KR20020072630A - Conductive unsaturated polyester resin composition and a panel manufactured therewith - Google Patents

Conductive unsaturated polyester resin composition and a panel manufactured therewith Download PDF

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KR20020072630A
KR20020072630A KR1020010012549A KR20010012549A KR20020072630A KR 20020072630 A KR20020072630 A KR 20020072630A KR 1020010012549 A KR1020010012549 A KR 1020010012549A KR 20010012549 A KR20010012549 A KR 20010012549A KR 20020072630 A KR20020072630 A KR 20020072630A
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conductive
polyester resin
unsaturated polyester
weight
resin composition
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KR1020010012549A
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Korean (ko)
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안상욱
이영진
황재현
박동철
박재범
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주식회사 인트켐
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06Unsaturated polyesters
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/004Additives being defined by their length
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE: Provided are a conductive unsaturated polyester resin composition having excellent electrostatic dispersibility, soil resistance, durability, chemical resistance and appearance, and a conductive panel produced by using the same. CONSTITUTION: The conductive unsaturated polyester resin composition comprises 0.1-10 parts by weight of conductive fiber and/or 0.1-20 parts by weight of metal powder, and 0.3-2.5 parts by weight of hardening agent with respect to 100 parts by weight of unsaturated polyester resin having viscosity of 0.5-10 poise at ambient temperature(25 deg.C). The conductive fiber is at least one selected from the group consisting of Pitch- or PAN-based carbon fiber, stainless(SUS) fiber, and steel fiber having length of 0.1-12 mm.

Description

도전성 불포화 폴리에스테르 수지 조성물 및 이를 이용하여 제조되는 도전성 패널{Conductive unsaturated polyester resin composition and a panel manufactured therewith}Conductive unsaturated polyester resin composition and a conductive panel manufactured using the same

본 발명은 도전성 불포화 폴리에스테르 수지 조성물 및 이를 이용하여 제조되는 도전성 패널에 관한 것으로서, 더욱 상세하게는 불포화 폴리에스테르 수지와, 전도성 섬유 및/또는 금속 분말과, 경화제 등으로 구성되어 균일한 표면저항과 별도의 마감작업이 필요없는 자기 수평성을 나타내는 도전성 불포화 폴리에스테르 수지 조성물 및 이를 이용하여 제조되는 도전성 패널에 관한 것이다.The present invention relates to a conductive unsaturated polyester resin composition and a conductive panel manufactured using the same, and more particularly, to a uniform surface resistance composed of an unsaturated polyester resin, a conductive fiber and / or metal powder, a curing agent, and the like. The present invention relates to a conductive unsaturated polyester resin composition exhibiting self-leveling, which does not require a separate finishing operation, and a conductive panel manufactured using the same.

종래에는 건축물의 바닥면에 정전기를 방지할 목적으로 재료에 적절히 전기 전도성을 부여한 도전성 에폭시수지, 도전성 PVC타일, 도전성 카펫, 도전성 매트 등을 사용하여 왔다. 특히 전산실, 전자부품 공장 등에서는 대부분이 정전기 방지용 PVC타일 및 이를 이용하여 제조되는 정전기 방지용 이중바닥재 시설을 하고 있다.Conventionally, conductive epoxy resins, conductive PVC tiles, conductive carpets, conductive mats and the like that have appropriately provided electrical conductivity to materials have been used for the purpose of preventing static electricity on the floor of a building. In particular, computer rooms, electronic component factories, etc., most of the anti-static PVC tile and the anti-static double floors are manufactured using the same.

그러나 상기 도전성 에폭시 수지는 금속 분말 함침 시스템으로서 정전기 분산 특성이 떨어지는 단점이 있으며, 도전성 PVC계 타일 및 카펫트는 표면이 오염되기 쉬워 지속적으로 보수 및 왁스 작업이 필요하며, 내화성이 낮고 중량물의 이동시 파손 또는 변형의 우려가 있었다.However, the conductive epoxy resin is a metal powder impregnation system has a disadvantage of poor electrostatic dispersion characteristics, conductive PVC-based tiles and carpets are easily contaminated on the surface and need to be repaired and waxed continuously, low fire resistance and breakage when moving heavy objects or There was a fear of deformation.

따라서 중량물의 이동이 잦은 장소의 경우에는 변형, 들뜸 현상 및 접합 부분의 박리 현상이 더 빈번히 발생하여 유지 보수에 많은 비용이 소요되는 문제점이 있었다.Therefore, in the case of frequent movement of heavy materials, there is a problem in that deformation, lifting phenomenon and peeling phenomenon of the joint part occur more frequently, resulting in costly maintenance.

상기와 같은 문제점들을 개선하기 위하여 에폭시 수지의 정전기 분산 특성 개선 및 PVC계 타일 자체의 내구성 증진에 대한 연구 등이 활발히 진행되고 있으나, 아직은 만족스러운 성과를 얻지 못하고 있다.In order to improve the above problems, research on improving the electrostatic dispersion characteristics of the epoxy resin and improving the durability of the PVC-based tiles itself, but is actively progressing, but has not yet achieved satisfactory results.

한편, 본 발명자의 특허출원 제2000-0048333호 정전기 분산을 위한 전기전도성 조성물 및 이를 이용하여 제조되는 도전성 패널에는 우수한 정전기 분산성능 및 내구성 증진 효과를 나타내는 전기전도성 조성물 및 패널이 개시되어 있으나, 상기 전기전도성 조성물 및 패널은 표면이 기존 제품에 비하여 미려하지 못한 문제점이 있어 이의 개선이 요구되었다.On the other hand, the present inventors patent application No. 2000-0048333 of the electroconductive composition for electrostatic dispersion and the conductive panel manufactured using the same, but the electroconductive composition and panel exhibiting excellent electrostatic dispersion performance and durability enhancement effect is disclosed, the electrical The conductive composition and the panel has a problem that the surface is not beautiful compared to the existing product has been required for its improvement.

본 발명은 종래의 상기와 같은 문제점들을 해결하기 위하여 안출된 것으로서, 정전기 분산성이 우수할 뿐만 아니라, 내오염성, 내구성, 내약품성, 외장의 수려함을 향상시킨 도전성 불포화 폴리에스테르 수지 조성물 및 이를 이용하여 제조되는 인조대리석, 이중바닥재 패널 등의 전도성 패널을 제공하는 것을 목적으로 한다.The present invention has been devised to solve the above problems, the conductive unsaturated polyester resin composition and excellent use of the electrostatic dispersibility, improved pollution resistance, durability, chemical resistance, the appearance of the exterior and use thereof An object of the present invention is to provide a conductive panel such as artificial marble, a double floor panel manufactured.

본 발명의 상기 목적은 불포화 폴리에스테르 수지에 전도성 섬유 및/또는 금속분말, 경화제 등을 혼합하여 구성되는 도전성 불포화 폴리에스테르 수지와, 이를 이용하여 제조되는 도전성 패널을 제공함으로써 달성된다.The above object of the present invention is achieved by providing a conductive unsaturated polyester resin composed by mixing a conductive fiber and / or metal powder, a curing agent, and the like with an unsaturated polyester resin, and a conductive panel produced using the same.

상기 도전성 패널은 우수한 정전기 분산 효과를 나타낼 뿐만 아니라 내오염성, 내구성, 내약품성 등이 획기적으로 개선되었으며, 패널 제조시 금속계 또는 섬유계 메쉬를 삽입함으로써 강도가 크게 향상되었다.The conductive panel not only exhibits excellent electrostatic dispersion effect, but also significantly improves stain resistance, durability, chemical resistance, and the like, and greatly improves strength by inserting a metal-based or fibrous mesh when manufacturing the panel.

이하, 본 발명의 도전성 불포화 폴리에스테르 수지 조성물 및 이를 이용하여 제조되는 도전성 패널에 대하여 좀 더 상세하게 설명하면 다음과 같다.Hereinafter, the conductive unsaturated polyester resin composition of the present invention and the conductive panel manufactured by using the same will be described in more detail.

본 발명은 상온(25℃)에서 점도가 0.5∼10 포이즈인 불포화 폴리에스테르 수지 100 중량부에 대하여, 전도성 섬유 0.1∼10 중량부 및/또는 금속 분말 0.1∼20 중량부와, 경화제 0.3∼2.5 중량부를 포함하여 구성되는, 도전성 불포화 폴리에스테르 수지 조성물에 관한 것이다.The present invention relates to 0.1 to 10 parts by weight of conductive fibers and / or 0.1 to 20 parts by weight of metal powder and 0.3 to 2.5 parts by weight of a curing agent based on 100 parts by weight of an unsaturated polyester resin having a viscosity of 0.5 to 10 poise at room temperature (25 ° C). It is related with the conductive unsaturated polyester resin composition comprised including a part.

상기 불포화 폴리에스테르 수지의 점도 0.5 ∼ 10 포이즈는 열경화성 수지인 일반적인 주형용 불포화 폴리에스테르의 점도 범위이다.The viscosity 0.5-10 poise of the said unsaturated polyester resin is the viscosity range of the unsaturated polyester for general castings which is a thermosetting resin.

본 발명에 있어서 도전성 물질은 전도성 섬유 또는 금속분말을 단독 또는 병용하여 구성되며, 각각의 첨가량은 최종 제품의 전기저항 특성에 의하여 조절된다.In the present invention, the conductive material is composed of conductive fibers or metal powders alone or in combination, and the amount of each added is controlled by the electrical resistance characteristics of the final product.

구체적으로는 전도성 섬유의 경우 길이가 0.1∼12mm 범위인 피치(Pitch)계 또는 팬(PAN)계 탄소 섬유, 스테인레스 섬유, 스틸 섬유가 해당되며, 그 중에서도 3∼6 mm의 길이의 탄소 섬유가 가장 바람직하다.Specifically, in the case of conductive fibers, pitch- or PAN-based carbon fibers, stainless fibers, and steel fibers having a length ranging from 0.1 to 12 mm are used. Among them, carbon fibers having a length of 3 to 6 mm are the most. desirable.

이 때 상기 전도성 섬유의 길이가 12mm를 초과하면 수지와 혼합 성능이 떨어지며, 0.1mm 미만이면 전기 저항 특성이 떨어진다.At this time, when the length of the conductive fiber exceeds 12mm, the mixing performance with the resin is inferior, if less than 0.1mm, the electrical resistance properties are inferior.

상기 금속 분말은 입경이 0.1mm 이하인 은, 알루미늄, 니켈, 구리 분말을 선택적으로 사용한다.The metal powder is selectively used silver, aluminum, nickel, copper powder having a particle diameter of 0.1mm or less.

바람직하게는 은 분말이 가장 효과적이나, 가격이 비싸므로 사용에 어려움이 있어 경제성을 감안할 때 니켈 분말이 가장 적당하다.Preferably, silver powder is the most effective, but the price is expensive, so it is difficult to use, considering the economical efficiency, nickel powder is most suitable.

본 발명에 있어서 경화제로는 일반적인 촉매로서 메틸에틸케톤퍼옥시드(MEKPO), 촉진제로서 코발트나 프타네이트가 첨가되었으나 특별히 이에 한정되는 것은 아니다.In the present invention, as the curing agent, methyl ethyl ketone peroxide (MEKPO) is added as a general catalyst, and cobalt and phthalate are added as accelerators, but the present invention is not particularly limited thereto.

상기와 같이 구성되는 도전성 불포화 폴리에스테르 수지 조성물은 무기충전재와 각각 6∼40 중량%와 60∼94 중량%의 비율로 혼합되어 정전기 분산 효과가 우수한 도전성 패널 조성물로 제조된다.The conductive unsaturated polyester resin composition constituted as described above is mixed with the inorganic filler at a ratio of 6 to 40 wt% and 60 to 94 wt%, respectively, to prepare a conductive panel composition having excellent electrostatic dispersion effect.

이하 도전성 불포화 폴리에스테르 수지 조성물과 무기충전재로 구성되는 도전성 패널에 대하여 좀 더 구체적으로 설명하면 다음과 같다.Hereinafter, a conductive panel composed of a conductive unsaturated polyester resin composition and an inorganic filler will be described in more detail.

본 발명에 있어서 무기충전재로는 종석, 탄산칼슘, 수산화알루미늄, 규사, 실리카 미분말, 카올린, 대리석 파쇄물, 글라스 비드 등이 사용된다.In the present invention, as the inorganic filler, calcite, calcium carbonate, aluminum hydroxide, silica sand, fine silica powder, kaolin, marble crushed material, glass beads, and the like are used.

이 때, 낮은 수지함량을 가지는 패널을 제조하기 위해서는 비표면적이 작은 무기충전재를 사용해야 하는데, 탄산칼슘, 수산화알루미늄은 비표면적이 비교적 크기 때문에 수지를 많이 흡수하는 반면 천연 실리카의 경우 입도 분포를 비교적 크게 하면 비표면적이 커져서 수지를 적게 흡수하게 된다.In this case, in order to manufacture a panel having a low resin content, an inorganic filler having a small specific surface area should be used. Since calcium carbonate and aluminum hydroxide have a relatively large specific surface area, they absorb a lot of resin, whereas natural silica has a relatively large particle size distribution. As a result, the specific surface area is increased to absorb less resin.

본 발명의 도전성 패널에 있어서 도전성 불포화 폴리에스테르 수지 조성물의첨가량은 최종 제품의 전기 저항 특성 및 물성에 따라서 조절된다.In the conductive panel of the present invention, the amount of the conductive unsaturated polyester resin composition added is adjusted according to the electrical resistance properties and physical properties of the final product.

즉, 정전기 방지용 인조대리석과 정전기 방지용 이중바닥재 패널의 경우 표면-표면 저항이 2.5×104∼ 1.0 ×106Ω일 때 가장 바람직한 전기 저항 특성을 나타내는데, 이러한 전기 저항 특성을 부여하기 위한 상기 도전성 불포화 폴리에스테르 조성물의 첨가량은 7∼18 중량%이다.That is, in the case of the anti-static artificial marble and the anti-static double-floor panel shows the most desirable electrical resistance properties when the surface-surface resistance is 2.5 × 10 4 ~ 1.0 × 10 6 Ω, the conductive unsaturated to give such electrical resistance characteristics The addition amount of the polyester composition is 7-18 weight%.

본 발명의 도전성 패널의 바람직한 실시예로서 제조된 패널의 외관을 수려하게 하기 위하여 표면을 연마함으로써 외장재로서의 가치를 증대시킬 수 있다.In order to enhance the appearance of the panel produced as a preferred embodiment of the conductive panel of the present invention, the surface can be increased by polishing the surface.

즉, 본 발명의 도전성 패널은 일반적인 인조대리석 공정에 의하여 두께 10∼30 mm의 도전성이 우수한 인조대리석으로 제조될 수 있는데, 도전성 패널 표면에 인조대리석과 같은 외관을 나타내기 위하여 인조대리석과 같이 표면을 연마하여 줌으로써 기존의 도전성 PVC 타일에 의존했던 외관을 획기적으로 개선시킬 수 있다.That is, the conductive panel of the present invention can be made of artificial marble having excellent conductivity of 10 to 30 mm in thickness by a general artificial marble process, the surface of the conductive panel, such as artificial marble in order to exhibit an appearance such as artificial marble Polishing can significantly improve the appearance of the conventional conductive PVC tile.

한편, 도전성 이중바닥재 패널의 경우에는 도전성 인조대리석에 비하여 높은 국부압축강도가 요구되는데, 본 발명의 도전성 패널의 바람직한 다른 실시예로서 도전성 불포화 폴리에스테르 수지 조성물과 무기충전재의 혼합공정에서 패널의 강도 보강을 위하여 금속계 또는 섬유계 메쉬를 1장 이상 삽입하여 제조함으로써 이를 개선시킬 수 있다.On the other hand, in the case of the conductive double-floor panel, higher local compressive strength is required than the conductive artificial marble. As another preferred embodiment of the conductive panel of the present invention, the strength of the panel is reinforced in the mixing process of the conductive unsaturated polyester resin composition and the inorganic filler. For this purpose it can be improved by manufacturing by inserting at least one metal-based or fibrous mesh.

이하 본 발명을 실시예 및 비교예를 들어 상세히 설명하고자 하나, 이하의 실시예들은 본 발명을 예증하기 위한 것으로서 본 발명이 기술된 실시예에 제한되는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples, but the following Examples are provided to illustrate the present invention, and the present invention is not limited to the described Examples.

실시예 1∼3 및 비교예 1∼3Examples 1-3 and Comparative Examples 1-3

1. 하기 표 1의 조성비에 따라 각 재료를 진공믹서에 넣고 혼합한 후, 600 X 600 mm X 12mm 의 몰드에 부어 가압 성형하였다.1. According to the composition ratio shown in Table 1, each material was put into a vacuum mixer, mixed, and poured into a mold of 600 X 600 mm X 12 mm and pressure molded.

2. 상기 성형물을 80℃에서 약 2시간동안 경화시킨 다음 상온에서 방치 후 몰드에서 탈형하여 경화 6시간 정도 후에 표면을 연마하여 인조대리석 패널을 제조하였다.2. The molded product was cured at 80 ° C. for about 2 hours, then left at room temperature, demolded from the mold, and polished to prepare the artificial marble panel after 6 hours of curing.

실시예 4Example 4

하기 표 1의 조성비에 따라 상기 실시예 1과 동일한 방법으로 패널을 제조하되, 상기 제조 공정 중 성형체 안에 와이어메쉬를 1장 삽입하는 공정을 추가하여 두께 15mm의 이중바닥재용 패널을 제조하였다.According to the composition ratio of Table 1 below to prepare a panel in the same manner as in Example 1, during the manufacturing process was added a step of inserting one wire mesh into the molded body to prepare a panel for a double floor material having a thickness of 15mm.

(단위:중량부)(Unit: weight part) 실 시 예Example 비 교 예Comparative Example 1One 22 33 44 1One 22 33 수지조성물Resin composition 불포화폴리에스테르 수지Unsaturated polyester resin 100100 100100 100100 100100 100100 100100 100100 경화제Hardener 1.01.0 1.01.0 1.01.0 1.01.0 1.01.0 1.01.0 1.01.0 도전성물질Conductive material 탄소섬유Carbon fiber 0.50.5 -- 1One 1One -- -- 1515 NiNi -- 1010 55 -- -- 2525 -- 패널panel 수지조성물Resin composition 1515 1010 1515 1515 1515 1515 1010 무기충전재Inorganic filler 8585 9090 8585 8585 8585 8585 9090 와이어메쉬Wire mesh -- -- -- 1장1 page -- -- --

상기 실시예 및 비교예에서 사용된 불포화 폴리에스테르 수지는 상온에서 점도가 7 포이즈인 오르소(ORTHO)계 수지이다.The unsaturated polyester resin used in the above examples and comparative examples is an ortho (ORTHO) resin having a viscosity of 7 poise at room temperature.

전도성 섬유로는 3mm 길이의 피치(Pitch)계 탄소 섬유를 사용하였으며, 경화제로는 메틸에틸케톤퍼옥시드(MEKPO), 코발트계 촉진제를 사용하였다.Pitch-based carbon fibers having a length of 3 mm were used as the conductive fibers, and methyl ethyl ketone peroxide (MEKPO) and cobalt-based accelerators were used as curing agents.

또한, 무기충전재로 평균입경이 50㎛ 인 탄산칼슘과 입경 2∼5 mm의 서로 색상이 다른 2종의 종석을 혼합하여 사용하였으며, 와이어메쉬는 직경 2mm의 스틸 메쉬를 사용하였다.In addition, as an inorganic filler, calcium carbonate having an average particle diameter of 50 μm and two kinds of stones having different colors with a particle diameter of 2 to 5 mm were mixed and used, and a wire mesh of steel mesh having a diameter of 2 mm was used.

상기 실시예 1∼4 및 비교예 1∼3에서 제조된 패널의 정전기 분산 성능을 측정하기 위하여 ESD S7.1 에 따라 표면-표면 저항을 측정하였다.Surface-surface resistance was measured according to ESD S7.1 in order to measure the electrostatic dispersion performance of the panels prepared in Examples 1-4 and Comparative Examples 1-3.

또한, 상기 패널들의 국부 압축 강도, 압축 강도 및 휨강도 측정을 위하여 별도로 시험체를 제작하여 ESD S7.1 및 KS F 4760에 따라 측정하고, 내충격성 및 내마모성 실험을 각각 KS F 2813, KS F 4760에 의거하여 행하였다.In addition, in order to measure the local compressive strength, compressive strength and flexural strength of the panels, a separate test specimen was prepared and measured according to ESD S7.1 and KS F 4760, and the impact resistance and abrasion resistance tests were performed according to KS F 2813 and KS F 4760, respectively. Was carried out.

여기서 국부 압축 강도는 500kgf/㎠ 의 하중을 가하였을 때의 변형량을 나타내며, 상기 시험 결과들을 표 2에 나타내었다.Here, the local compressive strength represents the deformation amount when a load of 500 kgf / cm 2 is applied, and the test results are shown in Table 2.

이 때 표면-표면 저항값은 2.5×104∼1.0×106Ω이 가장 바람직하며, 일반적으로 정전기 분산 성능은 1.0×104∼1.0×108Ω이면 만족한다. 또한, 국부 압축은 4mm 이하이면 만족한다.At this time, the surface-surface resistance value is most preferably 2.5 × 10 4 to 1.0 × 10 6 GPa, and generally, the electrostatic dispersion performance is satisfied if it is 1.0 × 10 4 to 1.0 × 10 8 GPa. Moreover, local compression is satisfied that it is 4 mm or less.

국부압축(mm)Local compression (mm) 표면-표면저항 (×105Ω)Surface to Surface Resistance (× 10 5 Ω) 압축강도(kgf/cm2)Compressive strength (kgf / cm 2 ) 휨 강도(kgf/cm2)Flexural strength (kgf / cm 2 ) 내충격성Impact resistance 내마모성(mg/mm2)Abrasion Resistance (mg / mm 2 ) 실시예Example 1One -- 1.01.0 16201620 460460 양 호Good 0.01이하0.01 or less 22 -- 10.010.0 16501650 400400 양 호Good 0.01이하0.01 or less 33 -- 0.40.4 16801680 490490 양 호Good 0.01이하0.01 or less 44 0.90.9 0.50.5 16901690 510510 양 호Good 0.01이하0.01 or less 비교예Comparative example 1One -- 측정 불능Inmeasurement 16001600 405405 양 호Good 0.01이하0.01 or less 22 -- 0.001이하Less than 0.001 16201620 408408 양 호Good 0.01이하0.01 or less 33 -- 0.001이하Less than 0.001 16201620 480480 양 호Good 0.0150.015

상기 표 2에 나타난 바와 같이, 비교예 1∼4에 의해 제조된 패널은 대체로 표면-표면 저항값이 매우 낮아 정전기 방지용으로 적용이 불가능하며, 실시예 1∼4에 의해 제조된 패널은 비교예보다 정전기 분산성, 휨강도, 압축강도 등이 매우 우수한 것으로 나타났다.As shown in Table 2, the panels produced by Comparative Examples 1 to 4 are generally very low in surface-to-surface resistance, and thus cannot be applied for antistatic applications. Electrostatic dispersibility, flexural strength and compressive strength were found to be very good.

또한, 성형체 안에 와이어메쉬를 1장 삽입시켜 제조된 실시예 4의 도전성 패널의 경우, 500kgf/cm2의 국부 하중에 의한 변형량이 0.9mm로서 도전성 이중바닥재 패널로서 우수한 특성을 나타내었다.In addition, the conductive panel of Example 4 prepared by inserting one wire mesh into a molded body exhibited excellent characteristics as a conductive double floor panel with a deformation amount of 0.9 mm due to a local load of 500 kgf / cm 2 .

본 발명의 도전성 불포화 폴리에스테르 수지 조성물 및 이를 이용하여 제조되는 도전성 패널은 정전기 분산 효과가 우수하여 균일한 표면저항을 확보할 수 있을 뿐 아니라 바닥재로 사용 가능하도록 강도 및 내구성이 우수하며, 표면 연마 공정을 통해 외장재로의 가치를 증대시킬 수 있다.The conductive unsaturated polyester resin composition of the present invention and the conductive panel manufactured using the same have excellent strength and durability to be used as a flooring material as well as ensuring uniform surface resistance due to excellent electrostatic dispersion effect, and surface polishing process Through this can increase the value of the exterior material.

따라서, 정밀 부품 및 기기를 취급하는 전자부품 생산 공장, 전산실 및 연구소, 병원 등의 다양한 용도로 사용될 수 있다.Therefore, it can be used in various applications such as electronic parts production plants, computer rooms and laboratories, hospitals that handle precision components and devices.

특히, 정전기 분산 특성 이외에 외관, 내오염성, 내구성 등이 매우 우수하여 병원, 전산실, 연구실 등에 사용하면 그 효과가 크다.In particular, in addition to the electrostatic dispersion characteristics, the appearance, pollution resistance, durability, etc. are very excellent, and when used in a hospital, computer room, laboratory, etc., the effect is great.

Claims (5)

상온(25℃)에서 점도가 0.5∼10 포이즈인 불포화 폴리에스테르 수지 100 중량부에 대하여, 전도성 섬유 0.1∼10 중량부 및/또는 금속 분말 0.1∼20 중량부와, 경화제 0.3∼2.5 중량부를 포함하여 구성되는, 도전성 불포화 폴리에스테르 수지 조성물.0.1 to 10 parts by weight of conductive fibers and / or 0.1 to 20 parts by weight of the metal powder and 0.3 to 2.5 parts by weight of the curing agent, based on 100 parts by weight of the unsaturated polyester resin having a viscosity of 0.5 to 10 poise at room temperature (25 ° C). Conductive unsaturated polyester resin composition comprised. 제 1항에 있어서, 상기 전도성 섬유는 길이가 0.1∼12mm 인 피치(Pitch)계 또는 팬(PAN)계 탄소 섬유, 스테인레스(SUS) 섬유, 스틸 섬유로 구성되는 군으로부터 선택되는 1종 이상인 것을 특징으로 하는, 도전성 불포화 폴리에스테르 수지 조성물The method of claim 1, wherein the conductive fiber is at least one member selected from the group consisting of pitch-based or pan-based carbon fiber, stainless steel (SUS) fiber, steel fiber having a length of 0.1 to 12mm. Electroconductive unsaturated polyester resin composition made into 제 1항에 있어서, 상기 금속 분말은 각각 입경이 0.1mm 이하인 은, 알루미늄, 니켈, 구리 분말로 구성된 군으로부터 선택되는 1종 이상인 것을 특징으로 하는, 도전성 불포화 폴리에스테르 수지 조성물.The conductive unsaturated polyester resin composition according to claim 1, wherein the metal powder is at least one selected from the group consisting of silver, aluminum, nickel, and copper powder having a particle diameter of 0.1 mm or less, respectively. 제1항의 도전성 불포화 폴리에스테르 수지 조성물 6∼40 중량%와 무기충전재 60∼94 중량%로 구성되는, 도전성 패널.The conductive panel which consists of 6-40 weight% of conductive unsaturated polyester resin compositions of Claim 1, and 60-94 weight% of inorganic fillers. 제4항에 있어서, 강도 보강을 위하여 금속계 또는 섬유계 메쉬가 1장 이상더 삽입되어 제조되는 것을 특징으로 하는, 도전성 패널.The conductive panel according to claim 4, wherein at least one metal or fibrous mesh is inserted and manufactured for strength reinforcement.
KR1020010012549A 2001-03-12 2001-03-12 Conductive unsaturated polyester resin composition and a panel manufactured therewith KR20020072630A (en)

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Publication number Priority date Publication date Assignee Title
KR20040052149A (en) * 2002-12-13 2004-06-19 오병욱 The Method of Forming on the Interior Metallic Tile with Brass Powder
KR100651082B1 (en) * 2006-03-28 2006-11-30 주식회사 인트켐 Epoxy mortar composition for electric static dissipative

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JPH03199237A (en) * 1989-12-28 1991-08-30 Mitsui Toatsu Chem Inc Production of electrically conductive sheet
KR930012986A (en) * 1991-12-31 1993-07-21 채오병 Thermosetting resin composition for electromagnetic shielding
KR930019743A (en) * 1992-03-20 1993-10-18 페이츠, 요셉 알베르투스 안나 Conductive reinforced plastic

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JPS60217129A (en) * 1984-04-12 1985-10-30 Mitsui Toatsu Chem Inc Manufacture of electromagnetic wave reflector
JPH03199237A (en) * 1989-12-28 1991-08-30 Mitsui Toatsu Chem Inc Production of electrically conductive sheet
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KR20040052149A (en) * 2002-12-13 2004-06-19 오병욱 The Method of Forming on the Interior Metallic Tile with Brass Powder
KR100651082B1 (en) * 2006-03-28 2006-11-30 주식회사 인트켐 Epoxy mortar composition for electric static dissipative

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