 to receive the resistance and making an electrical connection with the outside.

상기 제1리드선(12)은 상기 저항(30)의 일단에서 연장된 제3리드선(31)과 연결되고, 상기 저항(30)의 타 단부에서 연장된 제4리드선(32)은 상기 베이스(40) 하측의 제1단자부(42)와 연결되며, 상기 제2리드선(13)은 상기 베이스(40)의 측면의 제2단자부(41)와 연결된다.The first lead wire 12 is connected to a third lead wire 31 extending from one end of the resistor 30, and the fourth lead wire 32 extending from the other end of the resistor 30 is connected to the base 40. The first terminal portion 42 of the lower side is connected, and the second lead wire 13 is connected to the second terminal portion 41 of the side surface of the base 40.

상기 저항(30)과 제1리드선(12)은 도2에 도시된 바와 같이, 납땜(50)으로 연결되어 케이스(20)내에 수용된다.As shown in FIG. 2, the resistor 30 and the first lead wire 12 are connected to the solder 50 and accommodated in the case 20.

상기와 같이 리드선을 갖는 두 전기소자를 납땜으로 접속하는 경우 도3에 도시된 바와 같이, 납땜(50)주위의 연결부가 휘어져 접촉불량이 되거나 절단될 수 있는 문제점이 있었다.As described above, when the two electrical elements having the lead wires are connected by soldering, as shown in FIG. 3, the connection portion around the solder 50 may be bent, resulting in poor contact or cutting.

따라서, 본 발명은 상기의 제반 문제점을 해결하기 위하여 안출된 것으로서, 두 전기소자를 접속하는 방법에 있어서, 별도로 구비된 슬리브 내에 PCB기판의 리드와 저항 리드를 중첩시켜 삽입하고, 상기 슬리브 내부를 납땜하여, 접속부의 지지강도를 향상시키고, 접촉불량율을 감소시킬 수 있는 전기소자 접속방법을 제공하는데 그 목적이 있다.Accordingly, the present invention has been made to solve the above problems, in the method of connecting the two electrical elements, the lead and the resistance lead of the PCB substrate is superimposed and inserted into the sleeve provided separately, and the inside of the sleeve is soldered Accordingly, an object of the present invention is to provide an electric element connecting method capable of improving the supporting strength of the connecting portion and reducing the contact failure rate.

도1은 일반적인 LED 발광회로 구성을 도시한 분해사시도.1 is an exploded perspective view showing a general LED light emitting circuit configuration.

도2는 종래기술에 의한 도1의 LED칩 리드선과 저항 리드선의 접속상태를 도시한 사시도.FIG. 2 is a perspective view showing a connection state of the LED chip lead wire and the resistance lead wire of FIG. 1 according to the prior art; FIG.

도3은 도2의 리드선들의 접속상태를 도시한 정면도.FIG. 3 is a front view showing a connection state of the lead wires of FIG. 2; FIG.

도4는 본 발명에 의한 두 전기소자에서 연장된 리드선의 접속상태를 도시한 정면도.4 is a front view showing a connection state of lead wires extended in two electric elements according to the present invention;

도5는 본 발명에 의한 전기소자의 접속상태를 도시한 사시도.5 is a perspective view showing a connection state of the electric element according to the present invention;

* 도면의 주요부분에 관한 설명* Description of the main parts of the drawings

10 : 인쇄회로기판11 : LED 칩10: printed circuit board 11: LED chip

12 : 제1리드선13 : 제2리드선12: first lead wire 13: second lead wire

20 : 케이스30 : 저항20: case 30: resistance

31 : 제3리드선32 : 제4리드선31: third lead wire 32: fourth lead wire

상기와 같은 목적을 달성하기 위하여, 본 발명은, 복수개의 전기소자의 리드선을 중첩시키는 단계; 상기 중첩된 리드선들의 외부를 슬리브 부재로 둘러싸는 단계; 상기 슬리브 부재 내부에 전기소자와 리드선을 접속시켜 고정할 수 있는 접속물질을 충전시키는 단계; 및 상기 슬리브 부재 내에 위치된 상기 접속 물질을 녹여 상기 복수의 리드선 및 슬리브를 접속하는 단계를 포함하는 전기소자 접속방법을 제공한다.In order to achieve the above object, the present invention, the step of overlapping the lead wires of a plurality of electrical elements; Surrounding the outside of the overlapping leads with a sleeve member; Filling a connection material inside the sleeve member to connect and fix an electric element and a lead wire; And melting the connection material positioned in the sleeve member to connect the plurality of leads and the sleeve.

이하, 도1, 도4 및 도5를 참조하여, 본 발명에 의한 전기소자 접속방법을 설명한다.1, 4 and 5, an electric element connecting method according to the present invention will be described.

본 실시예에서는 LED 발광회로에서 저항과 LED 칩 단자핀과의 연결부를 납땜으로 연결하는 경우의 접속방법에 대하여 설명한다.In this embodiment, a connection method in the case of connecting the connection portion between the resistor and the LED chip terminal pin by soldering in the LED light emitting circuit will be described.

도1에 도시된 바와 같이, 본실시예의 LED 칩(11)과 연결된 인쇄회로기판(10)의 제1리드선(12)은 케이스(20)하부로 연장되어 저항(30)과 연결된다.As shown in FIG. 1, the first lead wire 12 of the printed circuit board 10 connected to the LED chip 11 of the present embodiment extends under the case 20 to be connected to the resistor 30.

도4에 도시된 바와 같이, 상기 제1리드선(12)은 저항(30) 일단부에서 연장된 제3리드선(31)과 연결되는데, 상기 제1리드선(12)과 제3리드선(31)의 접촉부는 외면이 원통형인 슬리브(sleeve)(100)로 둘러싸이며, 상기 슬리브(100)내부에서 납땜된다.As shown in FIG. 4, the first lead wire 12 is connected to a third lead wire 31 extending from one end of the resistor 30, and the first lead wire 12 and the third lead wire 31 are separated from each other. The contact is surrounded by a sleeve 100 having a cylindrical outer surface and soldered inside the sleeve 100.

상기 제1리드선(12)과 제3리드선(31)을 납땜하는 과정은 다음과 같다.The process of soldering the first lead wire 12 and the third lead wire 31 is as follows.

상기 제1리드선(12)과 제3리드선을 중첩시킨 후, 상기 중첩부를 원통형 슬리브(100)로 둘러싼다. 이후 땜납을 상기 슬리브(100)내부에 충전시키고, 녹여 상기 제1리드선(12)과 제3리드선(31) 및 슬리브(100)를 납땜한다.After overlapping the first lead wire 12 and the third lead wire, the overlapping portion is surrounded by the cylindrical sleeve 100. Thereafter, solder is filled into the sleeve 100 and melted to solder the first lead wire 12, the third lead wire 31, and the sleeve 100.

상기와 같이 납땜된 제1 및 제2리드선(12, 31)은 도5에 도시된 바와 같이, 납땜된 부분에서 슬리브(100)에 의해 지지되므로 곧은 상태로 유지되고, 상기 슬리브(100)는 납땜부를 보강하는 역할을 한다.The first and second lead wires 12 and 31 soldered as described above are held in a straight state because they are supported by the sleeve 100 in the soldered portion, as shown in FIG. 5, and the sleeve 100 is soldered. It serves to reinforce wealth.

상기에서 설명한 전기소자 납땜 방법은 LED 발광전구에만 한정되는 것이 아니라, 복수의 전기소자에서 연장된 리드선들을 납땜하는 경우에 적용될 수 있다.The electric element soldering method described above is not limited to LED light emitting bulbs, but may be applied to soldering lead wires extending from a plurality of electric elements.

이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하다는 것이 본 발명이 속하는 분야에서 통상의 지식을 가진 자에게 있어서 명백할 것이다.The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and it is common in the field of the present invention that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

전술한 바와 같이, 본 발명에 의하면, 복수의 전기소자들에서 연장된 리드선을 납땜으로 연결하는 경우, 슬리브에 의해 납땜 강도가 향상되고, 접촉 불량률이 감소되는 효과가 있다.As described above, according to the present invention, when connecting lead wires extended in a plurality of electric elements by soldering, the soldering strength is improved by the sleeve and the contact failure rate is reduced.

Claims (5)

복수개의 전기소자의 리드선을 중첩시키는 단계;Overlapping lead wires of the plurality of electric devices; 상기 중첩된 리드선들의 외부를 슬리브 부재로 둘러싸는 단계;Surrounding the outside of the overlapping leads with a sleeve member; 상기 슬리브 부재 내부에 전기소자와 리드선을 접속시켜 고정할 수 있는 접속물질을 충전시키는 단계; 및Filling a connection material inside the sleeve member to connect and fix an electric element and a lead wire; And 상기 슬리브 부재 내에 충전된 상기 접속 물질을 녹여 상기 복수의 리드선 및 슬리브를 접속하는 단계Melting the connection material filled in the sleeve member to connect the plurality of leads and the sleeve; 를 포함하는 전기소자 접속방법.Electrical device connection method comprising a. 제 1 항에 있어서,The method of claim 1, 상기 접속물질은 땜납으로 이루어지는The connecting material is made of solder 전기소자 접속방법.Electric element connection method. 제 1 항 또는 제 2 항의 방법으로 접속되는 전기소자.An electrical element connected by the method of claim 1 or 2. 복수개의 전기소자에서 연장되는 복수개의 리드선;A plurality of lead wires extending from the plurality of electrical elements; 상기 복수개의 리드선의 연결부 외면을 둘러싸는 슬리브 부재; 및A sleeve member surrounding outer surfaces of the connection portions of the plurality of lead wires; And 상기 슬리브 부재 내부에 충전되어 복수개의 리드선 간을 연결하는 접속물질A connecting material filled in the sleeve member to connect a plurality of lead wires 을 포함하는 전기소자 접속장치.Electrical device connection device comprising a. 제 4 항에 있어서The method of claim 4 상기 접속물질은 땜납으로 이루어진The connecting material is made of solder 전기소자 접속장치.Electrical device connection device.
KR1020020043007A 2002-07-22 2002-07-22 Method and apparatus for connection of electric element KR20040009164A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109794A (en) * 1987-10-22 1989-04-26 Alps Electric Co Ltd Terminal connection of electronic components
US4883925A (en) * 1988-05-02 1989-11-28 Graf Albert C Sealed solder connector assembly and method of use
KR900005940Y1 (en) * 1987-04-30 1990-06-30 삼성전자 주식회사 Fly back transformer
US5082453A (en) * 1991-05-16 1992-01-21 Siemens-Pacesetter, Inc. Multi-contact connector system for an implantable medical device
KR200289778Y1 (en) * 2002-07-03 2002-09-16 주식회사 연호전자 Connector for flexible cable

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900005940Y1 (en) * 1987-04-30 1990-06-30 삼성전자 주식회사 Fly back transformer
JPH01109794A (en) * 1987-10-22 1989-04-26 Alps Electric Co Ltd Terminal connection of electronic components
US4883925A (en) * 1988-05-02 1989-11-28 Graf Albert C Sealed solder connector assembly and method of use
US5082453A (en) * 1991-05-16 1992-01-21 Siemens-Pacesetter, Inc. Multi-contact connector system for an implantable medical device
KR200289778Y1 (en) * 2002-07-03 2002-09-16 주식회사 연호전자 Connector for flexible cable

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