KR200355758Y1 - Electrode integration type metal evaporation film structure - Google Patents
Electrode integration type metal evaporation film structure Download PDFInfo
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- KR200355758Y1 KR200355758Y1 KR20-2004-0011183U KR20040011183U KR200355758Y1 KR 200355758 Y1 KR200355758 Y1 KR 200355758Y1 KR 20040011183 U KR20040011183 U KR 20040011183U KR 200355758 Y1 KR200355758 Y1 KR 200355758Y1
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- deposition
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- 230000010354 integration Effects 0.000 title 1
- 238000001883 metal evaporation Methods 0.000 title 1
- 238000000151 deposition Methods 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 238000001465 metallisation Methods 0.000 claims abstract description 51
- 230000008021 deposition Effects 0.000 claims abstract description 47
- 239000003990 capacitor Substances 0.000 claims abstract description 34
- 239000007921 spray Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 22
- 239000011104 metalized film Substances 0.000 claims 1
- 238000007751 thermal spraying Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 9
- 239000004743 Polypropylene Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/14—Protection against electric or thermal overload
- H01G2/16—Protection against electric or thermal overload with fusing elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/015—Special provisions for self-healing
Abstract
본 고안은 전극통합형 금속증착필름에 관한 것으로,The present invention relates to an electrode integrated metal deposition film,
유전체필름에 금속을 증착하는 과정에서 전극판을 분할하지 않은 일체형전극증착부와 전극판을 분할한 분할형전극증착부를 동시에 함께 증착시켜서 된 전극통합형(전극조합형) 금속증착필름을 제공함으로써,By providing an electrode integrated (electrode combination type) metal deposition film formed by simultaneously depositing an integrated electrode deposition portion that does not divide an electrode plate and a divided electrode deposition portion that divides an electrode plate in the process of depositing a metal on the dielectric film,
이를 사용하여 콘덴서특성과 보안기능이 우수한 것은 물론, 사용수명이 장구하며, 높은 전압에서도 안전하게 콘덴서의 기능을 수행할 수 있는 고품질의 콘덴서를 제조할 수 있도록 함에 그 목적을 둔 것이다.It aims to be able to manufacture high quality capacitors that have excellent capacitor characteristics and security functions, as well as long service life and can safely perform the functions of capacitors even at high voltage.
상기와 같은 목적을 달성하기 위한 본 고안은,The present invention for achieving the above object,
금속증착필름을 구성함에 있어서,In constructing the metal deposition film,
단일체의 유전체필름(10)상면에 마진(margin)부(11)와 용사금속접촉부(21)가 형성되도록 금속전극막을 증착시키되,While depositing a metal electrode film to form a margin (11) and the thermal spray metal contact portion 21 on the upper surface of the single dielectric film 10,
금속전극막을 분할하지 않은 일체형전극증착부(20)와 휴즈(30a)부분이 구비되도록 소정간격으로 금속전극막을 분할한 분할형전극증착부(30)를 동시에 함께 증착하여서 이루어짐에 그 특징이 있는 것이다.It is characterized by being formed by simultaneously depositing the divided electrode deposition portion 30 which divided the metal electrode film at predetermined intervals so that the integrated electrode deposition portion 20 and the fuse 30a portion which do not divide the metal electrode film are provided together. .
Description
본 고안은 제조가 용이하고, 콘덴서에 사용시 콘덴서특성과 보안기능이 우수한 것은 물론, 사용수명이 장구하며, 높은 전압에서도 안전하게 콘덴서의 기능을 수행할 수 있도록 한 전극통합형 금속증착필름에 관한 것이다.The present invention relates to an electrode integrated metal deposition film that is easy to manufacture, has excellent condenser characteristics and security functions when used in a condenser, has a long service life, and can safely perform a condenser function even at a high voltage.
각종 민생용 또는 산업용 전기,전자기계기구등에는 콘덴서가 사용되고 있는데 이러한 콘덴서의 한예를 살펴보면 대부분 첨부도면 도1 내지 도3에 도시된 바와같이 각각 유전재료로 사용되는 폴리프로필렌(PP), 폴리에스테르(PET), 폴리에틸렌나프탈레이트(PEN), 폴리페닐린 설파이드(PPS)등과 같은 중합물로된 유전체필름(1) 상면에 마진(margin)부(1a)와 용사금속이 접촉되는 용사금속접촉부(3)가 형성되도록 금속전극막을 증착한 두개의 금속증착필름(9)(9')을 중첩시켜 권취한다음 양측면에 아연 또는 아연과 주석합금등의 금속을 금속용사하여 전극인출부(5a)를 형성하여서된 콘덴서소자(5)를 외부케이스(6)내에 내장하고 절연체(7)를 충진하여서 구성된 것이다.Capacitors are used in various civil or industrial electrical and electromechanical appliances, etc. Looking at one example of such capacitors, polypropylene (PP) and polyester (PP), each of which is used as a dielectric material as shown in FIGS. PET), polyethylene naphthalate (PEN), polyphenyline sulfide (PPS) and the like, the thermal sprayed metal contact portion (3) in contact with the margin (1a) and the thermal spray metal on the upper surface of the dielectric film (1) The two metal deposition films 9 and 9 'on which the metal electrode films are deposited are wound to overlap each other, and then the electrode lead portions 5a are formed by spraying metals such as zinc or zinc and tin alloy on both sides. The capacitor 5 is built in the outer case 6 and filled with the insulator 7.
그런데 이러한 콘덴서에 사용되는 종래의 금속증착필름(9)(9')은,By the way, the conventional metal deposition film 9 (9 ') used in such a capacitor,
유전체필름(1)상면에 마진(margin)부(1a)와 용사금속접촉부(3)가 형성되도록 금속전극막을 증착시키되,A metal electrode film is deposited so that a margin part 1a and a thermal spray metal contact part 3 are formed on the dielectric film 1.
금속전극막을 분할하지 않은 일체형전극증착부(3)로 된 금속증착필름(9) 1종류와,1 type of metal deposition film 9 which consists of the integral electrode deposition part 3 which does not divide a metal electrode film,
용사금속접촉부(3)측에 가깝게 휴즈(4a)부분이 구비되도록 금속전극막을 소정간격으로 분할한 분할형전극증착부(4)로 된 금속증착필름(9') 1종류를 각각 제조하여 사용하였는바,One type of metal deposition film 9 'made of the divided electrode deposition portions 4 in which the metal electrode film was divided at predetermined intervals so that the fuse 4a portion was provided near the sprayed metal contact portion 3 was used. bar,
구조가 각각 다른 2종류의 금속증착필름(9)(9')을 제조하여야 하므로 생산성과 수율이 떨어지며,Since two types of metal deposition films 9 and 9 'having different structures must be manufactured, productivity and yield are reduced.
2종류의 금속증착필름(9)(9')중 금속전극막을 소정간격으로 분할한 분할형전극증착부(4)로 된 금속증착필름(9')의 경우에는 전류가 인가되는 용사금속접촉부(3)측에 너무 가깝게 휴즈(4a)부분이 구비되어 있어서 휴즈(4a)부분의 손상이 쉽게 발생하고, 전류가 편향되게 전해져 전류분배를 균등히 할수 가 없으므로, 전류의 집중 또는 접착저항 상승에 의한 국부적인 발열 집중현상이 발생하는 문제점이 있었다.In the case of the metal deposition film 9 'including the split electrode deposition portion 4 in which the metal electrode film is divided at predetermined intervals among the two types of metal deposition films 9 and 9', a sprayed metal contact portion to which current is applied ( 3) The fuse 4a portion is provided too close to the side, so damage to the fuse 4a portion easily occurs, and current is deflected so that the current distribution cannot be equalized. There was a problem that phosphorous concentration occurs.
따라서, 종래의 금속증착필름(9)(9')을 이용하여 제조된 콘덴서는 고온영역보다는 비교적 저온영역에서 콘덴서 특성과 보안기능이 제대로 발휘되는 것이었으며 수명 또한 길지 못하였다.Therefore, the capacitor manufactured using the conventional metal deposition films 9 and 9 'exhibited good condenser characteristics and security functions in a relatively low temperature region rather than a high temperature region and did not have a long service life.
본 고안은 상기와 같은 제반 문제점을 감안하여 안출한 것으로,The present invention was devised in view of the above problems,
유전체필름에 금속을 증착하는 과정에서 전극판을 분할하지 않은 일체형전극증착부와 전극판을 분할한 분할형전극증착부를 동시에 함께 증착시켜서 된 전극통합형(전극조합형) 금속증착필름을 제공함으로써,By providing an electrode integrated (electrode combination type) metal deposition film formed by simultaneously depositing an integrated electrode deposition portion that does not divide an electrode plate and a divided electrode deposition portion that divides an electrode plate in the process of depositing a metal on the dielectric film,
이를 사용하여 콘덴서특성과 보안기능이 우수한 것은 물론, 사용수명이 장구하며, 높은 전압에서도 안전하게 콘덴서의 기능을 수행할 수 있는 고품질의 콘덴서를 제조할 수 있도록 함에 그 목적을 둔 것이다.It aims to be able to manufacture high quality capacitors that have excellent capacitor characteristics and security functions, as well as long service life and can safely perform the functions of capacitors even at high voltage.
도1은 종래 일반적인 콘덴서의 구성상태도.1 is a configuration diagram of a conventional general capacitor.
도2는 종래의 콘덴서소자용 금속증착필름의 구성상태도.2 is a configuration diagram of a metal deposition film for a conventional capacitor device.
도3은 종래의 콘덴서소자용 금속증착필름을 이용하여 콘덴서소자를 제조하는 구성상태도.Figure 3 is a configuration diagram for manufacturing a condenser element using a conventional metal deposition film for a capacitor element.
도4a,도4b,도4c는 본 고안의 콘덴서에 사용되는 콘덴서소자제조용 전극통합형 금속증착필름의 구성상태도로서,Figures 4a, 4b, 4c is a configuration diagram of the electrode integrated metal deposition film for producing a capacitor device used in the capacitor of the present invention,
도4a는 휴즈가 2개인 전극통합형 금속증착필름의 일 구성상태도.Figure 4a is a configuration diagram of one electrode integrated metal deposition film of two fuses.
도4b는 휴즈가 1개인 전극통합형 금속증착필름의 일 구성상태도.Figure 4b is a configuration of one electrode integrated metal deposition film having a fuse.
도4c는 휴즈가 3개인 전극통합형 금속증착필름의 일 구성상태도.Figure 4c is a configuration diagram of an electrode integrated metal deposition film of three fuses.
도4d는 전극통합형 금속증착필름을 제조하기 위한 일 실시예도.Figure 4d is an embodiment for manufacturing an electrode integrated metal deposition film.
도4e는 금속전극막 상면에 전극막보호층(40)을 형성한 전극통합형 금속증착필름의 일 구성상태도.Figure 4e is a configuration diagram of an electrode integrated metal deposition film in which the electrode film protective layer 40 is formed on the upper surface of the metal electrode film.
도4f는 전체 금속전극막의 두께를 일정하게 증착형성하여서된 전극통합형 금속증착필름의 다른 구성상태도.Figure 4f is another configuration of the electrode integrated metal deposition film formed by uniformly depositing the thickness of the entire metal electrode film.
도5는 본 고안의 전극통합형 금속증착필름을 이용하여 콘덴서소자를 제조하는 구성상태도.Figure 5 is a configuration diagram for manufacturing a capacitor device using the electrode integrated metal deposition film of the present invention.
도6은 본 고안으로서 분할형전극증착부를 다이아몬드형으로 분할한 구성상태도.6 is a configuration diagram in which the divided electrode deposition portion is divided into diamonds according to the present invention.
♣도면의 주요 부분에 대한 부호의 설명 ♣♣ Explanation of symbols for the main parts of the drawing ♣
10:유전체필름 11:마진부10: dielectric film 11: margin portion
20:일체형전극증착부 21:용사금속접촉부20: integral electrode deposition part 21: thermal spray metal contact portion
30:분할형전극증착부 30a:휴즈30: split electrode deposition part 30a: fuse
40:전극막보호층 50:전극인출부(50)40: electrode film protective layer 50: electrode lead portion 50
60:리드선 70:전극단자60: lead wire 70: electrode terminal
80:단자고정지지구 81:절연블록80: terminal fixing support 81: insulating block
82:돌기 90:외부케이스82: protrusion 90: outer case
95:절연체 100:전극통합형 금속증착필름95: insulator 100: electrode integrated metal deposition film
200:콘덴서소자200: capacitor element
상기와 같은 목적을 달성하기 위한 본 고안을 첨부도면에 의거 더욱 상세히 설명한다.The present invention for achieving the above object will be described in more detail based on the accompanying drawings.
본 고안의 전극통합형 금속증착필름은 첨부도면 도4a 내지 도6에 도시된 바와같이 유전체필름(10)상면에 마진(margin)부(11)와 용사금속접촉부(21)가 형성되도록 금속전극막을 증착시키되,In the electrode integrated metal deposition film of the present invention, as shown in FIGS. 4A to 6, the metal electrode film is deposited so that a margin part 11 and a thermal spray metal contact part 21 are formed on the top surface of the dielectric film 10. Let's say
용사금속접촉부(21)측부터 중간부분까지는 금속전극막을 분할하지 않은 일체형전극증착부(20)로 형성하고 이로부터 마진부(11)측으로는 휴즈(30a)부분이 형성되도록 금속전극막을 분할한 분할형전극증착부(30)로 형성하여서 이루어진다.From the sprayed metal contact portion 21 side to the middle portion, the metal electrode film is divided into an integral electrode deposition portion 20 without dividing the metal electrode film, and the fuse 30a portion is formed on the margin portion 11 side. It is formed by forming the electrode electrode depositing portion (30).
여기서, 본 고안의 전극통합형 금속증착필름(100)은,Here, the electrode integrated metal deposition film 100 of the present invention,
첨부도면 도4a 내지 도4c에 도시된 바와같이 사용에 따른 특성에 따라 분할형전극증착부(30)에 구비되는 휴즈(30a)가 각 분할전극 1마디마다 적어도 1개이상 형성하여 이루어진다.As shown in FIGS. 4A to 4C, at least one fuse 30a provided in the split electrode deposition unit 30 is formed for each segment of each segment electrode according to the characteristics of use.
그리고 첨부도면 도4d에 도시된 바와같이 단일체로된 폭이 넓은 판상의 유전체필름(10)상면에 일체형전극증착부(20)와 분할형전극증착부(30)가 통합되도록 형성되는 금속전극막을,As shown in FIG. 4D, a metal electrode film formed such that the integrated electrode deposition unit 20 and the divided electrode deposition unit 30 are integrated on the upper surface of the monolayer wide plate-like dielectric film 10.
용사금속접촉부(21)와 마진부(11)가 측면으로 연속적으로 이어지도록 다수개 증착배열하여서된 전극통합형(전극조합형) 금속증착필름(100)으로 구성하여,The sprayed metal contact portion 21 and the margin portion 11 is composed of an electrode integrated type (electrode combination type) metal deposition film 100 is arranged in a plurality of deposition arranged so as to continue to the side,
이를 화살표와 절단선(25)으로 표시한 일정폭으로 절단하여서 낱개로 분할 사용토록 이루어지는 것이 생산성이나 수율을 더욱 더 향상시킬 수 있으므로 가장 이상적이나 처음서부터 낱개로 된 전극통합형(전극조합형) 금속증착필름(100)으로 구성하여도 무방하다.It is ideal to cut it into a certain width indicated by an arrow and a cutting line 25 and use it separately so that it can improve productivity and yield even more, but it is most ideal, but it is a single electrode integrated type (electrode combination type) metal deposition film from the beginning. It may be configured as (100).
그리고 상기 전극통합형 금속증착필름(100)은, 첨부도면 도4e에 도시된 바와같이 상기 유전체필름(10)상면에 증착되는 일체형전극증착부(20)와 분할형전극증착부(30) 상면에 전극막보호층(40)을 형성하여 이들 금속전극막의 산화와 부식을 막아주어 품질이 저하되는 것을 미연에 방지할 수 도 있다.And the electrode integrated metal deposition film 100, the electrode on the integrated electrode deposition portion 20 and the divided electrode deposition portion 30 is deposited on the top surface of the dielectric film 10, as shown in Figure 4e The film protection layer 40 may be formed to prevent oxidation and corrosion of these metal electrode films, thereby preventing deterioration in quality.
또한, 상기 콘덴서 제조용 전극통합형 금속증착필름(100)은,In addition, the electrode integrated metal deposition film 100 for producing the capacitor,
아연(Zn) 또는 아연(Zn)합금을 증착전극으로 사용하여 주전극부(22)의 저항값이 3 ~ 30Ω/?이고, 용사금속이 접촉되는 용사금속접촉부(21)의 저항값이 0.5 ~ 10Ω/?가 되도록 증착되어져 이루어질 수 도 있으며,Using the zinc (Zn) or zinc (Zn) alloy as the deposition electrode, the resistance value of the main electrode portion 22 is 3 to 30? / ?, and the resistance value of the thermal spray metal contact portion 21 to which the thermal spray metal is in contact is 0.5 to. It may be made to be deposited to 10Ω / ?,
첨부도면 도4f와 같이 알루미늄(Al) 또는 알루미늄(Al)합금을 증착전극으로 사용하여 전체 전극부의 저항값이 1 ~ 8Ω/?을 가지도록 전체 금속전극막의 두께를 일정하게 증착하여서 이루어질 수 도 있다.As shown in FIG. 4F, aluminum (Al) or aluminum (Al) alloy may be used as the deposition electrode, and the thickness of the entire metal electrode film may be uniformly deposited so that the resistance value of the entire electrode portion may have 1 to 8Ω / ?. .
한편, 본 고안은 첨부도면 도6에 도시된 바와같이 상기 단일체의 유전체필름(10)상면에 금속전극막을 분할하지 않은 일체형전극증착부(20)와 일체형으로 형성되는 분할형전극증착부(30)를,On the other hand, according to the present invention, as shown in Figure 6, the divided electrode deposition portion 30 formed integrally with the integrated electrode deposition portion 20, which does not divide the metal electrode film on the upper surface of the dielectric film 10 of the unitary body 30. To,
휴즈(30a)부분이 구비되도록 다이아몬드형상으로 분할하여서 이루어질 수 도 있다.It may be made by dividing into a diamond shape so that the fuse 30a portion is provided.
본 고안은 상기한 일실시예들에 의해 결코 한정되는 것이 아닌 것이다.The present invention is by no means limited by the above embodiments.
즉, 상기 분할형전극증착부(30)의 분할된 모양은 상기한 실시예 이외에도 다양한 형상으로 구성가능한 것으로 단일체의 유전체필름(10)상에 일체형전극증착부(20)와 동시에 함께 증착되어진 것이라면 어떠한 형태로도 변형가능한 것이어서 이와같이 본 고안의 단순한 설계변경 내지는 치환된 것이라면 모두 본 고안의 기술범주내에 속한다 할 것이다.That is, the divided shape of the split electrode deposition unit 30 may be configured in various shapes in addition to the above embodiments, as long as it is deposited together with the integrated electrode deposition unit 20 on the single dielectric film 10. It is also possible to change in form so that any simple design changes or substitutions of the present invention will fall within the technical scope of the present invention.
상기와 같이 구성된 본 고안은 유전체필름(10)에 금속을 증착하는 과정에서 금속전극막을 분할하지 않은 일체형전극증착부(20)와 금속전극막을 분할한 분할형전극증착부(30)를 동시에 함께 형성시켜서 전극통합형 금속증착필름(100)을 제조하게 됨으로써, 1종류의 금속증착필름(100)만을 생산하면 되므로 금속증착필름(100)자체의 생산성과 수율이 향상된다.According to the present invention configured as described above, in the process of depositing metal on the dielectric film 10, the integrated electrode deposition unit 20, which does not divide the metal electrode film, and the split electrode deposition unit 30, which divides the metal electrode film, are formed together. By manufacturing the electrode integrated metal deposition film 100, only one type of metal deposition film 100 is produced, so that the productivity and yield of the metal deposition film 100 itself is improved.
특히, 단일체로된 넓은 판상의 유전체필름(10)상면에 일체형전극증착부(20)와 분할형전극증착부(30)가 통합되도록 형성되는 금속전극막을, 연속적으로 이어지도록 다수개 증착배열하여서 이를 일정폭으로 절단하여서 낱개로 분할 사용토록 구성한 경우에는 생산성이나 수율이 더욱 배가 된다.In particular, a plurality of metal electrode films formed to integrate the integrated electrode deposition unit 20 and the divided electrode deposition unit 30 on the upper surface of the wide plate-like dielectric film 10 are formed by depositing and arranging a plurality of metal electrode films so as to be connected continuously. When cut to a certain width and configured to be used separately, the productivity and yield are further doubled.
또한, 전극통합형(전극조합형) 금속증착필름(100)을 제조시 제시된 일실시예와 같이 아연(Zn) 또는 아연(Zn)합금을 증착전극으로 사용하여 주전극부(22)의 저항값이 3 ~ 30Ω/?이고, 용사금속이 접촉되는 용사금속접촉부(21)의 저항값이 0.5 ~ 10Ω/?가 되도록 증착하거나,In addition, the resistance value of the main electrode part 22 is 3 by using zinc (Zn) or zinc (Zn) alloy as the deposition electrode as in the embodiment of the present invention when manufacturing the electrode integrated type (electrode combination type) metal deposition film 100. 30 Ω / ?, and the deposition of the sprayed metal contact portion 21 to which the thermal spray metal is in contact is 0.5 to 10 Ω / ?, or
도4f와 같이 알루미늄(Al) 또는 알루미늄(Al)합금을 증착전극으로 사용하여 전체 전극부의 저항값이 1 ~ 8Ω/?을 가지도록 전체 금속전극막의 두께를 일정하게 증착하는등 일실시예에 따라 제조된 전극통합형 금속증착필름(100) 2장을 권취하여서된 콘덴서소자(200)를 사용하므로 양측 전극부 즉 일체형전극증착부(20)및 분할형전극증착부(30)와 금속용사면인 용사금속접촉부(21)의 전기적 접착저항이 낮추어지며, 전류가 흐르는 휴즈(30a)부분의 손상이 줄어들며, 전류의 분배가 균등하게 이루어지므로 전류의 집중 또는 접착저항 상승에 의한 국부적인 발열집중현상이현격히 개선된다.As shown in FIG. 4F, by using aluminum (Al) or aluminum (Al) alloy as the deposition electrode, the thickness of the entire metal electrode film is uniformly deposited such that the resistance value of the entire electrode portion is 1 to 8 Ω /? Since the condenser element 200 is wound around two manufactured electrode integrated metal deposition films 100, the electrode parts on both sides, that is, the integral electrode deposition part 20, the split electrode deposition part 30, and the metal spray surface are sprayed. The electrical adhesion resistance of the metal contact portion 21 is lowered, the damage of the portion of the fuse 30a through which current flows is reduced, and the distribution of current is made evenly, so that localized heat generation phenomenon due to concentration of current or increase in adhesion resistance is significantly. Is improved.
그리고, 본 고안의 전극통합형 금속증착필름(100)을 사용하여 콘덴서를 제조하면 저온영역에서 콘덴서특성과 보안기능이 발휘되는 종래의 콘덴서와는 달리 그 보다 높은 고온영역에서도 콘덴서특성과 보안기능이 충분히 발휘된다.In addition, when the capacitor is manufactured using the electrode integrated metal deposition film 100 of the present invention, unlike the conventional capacitor that exhibits the capacitor characteristic and the security function in the low temperature region, the capacitor characteristic and the security function are sufficiently high even in the high temperature region. Exerted.
따라서, 종래의 콘덴서보다 높은 전압에서도 안정하게 콘덴서의 기능을 수행한다.Therefore, the capacitor functions more stably even at a higher voltage than the conventional capacitor.
상기와 같이 본 고안은 전극통합형(전극조합형) 금속증착필름을 사용하므로 금속증착필름자체의 생산성과 수율이 향상되는 효과가 있다.As described above, the present invention uses an electrode integrated type (electrode combination type) metal deposition film, thereby improving productivity and yield of the metal deposition film itself.
그리고, 전극통합형(전극조합형) 금속증착필름 2장을 권취하여서 사용하므로 휴즈부분이 전류가 인가되는 용사금속접촉부와의 거리가 충분히 확보됨으로써 양측 전극부와 금속용사면인 용사금속접촉부의 전기적 접착저항이 낮추어지며,In addition, since two pieces of electrode integrated type (electrode combination type) metal deposition film are wound up and used, the fuse part has a sufficient distance between the sprayed metal contact portion to which the current is applied, so that the electrical adhesion resistance of both electrode portions and the sprayed metal contact portion of the metal spray surface Is lowered,
전류가 흐르는 휴즈부분의 손상이 줄어들며,Damage to the fuse part through which current flows is reduced,
전류의 분배가 균등하게 이루어지므로 전류의 집중 또는 접착저항 상승에 의한 국부적인 발열집중현상이 현격히 개선되는 효과가 있는 것은 물론,Since the distribution of the current is made evenly, the local heating concentration phenomenon due to the concentration of the current or the increase of the adhesion resistance is significantly improved.
저온영역에서 콘덴서특성과 보안기능이 발휘되는 종래의 콘덴서와는 달리Unlike conventional capacitors that exhibit condenser characteristics and security functions at low temperatures
본 고안의 전극통합형 금속증착필름을 사용하여 제조된 콘덴서는 그 보다 높은 고온영역에서도 콘덴서특성과 보안기능이 충분히 발휘되는 효과가 있는등 사용수명이 장구하며, 높은 전압에서도 안전하게 콘덴서의 기능을 수행할 수 있는 매우 획기적인 고안이다.The capacitor manufactured by using the electrode integrated metal deposition film of the present invention has a long service life such that the capacitor characteristics and security functions are sufficiently exhibited even in a high temperature region, and the capacitor can be safely operated even at a high voltage. It is a very breakthrough design.
Claims (7)
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| KR101173187B1 (en) | 2012-04-17 | 2012-08-10 | 성호전자(주) | Half pattern margin metalized plastic film capacitor and the product method thereof |
| KR101844886B1 (en) | 2015-12-08 | 2018-04-04 | 이성규 | film condenser |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101173187B1 (en) | 2012-04-17 | 2012-08-10 | 성호전자(주) | Half pattern margin metalized plastic film capacitor and the product method thereof |
| KR101844886B1 (en) | 2015-12-08 | 2018-04-04 | 이성규 | film condenser |
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