KR200378444Y1 - Device for increasing the cooling efficiency of communication equipment - Google Patents
Device for increasing the cooling efficiency of communication equipment Download PDFInfo
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- KR200378444Y1 KR200378444Y1 KR20-1999-0005786U KR19990005786U KR200378444Y1 KR 200378444 Y1 KR200378444 Y1 KR 200378444Y1 KR 19990005786 U KR19990005786 U KR 19990005786U KR 200378444 Y1 KR200378444 Y1 KR 200378444Y1
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- air
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- heat sink
- heat
- rear cover
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
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- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
본 고안은 통신전자장비의 방열판에서 발산되는 폐열의 배출속도를 증대시킬 수 있도록 된 통신전자장비의 방열판 냉각효율 증대장치에 관한 것이다. 통신전자장비는 프론트커버, 리어커버 및 프론트커버와 리어커버의 상부에 결합되는 루프커버와, 내부공간을 냉각시키기 위한 열교환기 및 방열판과, 리어커버에 인접하여 구비되고 방열판으로부터 발산되는 폐열이 외부로 배출되도록 하기 위한 개구부를 포함한다. 루프커버의 내부에는 열교환기로부터 열교환된 고온의 공기가 유입되는 유입구와, 유입구를 통해 유입된 고온의 공기가 통과되는 유속증대관로와, 개구부에 인접하여 위치되고 유속증대관로를 통과한 고온의 공기가 외부로 배출되도록 하는 배출구를 가지는 다수의 공기흐름관로가 형성된다. 유속증대관로는 유입구와 배출구보다 폭이 작게 형성된다. 유속증대관로를 통과하는 과정에서 공기의 압력이 상승하게 되고, 고압의 공기가 유속증대관로보다 폭이 넓은 배출구를 통해 배출되면서 공기의 압력이 낮아져 공기의 흐름속도가 빨라지게 된다. 흐름속도가 빨라진 공기에 의해 리어커버의 상부에 상승기류가 생성되기 때문에 방열판으로부터 발산되어 리어커버와 루프커버 사이에 형성된 개구부를 통해서 외부로 배출되는 폐열이 상승기류에 의해 빠르게 방출될 수 있게 되므로, 리어커버의 내부에 있는 방열판의 냉각효율을 증대시킨다.The present invention relates to a heat sink cooling efficiency increasing device of the communication electronic equipment that can increase the discharge speed of the waste heat emitted from the heat sink of the communication electronic equipment. The communication electronic equipment includes a front cover, a rear cover, a roof cover coupled to the front cover and an upper part of the rear cover, a heat exchanger and a heat sink for cooling the internal space, a waste heat provided adjacent to the rear cover and radiated from the heat sink. And an opening for discharging to the furnace. The inside of the roof cover has an inlet through which hot air heat exchanged from the heat exchanger enters, a flow rate increasing passage through which the high temperature air introduced through the inlet passes, and high temperature air located adjacent to the opening and passing through the flow rate increasing passage. A plurality of air flow passages are formed having outlets for discharging them to the outside. The flow rate increasing pipe is smaller than the inlet and outlet. The pressure of the air increases in the process of passing through the flow rate increasing pipeline, and as the high pressure air is discharged through the wider outlet than the flow rate increasing pipeline, the air pressure is lowered to increase the flow rate of the air. Since rising air is generated in the upper part of the rear cover by the air having a faster flow rate, waste heat emitted from the heat sink and discharged to the outside through the opening formed between the rear cover and the roof cover can be quickly released by the rising air. Increase the cooling efficiency of the heat sink inside the rear cover.
Description
본 고안은 통신전자장비내의 각종 전장품을 냉각시키기 위한 냉각장치에 관한 것으로, 특히 통신전자장비의 방열판에서 발산되는 폐열의 배출속도를 증대시킬 수 있도록 된 통신전자장비의 방열판 냉각효율 증대장치에 관한 것이다.The present invention relates to a cooling device for cooling various electrical appliances in communication electronic equipment, and more particularly, to a heat sink cooling efficiency increasing device of communication electronic equipment that can increase the discharge rate of waste heat emitted from a heat sink of communication electronic equipment. .
일반적으로, 통신전자장비는 뼈대를 이루게 되는 사각형상의 함체에 기지국으로부터 전송된 각종 신호를 입력받을 수 있도록 하기 위한 회로기판 등과 같은 각종 전장품이 체계적으로 정리된 함체로서, 이러한 통신전자장비의 내부에 열교환기가 장착되어 있다.In general, a communication electronic device is a box in which various electronic devices such as a circuit board for receiving various signals transmitted from a base station are systematically arranged in a rectangular box that forms a skeleton, and heat exchanges inside the communication electronic device. The machine is mounted.
그리고, 통신전자장비의 전후면에 외부로부터 침투되는 이물질을 차단하기 위한 각각의 프론트커버(front cover)와 리어커버(rear cover)가 장착되고, 내부에 각종 전장품으로부터 발산되는 열을 방열하기 위한 방열판과 열교환기가 설치된다.In addition, each front cover and rear cover are mounted on the front and rear surfaces of the communication electronic equipment to block foreign substances from penetrating from the outside, and a heat sink for dissipating heat emitted from various electrical appliances therein. And a heat exchanger is installed.
즉, 상기한 기능을 수행할 수 있도록 된 종래의 통신전자장비는 도 1의 단면도에 도시된 바와 같이, 통신전자장비(100)의 전후면에 외부로부터 침투되는 이물질을 차단하기 위한 프론트커버(110)와 리어커버(120)가 장착되고, 상기 리어커버(120)의 내측면에 회로기판과 같은 전장품으로부터 발산되는 열을 방열시키기 위한 방열판(130)이 설치되며, 통신전자장비(100)의 상면에 지붕을 이루게 되는 루프커버(140)가 장착된다. 방열판(130)에는 전장품으로부터 발산되는 열을 외부로 대류시키기 위한 냉각핀이 장착되어 있다. 리어커버(120)와 루프커버(140) 사이에는 방열판(130)으로부터 발산된 열이 외부로 배출될 수 있도록 개구부(160)가 형성되어 있다. 또한, 프론트커버(110)의 내측면에 통신전자장비(100)의 내부를 냉각시키기 위한 열교환기(150)가 설치된다.That is, the conventional communication electronic equipment capable of performing the above function, as shown in the cross-sectional view of Figure 1, the front cover 110 for blocking the foreign matter penetrated from the outside on the front and rear surfaces of the communication electronic equipment 100 ) And the rear cover 120 are mounted, and a heat sink 130 is installed on the inner surface of the rear cover 120 to dissipate heat emitted from electrical equipment such as a circuit board, and the top surface of the communication electronic equipment 100. The roof cover 140 is formed on the roof. The heat sink 130 is equipped with a cooling fin for convection the heat emitted from the electrical equipment to the outside. An opening 160 is formed between the rear cover 120 and the roof cover 140 to allow heat radiated from the heat sink 130 to be discharged to the outside. In addition, a heat exchanger 150 is installed on the inner side of the front cover 110 to cool the inside of the communication electronic device 100.
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따라서, 통신전자장비(100)가 가동되는 과정에서 전장품으로부터 발생되는 폐열이 방열판(130)의 냉각핀을 통과함과 동시에 열교환기(150)에 의해 냉각된 상태로 예컨대, 자연대류방식에 의해 리어커버(120)를 따라 상향되면서 개구부(160)를 통해 외부로 배출되는 것이다.Therefore, the waste heat generated from the electrical equipment during the operation of the communication electronic equipment 100 passes through the cooling fins of the heat sink 130 and is cooled by the heat exchanger 150, for example, by a natural convection method. It is discharged to the outside through the opening 160 while being upward along the cover 120.
그런데, 통신전자장비(100)내의 각종 전장품으로부터 발산되는 폐열이 열교환기(150)에 의해 냉각된 상태에서 방열판(130)을 통해 자연대류방식으로 순차배출되는 과정에서, 폐열배출 흐름속도가 미약하여 방열판의 냉각효율이 저하된다는 문제점이 있었다.However, in the process of sequentially discharging waste heat emitted from various electrical appliances in the communication electronic device 100 through the heat sink 130 in a natural convection manner while being cooled by the heat exchanger 150, the waste heat discharge flow rate is weak. There was a problem that the cooling efficiency of the heat sink is lowered.
또한, 통신전자장비(100)의 내부공간을 강제대류방식으로 냉각하기 위한 수단으로 열교환기를 설치하게 되므로, 열교환기를 제조하기 위한 제조경비가 증대될 뿐만 아니라 열교환기가 차지하는 공간이 증대되므로 통신전자장비의 부피가 증대되는 문제점이 있었다.In addition, since the heat exchanger is installed as a means for cooling the internal space of the communication electronic device 100 by a forced convection method, not only the manufacturing cost for manufacturing the heat exchanger is increased but also the space occupied by the heat exchanger is increased. There was a problem that the volume is increased.
이에, 본 고안은 상기한 바와 같은 문제점을 해결하기 위하여 안출된 것으로서, 열교환기로부터 발산되는 압력이 낮은 공기가 폭이 넓게 형성된 유입구를 경유하여 폭이 작은 유속증대로로 유입되므로 공기의 압력이 상승하며, 압력이 상승한 공기는 유입구와 같이 동일한 폭의 배출구로 배출되면서 발생하는 압력차에 의해 공기의 흐름속도가 증대됨과 동시에, 리어커버의 상부에 상승기류가 생성되어 방열판으로부터 발산되는 폐열이 외부로 빠르게 배출되므로, 방열판의 냉각효율이 향상되고 각종 전장품의 수명이 연장될 뿐만 아니라 열교환기의 용량이 축소되어 제조경비가 절감되는 통신전자장비의 방열판 냉각효율 증대장치를 제공하는 데에 그 목적이 있다.Accordingly, the present invention was devised to solve the problems as described above, and the air pressure is increased because the low pressure air emitted from the heat exchanger flows into the small flow rate increase through the inlet formed wide. The increased air flow rate increases due to the pressure difference generated by the discharge of the same width as the inlet and discharged from the heat sink to the outside. Since it is discharged quickly, the purpose of the present invention is to provide a heat sink cooling efficiency increasing device of communication electronic equipment which improves the cooling efficiency of the heat sink and extends the lifespan of various electric appliances and reduces the manufacturing cost by reducing the capacity of the heat exchanger. .
이하, 본 고안에 따른 실시예를 첨부된 예시도면을 참조로하여 상세하게 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings illustrating an embodiment according to the present invention in detail as follows.
도 2는 본 고안에 따른 통신전자장비의 방열판 냉각효율 증대장치가 장착된 상태를 도시한 사시도 및 부분확대도이며, 도 3은 본 고안에 따른 통신전자장비의 방열판 냉각효율 증대장치가 작동되는 과정을 도시한 작동상태도이다.2 is a perspective view and a partially enlarged view showing a state in which the heat sink cooling efficiency increasing device of the communication electronic device according to the present invention is mounted, Figure 3 is a process in which the heat sink cooling efficiency increasing device of the communication electronic device according to the present invention is operated It is a state diagram showing the operation.
통신전자장비(100)의 후면을 이루는 리어커버(120)의 내측면에 전장품으로부터 발산되는 열을 방열시키는 방열판(130)이 설치되며, 통신전자장비(100)의 전면을 이루는 프론트커버(110)의 내측면에 통신전자장비(100)의 실내를 냉각시키는 열교환기(150)가 설치된다. 프론트커버(110)와 리어커버(120)의 상부에는 루프커버(140)가 결합되고, 리어커버(120)와 루프커버(140) 사이에는 방열판(130)으로부터 발산된 열이 외부로 배출될 수 있도록 개구부(160)가 형성되어 있다. 루프커버(140)의 내부에는 열교환기(150)로부터 열교환된 고온의 공기가 유입되는 유입구(11)와, 유입구(11)를 통해 유입된 고온의 공기가 통과되는 유속증대관로(12)와, 개구부(160)에 인접하여 위치되고 유속증대관로(12)를 통과한 고온의 공기가 통신전자장비(100)의 외부로 배출되도록 하는 배출구(13)를 가지는 다수의 공기흐름관로(10)가 형성되어 있다. 유속증대관로(12)는 유입구(11)와 배출구(13)보다 폭이 작게 형성된다.다음은 상기와 같이 구성된 본 고안의 사용상태를 설명한다.The heat dissipation plate 130 is installed on the inner surface of the rear cover 120 forming the rear side of the communication electronic device 100 to dissipate heat emitted from the electrical equipment, and the front cover 110 forming the front side of the communication electronic device 100. On the inner side of the heat exchanger 150 for cooling the interior of the communication electronic equipment 100 is installed. The roof cover 140 is coupled to an upper portion of the front cover 110 and the rear cover 120, and heat radiated from the heat sink 130 may be discharged to the outside between the rear cover 120 and the roof cover 140. The opening 160 is formed to be. Inside the roof cover 140, an inlet port 11 through which hot air heat exchanged from the heat exchanger 150 flows in, a flow rate increasing pipe line 12 through which the hot air introduced through the inlet port 11 passes, A plurality of air flow conduits 10 are formed adjacent to the opening 160 and have outlets 13 through which the hot air passing through the flow rate increasing conduit 12 is discharged to the outside of the communication electronic equipment 100. It is. The flow rate increasing pipe 12 is formed to have a smaller width than the inlet 11 and outlet 13. The following describes the state of use of the present invention configured as described above.
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먼저, 도 2에 도시된 바와 같이, 통신전자장비(100)의 내부 수용공간에 장착된 열교환기(150)에 의해 순환되던 공기가 배출관로(151)를 통과하면서 공기흐름관로(10)의 유입구(11)로 유입된다.First, as shown in Figure 2, the air circulated by the heat exchanger 150 mounted in the inner receiving space of the communication electronic device 100 passes through the discharge pipe 151, the inlet of the air flow pipe (10) Flows into (11).
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이때, 공기흐름관로(10)의 유입구(11)로 유입되는 공기는 상기 유입구(11)보다 좁게 형성된 유속증대관로(12)를 통과하여 넓게 형성된 배출구(13)를 통해 다시 외부로 배출된다.상기와 같이 공기배출관로(10)를 통과하여 배출되는 공기는 넓게 형성된 유입구(11)를 통과하여 좁게 형성된 유속증대관로(12)로 공급될 때, 공기의 압력이 낮은 상태로 유입구(11)에 유입되고, 이렇게 유입된 공기는 폭이 작게 형성된 유속증대관로(12)로 유입되게 되는데 이때, 압력이 낮은상태의 공기가 유속증대관로(12)를 통과하는 과정에서 공기의 압력이 상승하게 되고, 압력이 상승한 공기는 유속증대관로(12)를 지나서 유입구(11)와 같이 넓게 형성된 배출구(13)로 배출됨과 동시에 압력이 상승하여 흐르던 공기가 압력이 낮아지면서 공기의 흐름속도가 빨라지게 된다.이와 같이, 공기흐름관로(10)를 통과하는 과정에서 흐름속도가 빨라진 공기에 의해 리어커버(120)의 상부에 상승기류가 생성되기 때문에 방열판(130)으로부터 발산되어 리어커버(120)와 루프커버(140) 사이에 형성된 개구부(160)를 통해서 외부로 배출되는 폐열이 상승기류에 의해 빠르게 방출될 수 있게 되므로, 리어커버(120)의 내부에 있는 방열판(130)의 냉각효율을 증대시키게 되는 것이다.At this time, the air flowing into the inlet 11 of the air flow pipe 10 is discharged to the outside again through the outlet 13 is formed wider through the flow rate increasing pipe 12 formed narrower than the inlet (11). When the air discharged through the air discharge pipe line 10 is supplied to the flow rate increasing pipe line 12 narrowly formed through the inlet port 11 formed wide, the air inlet flows into the inlet port 11 with a low pressure In this way, the introduced air is introduced into the flow rate increasing pipe line 12 formed with a small width. At this time, the pressure of the air rises in the process of passing the air of the low pressure state through the speed increasing pipe line 12, and the pressure The elevated air is discharged through the flow rate increasing passage 12 to the discharge port 13 formed as wide as the inlet 11, and at the same time the pressure is increased to lower the pressure of the air flows to increase the flow rate of the air. , Ball In the process of passing through the gas flow pipe 10, the air flow is increased in the upper portion of the rear cover 120 by the air flow rate is emitted from the heat sink 130, the rear cover 120 and the roof cover 140 Since the waste heat discharged to the outside through the opening 160 formed therebetween can be quickly discharged by the rising airflow, the cooling efficiency of the heat sink 130 inside the rear cover 120 is increased.
이상에서 설명한 바와 같이 본 고안은, 열교환기로부터 발산되는 압력이 낮은 공기가 폭이 넓게 형성된 유입구를 경유하여 폭이 작은 유속증대로로 유입되므로, 공기의 압력이 상승하며, 압력이 상승한 공기는 유입구와 같이 동일한 폭의 배출구로 배출되면서 발생하는 압력차에 의해 공기의 흐름속도가 증대됨과 동시에, 리어커버의 상부에 상승기류가 생성되어 방열판으로부터 발산되는 폐열이 외부로 빠르게 배출되므로, 방열판의 냉각효율이 향상되고 각종 전장품의 수명이 연장될 뿐만 아니라 열교환기의 용량이 축소되어 제조경비가 절감되는 효과가 있다.As described above, in the present invention, since the low pressure air emitted from the heat exchanger flows into the small flow rate increase through the wide inlet, the air pressure rises, and the air whose pressure rises is the inlet. As the flow rate of air is increased by the pressure difference generated while being discharged to the outlet of the same width as described above, the rising air is generated in the upper part of the rear cover, and the waste heat emitted from the heat sink is discharged quickly to the outside, thus cooling efficiency of the heat sink. This improves and extends the lifespan of various electrical appliances as well as reducing the capacity of the heat exchanger, thereby reducing manufacturing costs.
도 1은 종래 기술에 따른 통신전자장비의 방열판이 설치된 상태를 개략적으로 도시한 측면도,1 is a side view schematically showing a state in which a heat sink of communication electronic equipment according to the prior art is installed;
도 2는 본 고안에 따른 통신전자장비의 방열판 냉각효율 증대장치가 장착된 상태를 도시한 사시도 및 부분확대도,2 is a perspective view and a partially enlarged view showing a state in which a heat sink cooling efficiency increasing apparatus of the communication electronic device according to the present invention is mounted;
도 3은 본 고안에 따른 통신전자장비의 방열판 냉각효율 증대장치가 작동되는 과정을 도시한 작동상태도이다.* 도면의 주요부분에 대한 부호의 설명 *Figure 3 is an operating state diagram showing a process of operating the heat sink cooling efficiency of the communication electronic device according to the present invention. * Explanation of the symbols for the main parts of the drawings *
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100 : 통신전자장비 110 : 프론트커버100: communication electronic equipment 110: front cover
120 : 리어커버 130 : 방열판120: rear cover 130: heat sink
140 : 루프커버 150 : 열교환기 140: roof cover 150: heat exchanger
10 : 공기흐름관로 11,13 : 유입구와 배출구10: air flow path 11,13: inlet and outlet
12 : 유속증대관로 12: Velocity increase pipeline
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-1999-0005786U KR200378444Y1 (en) | 1999-04-09 | 1999-04-09 | Device for increasing the cooling efficiency of communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-1999-0005786U KR200378444Y1 (en) | 1999-04-09 | 1999-04-09 | Device for increasing the cooling efficiency of communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000019331U KR20000019331U (en) | 2000-11-15 |
| KR200378444Y1 true KR200378444Y1 (en) | 2005-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20-1999-0005786U KR200378444Y1 (en) | 1999-04-09 | 1999-04-09 | Device for increasing the cooling efficiency of communication equipment |
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| Country | Link |
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| KR (1) | KR200378444Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101306252B1 (en) | 2013-07-17 | 2013-09-09 | 주식회사 이앰 | Cooler for blower |
-
1999
- 1999-04-09 KR KR20-1999-0005786U patent/KR200378444Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101306252B1 (en) | 2013-07-17 | 2013-09-09 | 주식회사 이앰 | Cooler for blower |
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| Publication number | Publication date |
|---|---|
| KR20000019331U (en) | 2000-11-15 |
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