KR20030017269A - Bed cooling and heating device using thermo electric module - Google Patents
Bed cooling and heating device using thermo electric module Download PDFInfo
- Publication number
- KR20030017269A KR20030017269A KR1020010051495A KR20010051495A KR20030017269A KR 20030017269 A KR20030017269 A KR 20030017269A KR 1020010051495 A KR1020010051495 A KR 1020010051495A KR 20010051495 A KR20010051495 A KR 20010051495A KR 20030017269 A KR20030017269 A KR 20030017269A
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- heat
- bed
- plate
- thermoelectric semiconductor
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Classifications
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C21/00—Attachments for beds, e.g. sheet holders, bed-cover holders; Ventilating, cooling or heating means in connection with bedsteads or mattresses
- A47C21/04—Devices for ventilating, cooling or heating
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
본 발명은 열전 반도체를 이용한 침대 상판재를 냉온(冷溫)시킬 수 있는 침대에 관한 것으로서 열전 반도체 구동 전원을 저압의 직류 전기를 사용하므로 전자파, 화재, 감전 등의 위험요소가 없어 노약자, 임산부등이 안심하고 사용할 수 있는 장점이 있다.The present invention relates to a bed capable of cooling the bed top plate material using thermoelectric semiconductor. Since the thermoelectric semiconductor driving power source uses low voltage direct current electricity, there is no risk of electromagnetic waves, fire, electric shock, etc. This has the advantage of being used with confidence.
특히 열전 반도체의 극성을 전화시켜 동절기에는 상판재를 뜨겁게 해주고, 하절기에는 상판재를 차갑게 할 수 있도록 함과 아울러, 열전 반도체 하부에 설치된 방열판과 냉각팬을 개선하여 소음이 적은 방열 구조로 냉각 혹은 가열 효율이 보다 향상 되도록 열전 반도체를 이용한 침대 상판재 냉온에 관한 것이다.In particular, the polarization of the thermoelectric semiconductor is reversed to make the top plate hot in winter, and the top plate cool in the summer, and the heat sink and cooling fan installed in the lower part of the thermoelectric semiconductor are improved for cooling or heating with a low heat dissipation structure. It relates to the cold temperature of the bed top plate using a thermoelectric semiconductor so as to improve the efficiency.
온열 효과만을 위한 기능의 침대는 일반적으로 교류 전기를 사용하므로 전자파, 화재, 감전등의 위험 요소를 지니고 있어 노약자나 임산부 뿐만 아니라 일반인도 사용을 기피하는 문제점이 있었다.The bed only for the thermal effect has a problem of electromagnetic waves, fire, electric shock, etc., because the use of alternating current generally has a problem of avoiding the use of the elderly and pregnant women as well as the public.
상기한 바와 같은 문제점을 해결하기 위한 본 발명의 목적은 침대 상판재를 냉온 시킬 수 있는 기능을 갖고 온도조절기에 구성된 극성 전천스위치를 이용하여 동절기에는 침대 상판재를 뜨겁게 해주고 하절기에는 상판재를 차갑게 할 수 있는침대 상판재 냉,온 기능을 제공하면서 저압의 직류전기를 사용함으로 전자파 및 화재, 감전 등의 위험요소가 없어 노약자나 임산부가 안심하고 사용할 수 있는 것에 있다.An object of the present invention for solving the problems as described above is to have a function to cool the bed top plate and to make the bed top plate in the winter and to cool the top plate in the summer season by using a polarized electric switch configured in the temperature controller It can be used by the elderly and pregnant women with low risk of electric wave, fire, electric shock, etc. by using low voltage direct current while providing cold and hot function.
도 1 은 본 발명에 따른 열전 반도체를 이용한 침대 상판재 냉온 장치 부분분해 사시도.1 is a partially exploded perspective view of a bed top plate cold temperature device using a thermoelectric semiconductor according to the present invention.
도 2 는 도 1의 단면도.2 is a cross-sectional view of FIG.
도 3 은 본 발명에 따른 침대 상판재 냉온 장치 분해 조립 사시도.3 is an exploded perspective view of the bed top plate cold and warm device according to the present invention.
도 4 는 본 발명에 따른 냉온 장치 전원 공급 제어 블록도.Figure 4 is a cold and hot power supply control block diagram according to the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
(100) : 침대 후레임 (200) : 상판재100: bed frame 200: top plate
(300) : 단열재 (10) : 전열판300: heat insulating material 10: heat transfer plate
(11) : 체결볼트 (12) : 단열칼라(11): Fastening bolts (12): Insulation collar
(13) ; 서모스탯 (20) : 열전 반도체(13); Thermostat 20: Thermoelectric Semiconductor
(30) ; 방열판 (31) : 체결홀30; Heat Sink 31: Fastening Hole
(32) : 체결너트 (33) : 송풍관(32): Fastening nut (33): Blowing pipe
(34) : 냉각팬 (35) : 송풍관체결볼트(34): Cooling fan (35): Blowing pipe fastening bolt
(36) : 송풍관 체결홀 (40) : 온도조절기(36): Blowing pipe fastening hole (40): Temperature controller
(41) : 극성전환부 (42) : 전원공급 릴레이부(41): polarity switching unit (42): power supply relay unit
(43) : 온도조절스위치 (44) : 과열차단부(43): temperature control switch (44): overheat cutoff
(45) : 서모스텟 (50) : 정류기(45): thermostat (50): rectifier
이와 같은 목적을 달성하기 위한 본 발명의 실시예를 하기에서 첨부된 도면을 참조하여 보다 상세하게 살펴본다.An embodiment of the present invention for achieving the above object will be described in more detail with reference to the accompanying drawings.
도 1 은 본 발명에 따른 열전 반도체가 부착된 침대 상판재를 냉,온 장치를 나타내는 부분 분해 사시도이고,1 is a partially exploded perspective view of a bed top plate material with a thermoelectric semiconductor according to the present invention showing a cold and warm device,
도 2 는 도 1 의 단면도이며2 is a cross-sectional view of FIG.
도 3 은 본 발명에 따른 침대의 냉온장치 분해조립 예를 나타내는 사시도이고,3 is a perspective view showing an example of disassembly and assembly of a cold and warm device of a bed according to the present invention;
도 4 는 전원공급제어 블록도이다.4 is a power supply control block diagram.
본 발명에 따른 열전 반도체가 부착된 침대 상판재 냉온 장치는 도 1내지 도 4에 나타내는 바와 같이 상부에 상판재(200)가 침대후레임(100)안에 형성되고 상판재(200)와 전열판(10)을 밀착 체결함에 있어 열전도율을 높게 하기 위하여 전열판(10) 상단부에 방열 구리스를 도포한 뒤 체결한다.In the bed top plate cold temperature apparatus with a thermoelectric semiconductor according to the present invention, the top plate 200 is formed in the bed frame 100 on the top as shown in FIGS. 1 to 4, and the top plate 200 and the heat transfer plate 10 are provided. In close contact with the fastening after applying a heat-dissipating grease to the upper end of the heat transfer plate 10 in order to increase the thermal conductivity.
상판재(200)하부에 알미늄재 전열판(10)과 열전 반도체(20)를 사이에 두고 방열판(30)과 체결할 수 있는 체결볼트(11)와 알미늄재 전열판(10)과 방열단(30)체결시 체결볼트(11)를 통하여 전도되는 열을 막기 위하여 단열칼라(12)를 전열판(10) 체결홀 부터 방열판의 체결홀(31)까지 관통하고 열전 반도체(20) 상하부에 열전도율을 높게 하기 위하여 방열구리스 처리를 하고 전열판(10)과 방열판(30) 사이에 삽입하고 체결볼트(11)에 체결너트(31)을 이용하여 체결한다.The fastening bolt 11 and the aluminum plate 10 and the heat dissipation end 30 which can be fastened to the heat sink 30 with the aluminum plate 10 and the thermoelectric semiconductor 20 interposed therebetween. In order to prevent heat conducting through the fastening bolt 11 at the time of fastening, the heat insulating color 12 penetrates from the fastening hole of the heat transfer plate 10 to the fastening hole 31 of the heat dissipation plate and to increase the thermal conductivity in the upper and lower portions of the thermoelectric semiconductor 20. The heat dissipation grease process is inserted between the heat transfer plate 10 and the heat dissipation plate 30 and fastened to the fastening bolt 11 by using the fastening nut 31.
방열효과를 돕는 송풍관(33)과 냉각팬(34)이 일체화 된 것을 송풍관 체결볼트(35)를 사용하여 송풍관 체결홀(36)에 밀착 체결되는 구조로 구성된다.The blower tube 33 and the cooling fan 34 which help the heat dissipation effect are integrated into the blower tube fastening hole 36 by using the blower tube fastening bolt 35.
상기한 바와 같이 구성된 본 발명에 따른 열전 반도체를 이용한 침대 상판재냉온방법을 하기에서 살펴본다.Below is a look at the bed top plate cold-temperature method using a thermoelectric semiconductor according to the present invention configured as described above.
우선 펠티어 현상 (peltier effect)을 설명하면 열전 반도체(Thermo Electric Module)에 직류전기를 가해주면 Negative로 대전된 금속/반도체 접점에서는 주위로부터 열에너지를 흡수한 전자가 열전 반도체 내부로 이동하여 한쪽면은 냉각이 일어나고 다른 한쪽면은 발열이 일어나는 현상이다.First of all, the peltier effect is explained by applying a direct current electric current to a thermoelectric module. At a metal / semiconductor contact that is negatively charged, electrons absorbing thermal energy from the surroundings move into the thermoelectric semiconductor and one side is cooled. This happens and the other side is a fever.
이 상태에서 전극의 극성을 바꾸어주면 냉각쪽은 발열이 일어나고 발열쪽은 냉각이 일어난다.In this state, if the polarity of the electrode is changed, the cooling side generates heat and the heating side generates cooling.
이현상을 이용하여 침대 상판재는 냉,온 시킬수 있는 것이다.Using this phenomenon, bed tops can be cold and warm.
먼저 하절기 사용시 상판재 냉각에 대하여 설명하면 아래와 같다.First, the cooling of the upper plate during summer use will be described.
도 4의 온도조절기(40)에서 극성전화부(41)의 냉,온 중 냉을 선택하면 전원공급 릴레이부(42)의 릴레이접점을 통하여 열전 반도체에 저압의 직류전기가 인가되어 펠티어 현상이 일어난다.When the temperature controller 40 of FIG. 4 selects cold / cold temperature of the polarity telephone part 41, a low voltage direct current is applied to the thermoelectric semiconductor through a relay contact of the power supply relay part 42, and a Peltier phenomenon occurs.
여기서 전열판(10)은 차갑게 되고 방열판(30)은 뜨거워진다.Here, the heat transfer plate 10 becomes cold and the heat sink 30 becomes hot.
뜨거워진 방열판의 열을 효율적으로 방출시켜야만 냉각효율이 극대화되므로 방열판(30)에 송풍과(33) 일체형으로 형성된 냉각팬(34)이 송풍함으로 방열판(30)을 냉각시켜 전열판(10)의 냉각을 극대화할 수 있다.Cooling efficiency is maximized only when the heat of the heat sink is efficiently released, so the cooling fan 34 formed integrally with the air blower 33 on the heat sink 30 is blown to cool the heat sink 30 to cool the heat sink 10. It can be maximized.
상기와 같이 전열판(10)은 차갑고 방열판(30)은 뜨거우므로 이 열의 전도를 방지할 수 있는 단열 칼라(12)와 전열판(10)과 방열판(30)의 경계면에 단열재(300)처리를 한다.As described above, since the heat transfer plate 10 is cold and the heat sink 30 is hot, the heat insulating material 300 is treated at the interface between the heat insulation collar 12 and the heat transfer plate 10 and the heat sink 30 which can prevent the conduction of heat.
위와 반대로 동절기 온열효과를 위한 조작 방법은 극성전환부(41)의 온을 선택함으로 상판재 냉각과 반대로 상판재 온열 효과를 얻을 수 있다.In contrast to the above operation method for the winter heat effect by selecting the on of the polarity switching unit 41 can be obtained the heat effect of the top plate material as opposed to the top plate cooling.
상기와 같은 본 발명에 따르면 동절기, 하절기에 사용자의 선택에 따라 침대 상판제를 뜨겁게 혹은 차갑게 할 수 있으므로 사계절 감각에 맞추어 사용할 수 있으며 교류전기가 아닌 직류 저전압 전기를 사용함으로 전자파 화재 감전 등의 위험요소가 없어 노약자나 임산부가 안심하고 사용할수 있는 효과가 있다.According to the present invention as described above, it can be used according to the user's choice during the winter season, summer season can be hot or cold, can be used according to the four seasons sense and risk factors such as electromagnetic wave fire electric shock by using DC low voltage electricity, not AC electricity There is no effect that the elderly and pregnant women can use with confidence.
한편 본 발명은 그에 관한 최선의 실시예를 예거하였으나, 굳이 이에 한정되는 것은 아니며 첨부된 청구 범위에 국한되어 본 발명의 범위를 벗어나지 않고 실시 될 수 있다면 지금까지 설명된 실시예의 변경을 고려해 볼 수도 있음은 물론일것이다.Meanwhile, the present invention exemplifies the best embodiment thereof, but is not limited thereto, and if the present invention can be practiced without departing from the scope of the present invention, it may be considered to change the embodiments described so far. Of course.
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KR1020010051495A KR20030017269A (en) | 2001-08-24 | 2001-08-24 | Bed cooling and heating device using thermo electric module |
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KR1020010051495A KR20030017269A (en) | 2001-08-24 | 2001-08-24 | Bed cooling and heating device using thermo electric module |
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KR2020010025885U Division KR200255678Y1 (en) | 2001-08-25 | 2001-08-25 | Bed cooling and heating device using thermo electric module |
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KR1020010051495A KR20030017269A (en) | 2001-08-24 | 2001-08-24 | Bed cooling and heating device using thermo electric module |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100865918B1 (en) * | 2005-05-30 | 2008-10-29 | 유철현 | Bed capable coldness and warmth using thermoelectric element |
CN103251245A (en) * | 2013-06-09 | 2013-08-21 | 太仓苏晟电气技术科技有限公司 | Solar mattress control system and use method thereof |
KR101495639B1 (en) * | 2014-11-04 | 2015-02-26 | 윤정권 | Medical matrix and medical bed using the same |
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US4777802A (en) * | 1987-04-23 | 1988-10-18 | Steve Feher | Blanket assembly and selectively adjustable apparatus for providing heated or cooled air thereto |
US5166777A (en) * | 1987-04-22 | 1992-11-24 | Sharp Kabushiki Kaisha | Cooling apparatus for superconducting devices using Peltier effect cooling element |
US5555579A (en) * | 1994-03-03 | 1996-09-17 | Wu; Wen-Pin | Mattress assembly with semiconductor thermo-control |
KR19990037881A (en) * | 1999-02-10 | 1999-05-25 | 김준섭 | Bed using yellow earth pad |
KR20000006819A (en) * | 1999-11-05 | 2000-02-07 | 김병석 | Cool and warm device of sheet using thermal semiconductor |
-
2001
- 2001-08-24 KR KR1020010051495A patent/KR20030017269A/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5166777A (en) * | 1987-04-22 | 1992-11-24 | Sharp Kabushiki Kaisha | Cooling apparatus for superconducting devices using Peltier effect cooling element |
US4777802A (en) * | 1987-04-23 | 1988-10-18 | Steve Feher | Blanket assembly and selectively adjustable apparatus for providing heated or cooled air thereto |
US5555579A (en) * | 1994-03-03 | 1996-09-17 | Wu; Wen-Pin | Mattress assembly with semiconductor thermo-control |
KR19990037881A (en) * | 1999-02-10 | 1999-05-25 | 김준섭 | Bed using yellow earth pad |
KR20000006819A (en) * | 1999-11-05 | 2000-02-07 | 김병석 | Cool and warm device of sheet using thermal semiconductor |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100865918B1 (en) * | 2005-05-30 | 2008-10-29 | 유철현 | Bed capable coldness and warmth using thermoelectric element |
CN103251245A (en) * | 2013-06-09 | 2013-08-21 | 太仓苏晟电气技术科技有限公司 | Solar mattress control system and use method thereof |
KR101495639B1 (en) * | 2014-11-04 | 2015-02-26 | 윤정권 | Medical matrix and medical bed using the same |
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