KR20030057105A - Liquid epoxy resin composition for use in cavity-down type ball grid array package - Google Patents
Liquid epoxy resin composition for use in cavity-down type ball grid array package Download PDFInfo
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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Abstract
Description
본 발명은 캐비티 다운형 볼그리드어레이 패키지용 액상 에폭시 수지 조성물에 관한 것으로, 보다 상세하게는 에폭시 수지로서 나프탈렌계 및 비스페놀계 에폭시 수지를 병용하고 경화제로서 알킬기를 함유하는 테트라하이드로프탈산 무수물을 사용하며 경화촉진제로서 이미다졸계 촉매를 사용하는 것을 특징으로 하는 액상 에폭시 수지 조성물에 관한 것이다.The present invention relates to a liquid epoxy resin composition for a cavity down ball grid array package, and more particularly, a combination of naphthalene-based and bisphenol-based epoxy resins as an epoxy resin and a tetrahydrophthalic anhydride containing an alkyl group as a curing agent. A liquid epoxy resin composition characterized by using an imidazole catalyst as an accelerator.
전자 및 전기 기기의 소형화, 경량화 그리고 고기능화에 따라 반도체의 실장방법도 핀 삽입형에서 표면 실장형이 주류가 되고 있다. 또한 단위 면적당 처리용량이 커짐에 따라 열방출 효과가 우수한 신규 패키지에 대한 요구가 날로 증가하고 있는 실정이다.With the miniaturization, light weight, and high functionality of electronic and electrical equipment, semiconductor mounting methods have become mainstream in the way of pin insertion and surface mounting. In addition, as the processing capacity per unit area increases, the demand for new packages having excellent heat dissipation effects is increasing day by day.
일반적으로 반도체 소자용 액상 봉지재는 반도체칩, 전도성 와이어, 리드프레임 또는 인쇄회로기판 등을 외부의 환경으로 부터 보호하기 위해 사용되는 재료로서, 에폭시몰딩컴파운드와 함께 사용되고 있다. 에폭시몰딩컴파운드를 이용한봉지공정은 일정한 금형에서 트랜스퍼몰딩 방식으로 밀봉함으로써 초기 투자비용이 많이 소요되고, 몰딩시 와이어의 손상과 금형오염에 따른 패키지의 오염발생 등의 단점이 있다. 이러한 단점을 해결하기 위하여 최근에는 액상 봉지재를 주입하는 방식의 밀봉방법이 볼그리드어레이 패키지 및 핀그리드어레이 패키지 등의 생산에 적용되고 있다(참조: 대한민국 특허공개 제 1999-0043137호).In general, a liquid encapsulant for semiconductor devices is a material used to protect a semiconductor chip, a conductive wire, a lead frame or a printed circuit board from an external environment, and is used with an epoxy molding compound. The encapsulation process using epoxy molding compound requires a lot of initial investment by sealing in a constant mold by transfer molding, and has disadvantages such as damage to the wire during molding and contamination of the package due to mold contamination. In order to solve this disadvantage, recently, a sealing method of injecting a liquid encapsulant has been applied to the production of a ball grid array package and a pin grid array package (see Korean Patent Publication No. 1999-0043137).
특히 캐비티 다운형 볼그리드어레이 패키지는 열방출 특성이 우수한 패키지로 현재 수요가 증가되고 있는 실정이며, 봉지재로 작업성이 우수한 액상 에폭시 수지 조성물을 사용하고 있다. 종래의 액상 에폭시 수지 조성물로서는, 액상 에폭시 수지에 페놀계 경화제 및 경화촉진제, 신뢰성 향상을 위한 실리카 등의 무기충전제, 및 점도조절을 위한 용매를 첨가하여 제조된 조성물이 주류를 이루고 있다. 그러나, 이와 같이 점도조절을 위하여 액상 봉지재에 용매를 첨가할 경우, 경화후 봉지재의 강도가 떨어질 뿐만 아니라, 반도체 조립시 용매 휘발을 위한 공정이 필요하여 생산성의 저하가 문제로 나타나 이에 대한 개선이 요구되었다.In particular, the cavity down-type ball grid array package is a situation that the current demand is increasing as a package having excellent heat dissipation characteristics, using a liquid epoxy resin composition excellent in workability as an encapsulant. As a conventional liquid epoxy resin composition, a composition prepared by adding a phenolic curing agent and a curing accelerator, an inorganic filler such as silica for improving reliability, and a solvent for viscosity control is added to the liquid epoxy resin. However, when the solvent is added to the liquid encapsulant for viscosity control as described above, the strength of the encapsulant after curing is not only lowered, but also a process for volatilization of the solvent is required during the assembly of the semiconductor, resulting in a decrease in productivity. Was required.
이러한 요구에 부응하여, 최근 저점도 에폭시 수지와 산무수물을 사용하여 무용제 액상 봉지재 개발이 활발히 이루어지고 있는 실정이나(참조: 일본국 특허공개 제 2000-273149호, 미국특허 제 6,117,953호, 일본국 특허공개 평 11-269250 호 등), 산무수물의 적용시 발생되는 수분흡수율의 증가와 저분자량의 에폭시 수지를 사용함으로써 발생되는 내열성 저하 및 이로 인한 열충격 신뢰도 불량이 발생되어, 이에 대한 개선이 요구되고 있는 실정이다.In response to these demands, the development of a solvent-free liquid encapsulant using low-viscosity epoxy resins and acid anhydrides has been actively developed (see Japanese Patent Application Laid-Open No. 2000-273149, US Patent No. 6,117,953, and Japan). Patent Publication No. Hei 11-269250, etc.), an increase in the water absorption rate generated by the application of acid anhydride and the heat resistance caused by the use of a low molecular weight epoxy resin, resulting in poor thermal shock reliability, resulting in improvement is required. There is a situation.
이에 본 발명은 상기와 같은 종래기술의 문제점들을 해결하기 위한 것으로, 용매를 사용하지 않음으로써 기존 액상 봉지재 제조시 점도조절을 목적으로 사용되는 용매로 인한 문제점을 개선하는 동시에 흡습성을 낮추어 공정성 및 신뢰성이 향상된 에폭시계 액상 봉지재를 제공함을 목적으로 한다.Therefore, the present invention is to solve the problems of the prior art as described above, by improving the problem caused by the solvent used for the purpose of viscosity control in the conventional liquid encapsulation material by not using a solvent while reducing the hygroscopicity and processability and reliability It is an object of the present invention to provide an improved epoxy-based liquid encapsulant.
즉, 본 발명은 다음의 성분들을 포함하는 캐비티 다운형 볼그리드어레이 패키지용 액상 에폭시 수지 조성물을 제공한다:That is, the present invention provides a liquid epoxy resin composition for a cavity down ball grid array package comprising the following components:
(a) 하기 화학식 1로 표현되는 나프탈렌계 에폭시 수지;(a) a naphthalene epoxy resin represented by the following formula (1);
(b) 하기 화학식 2로 표현되는 비스페놀계 에폭시 수지;(b) bisphenol-based epoxy resins represented by the following general formula (2);
(c) 하기 화학식 3으로 표현되는 트리알킬테트라하이드로프탈산 무수물;(c) trialkyltetrahydrophthalic anhydride represented by the following formula (3);
(d) 하기 화학식 4로 표현되는 메틸테트라하이드로프탈산 무수물;(d) methyltetrahydrophthalic anhydride represented by the following formula (4);
(e) 하기 화학식 5로 표현되는 이미다졸계 촉매; 및(e) an imidazole catalyst represented by the following formula (5); And
(f) 무기충전제:(f) inorganic fillers:
[화학식 1][Formula 1]
[화학식 2][Formula 2]
(상기 화학식에서, R은 수소원자 또는 메틸기임)(Wherein R is a hydrogen atom or a methyl group)
[화학식 3][Formula 3]
(상기 화학식에서, R1, R2및 R3는 각각 알킬기 또는 알케닐기이며, R1+R2+R3=C6H15를 만족함)(In the above formula, R 1 , R 2 and R 3 are each an alkyl group or an alkenyl group, and satisfies R 1 + R 2 + R 3 = C 6 H 15. )
[화학식 4][Formula 4]
[화학식 5][Formula 5]
(상기 화학식에서, R1, R2및 R3는 각각 독립적으로 수소원자, 메틸기, 에틸기, 페닐기, 시아노에틸기 또는 벤질기임).(In the above formula, R 1 , R 2 and R 3 are each independently a hydrogen atom, a methyl group, an ethyl group, a phenyl group, a cyanoethyl group or a benzyl group).
본 발명자들은 용매를 사용하지 않고, 에폭시 수지로 나프탈렌계 및 비스페놀계 에폭시 수지를 병용하고, 경화제로 트리알킬테트라하이드로프탈산 무수물 및 메틸테트라하이드로프탈산 무수물을 병용하면서 경화촉진제로 이미다졸계 촉매를 사용할 경우, 무기충전제 함량이 70~80중량%인 범위내에서 점도가 25,000~45,000cps로 적절하고 우수한 굴곡강도, 내습성 및 내열성을 갖는 액상 에폭시 수지 조성물을 얻을 수 있음을 확인하고 본 발명을 성안하게 되었다.The present inventors use a naphthalene-based and bisphenol-based epoxy resin together with an epoxy resin without using a solvent, and use a trialkyltetrahydrophthalic anhydride and methyltetrahydrophthalic anhydride together as a curing agent and use an imidazole catalyst as a curing accelerator. In the range of 70 to 80% by weight of the inorganic filler content, the viscosity of 25,000 ~ 45,000cps was confirmed that the liquid epoxy resin composition having a suitable and excellent flexural strength, moisture resistance and heat resistance can be obtained and the present invention was devised. .
이하, 본 발명을 보다 상세하게 설명한다.Hereinafter, the present invention will be described in more detail.
본 발명에서는 에폭시 수지로서 하기 화학식 1의 구조를 갖는 나프탈렌계 에폭시 수지에 점도를 낮추기 위한 목적으로 하기 화학식 2의 구조를 갖는 비스페놀계 에폭시 수지를 혼합하여 사용한다.In the present invention, a bisphenol-based epoxy resin having a structure of the following formula (2) is mixed and used for the purpose of lowering the viscosity to a naphthalene epoxy resin having the structure of the following formula (1) as the epoxy resin.
(상기 화학식에서, R은 수소원자 또는 메틸기임)(Wherein R is a hydrogen atom or a methyl group)
상기 나프탈렌계 에폭시 수지와 비스페놀계 에폭시 수지는 각각 에폭시 당량이 130~160 및 160~190인 고순도의 에폭시 수지이다. 바람직하게, 본 발명에 사용된 비스페놀계 에폭시 수지로는 비스페놀-A형, 비스페놀-F형, 수소화 비스페놀-A형 및 수소화 비스페놀-B형으로 구성된 군에서 선택되는 1종을 단독으로 사용하거나, 또는 2종 이상을 혼합하여 사용한다.The naphthalene epoxy resin and the bisphenol epoxy resin are high purity epoxy resins having an epoxy equivalent of 130 to 160 and 160 to 190, respectively. Preferably, the bisphenol-based epoxy resin used in the present invention is used alone or selected from the group consisting of bisphenol-A type, bisphenol-F type, hydrogenated bisphenol-A type and hydrogenated bisphenol-B type, or 2 or more types are mixed and used.
본 발명의 조성물 중의 상기 에폭시 수지 성분의 총함량은 9~15중량%인 것이 바람직하다. 수지 함량이 9중량% 미만이면 본 발명에서 요구하는 정도의 물성을 얻을 수 없고, 15중량%를 초과하면 반응속도가 느려져서 공정시간이 길어지는 단점이 있다.It is preferable that the total content of the said epoxy resin component in the composition of this invention is 9-15 weight%. If the resin content is less than 9% by weight, the physical properties of the degree required by the present invention cannot be obtained. If the resin content is more than 15% by weight, the reaction rate is slowed, resulting in a long process time.
아울러, 상기에서 나프탈렌계 에폭시 수지:비스페놀계 에폭시 수지의 혼합비는 중량비로 60:40 내지 80:20의 범위에 드는 것이 바람직하다. 상기 나프탈렌계 에폭시 수지는 최종 경화물의 유리전이 온도에 영향을 주며, 사용량의 증가에 따라 패키지의 내열특성이 향상되는 효과가 있다. 따라서, 상기 나프탈렌계 에폭시 수지의 사용량이 전체 에폭시 수지의 60중량% 미만이고, 대신 상기 비스페놀계 에폭시 수지의 사용량이 전체 에폭시 수지의 40중량%를 초과하는 경우에는 최종 수지 조성물의 점도는 낮출 수 있으나, 유리전이 온도가 낮아져 경화물의 내열특성이 저하되는 단점이 있다. 반면, 상기 비스페놀계 에폭시 수지의 사용량이 전체 에폭시 수지의 20중량% 미만인 경우에는 최종 수지 조성물의 점도가 지나치게 높아져 작업성이 불량해지는 단점이 있다.In addition, it is preferable that the mixing ratio of a naphthalene type epoxy resin: bisphenol type epoxy resin falls in the range of 60: 40-80: 20 by weight ratio. The naphthalene-based epoxy resin has an effect on the glass transition temperature of the final cured product, and has an effect of improving the heat resistance characteristics of the package as the amount of the increase increases. Therefore, when the amount of the naphthalene-based epoxy resin is less than 60% by weight of the total epoxy resin, and instead the amount of the bisphenol-based epoxy resin is more than 40% by weight of the total epoxy resin, the viscosity of the final resin composition may be lowered. In addition, the glass transition temperature is low, there is a disadvantage that the heat resistance of the cured product is lowered. On the other hand, when the amount of the bisphenol-based epoxy resin is less than 20% by weight of the total epoxy resin, the viscosity of the final resin composition is too high, there is a disadvantage that the workability is poor.
본 발명에서는 경화제로서 하기 화학식 3의 구조를 갖는 트리알킬테트라하이드로프탈산 무수물과 하기 화학식 4의 구조를 갖는 메틸테드라하이드로프탈산 무수물을 혼합하여 사용한다.In the present invention, a trialkyltetrahydrophthalic anhydride having a structure represented by the following formula (3) and a methyltetrahydrophthalic anhydride having the structure represented by the following formula (4) are used as a curing agent.
(상기 화학식에서, R1, R2및 R3는 각각 알킬기 또는 알케닐기이며, R1+R2+R3=C6H15를 만족함)(In the above formula, R 1 , R 2 and R 3 are each an alkyl group or an alkenyl group, and satisfies R 1 + R 2 + R 3 = C 6 H 15. )
상기 트리알킬테트라하이드로프탈산 무수물과 메틸테트라하이드로프탈산 무수물은 각각 분자량이 210~250 및 150~170인 고순도의 산무수물이다. 본 발명의 조성물 중의 상기 경화제 성분의 총함량은 10~15중량%인 것이 바람직하다. 경화제 함량이 10중량% 미만이면 경화속도가 느려지고, 15중량%를 초과하면 패키지 내에 잔류물이 형성되어 신뢰성이 저하된다.The trialkyltetrahydrophthalic anhydride and methyltetrahydrophthalic anhydride are high purity acid anhydrides having a molecular weight of 210 to 250 and 150 to 170, respectively. It is preferable that the total content of the said hardening | curing agent component in the composition of this invention is 10-15 weight%. If the content of the curing agent is less than 10% by weight, the curing rate is slowed down, and if the content of the curing agent is more than 15% by weight, residues are formed in the package, thereby lowering the reliability.
아울러, 상기에서 트리알킬테트라하이드로프탈산 무수물:메틸테트라하이드로프탈산 무수물의 혼합비는 중량비로 50:50 내지 70:30의 범위에 드는 것이 바람직하다. 만일 상기 트리알킬테트라하이드로프탈산 무수물의 사용량이 전체 경화제의 50중량% 미만이고, 대신 메틸테트라하이드로프탈산 무수물의 사용량이 전체 경화제의 50중량%를 초과하는 경우에는 최종 수지 조성물의 수분흡수율이 증가하여 신뢰성이 저하된다. 반면, 상기 트리알킬테트라하이드로프탈산 무수물의 사용량이 증가할수록 내습특성이 향상되어 패키지의 신뢰성이 개선되긴 하나, 전체 경화제의 70중량%를 초과하는 양으로 사용할 경우에는 봉지재의 점도가 지나치게 증가되어 작업성이 현저히 저하된다.In addition, the mixing ratio of trialkyltetrahydrophthalic anhydride: methyltetrahydrophthalic anhydride in the above is preferably in the range of 50:50 to 70:30 by weight. If the amount of the trialkyltetrahydrophthalic anhydride is less than 50% by weight of the total curing agent, and instead the amount of methyltetrahydrophthalic anhydride exceeds 50% by weight of the total curing agent, the water absorption of the final resin composition is increased Is lowered. On the other hand, as the amount of the trialkyltetrahydrophthalic anhydride used increases, the moisture resistance is improved to improve the reliability of the package, but when used in an amount exceeding 70% by weight of the total curing agent, the viscosity of the encapsulant is excessively increased, resulting in workability. This is significantly lowered.
본 발명에서는 경화촉진제로서 하기 화학식 5의 구조를 갖는 이미다졸계 촉매를 사용한다. 하기 화학식 5에서 R1, R2및 R3로 표현되는 작용기의 종류에 따라 촉매활성이 약간씩 달라져 겔화시간에 차이가 발생하나, 본 발명의 범위내에서 촉매 사용량의 증감을 통하여 겔화시간을 적절히 조절할 수 있다.In the present invention, an imidazole catalyst having a structure represented by the following Chemical Formula 5 is used as a curing accelerator. In the following Chemical Formula 5, the catalytic activity varies slightly depending on the type of functional groups represented by R 1 , R 2, and R 3 , resulting in a difference in gelation time. However, within the scope of the present invention, gelation time is appropriately increased by increasing or decreasing the amount of catalyst used. I can regulate it.
(상기 화학식에서, R1, R2및 R3는 각각 독립적으로 수소원자, 메틸기, 에틸기, 페닐기, 시아노에틸기 또는 벤질기임)(In the above formula, R 1 , R 2 and R 3 are each independently a hydrogen atom, methyl group, ethyl group, phenyl group, cyanoethyl group or benzyl group)
본 발명의 조성물 중의 상기 경화촉진제 성분의 총함량은 0.1~0.5중량%인 것이 바람직하다. 경화촉진제 함량이 0.1중량% 미만이면 경화 속도가 느려져서 생산성이 감소하고, 0.5중량%를 초과하면 원하는 경화 특성을 얻을 수 없을 뿐만 아니라 수지 조성물의 보관안정성이 나빠져서 좋지 않다.It is preferable that the total content of the said hardening accelerator component in the composition of this invention is 0.1 to 0.5 weight%. If the content of the curing accelerator is less than 0.1% by weight, the curing rate is slowed to decrease the productivity. If the content of the curing accelerator is more than 0.5%, the desired curing properties are not obtained, and the storage stability of the resin composition is not good.
본 발명에서는 무기충전제로서 바람직하게는 평균입도가 0.1~10.0㎛인 용융또는 합성 실리카를 사용한다.In the present invention, as the inorganic filler, fused or synthetic silica having an average particle size of preferably 0.1 to 10.0 µm is used.
본 발명의 조성물 중의 상기 무기충전체 성분의 총함량은 70~80중량%인 것이 바람직하다. 무기충전체 함량이 70중량% 미만이면 경화물의 충분한 강도와 저열팽창화를 실현할 수 없으며 또한 수분의 침투가 용이해져 신뢰성이 저하되고, 80중량%를 초과하면 최종 수지 조성물의 유동특성의 저하로 인하여 성형성이 나빠질 우려가 있다.It is preferable that the total content of the said inorganic filler component in the composition of this invention is 70 to 80 weight%. If the inorganic filler content is less than 70% by weight, sufficient strength and low thermal expansion of the cured product may not be realized, and the penetration of moisture may be easy, resulting in a decrease in reliability. There exists a possibility that a moldability may worsen.
상술한 필수 성분들 이외에도, 본 발명의 수지 조성물에는 카본블랙 및 유·무기염료 등의 착색제, 커플링제, 소포제 등을 필요에 따라서 추가로 첨가할 수 있다.In addition to the essential components mentioned above, to the resin composition of the present invention, colorants such as carbon black and organic and inorganic dyes, coupling agents, antifoaming agents and the like can be further added as necessary.
본 발명의 액상 에폭시 수지 조성물을 제조하기 위한 방법은 특별히 제한되지 않으며, 예를 들면, 에폭시 수지, 경화제, 경화촉진제, 무기충전제 등의 각종 성분을 동시에 또는 순차적으로 필요에 따라 가열처리를 하면서 교반, 혼합, 분산시킴으로써 원하는 수지 조성물을 얻을 수 있다. 상기 교반, 혼합, 분산 등에 사용되는 장치 역시 본 발명의 목적을 저해하지 않는 한 특별히 한정되지 않고, 교반 및 가열장치를 구비한 통상의 혼합분쇄기, 3축 롤밀, 볼밀, 유성형 혼합기 등을 사용할 수 있으며, 이러한 장치들중 둘 이상을 적절하게 조합하여 사용할 수도 있다.The method for producing the liquid epoxy resin composition of the present invention is not particularly limited, and for example, various components such as an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, or the like, may be stirred simultaneously or sequentially as needed while stirring, The desired resin composition can be obtained by mixing and dispersing. The apparatus used for stirring, mixing, dispersing, etc. is not particularly limited as long as the object of the present invention is not impaired, and a conventional mixing grinder, a three-axis roll mill, a ball mill, a planetary mixer with a stirring and heating device may be used. However, two or more of these devices may be used in combination as appropriate.
상술한 바와 같이 제조된 본 발명의 액상 에폭시 수지 조성물의 점도는 25℃에서 25,000~45,000cps, 바람직하게는 25,000~40,000cps의 범위내에 들어야 한다. 만일 수지 조성물의 점도가 상기 범위를 벗어나는 경우에는 패키지 성형시 디스펜싱 공정에서의 작업성이 불량해진다.The viscosity of the liquid epoxy resin composition of the present invention prepared as described above should be in the range of 25,000 ~ 45,000cps, preferably 25,000 ~ 40,000cps at 25 ℃. If the viscosity of the resin composition is out of the above range, workability in the dispensing process during package molding becomes poor.
본 발명의 액상 에폭시 수지 조성물을 사용한 패키지 성형은 통상의 디스펜싱 공정에 따라 수행될 수 있으며, 후경화를 위해서는 120℃에서 0.5시간 이상 경화후 150℃에서 0.5시간 이상 더 경화하는 것이 바람직하다. 120℃에서 0.5시간 미만 경화시에는 경화후에 공극발생이 관찰되며, 150℃에서 0.5시간 미만 경화시에는 충분한 경화 특성을 얻을 수 없다.Package molding using the liquid epoxy resin composition of the present invention can be carried out according to a conventional dispensing process, it is preferable to further cure at 150 ℃ more than 0.5 hours after curing at 120 ℃ for more than 0.5 hours. Porosity is observed after curing at 120 ° C. for less than 0.5 hours, and sufficient curing properties cannot be obtained when curing at 150 ° C. for less than 0.5 hours.
본 발명의 에폭시 수지 조성물에는 상술한 바와 같이 용매가 함유되지 않았기 때문에 성형시 공정성이 우수할 뿐만 아니라 경화후 굴곡강도가 크고, 높은 내열특성을 가지므로, 캐비티 다운형 볼그리드어레이 패키지에 적용시 매우 우수한 신뢰도 특성을 달성할 수 있다.Since the epoxy resin composition of the present invention does not contain a solvent as described above, it is not only excellent in processability during molding but also has a high flexural strength after curing, and has high heat resistance, so when applied to a cavity down-type ball grid array package, Excellent reliability characteristics can be achieved.
이하, 실시예를 통하여 본 발명을 보다 구체적으로 설명하고자 하나, 이러한 실시예들은 단지 설명의 목적을 위한 것으로 본 발명을 제한하는 것으로 해석되어서는 안된다.Hereinafter, the present invention will be described in more detail with reference to examples, but these examples are for illustrative purposes only and should not be construed as limiting the present invention.
실시예 1~3 및 비교예 1~4Examples 1-3 and Comparative Examples 1-4
실시예 및 비교예에서 제조된 에폭시 수지 조성물의 조성과 제반물성 및 신뢰성 평가결과를 하기 표 1에 나타내었다.The composition, the overall physical properties, and the reliability evaluation results of the epoxy resin compositions prepared in Examples and Comparative Examples are shown in Table 1 below.
注) 1) HP-4032D (DIC사(社), 일본)1) HP-4032D (DIC Corporation, Japan)
2) YL-980 (JER(社), 일본)2) YL-980 (JER, Japan)
3) YL-983U (JER(社), 일본)3) YL-983U (JER, Japan)
4) YH-306 (JER(社), 일본)4) YH-306 (JER, Japan)
5) B-570 (DIC(社), 일본)5) B-570 (DIC, Japan)
6) KS-603 (Shinetsu(社), 일본)6) KS-603 (Shinetsu, Japan)
[물성 및 신뢰성 평가 방법][Method of property and reliability evaluation]
1) 점도1) viscosity
Cone & Plate 형 Brookfield 점도계를 사용하여 25℃에서 측정Measurement at 25 ° C using Cone & Plate type Brookfield Viscometer
2) 유리전이온도(Tg), 열팽창계수2) Glass transition temperature (Tg), thermal expansion coefficient
TMA(Thermomechanical Analyser)로 평가(승온속도 10℃/min)Evaluation by TMA (Thermomechanical Analyser)
3) 굴곡강도3) flexural strength
UTM(Universal Test Machine)을 이용하여 ASTM D190에 의거 평가Evaluation according to ASTM D190 using UTM (Universal Test Machine)
4) 흡수율4) Absorption rate
PCT(Pressure Cooker Tester)를 사용하여 121℃, 2기압의 조건하에서 24시간 동안 흡습시킨 후 무게변화를 측정Weight change was measured after absorbing for 24 hours under conditions of 121 ℃ and 2 atmospheres using a pressure cooker tester (PCT).
5) 신뢰도(Precon Test)5) Precon Test
JEDEC, JESD22-A113에 의거 레벨 2에서 평가한 후 C-SAM을 사용하여 박리평가Peeling evaluation using C-SAM after evaluation at level 2 in accordance with JEDEC, JESD22-A113
6) 경화후 평활도6) Smoothness after curing
3차원 표면측정기를 사용하여 경화된 패키지 표면의 높이 차이를 측정Measure the height difference of the cured package surface using a three-dimensional surface measuring instrument
상기 표 1의 결과에서 볼 수 있듯이, 에폭시 수지중 나프탈렌계의 구성비가 60중량% 이상이고, 경화제중 트리알킬테트라하이드로프탈산 무수물의 구성비가 50중량% 이상인 경우에, 25,000cps 이상 40,000cps 이하의 범위내에 드는 적절한 점도를 유지함과 동시에 캐비티 다운형 볼그리드어레이 패키지 성형시 안정된 작업성과 우수한 신뢰도 특성을 확보할 수 있었다.As can be seen from the results in Table 1 above, when the composition ratio of naphthalene-based epoxy resin in the epoxy resin is 60% by weight or more and the composition ratio of trialkyltetrahydrophthalic anhydride in the curing agent is 50% by weight or more, the range of 25,000 cps or more and 40,000 cps or less While maintaining the proper viscosity within the mold, it was possible to secure stable workability and excellent reliability characteristics when forming a cavity down ball grid array package.
이상에서 상세히 설명한 바와 같이, 본 발명의 에폭시 수지 조성물을 캐비티 다운형 볼그리드어레이 패키지에 적용하면 우수한 공정성, 내습성 및 신뢰성을 확보할 수 있다.As described above in detail, when the epoxy resin composition of the present invention is applied to a cavity down ball grid array package, excellent processability, moisture resistance, and reliability can be ensured.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0087478A KR100479856B1 (en) | 2001-12-28 | 2001-12-28 | Liquid epoxy resin composition for use in cavity-down type ball grid array package |
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| Application Number | Priority Date | Filing Date | Title |
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| KR10-2001-0087478A KR100479856B1 (en) | 2001-12-28 | 2001-12-28 | Liquid epoxy resin composition for use in cavity-down type ball grid array package |
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| KR20030057105A true KR20030057105A (en) | 2003-07-04 |
| KR100479856B1 KR100479856B1 (en) | 2005-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR10-2001-0087478A KR100479856B1 (en) | 2001-12-28 | 2001-12-28 | Liquid epoxy resin composition for use in cavity-down type ball grid array package |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07292077A (en) * | 1994-04-28 | 1995-11-07 | Nitto Denko Corp | Epoxy resin composition for casting |
| KR100189095B1 (en) * | 1996-06-21 | 1999-06-01 | 유현식 | Epoxy resin compositions for sealing semiconductor precisely |
| US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| US6117953A (en) * | 1998-01-22 | 2000-09-12 | Shin-Etsu Chemical Co., Ltd. | Liquid epoxy resin composition for ball grid array package |
| JP4577536B2 (en) * | 1998-12-28 | 2010-11-10 | ナガセケムテックス株式会社 | Epoxy resin composition and method for sealing LSI using the same |
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| KR100479856B1 (en) | 2005-03-30 |
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