KR20010082793A - Structure mount method for PCB of mounting Chip LED - Google Patents

Structure mount method for PCB of mounting Chip LED Download PDF

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Publication number
KR20010082793A
KR20010082793A KR1020000008112A KR20000008112A KR20010082793A KR 20010082793 A KR20010082793 A KR 20010082793A KR 1020000008112 A KR1020000008112 A KR 1020000008112A KR 20000008112 A KR20000008112 A KR 20000008112A KR 20010082793 A KR20010082793 A KR 20010082793A
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KR
South Korea
Prior art keywords
light emitting
pcb
chip
mounting
emitting diode
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KR1020000008112A
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Korean (ko)
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KR100315190B1 (en
Inventor
김기현
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윤종용
삼성전자 주식회사
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Priority to KR1020000008112A priority Critical patent/KR100315190B1/en
Publication of KR20010082793A publication Critical patent/KR20010082793A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A chip LED mounted printed circuit board(PCB) structure and mounting method are provided to shorten the manufacturing time by allowing the chip LED to mount on a surface where general components are mounted and to reduce the cost by excluding the peel coating. CONSTITUTION: The chip LED mounted PCB(1) comprises a plurality of holes(2), a plurality of chip LEDs(5), and general components(4). Each hole is formed on the LED mounted position to emit the light of each LED. All LEDs and general components are mounted on one surface of the PCB. The diameter of each hole is those of diode. The light of LED is emitted through the hole, which allows the recognition of light under the PCB. The mounting method includes the steps of penetrating the PCB to form the holes, mounting the general components on one surface of PCB, and mounting the LEDs on the same surface.

Description

칩형 발광다이오드가 실장되는 인쇄회로기판의 구조 및 실장 방법{Structure mount method for PCB of mounting Chip LED}Structure and method of mounting a printed circuit board on which a chip type light emitting diode is mounted {Structure mount method for PCB of mounting Chip LED}

본 발명은 전자 제품의 표시장치에 사용되는 칩형 발광다이오드(Chip LED)가 실장되는 인쇄회로기판의 구조에 관한 것으로, 특히 기판에 실장되는 일반 부품과 칩형 발광다이오드를 동일면에 실장가능하도록 한 칩형 발광다이오드가 실장되는인쇄회로기판의 구조 및 실장 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a printed circuit board on which a chip LED used in a display device of an electronic product is mounted, and in particular, a chip type light emitting device capable of mounting a general component mounted on a board and a chip type light emitting diode on the same surface. The present invention relates to a structure and a mounting method of a printed circuit board on which a diode is mounted.

종래 인쇄기판조립체(PBA;Printed Board Assembly)는 도 1에 도시한 바와 같이, 기판(1)에서 일반 부품(4)이 실장되는 면(2)에 칩형 발광다이오드(5)를 동일하게 실장하도록 하고, 다시 반대면(3)에도 칩형 발광다이오드(5)를 실장하도록 한다.In the conventional printed board assembly (PBA), as shown in FIG. 1, the chip-shaped light emitting diode 5 is mounted on the surface 2 on which the general component 4 is mounted on the substrate 1. In addition, the chip type light emitting diodes 5 are mounted on the opposite side 3.

이와 같이 종래에는 일측면(2)에 자삽 공정과 납땜 공정이 끝난 후에, 다시 반대면(3)에 칩형 발광다이오드(5)를 자삽하여 납땜 공정을 수행함으로써 각각의 기판(1)의 면(2)(3)에 자삽 공정 및 납땜 공정이 수행되어야 하므로 공정에 소요되는 시간이 지연되는 문제가 있다.As described above, after the insertion process and the soldering process are completed on one side 2, the surface of each substrate 1 is inserted by inserting the chip-shaped light emitting diode 5 on the opposite side 3 and performing the soldering process. There is a problem that the time required for the process is delayed because the insertion process and the soldering process must be performed in the (3).

또한, 본 발명이 적용되고 있는 전화기의 인쇄기판조립체에서는 칩형 발광다이오드가 카본 접점과 함께 사용되기 때문에 납땜시 접점을 보호하기 위하여 기판상에 납이 묻지 않도록 하기 위한 필 코팅(peel coating)을 실시하게 되므로 제조 비용도 상승되어 경쟁력이 저하되는 문제가 있다.In addition, in the printed circuit board assembly of the telephone to which the present invention is applied, since the chip type light emitting diode is used together with the carbon contact, it is necessary to perform a peel coating to prevent lead on the substrate to protect the contact during soldering. Therefore, there is a problem that the manufacturing cost is also increased and the competitiveness is lowered.

이와 같은 문제점을 감안하여 안출한 본 발명의 목적은 인쇄회로기판의 일측면 즉, 일반 부품이 실장되는 면에 칩형 발광다이오드를 실장가능하도록 하여 제조공정 시간을 단축하려는 것이다.The object of the present invention devised in view of such a problem is to shorten the manufacturing process time by allowing the chip type light emitting diode to be mounted on one side of the printed circuit board, that is, the surface on which the general component is mounted.

본 발명의 다른 목적은 칩형 발광다이오드를 카본 접점과 동일면에 함께 실장시키지 않도록 함으로써 별도의 필 코팅을 배제하여 제조 단가를 절감하여 제품경쟁력을 향상시키려는 것이다.Another object of the present invention is to prevent the chip-shaped light emitting diode from being mounted on the same surface as the carbon contact, thereby eliminating a separate peel coating, thereby reducing manufacturing cost and improving product competitiveness.

도 1은 종래 기술에 의한 인쇄회로기판의 구조를 보인 측면도.1 is a side view showing the structure of a printed circuit board according to the prior art.

도 2는 본 발명에 의한 인쇄회로기판의 측면도.Figure 2 is a side view of a printed circuit board according to the present invention.

도 3은 본 발명에 의한 인쇄회로기판의 평면도.3 is a plan view of a printed circuit board according to the present invention;

( 도면의 주요 부분에 대한 부호의 설명 )(Explanation of symbols for the main parts of the drawing)

1 ; 인쇄회로기판 2 ; 일반 부품 실장면One ; Printed circuit board 2; General part mounting surface

3 ; 솔더링 면 4 ; 일반 부품3; Soldering surface 4; General parts

5 ; 칩형 발광다이오드 6 ; 발광다이오드 발광공5; Chip type light emitting diode 6; LED Emitting Ball

상기한 바와 같은 본 발명의 목적을 달성하기 위한 칩형 발광다이오드가 실장되는 인쇄회로기판의 구조는 기판에 칩형 발광다이오드가 실장되는 위치마다 각각 발광다이오드 발광공이 천공되고, 기판의 양측면에서 일반 부품이 실장되는 면과 동일면에 상기 칩형 발광다이오드가 실장된 것을 특징으로 한다.In the structure of a printed circuit board on which a chip type light emitting diode is mounted to achieve the object of the present invention as described above, light emitting diode light emitting holes are perforated at each position where the chip type light emitting diode is mounted on a substrate, and general components are mounted on both sides of the substrate. The chip type light emitting diode is mounted on the same surface as the surface.

또한, 본 발명에 의한 칩형 발광다이오드가 실장되는 인쇄회로기판의 실장 방법은 기판에 칩형 발광다이오드 실장되는 위치마다 발광다이오드의 빛이 발광될 수 있는 발광공을 천공하는 단계와; 상기 기판의 일측면에 일반 부품을 실장함과 아울러 동일면에서 상기 발광공의 천공 위치에 상기 칩형 발광다이오드를 실장하는 단계를 포함하는 것을 특징으로 한다.In addition, the method for mounting a printed circuit board on which a chip type light emitting diode is mounted according to the present invention includes the steps of: drilling a light emitting hole for emitting light of the light emitting diode at each position where the chip type light emitting diode is mounted on the substrate; Mounting the general component on one side of the substrate, and mounting the chip-shaped light emitting diode at the punctured position of the light emitting hole in the same surface.

이와 같이 본 발명에 의한 인쇄회로기판의 구조 및 실장 방법에 의하면, 종래 전자 제품의 표시 장치로 칩형 발광다이오드를 사용하는 제품에서 원활한 표시 상태를 유지하기 위하여 다른 부품의 반대면에 칩형 발광다이오드를 실장하는 구조에서 다른 부품의 실장면과 동일면에 칩형 발광다이오드를 실장함에 따라 제조 공정을 간소화하고, 제조 비용을 절감하는 효과가 있는 것이다.As described above, according to the structure and mounting method of a printed circuit board according to the present invention, in order to maintain a smooth display state in a product using a chip type light emitting diode as a display device of a conventional electronic product, a chip type light emitting diode is mounted on an opposite surface of another component. By mounting the chip type light emitting diode on the same surface as the mounting surface of other components in the structure to simplify the manufacturing process, it is effective to reduce the manufacturing cost.

이하, 상기한 바와 같은 본 발명의 바람직한 실시예를 첨부도면에 의거하여 보다 상세히 설명한다.Hereinafter, preferred embodiments of the present invention as described above will be described in more detail with reference to the accompanying drawings.

첨부도면 도 2는 본 발명에 의한 인쇄회로기판의 측면도이고, 도 3은 본 발명에 의한 인쇄회로기판의 평면도이다.2 is a side view of a printed circuit board according to the present invention, and FIG. 3 is a plan view of the printed circuit board according to the present invention.

이에 도시한 바와 같이, 본 발명 실시예는 기판(1)에 칩형 발광다이오드의 LED 발광부위에 해당되는 크기만큼 기판에 발광다이오드 발광공(6)을 천공하고, 칩형 발광다이오드(5)를 일반 부품(4)이 실장되는 면(2)측에서 발광다이오드 발광공(6)이 형성된 부위에 실장한 것이다.As shown in the drawing, the embodiment of the present invention perforates the light emitting diode light emitting holes 6 in the substrate by the size corresponding to the LED light emitting region of the chip type light emitting diode on the substrate 1, and the chip type light emitting diode 5 is replaced with a general component. It is mounted in the part in which the light emitting diode light emitting hole 6 was formed in the surface 2 side in which (4) is mounted.

이와 같이 구성되는 본 발명 인쇄회로기판에 의하면 칩형 발광다이오드(5)가 일측면에만 실장된 상태이지만, 발광다이오드(5a)의 빛이 발광다이오드 발광공(6)을 통과하여 타측으로 조사되기 때문에 발광다이오드(5a)의 빛이 사용자에게 인식가능하게 된다.According to the printed circuit board of the present invention configured as described above, although the chip type light emitting diodes 5 are mounted on only one side, the light of the light emitting diodes 5a passes through the light emitting diode light emitting holes 6 and is irradiated to the other side. Light of the diode 5a becomes visible to the user.

이러한 본 발명에 의한 실장 구조에 의하면, 종래의 기능과 동일한 효과를 발휘하면서도 제조 공정은 50％를 줄일 수 있게 되는 것이다.According to such a mounting structure according to the present invention, the manufacturing process can be reduced by 50% while exhibiting the same effects as the conventional functions.

이상에서 설명한 바와 같이, 본 발명에 의한 방법으로 인쇄회로기판을 설계하면, 종래 방식에 비하여 제조 공정이 최소한 50％는 절감되는 효과가 있다.As described above, when the printed circuit board is designed by the method according to the present invention, there is an effect that the manufacturing process is reduced by at least 50% compared to the conventional method.

또한, 전화기와 같은 통신용 인쇄기판조립체의 경우에는 접점으로 카본을 사용할 때, 인쇄회로기판 자체의 원가도 약 15％정도가 절감되므로 제조 비용을 현저하게 절감할 수 있어 제품 경쟁력도 향상시킬 수 있는 효과가 있다.In addition, in the case of a communication printed circuit board assembly such as a telephone, when carbon is used as a contact point, the cost of the printed circuit board itself is also reduced by about 15%, thereby significantly reducing manufacturing costs and improving product competitiveness. There is.

아울러 기판의 양측면에서 납땜 공정을 수행하는 종래 방식에 비하여 한 번의 납땜 공정만 실시하게 됨으로써 부품에 가해지는 열적 스트레스를 줄여 품질 향상에도 기여하는 것이다.In addition, compared to the conventional method of performing the soldering process on both sides of the substrate, only one soldering process is performed, thereby reducing the thermal stress applied to the component, thereby contributing to quality improvement.

Claims (2)

기판에 칩형 발광다이오드가 실장되는 위치마다 각각 발광다이오드 발광공이 천공되고, 기판의 양측면에서 일반 부품이 실장되는 면과 동일면에 상기 칩형 발광다이오드가 실장된 것을 특징으로 하는 칩형 발광다이오드가 실장되는 인쇄회로기판의 구조.Printed circuits in which chip-shaped light emitting diodes are mounted, wherein light-emitting diode light emitting holes are punctured at each position where a chip-shaped light emitting diode is mounted on a substrate, and the chip-shaped light emitting diodes are mounted on the same surface as the surface on which general components are mounted on both sides of the substrate. Structure of the substrate. 기판에 칩형 발광다이오드 실장되는 위치마다 발광다이오드의 빛이 발광될 수 있는 발광공을 천공하는 단계와;Perforating light emitting holes for emitting light of the light emitting diodes at positions where the chip type light emitting diodes are mounted on the substrate; 상기 기판의 일측면에 일반 부품을 실장함과 아울러 동일면에서 상기 발광공의 천공 위치에 상기 칩형 발광다이오드를 실장하는 단계를 포함하는 것을 특징으로 하는 칩형 발광다이오드가 실장되는 인쇄회로기판의 실장 방법.And mounting the chip-shaped light emitting diode at a punctured position of the light emitting hole on the same surface as well as mounting a general component on one side of the substrate.
KR1020000008112A 2000-02-21 2000-02-21 Structure mount method for PCB of mounting Chip LED KR100315190B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008016803A3 (en) * 2006-07-31 2008-04-10 Alcon Inc Rfid ring illumination system for surgical machine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102065442B1 (en) * 2013-07-16 2020-01-13 삼성전자주식회사 Printed circuit board assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008016803A3 (en) * 2006-07-31 2008-04-10 Alcon Inc Rfid ring illumination system for surgical machine
US7551077B2 (en) 2006-07-31 2009-06-23 Alcon, Inc. RFID ring illumination system for surgical machine

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