KR20010088301A - 프린트 기판의 납땜방법 및 자동 납땜장치 - Google Patents
프린트 기판의 납땜방법 및 자동 납땜장치 Download PDFInfo
- Publication number
- KR20010088301A KR20010088301A KR1020000077660A KR20000077660A KR20010088301A KR 20010088301 A KR20010088301 A KR 20010088301A KR 1020000077660 A KR1020000077660 A KR 1020000077660A KR 20000077660 A KR20000077660 A KR 20000077660A KR 20010088301 A KR20010088301 A KR 20010088301A
- Authority
- KR
- South Korea
- Prior art keywords
- soldering
- solder
- nozzle
- rear former
- printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (4)
- 프린트 기판을 거친 물살의 제1차 분류(噴流) 노즐로 납땜한 후에 완만한 분류의 제2차 분류 노즐로 납땜하는 납땜방법에 있어서,제2차 분류 노즐에서의 납땜에서는, 땜납의 대량 부착용이나 좁은 피치용 등의 프린트 기판의 종류에 따라 제2차 분류 노즐의 리어 포머(rear former)의 경사각도를 변경시킴과 동시에 리어 포머 위에서 불활성 분위기를 형성하는 주변부의 위치를 적절하게 이동시키는 것을 특징으로 하는 프린트 기판의 납땜방법.
- 프린트 기판을 반송장치로 반송하면서 땜납 조 내의 제1차 분류 노즐과 제2차 분류 노즐에 의하여 순차적으로 납땜하는 자동 납땜장치에 있어서,제2차 분류 노즐의 리어 포머는 각도를 변경할 수 있게 되어 있고 또한 리어 포머의 근방에는 불활성 분위기를 형성하는 주변부가 설치되어 있고 또 주변부의 탑 커버는 프린트 기판의 진행방향으로 이동할 수 있게 되어 있는 것을 특징으로 하는 자동 납땜장치.
- 제2항에 있어서,상기의 주변부는 하부가 땜납 조의 용융 땜납 속에 잠겨 있는 것을 특징으로 하는 자동 납땜장치.
- 제2항에 있어서,상기의 주변부는 반송장치와 대략 평행하게 설치되어 있는 것을 특징으로 하는 자동 납땜장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000061997A JP2001251047A (ja) | 2000-03-07 | 2000-03-07 | プリント基板のはんだ付け方法および自動はんだ付け装置 |
JP2000-061997 | 2000-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010088301A true KR20010088301A (ko) | 2001-09-26 |
KR100738499B1 KR100738499B1 (ko) | 2007-07-11 |
Family
ID=18582062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000077660A KR100738499B1 (ko) | 2000-03-07 | 2000-12-18 | 프린트 기판의 납땜방법 및 자동 납땜장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6478215B2 (ko) |
JP (1) | JP2001251047A (ko) |
KR (1) | KR100738499B1 (ko) |
MY (1) | MY129361A (ko) |
TW (1) | TW479448B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100442093B1 (ko) * | 2001-11-22 | 2004-07-30 | 주식회사 티에스 | 무연 솔더를 이용한 플로우 솔더링 시스템 |
KR20230144835A (ko) | 2022-04-08 | 2023-10-17 | 송현정 | 솔더링 압력 미세 조정형 초음파 솔더링 장치 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6742693B2 (en) * | 2001-12-21 | 2004-06-01 | Asustek Computer, Inc. | Solder bath with rotatable nozzle |
JPWO2006118138A1 (ja) * | 2005-04-27 | 2008-12-18 | 千住システムテクノロジー株式会社 | プリント基板の多機能型はんだ付け装置およびはんだ付け方法 |
CN101557900A (zh) * | 2006-05-16 | 2009-10-14 | 塞拉斯提卡国际公司 | 层流井 |
US20080302861A1 (en) * | 2007-06-11 | 2008-12-11 | Szymanowski Richard A | Method and apparatus for wave soldering an electronic substrate |
JP5343566B2 (ja) * | 2009-01-08 | 2013-11-13 | 富士通株式会社 | 接合方法及びリフロー装置 |
US8220699B2 (en) | 2010-03-12 | 2012-07-17 | Air Products And Chemicals, Inc. | Apparatus and method for providing an inerting gas during soldering |
US8146792B2 (en) * | 2010-03-16 | 2012-04-03 | Flextronics Ap, Llc | Solder return for wave solder nozzle |
US8579182B2 (en) * | 2011-06-17 | 2013-11-12 | Air Products And Chemicals, Inc. | Method for providing an inerting gas during soldering |
DE102012022669B4 (de) * | 2012-11-21 | 2022-10-13 | Illinois Tool Works Inc. | Selektiv-Lötanlage |
DE102014110720A1 (de) * | 2014-07-29 | 2016-02-04 | Illinois Tool Works Inc. | Lötmodul |
CN104191064B (zh) * | 2014-09-17 | 2017-05-24 | 山东光因照明科技有限公司 | 回流焊出口简易接驳台 |
JP6593400B2 (ja) | 2017-08-04 | 2019-10-23 | 千住金属工業株式会社 | 噴流はんだ槽及び噴流はんだ付け装置 |
JP2019171400A (ja) * | 2018-03-27 | 2019-10-10 | 株式会社デンソーテン | はんだ減勢装置 |
JP6852710B2 (ja) * | 2018-04-20 | 2021-03-31 | オムロン株式会社 | 噴流式はんだ付け装置 |
US10780516B2 (en) * | 2018-06-14 | 2020-09-22 | Illinois Tool Works Inc. | Wave solder nozzle with automated adjustable sliding plate to vary solder wave width |
US11389888B2 (en) * | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5852899A (ja) | 1981-09-24 | 1983-03-29 | 東京生産技研株式会社 | プリント基板へのハンダ付け方法およびその装置 |
FR2572970B1 (fr) * | 1984-11-15 | 1987-02-13 | Outillages Scient Lab | Dispositif chauffant de generation d'une vague de soudure pour machine de soudage a la vague |
US4869418A (en) * | 1986-06-11 | 1989-09-26 | International Business Machines Corporation | Solder leveling method and apparatus |
KR920008948B1 (ko) * | 1987-02-12 | 1992-10-12 | 니혼 덴네쯔 게이기 가부시끼가이샤 | 프린트 기판의 납땜방법 및 그의 장치 |
JPS6434577A (en) | 1987-07-31 | 1989-02-06 | Nec Corp | Soldering device for printed board |
JPH0721504B2 (ja) | 1987-08-31 | 1995-03-08 | 日本碍子株式会社 | 試料供給装置 |
JP2757389B2 (ja) * | 1988-09-13 | 1998-05-25 | 松下電器産業株式会社 | 噴流式自動半田付装置 |
MY104879A (en) * | 1988-12-31 | 1994-06-30 | Yokota Kikai Kk | An automatic soldering method and the apparatus thereof |
US5044542A (en) * | 1989-11-22 | 1991-09-03 | Electrovert Ltd. | Shield gas wave soldering |
US5228614A (en) * | 1990-07-09 | 1993-07-20 | Electrovert Ltd. | Solder nozzle with gas knife jet |
JP3104191B2 (ja) * | 1991-01-28 | 2000-10-30 | ソニー株式会社 | 噴流はんだ槽 |
US5203489A (en) * | 1991-12-06 | 1993-04-20 | Electrovert Ltd. | Gas shrouded wave soldering |
US5409159A (en) * | 1994-02-28 | 1995-04-25 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and methods for inerting solder during wave soldering operations |
JPH09283912A (ja) | 1996-04-12 | 1997-10-31 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法および噴流はんだ槽 |
JPH09293959A (ja) * | 1996-04-26 | 1997-11-11 | Senju Metal Ind Co Ltd | 噴流はんだ槽 |
JPH09293958A (ja) * | 1996-04-26 | 1997-11-11 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法およびはんだ付け装置 |
JP3638415B2 (ja) * | 1997-01-20 | 2005-04-13 | 日本電熱計器株式会社 | ガス雰囲気はんだ付け装置 |
-
2000
- 2000-03-07 JP JP2000061997A patent/JP2001251047A/ja active Pending
- 2000-12-05 TW TW089125844A patent/TW479448B/zh not_active IP Right Cessation
- 2000-12-18 KR KR1020000077660A patent/KR100738499B1/ko active IP Right Grant
-
2001
- 2001-03-02 US US09/796,463 patent/US6478215B2/en not_active Expired - Lifetime
- 2001-03-05 MY MYPI20010996A patent/MY129361A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100442093B1 (ko) * | 2001-11-22 | 2004-07-30 | 주식회사 티에스 | 무연 솔더를 이용한 플로우 솔더링 시스템 |
KR20230144835A (ko) | 2022-04-08 | 2023-10-17 | 송현정 | 솔더링 압력 미세 조정형 초음파 솔더링 장치 |
Also Published As
Publication number | Publication date |
---|---|
MY129361A (en) | 2007-03-30 |
US20010020637A1 (en) | 2001-09-13 |
TW479448B (en) | 2002-03-11 |
KR100738499B1 (ko) | 2007-07-11 |
JP2001251047A (ja) | 2001-09-14 |
US6478215B2 (en) | 2002-11-12 |
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