KR20030008770A - Electric light using the pile up LED modules - Google Patents

Electric light using the pile up LED modules Download PDF

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Publication number
KR20030008770A
KR20030008770A KR1020010043673A KR20010043673A KR20030008770A KR 20030008770 A KR20030008770 A KR 20030008770A KR 1020010043673 A KR1020010043673 A KR 1020010043673A KR 20010043673 A KR20010043673 A KR 20010043673A KR 20030008770 A KR20030008770 A KR 20030008770A
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South Korea
Prior art keywords
led
bulb
light
power supply
power
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KR1020010043673A
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Korean (ko)
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KR100399039B1 (en
Inventor
박종발
전인석
윤진식
송동현
박준석
이현재
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금동조명주식회사
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Priority to KR10-2001-0043673A priority Critical patent/KR100399039B1/en
Publication of KR20030008770A publication Critical patent/KR20030008770A/en
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Publication of KR100399039B1 publication Critical patent/KR100399039B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

PURPOSE: An electric bulb is provided to radiate high quality white light in an effective manner by arranging maximum numbers of LEDs into the minimum configuration. CONSTITUTION: An electric bulb comprises a power supply unit(20) interposed between a bulb(40) and a socket(10), and which receives power from an external source and supplying current in a pulse width modulation system; LEDs having LED modules(30) arranged into a hexagonal shape on the power supply unit; and a connecting column for supplying power to LEDs. The power supply unit receives power from an external source through the socket, rectifies the power at a bridge diode through a thyristor, outputs the rectified power, connects a PWM IC to a gate of the thyristor, and sets a thyristor turn-on rate by the RC values of the capacitor and variable resistor connected to the PWM IC.

Description

ＬＥＤ모듈을 적층 형성한 전구{Electric light using the pile up LED modules}Light bulb laminated with LED modules {Electric light using the pile up LED modules}

본 발명은 전구에 관한 것으로서, 보다 상세하게는 최소 형태로 다수의 LED를 배치하고 이를 다층으로 형성시켜 백색광 및 다수의 광을 조사할 수 있는 LED모듈을 적층 형성한 전구에 관한 것이다.The present invention relates to a light bulb, and more particularly, to a light bulb in which a plurality of LEDs are arranged in a minimum form and formed in a multi-layered layer, and laminated with LED modules capable of irradiating white light and a plurality of lights.

LED(Light Emitting Diode)란 발광다이오드의 약자로서 빛을 발하는 반도체 소자를 말하여, 방출하는 빛의 색깔은 반도체 칩 구성원소의 배합에 따라 파장을 만들며, 이러한 파장이 빛의 색깔을 결정한다.Light Emitting Diode (LED) is an abbreviation of light emitting diode and refers to a semiconductor device that emits light. The color of emitted light creates a wavelength according to the composition of semiconductor chip components, and the wavelength determines the color of light.

현재 고휘도 LED에 주로 사용하는 Alumiium Gallium Indium Phosphide(AlGaInP) 칩에서는 Red부터 Amber까지, Indium Gallium Nitride(InGaN) 칩에서는 Blue 와 Green, 그리고 Blue chip에 Phosphor 기술을 접목하여 White LED까지 있다.In Alumiium Gallium Indium Phosphide (AlGaInP) chip, which is mainly used for high-brightness LED, from Red to Amber, and Indium Gallium Nitride (InGaN) chip, Blue and Green and Blue LED are combined with Phosphor technology to White LED.

그리고 기존의 일반 백열전구와 비교하면, LED 방식의 경우 전력 소모는 기존의 전구에 의한 것보다 약 30~50% 에너지 절감을 달성할 수 있게 된다. 왜냐하면, 기존 방식의 경우 열선(filament)을 가열하여 생기는 빛을 이용하기 때문에 열에 의한 손실이 크기 때문이다. 또한, 고온의 열선의 수명을 유지하기 위해, 불활성 개스나 진공의 전구를 필요로 하였었다In addition, compared with conventional incandescent bulbs, the power consumption of the LED method can achieve energy savings of about 30-50% compared to the conventional bulbs. This is because, in the conventional method, the loss caused by heat is large because light generated by heating a filament is used. In addition, in order to maintain the lifetime of hot wires, an inert gas or vacuum bulb was required.

즉, LED는 일반 백열전구에 비하여 소비전력은 1/5밖에 안되고, 반응시간은 1,000,000배나 빠르며, 수명은 반영구적으로서, 그 동안 각종 적용 분야에 현저히 발달, 향상되어 정밀 반도체 장비 검사 기구, 자동차 계기판 등의 전자 표시판, 전광판, 산업기계 표시기 및 각종 교통 안전 신호등에 사용되고 있다.In other words, the LED consumes only 1/5 of the power of a typical incandescent lamp, the reaction time is 1,000,000 times faster, and the life is semi-permanent. Electronic displays, electronic signs, industrial machine indicators and various traffic safety signals.

그러나 상기 백색LED는 청색칩과 황색인광체(phosphor)를 이용하였기에 연색성이 좋지 못한 단점을 가지고 있다. 따라서, 종래의 백열전구를 완전히 대체하기는 어려운 실정이다.However, the white LED has a disadvantage of poor color rendering because it uses a blue chip and a yellow phosphor. Therefore, it is difficult to completely replace the conventional incandescent lamp.

본 발명은 상기와 같은 문제점을 해결하기 위해 창안된 것으로서, 본 발명의 목적은 고품질의 백색광을 얻기 위해 최소형태로 최대의 LED를 배치할 수 있는 육각형 구조로 빛의 3원색인 적색, 녹색, 청색 LED를 이용하여 LED모듈을 형성하고 이를 다층으로 적층하여 형성된 전구와 이에 적합한 전원을 공급할 수 있는 전원공급회로가 내장된 LED모듈을 적층 형성한 전구를 제공함에 있다.The present invention was devised to solve the above problems, and an object of the present invention is a hexagonal structure in which the maximum LED can be arranged in a minimum form to obtain high quality white light, and the three primary colors of light are red, green, and blue. The present invention provides a light bulb in which an LED module is formed by using an LED, and a light bulb formed by stacking the multilayered LED and a LED module having a built-in power supply circuit capable of supplying a power suitable for the LED module.

상기 목적을 달성하기 위한 본 발명의 구성은, 통상의 나사산 형태의 소켓과 전구 형태로 이루어진 벌브로 형성된 전구에 있어서, 상기 벌브(40)의 하단부와 소켓(10) 사이에 외부의 상용전원을 입력받아 PWM방식으로 전류를 공급하는 전원공급부(20)와; 상기 전원공급부(20)의 상부에 육각형 형태로 다수의 LED기본모듈(300)을 구비한 다층의 LED기판(31,32,33)과; 상기 다층의 LED기판(31,32,33)에 전원을 공급하고 고정 지지하는 연결주(柱)(340)로 이루어지는 것을 특징으로 한다.The configuration of the present invention for achieving the above object, in the bulb formed of a bulb in the form of a bulb and a conventional screw type, the external commercial power source is input between the lower end of the bulb 40 and the socket 10 A power supply unit 20 for supplying current in a PWM manner; A multi-layered LED substrate (31, 32, 33) having a plurality of LED basic modules (300) in a hexagonal shape on top of the power supply (20); It is characterized in that it consists of a connecting column (340) for supplying and fixing power to the multi-layered LED substrate (31, 32, 33).

또한 바람직하게는 상기 전원공급부는, 외부의 상용전원을 소켓(10)을 통해 공급받아(IN) 사이리스터(21)를 통해 브릿지다이오드(23)에서 정류하여 출력하며(OUT), 상기 사이리스터(21)의 게이트에 PWM IC회로(22)를 연결하고 상기 PWM IC회로(22)에 연결된 커패시터(C)와 가변저항(R)의 RC값에 의해 사이리스터(21)의 도통비율을 설정하는 것을 특징으로 하고, 상기 LED기판은, 적색, 녹색, 청색 LED(R,G,B)를 삽입하여 삼각형 모양으로 형성된 LED 기본모듈(300)과; 상기 LED기본모듈(300) 삼각형의 2변에 요철(凹凸)형상의 결합돌기(320)와 결합홈(310)이 형성되어 6개의 LED기본모듈(300)을 연결하여 육각형을 형성하게 되며, 상기 결합돌기(320)와 결합홈(310)이 맞닿은 꼭지점이 소정크기로 절단되어 상기 연결주(340)에 삽입될 수 있도록 홀(330)이 형성되어 이루어지는 것을 특징으로 하며, 상기 LED기본모듈은, 동일한 색상의 LED로 구성되어 단색조명등으로 이루어지는 것을 특징으로 하고, 상기 LED기판은, 상기 전원공급부(20)에 가장 근접한 LED기판(33)의 재질은 빛을 반사하는 재질로 이루어지며, 상기 LED기판(33) 위에 적층되는 LED기판(31,32)은 빛을 투과하는 재질로 이루어지는 것을 특징으로 한다.Also preferably, the power supply unit receives the external commercial power through the socket 10 (IN) and rectifies and outputs the bridge diode 23 through the thyristor 21 (OUT), the thyristor 21 The PWM IC circuit 22 is connected to the gate of the circuit, and the conduction ratio of the thyristor 21 is set by the RC value of the capacitor C and the variable resistor R connected to the PWM IC circuit 22. The LED substrate may include: an LED base module 300 having a triangular shape by inserting red, green, and blue LEDs (R, G, B); On the two sides of the LED base module 300 triangle, the coupling protrusion 320 and the coupling groove 310 of the uneven shape (凹凸) is formed to connect the six LED base module 300 to form a hexagon. A vertex in contact with the coupling protrusion 320 and the coupling groove 310 is cut to a predetermined size, characterized in that the hole 330 is formed to be inserted into the connecting column 340, the LED basic module, Characterized in that the LED is composed of the same color and consisting of a single color light, the LED substrate, the material of the LED substrate 33 closest to the power supply 20 is made of a material that reflects light, the LED substrate The LED substrates 31 and 32 stacked on the 33 are made of a material that transmits light.

도1은 본 발명의 일실시 예에 따른 LED모듈을 이용한 전구,1 is a light bulb using an LED module according to an embodiment of the present invention,

도2는 도1의 LED모듈을 이용한 전구의 분해사시도,Figure 2 is an exploded perspective view of a light bulb using the LED module of Figure 1,

도3은 본 발명에 따른 LED모듈,3 is an LED module according to the present invention;

도4는 본 발명에 따른 LED모듈을 이용한 전구의 전원회로.Figure 4 is a power supply circuit of the bulb using the LED module according to the present invention.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

10: 소켓 20: 전원공급부10: socket 20: power supply

21: 사이리스터 22: PWM IC회로21: thyristor 22: PWM IC circuit

23: 브릿지 다이오드 30: LED모듈23: bridge diode 30: LED module

34: LED 40: 벌브34: LED 40: Bulb

300: LED 기본모듈 340: 연결주(柱)300: LED base module 340: connecting column (柱)

이하 첨부된 도면을 참조하여 본 발명의 LED모듈을 적층 형성한 전구에 대해 상세히 설명한다.Hereinafter, a light bulb in which the LED module of the present invention is laminated with reference to the accompanying drawings will be described in detail.

도1은 본 발명의 일실시 예에 따른 LED모듈을 적층 형성한 전구이고, 도2는 도1의 LED모듈을 적층 형성한 전구의 분해사시도이며, 도3은 본 발명에 따른 LED기판이고, 도4는 본 발명에 따른 LED모듈을 적층 형성한 전구의 전원회로이다1 is a bulb formed by stacking the LED module according to an embodiment of the present invention, Figure 2 is an exploded perspective view of a bulb formed by stacking the LED module of Figure 1, Figure 3 is an LED substrate according to the invention, Figure 4 is a power supply circuit of the bulb formed by laminating the LED module according to the present invention.

상기 도1 내지 도4를 참조하면, 통상의 나사산 형태의 소켓(10)을 구비하고 상기 소켓(10)의 상부에 통상의 전구 형태로 이루어진 벌브(bulb)(40)와, 상기 벌브(40)의 하단부와 소켓(10) 사이에 외부의 상용전원을 입력받아 PWM방식으로 전류를 공급하는 전원공급부(20)와, 상기 전원공급부(20)의 상부에 육각형 형태로 다수의 LED모듈(30)을 구비한 다층의 LED기판(31,32,33)과, 상기 다층의 LED기판(31,32,33)에 전원을 공급하고 고정 지지하는 연결주(柱)(340)로 구성된다.1 to 4, a bulb 40 having a conventional threaded socket type 10 and a bulb 40 formed on the upper portion of the socket 10 in the form of a conventional light bulb, and the bulb 40 are provided. Between the lower end and the socket 10 receives the external commercial power supply power supply unit 20 for supplying a current by the PWM method, and a plurality of LED modules 30 in the hexagonal shape on the top of the power supply unit 20 It is composed of a multi-layered LED substrate (31, 32, 33) and a connecting column (340) for supplying and fixing the power to the multi-layered LED substrate (31, 32, 33).

상기 LED모듈(30)은 도3에 도시된 바와 같이 적색, 녹색, 청색 LED(R,G,B)를삽입하여 삼각형 모양으로 LED 기본모듈(300)이 구성되며, 상기 LED 기본모듈(300) 6개가 결합되어 LED기판(31,32,33)이 구성된다.The LED module 30 is inserted into the red, green, blue LED (R, G, B) as shown in Figure 3, the LED base module 300 is configured in a triangular shape, the LED base module 300 Six are combined to form an LED substrate (31, 32, 33).

그리고 상기 LED기판(31,32,33)이 다층으로 바람직하게는 3개층으로 적층되어 LED모듈(30)이 형성된다.In addition, the LED substrates 31, 32, and 33 are stacked in a multi-layer, preferably three layers, thereby forming an LED module 30.

이 때 상기 LED기본모듈(300)은 삼각형의 2변에 요철(凹凸)형상의 결합돌기(320)와, 결합홈(310)이 형성되어 각각의 LED기본모듈(300)을 연결하게 된다. 즉, 최소의 면적으로 최대의 LED를 삽입하여 형성한 것이다.At this time, the LED base module 300 is formed on the two sides of the triangular convex (凹凸) -shaped coupling protrusion 320 and the coupling groove 310 is formed to connect the respective LED base module 300. That is, it is formed by inserting the largest LED with the smallest area.

그리고 상기 결합돌기(320)와 결합홈(310)이 맞닿은 꼭지점은 소정크기로 절단되어 상기 연결주(340)에 삽입될 수 있도록 홀(330)이 형성되어 LED기판(31,32,33)이 구성된다.In addition, the vertices where the coupling protrusion 320 and the coupling groove 310 are in contact with each other are cut into a predetermined size and a hole 330 is formed to be inserted into the connection column 340. It is composed.

상기 연결주(340)는 도2에 도시된 바와 같이 각각의 LED기판(31,32,33)에 전원을 공급하도록 양극단자(342)와 음극단자(341)가 형성되며, 상기 LED기판(31,32,33)의 가장 하층의 LED기판(33)의 재질은 고반사율을 가지는 물질로 형성되어 일부 밑으로 조사되는 빛을 반사하여 벌브(40) 밖으로 투사되도록 하며, 그 위의 2 LED기판(32,33)의 재질은 고투과율 물질로 형성되어 각각의 LED에서 발광하는 빛과 반사되어지는 빛 모두를 투과하여 벌브(40) 밖으로 투사되도록 구성된다.As shown in FIG. 2, the connecting column 340 has a positive electrode terminal 342 and a negative electrode terminal 341 to supply power to each of the LED substrates 31, 32, and 33, and the LED substrate 31 is formed. The material of the lowermost LED substrate 33 of the, 32, 33 is formed of a material having a high reflectance to reflect the light irradiated below a part to be projected out of the bulb 40, the two LED substrate ( 32 and 33 are made of a high transmissive material and are configured to transmit both the light emitted from each LED and the reflected light to be projected out of the bulb 40.

또한 도3에 도시된 바와 같이 LED기본모듈(300)을 단색의 LED만으로 구성하여 필요에 조명등으로 사용할 수 있음은 당업자라하면 용이하게 실시할 수 있을 것이다.In addition, as shown in FIG. 3, the LED basic module 300 may be configured as only a single color LED and used as a lighting lamp as required by those skilled in the art.

그리고 상기 전원공급부(20)는 종래의 직류전원으로 이용하는 PWM회로를 교류전원에 직접사용하여 PWM회로를 구성하는 별도의 직류전원 없이 간단하게 곧바로 교류전원에 사용하는 장점이 있는 것으로 도4에 도시된 바와 같이 외부의 상용전원이 소켓(10)을 통해 공급되면(IN), 사이리스터(21)를 통해 브릿지다이오드(23)에서 정류되어 상기 LED모듈(30)에 공급된다(OUT).In addition, the power supply unit 20 has a merit of simply using a conventional direct current (DC) power supply directly to an AC power source without using a separate direct current power source that constitutes a PWM circuit. As described above, when external commercial power is supplied through the socket 10 (IN), it is rectified by the bridge diode 23 through the thyristor 21 and supplied to the LED module 30 (OUT).

이 때 상기 사이리스터(21)는 PWM(pulse width modulation;펄스 폭 변조방식) IC회로(22)에서 발생되는 펄스가 게이트단자에 연결되어 상기 PWM IC회로에 각각 연결되어 있는 커패시터(C)와 가변저항(R)의 RC값 즉, 듀티(DUTY) 비율에 의한 펄스에 의해 사이리스터(21)의 도통비율로 일정한 전류값이 공급되어 진다.At this time, the thyristor 21 is a capacitor (C) and a variable resistor, the pulses generated from the pulse width modulation (PWM) IC circuit 22 is connected to the gate terminal and connected to the PWM IC circuit, respectively. The constant current value is supplied at the conduction ratio of the thyristor 21 by the RC value of (R), that is, the pulse by the duty ratio.

즉, 가변저항(R)의 간단한 조절로 부하전류를 미세하게 제어할 수 있어 적색, 녹색, 청색 LED의 광색을 용이하게 제어할 수 있게 된다. 또한 종래의 커패시터로 전류를 제어할 때처럼 위상차가 존재하지 않으며, PWM 방식이므로 전력효율 또한 증가한다.That is, the load current can be finely controlled by simple adjustment of the variable resistor R, so that the color of the red, green, and blue LEDs can be easily controlled. In addition, there is no phase difference as in the case of controlling current with a conventional capacitor, and the power efficiency also increases because of the PWM method.

상기와 같이 구성된 본 발명의 작용ㆍ효과를 살펴보면, 먼저 외부의 상용전원이 소켓(10)을 통해 공급되면, 상기 전원공급부(20)를 통해 소정의 전류가 RC 듀티비에 의해 발생된 펄스폭만큼의 소정시간 간격으로 일정하게 출력되어 상기 연결주(340)를 통해 LED모듈(30)에 공급된다.Looking at the operation and effect of the present invention configured as described above, when the external commercial power is first supplied through the socket 10, a predetermined current through the power supply unit 20 by the pulse width generated by the RC duty ratio Constantly output at predetermined time intervals of the supplied to the LED module 30 through the connection column 340.

공급된 전원은 각각의 LED기판(31,32,33)의 LED(34)에 공급되어 발광을 하게 된다.The supplied power is supplied to the LEDs 34 of the LED substrates 31, 32, and 33 to emit light.

즉, 3색으로 형성된 각각의 LED(34)에 의해 고품질의 백색광이 벌브(40)를통해 투사되게 된다.That is, high quality white light is projected through the bulb 40 by the respective LEDs 34 formed in three colors.

이 때 가장 하층의 LED기판(33)은 위쪽으로 모든 빛을 반사하는 재질로 이루어졌고, 상기 LED기판(33)의 상층 LED기판(31,32) 들은 고투과율 재질로 형성되었기 때문에 효율적으로 벌브(40) 바깥으로 빛을 투사하게 되는 것이다.At this time, the lowermost LED substrate 33 is made of a material that reflects all light upwards, and the upper LED substrates 31 and 32 of the LED substrate 33 are formed of a high transmittance material so that the bulb ( 40) Projecting light outward.

그리고 LED배치와 개수는 단일 RGB LED소자의 광도와 크기, 형태에 따라 LED기판 배치 형태와 적층되는 개수가 달라질 수 있으며, 적용되는 필요(밝기, 크기, 형태 등)에 따라서 LED모듈(30)이 가변될 수 있음은 당업자라하면 용이하게 실시할 수 있을 것이다.LED arrangement and number may vary depending on the brightness, size, and shape of a single RGB LED device. The variable may be easily implemented by those skilled in the art.

이와 같이, 본 발명의 상세한 설명에서는 구체적인 실시예(들)에 관해 설명하였으나, 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형이 가능함은 물론이다. 그러므로, 본 발명의 범위는 설명된 실시예(들)에 국한되어 정해져서는 안되며, 후술하는 청구범위 뿐만 아니라 이 청구범위와 균등한 것들에 의해 정해져야 한다.As described above, although the specific embodiment (s) have been described in the detailed description of the present invention, various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiment (s), but should be defined by the claims below and equivalents thereof.

상술한 바와 같이 본 발명에 따르면, 입력되는 상용전원을 부피가 많이 차지하는 트랜스포머에 의하지 않고 PWM방식으로 전류를 공급받아 적색, 녹색, 청색의 LED로 형성된 기본 모듈을 기판으로 형성하고 이를 다층으로 구성하여 효율적으로 백색광을 발광시켜 종래의 일반전구의 단점을 극복하고 LED 고유의 장점을 충분히 활용할 수 있는 실용적이고 효율적인 LED전구를 제공하는 효과가 있다.As described above, according to the present invention, a base module formed of red, green, and blue LEDs is formed as a substrate by receiving a current in a PWM method and not by a transformer that occupies a large amount of commercial power input, thereby configuring the multilayer structure. By efficiently emitting white light, there is an effect of providing a practical and efficient LED bulb that can overcome the disadvantages of the conventional general bulb and fully utilize the advantages of the LED.

Claims (5)

통상의 나사산 형태의 소켓과 전구 형태로 이루어진 벌브로 형성된 전구에 있어서,In a bulb formed of a bulb in the form of a conventional threaded socket and a bulb, 상기 벌브(40)의 하단부와 소켓(10) 사이에 외부의 상용전원을 입력받아 PWM방식으로 전류를 공급하는 전원공급부(20)와;A power supply unit 20 which receives an external commercial power source between the lower end of the bulb 40 and the socket 10 and supplies a current in a PWM manner; 상기 전원공급부(20)의 상부에 육각형 형태로 다수의 LED기본모듈(300)을 구비한 다층의 LED기판(31,32,33)과;A multi-layered LED substrate (31, 32, 33) having a plurality of LED basic modules (300) in a hexagonal shape on top of the power supply (20); 상기 다층의 LED기판(31,32,33)에 전원을 공급하고 고정 지지하는 연결주(柱)(340)로 이루어지는 것을 특징으로 하는 LED모듈을 적층 형성한 전구.Light bulbs laminated with LED modules, characterized in that consisting of a connecting column (340) for supplying and fixing power to the multi-layered LED substrate (31, 32, 33). 제1항에 있어서, 상기 전원공급부는,The method of claim 1, wherein the power supply unit, 외부의 상용전원을 소켓(10)을 통해 공급받아(IN) 사이리스터(21)를 통해 브릿지다이오드(23)에서 정류하여 출력하며(OUT), 상기 사이리스터(21)의 게이트에 PWM IC회로(22)를 연결하고 상기 PWM IC회로(22)에 연결된 커패시터(C)와 가변저항(R)의 RC값에 의해 사이리스터(21)의 도통비율을 설정하는 것을 특징으로 하는 LED모듈을 적층 형성한 전구.External commercial power is supplied through the socket 10 (IN) and rectified by the bridge diode 23 through the thyristor 21 (OUT), and the PWM IC circuit 22 to the gate of the thyristor 21 The light bulb of the LED module, characterized in that for connecting and setting the conduction ratio of the thyristor (21) by the RC value of the capacitor (C) and the variable resistor (R) connected to the PWM IC circuit (22). 제1항에 있어서, 상기 LED기판은,The method of claim 1, wherein the LED substrate, 적색, 녹색, 청색 LED(R,G,B)를 삽입하여 삼각형 모양으로 형성된 LED 기본모듈(300)과;An LED base module 300 having a triangular shape by inserting red, green, and blue LEDs (R, G, B); 상기 LED기본모듈(300) 삼각형의 2변에 요철(凹凸)형상의 결합돌기(320)와 결합홈(310)이 형성되어 6개의 LED기본모듈(300)을 연결하여 육각형을 형성하게 되며, 상기 결합돌기(320)와 결합홈(310)이 맞닿은 꼭지점이 소정크기로 절단되어 상기 연결주(340)에 삽입될 수 있도록 홀(330)이 형성되어 이루어지는 것을 특징으로 하는 LED모듈을 적층 형성한 전구.On the two sides of the LED base module 300 triangle, the coupling protrusion 320 and the coupling groove 310 of the uneven shape (凹凸) is formed to connect the six LED base module 300 to form a hexagon. Bulb formed by stacking the LED module, characterized in that a hole 330 is formed so that the vertex that the coupling protrusion 320 and the coupling groove 310 abuts is cut to a predetermined size and inserted into the connecting column 340. . 제1항 또는 제3항에 있어서, 상기 LED기본모듈은,According to claim 1 or 3, wherein the LED base module, 동일한 색상의 LED로 구성되어 단색조명등으로 이루어지는 것을 특징으로 하는 LED모듈을 적층 형성한 전구.Light bulb consisting of LED modules, characterized in that consisting of LED light of the same color consisting of a single color light. 제1항 또는 제3항에 있어서, 상기 LED기판은,The method of claim 1 or 3, wherein the LED substrate, 상기 전원공급부(20)에 가장 근접한 LED기판(33)의 재질은 빛을 반사하는 재질로 이루어지며, 상기 LED기판(33) 위에 적층되는 LED기판(31,32)은 빛을 투과하는 재질로 이루어지는 것을 특징으로 하는 LED모듈을 적층 형성한 전구.The LED substrate 33 closest to the power supply 20 is made of a material that reflects light, and the LED substrates 31 and 32 stacked on the LED substrate 33 are made of a material that transmits light. Bulbs formed by laminating the LED module, characterized in that.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060026227A (en) * 2004-09-20 2006-03-23 이익중 Led blub light
KR100683554B1 (en) * 2005-11-22 2007-02-16 왕재학 Limplight equipped with speaker
KR100763402B1 (en) * 2005-01-07 2007-10-05 엘지전자 주식회사 lighting apparatus
KR100869368B1 (en) * 2008-04-24 2008-11-19 (주)아이닉스 Led emitting apparatus
KR100987799B1 (en) * 2008-04-30 2010-10-13 버스텍 주식회사 Diffusing member and light emitting diode module, led lighting apparatus and led display apparatus using thereof
KR101102455B1 (en) * 2010-01-25 2012-01-09 오명호 LED Lamp

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060026227A (en) * 2004-09-20 2006-03-23 이익중 Led blub light
KR100763402B1 (en) * 2005-01-07 2007-10-05 엘지전자 주식회사 lighting apparatus
KR100683554B1 (en) * 2005-11-22 2007-02-16 왕재학 Limplight equipped with speaker
KR100869368B1 (en) * 2008-04-24 2008-11-19 (주)아이닉스 Led emitting apparatus
KR100987799B1 (en) * 2008-04-30 2010-10-13 버스텍 주식회사 Diffusing member and light emitting diode module, led lighting apparatus and led display apparatus using thereof
KR101102455B1 (en) * 2010-01-25 2012-01-09 오명호 LED Lamp

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